MEMS And Nanotechnology-Based Sensors And Devices For .
MEMS andNanotechnology-BasedSensors and Devicesfor Communications,Medical andAerospaceApplicationsA.R. Jha, Ph.D. C) CRC PressJTaylor & Francis GroupBoca Raton London New YorkCRC Press is an imprint of theTaylor & Francis Group, an I n f o r m a businessAN AUERBACHBOOK
ContentsForewordxixPrefacexxiAuthorxxix1Highlights and Chronological Developmental History of MEMSDevices Involving Nanotechnology1.1 Introduction1.2 What Is MEMS?1.2.1 Frequently Used Terms in Nanotechnology1.2.2 2005 MEMS Industry Overview and Sales Projectionsfor MEMS Devices1.3 Potential Applications of MEMS Devices in Commercialand Space Systems1.3.1 MEMS for Wireless, Base Stations, Satellites,and Nanosatellites1.3.1.1 RF-MEMS Amplifier-Switched Filter BankCapabilities1.3.1.2 Passive RF-MEMS Components1.3.2 RF-MEMS Technology for Base Station Requirements1.4 MEMS Technology for Military Systems Applications1.4.1 Material Requirements for Fabricationof MEMS Devices1.4.2 Types of Nanostructures and Their Properties1.4.2.1 Surface Plasmon Resonance1.4.2.2 Ceramics for MEMS Sensors1.4.3 Fabrication of Critical Elements of a MEMS Device1133445679111314161717v
vi 1.4.4MEMS Technology for Electronic Circuitsand Detectors for Military Applications1.4.4.1 Passive MEMS Devices for Commercial,Military, and Space Applications1.4.5 Nanotechnology for Armors to Provide Protectionto Soldiers1.4.6 Nanotechnology-Based Biometrie Structuresto Monitor Soldier Health1.4.7 Nanomaterials for External Support Muscles and ArtificialMuscles for Injured Soldiers on the Battlefield1.4.8 Robotic Arms for Battlefield Applications1.4.9 Portable Radar Using MEMS/Nanotechnologyfor Military Applications1.5MEMS for Commercial, Industrial, Scientific,and Biomedical System Applications1.5.1 Nanotubes and Nanotube Arrays for VariousApplications1.5.2 MEMS-Based Video Projection System1.5.3 Nanotechnology for Photovoltaic Solar Cells and 3-DLithium Ion Microbatteries for MEMS Devices1.6MEMS Technology for Hard-Disk Drives1.6.1 MEMS Devices for Thermographic NondestructiveTesting1.7MEMS Devices for Uncooled Thermal Imaging Arraysand Cooled Focal Planar Arrays for Various Applications1.8Applications of Nanotechnology in IR and Electro-OpticalSensors for Biomettic and Security Applications1.8.1 Nanotechnology-Based Laser Scanning Systems1.8.2 MEMS-Based Sensors for Detection of Chemicaland Biological Threats1.8.3 Potential Applications of Nanophotonic Sensorsand Devices1.8.4 MEMS Technology for Photonic Signal Processingand Optical Communications1.9MEMS Technology for Medical Applications1.10 MEMS Technology for Satellite Communicationsand Space Systems Applications1.11 MEMS Devices for Auto Industry Applications1.12 MEMS Technology for Aerospace System Applications1.13 13132333436373839
23Potential Actuation Mechanisms, Their Performance Capabilities,and Applications2.1 Introduction2.2 Classification of Actuation Mechanisms2.3 Structural Requirements and Performance Capabilitiesof Electrostatic Actuation Mechanism2.3.1 Electrostatic Actuation Mechanism2.3.1.1 Cantilever Beam Design Requirements2.3.2 Electrostatic Force Computation2.3.3 Pull-In and Pull-Out Voltage Requirements2.3.3.1 Pull-In Voltage2.3.3.2 Pull-Out Voltage2.3.3.3 Electrostatic Microactuator Configurationsfor Generating Higher Force and EnergyDensity Capabilities2.4 Piezoelectric Actuation Mechanism2.4.1 Structural Material Requirements for Cantilever Beams2.4.2 Threshold Voltage2.4.3 Tip Deflection of the Cantilever Beam2.4.4 Bending Moment of the Cantilever Beam2.4.5 Contact Force Requirements2.5 Electrothermal Actuation Mechanism2.6 Electromagnetic Actuation Mechanism2.6.1 Pull-In and Pull-Out Magnetomotive Forces2.6.2 Actuation Force due to Induced Magnetic Force2.6.2.1 Parametric Trade-Off Computations2.7 Electrodynamic Actuation Mechanism2.8 Electrochemical Actuation Mechanism2.8.1 Classification and Major Benefits of C N T2.8.2 M W C N T Arrays and Electrochemical ActuatorPerformance2.8.3 Fabrication and Material Requirements for the Actuator2.9 SummaryReferencesLatest and Unique Methods for Actuation3.1 Introduction3.2 Electrostatic Rotary Microactuator with Improved Shaped Design3.2.1 Performance Limitation of Conventional Parallel-PlateElectrodes3.2.2 ESRM with Tilted 78838485878891929292949597979899100
3.2.33.2.4Requirements for Optimum Shaped ElectrodesForce Generation Computations of Rotary Actuatorwith Conventional and Tilted Configurations3.2.4.1 Actuation Force Computationfor Conventional Configuration3.2.4.2 Force Generation Computationfor Tilted Configuration3.2.5 Torque-Generating Capability of the Rotary Actuatorwith Tilted Configuration3.2.6 Optimum Curve Shape of the Electrodes3.2.6.1 Potential Electrode Shapes3.2.6.2 Normalized Torque as a Functionof Normalized Angular Displacement3-2.6.3 Parametric Requirements for OptimumRotary MicroactuatorUnique Microactuator Design for H H D Applications3.3.1 Introduction3.3.2 Benefits and Design Aspects of a Dual-StageServomechanism (or MEMS Piggyback Actuator)3.3.2.1 Architecture of a Third-GenerationMicroactuator3-3.2.2 Performance Capabilities of the MEMSPiggyback Microactuator3.3.3 Force Generation Capability, Displacement Limit,and Mechanical Resonance Frequency Range3.3.3.1 Electrostatic Force Calculation3.3.3.2 Mechanical Resonance FrequencyCalculation3.3.3.3 Electrode Mass Computation3.3.3.4 Displacement (x) as a Function ofGap Size (g) and Number of Electrodes (N)Capabilities of Vertical Comb Array Microactuator3.4.1 Structural Requirements and Critical Design Aspectsof VCA Actuator3.4.2 VCAM Performance Comparison with OtherActuators3.4.3 Potential Comb Finger ShapesCapabilities of Bent-Beam Electrothermal Actuators3.5.1 Performance Capabilities and Design Configurationof Bent-Beam Electrothermal 0122123123125126127129130130133133
3.5.2 Brief Description of the BBET Structure3.5.3 Input Power Requirements for BBET Actuators3.6 SummaryReferences4Packaging, Processing, and Material Requirementsfor MEMS Devices4.1 Introduction4.2 Packaging and Fabrication Materials4.2.1 Packaging Material Requirements and PackagingProcesses4.2.1.1 Sealing Methods4.2.2 Effects of Temperature on Packaging4.2.3 Effect of Pressure on Packaging and Device Function4.2.4 Fabrication Aspects for MEMS Devices IncorporatingNanotechnology4.2.4.1 Thin-Film Capping Requirementsfor MEMS Devices4.2.4.2 Chip Capping and Bonding Requirements4.2.4.3 Transition and Feedthrough Requirementsfor MEMS Devices4.2.4.4 Material Requirements for PiezoelectricActuators4.2.4.5 Material Requirements for StructuralSupport, Electrodes, and Contact Pads4.2.4.6 Requirements for Electrodepositionand Electroplating Materials4.3 Impact of Environments on MEMS Performance4.3.1 Impact of Temperature Variations on Coefficientof Thermal Expansion4.3.2 Effects of Temperature on Thermal Conductivityof Materials Used in MEMS4.3.3 Special Alloys Best Suited for MEMS Applications4.3.3.1 Benefits of CE-Alloys in RF/MicrowaveMEMS Packaging4.3.3.2 Benefits of CE-Alloys for Thermal BackingPlates4.3.3.3 Benefits of CE-Alloys in Integrated CircuitAssemblies4.3.4 Bulk Materials Best Suited for Mechanical Designof MEMS 9150151153153154155156159160160161161
X 4.4Material Requirements for Electrostatic Actuator Components4.4.1 Material Properties for MEMS Membranes4.4.2 Sacrificial Material Requirements for MEMS Devices4.4.3 Three-Dimensional Freely Movable MechanicalStructure Requirements4.5 Substrate Materials Best Suited for Various MEMS Devices4.5.1 Soft Dielectric Substrates4.5.2 Hard Dielectric Substrates4.5-3 Electrical Properties of Soft and Hard Substrates4.5.4 Glass-Ceramic Hybrid Substrate for MEMS4.5.5 Para-Electronic Ceramic Substrates for MEMSApplications4.5.6 Insulation and Passivation Layer Materials4.5.7 Material Requirements for MEMS in Aerospace Systems4.6 SummaryReferences5RF-MEMS Switches Operating at Microwaveand mm-Wave Frequencies5.1 Introduction5.2 Operating Principle and Critical Performance Parametersof MEMS Devices5.2.1 Critical Performance Parameters Affectedby Environments5.2.2 Two Distinct Configurations of RF-MEMS Switchesand Design Aspects5.3 Performance Capabilities and Design Aspects of RF-MEMSShunt Switches5.3.1 Electrostatic Actuation Requirements for the ShuntSwitch Using Membranes5.3.1.1 Sample Calculations for Spring Constantand Pull-in Voltage5.3.2 Computer Modeling Parameters for MEMSShunt Switch5.3.2.1 Computation of Upstate and DownstateCapacitances5.3.2.2 Current Distribution and Series Resistanceof the MEMS Bridge Structure5.3.2.3 Estimates of Switch Inductanceand Capacitance Parameters5.3.2.4 Insertion Loss in a MEMS 5175177177178180181183183185186187188
5.3.2.55.45.55.65.75.8xiEstimation of Series Resistance of the Bridge andImpact of Switch Inductance on the Isolation1895.3.2.6 Typical Upstate and Downstate InsertionLosses in a MEMS Shunt Switch191MEMS Shunt Switch Configuration for High Isolation1925.4.1 Tuned Two-Bridge Design and Its PerformanceCapabilities1935.4.2 Design Aspects and Performance Capabilitiesof Four-Bridge Cross Switch1945.4.2.1 High Isolation with Inductively TunedMEMS Switches1965.4.3 MEMS Shunt Switches for Higher mm-Wave Frequencies . 1975.4.3.1 W-Band MEMS Shunt-Capacitive Switch1975.4.3.2 Switching Speed of M E M S Shunt Switches199MEMS Switches Using Metallic Membranes2015.5.1 Introduction2015.5.2 Operating Principle and Design Aspects of CapacitiveMembrane Switches2015.5.3 RF Performance Parameters of Membrane Shunt Switch209RF-MEMS Switches with Low-Actuation Voltage2105.6.1 Introduction2105.6.2 Fabrication Process Steps and Critical Elementsof the Switch2115.6.3 Reliability Problems and Failure Mechanismsin the Shunt MEMS Switches2115.6.4 RF Performance Capabilities213RF-MEMS Series Switches2135.7.1 Introduction2135.7.2 Description and Design Aspects of the MEMSSeries Switch2135.7.3 Fabrication Process Steps and Switch OperationalRequirements2155.7.4 RF Design Aspects2175.7.5 RF Performance Parameters of the Switch217Effects of Packaging Environments on the Functionalityand Reliability of the MEMS Switches2185.8.1 Introduction2185.8.2 Impact of Temperature on the Functionalityand Reliability2185.8.3 Impact of Pressure on Switch Reliabilityand RF Performance219
5.8.4Effects of Zero-Level Packaging on MEMS SwitchPerformance5.9Packaging Material Requirements for MEMS Switches5.9.1 Properties and Applications of CE-Alloysfor RF-MEMS Devices and Sensors5.10 SummaryReferencesRF/Microwave MEMS Phase Shifter6.1Introduction6.2Properties and Parameters of C P W Transmission Lines6.2.1 Computations of C P W Line Parameters6.3Distributed MEMS Transmission-Line Phase Shifters6.3.1 Introduction6.3.2 Computations of D M T L Parameters6.3.2.1 Bragg Frequency Computations6.3.2.2 Computations of Bridge Impedance (2ГВ)and Phase Velocity (Vp)6.3.2.3 Insertion Loss in the D M T L Section6.4Design Aspects and D M T L Parameter Requirementsfor T T D Phase Shifters Operating at mm-Wave Frequencies6.4.1 Computations of Unloaded Line Impedance (Zu\),Line Inductance, and Capacitance per UnitLength of the Transmission Line6.4.2 Digital MEMS Distributed X-Band Phase Shifter6.4.3 Design Procedure for mm-Wave D M T L Phase Shifters6.4.4 Expression for Phase Shift6.4.5 Optimized Design Parameters for a W-Band D M T LPhase Shifter6.5Two-Bit MEMS D M T L Phase Shifter Designs6.5.1 Design Parameters and Performance Capabilitiesof 2-Bit, X-Band Phase Shifter6.5.2 Insertion Loss in a D M T L Phase Shifter6.5.3 Digital Version of the D M T L Phase Shifterwith 360 Phase Capability6.5.3.1 Design Parameter Requirements for Digital,360 Phase Shifter6.5.3.2 Insertion Loss Contributed by MIMCapacitors and Its Effect on C P W Line Loss6.5.3.3 Phase Noise Contribution from D M T LPhase 238239240241242244245247248249250250252253
Multi-Bit Digital Phase Shifter Operating at / f a n d K3Frequencies6.6.1Introduction6.6.2Design Aspects and Critical Elements of the M D D MPhase Shifter6.7Ultrawide Band Four-Bit True-Time-Delay M E M S PhaseShifter Operating over dc-40 G H z6.7.1Introduction6.7.2Design Requirements and Parameters to MeetSpecific Performance for a Wideband 4-Bit, T T DPhase Shifter6.7.3Performance Parameter of the Device6.8Two-Bit, V-Band Reflection-Type MEMS Phase Shifter6.8.1Introduction6.8.2Design Aspects and Performance Capabilities6.9Three-Bit, Ultralow Loss Distributed Phase Shifter Operatingover K-Band Frequencies6.9.1Introduction6.9.2Design Aspects, Operating Principle, and Descriptionof Critical Elements6.10 Three-Bit, V-Band, Reflection-Type Distributed MEMSPhase Shifter6.10.1 Design Aspects and Critical Performance Parameters6.10.2 RF Performance of the 3 dB C P W Couplerand the 3-Bit, V-Band Phase Shifter6.10.3 Maximum Phase Shift Available from a MultibridgeD M T L Phase Shifter6.11 SummaryReferencesXIII6.67Applications of Micropumps and Microfluidics7.1Introduction7.2Potential Applications of Micropumps7.3Design Aspects of Fixed-Valve Micropumps7.3.1Models Most Suited for Performance Optimization7.3.2Reliable Modeling Approach for MPs with Fixed Valves.7.3.2.1 Electrical and Mechanical Parametersfor Low-Order Model7.3.2.2 Mathematical Expression for Critical PumpParameters7.3.2.3 Chamber 66266267267269270271271272272273273274275276
7.3.2.4Fluidic Valve Parameters and TheirTypical Values7.3.2.5 Description of Micropumps withStraight-Channel Configurations7.3.2.6 Impact of Viscosity and MembraneParameters on Valve Performance7.4 Dynamic Modeling for Piezoelectric Valve-Free Micropumps7.4.1 Introduction7.4.2 Modeling for the Piezoelectric Valve-Free Pump7.4.3 Natural Frequency of the Micropump System7.4.4 Pump Performance in Terms of Critical Parameters7.5 Design Aspects and Performance Capabilities of anElectrohydrodynamic Ion-Drag Micropump7.5.1 Introduction7.5.2 Design Concepts and Critical Parametersof an E H D Pump7.5.3 Benefits of E H D Ion-Drag Pumps7.5.4 Critical Design Aspects of Ion-Drag Pumpand Electrode Geometries7.6 Capabilities of a Ferrofluidic Magnetic Micropump7.6.1 Introduction7.6.2 Design Aspects and Critical Performance Parameters7.6.3 Operational Requirements for Optimum PumpPerformance7.7 SummaryReferencesMiscellaneous MEMS/Nanotechnology Devices and Sensorsfor Commercial and Military Applications8.1 Introduction8.2 MEMS Varactors or Tunable Capacitors8.2.1 Benefits and Shortcomings of MEMS Varactors8.2.2 MEMS Varactor Design Aspects and FabricationRequirements8.2.3 Effects of Nonlinearity Generated by MEMSCapacitors8.3 Micromechanical Resonators8.3.1 Introduction8.3.2 Types of Micro-Resonators and Their 11311
8.3.38.48.58.68.78.88.9Free-Free Beam H i g h - Q Micro-Resonators8.3.3.1 Structural Design Aspects and Requirementsof FFB Micro-Resonators8.3.3.2 Operational Requirements and ParametersFFB Micro-Resonator8.3.4 Folded-Beam Comb-Transducer Micro-Resonator8.3.5 Clamped-Clamped Beam Micro-Resonator8.3.5.1 Effects of Environmental Factorson Micro-Resonator Performance8.3.5-2 Performance Summary of VariousMicromechanical ResonatorsMicromechanical Filters8.4.1 Micromechanical Filter Design Aspects8.4.2 Critical Elements and Performance Parametersof Micromechanical Filters8.4.3 Performance Summary of a Two-ResonatorHigh-Frequency FilterTransceivers8.5.1 Introduction8.5.2 Transceiver Performance Improvement from Integrationof Micromechanical Resonator TechnologyOscillator Using Micromechanical Resonator Technology8.6.1 Design Concepts and Performance Parametersof the 16.5 kHz OscillatorV-Band MEMS-Based Tunable Band-Pass Filters8.7.1 Introduction8.7.2 Design Parameters and Fabrications Techniquesfor a V-Band MEMS-Filter8.7.3 Performance Parameters of a V-Band, Two-StageMEMS Tunable FilterMEMS-Based Strain Sensors8.8.1 Introduction8.8.2 Design Aspects and Requirements for Strain SensorInstallation and Calibration8.8.3 Gauge Factor ComputationMEMS Interferometric Accelerometers8.9.1 Introduction8.9.2 Design Aspects and Requirementsfor an Interferometric 9329329330330331331332333333333333336338338338
xvi 8.10MEMS-Based Micro-Heat Pipes8.10.1 Introduction8.10.2 Design Aspects and Critical Parametersof Micro-Heat Pipes8.11 MEMS-Based Thin-Film Microbatteries8.11.1 Introduction8.11.2 Critical Design Aspects and Requirementsfor the 3-D, Thin-Film Microbatteries8.11.3 Projected Performance Parameters of a 3-D,Thin-Film Microbattery8.11.4 Unique Features and Potential Applicationsof Microbatteries8.12 SummaryReferences9Materials for MEMS and Nanotechnology-Based Sensorsand Devices9.1Introduction9.2Photonic Crystals9.2.1Photonic Bandgap Fiber9.2.2Core Material Requirements for PCF9.2.3Unique Properties of PCFs and Their PotentialApplications9.3Nanotechnology-Based Materials and Applications9.3.1Nanocrystals9.3.2Photonic Nanocrystals9.3.3Nanowires and Rods and Their Applications9.3.3.1 Zinc Oxide Nanowires9.3.3.2 Silicon Nanowires9.3.3.3 Zinc Selenium Nanowires9.3.3.4 Zinc Phosphide Nanowires9.3.3.5 Cadmium Sulfide Nanowires9.3.3.6 Iron-Gallium Nanowires9.4Nanoparticles9.5Quantum Dots9.5.1Applications of Quantum Dots9.5.2Unique Security Aspects of Quantum Dots9.5.3Lead Sulfide Quantum Dots with Nonlinear Properties.9.6Nanobubbles9.6.1Applications of Nanobubbles9.7MEMS Deformable 364365365366366
9.7.1 Applications of MEMS Deformable MirrorsCarbon Nanotubes and C N T Arrays9.8.1 Potential Applications of C N T Arrays9.8.1.1 Nanostructures/Nanocomposites UsingC N T Arrays9.8.1.2 C N T s as Field Emitters or Electron Sources9.8.1.3 C N T Technology for Biosensor Chemicaland Environmental Applications9.8.1.4 Nanotube Arrays for ElectrochemicalActuators9.8.1.5 Nanotube Probes and Dispensing DevicesNanotechnology- and MEMS-Based Sensors and Devicesfor Specific Applications9.9.1 Acoustic Sensors Using Nanotechnologyfor Underwater Detection Applications9.9.2 MEMS Technology for mm-WaveMicrostrip Patch Antennas9.9.3 Carbon Nanotube-Based Transistors and Solar Cells9.9.4 Nanotechnology-Based Sensors for Weapon Healthand Battlefield Environmental Monitoring Applications9.9.4.1 Nanotechnology-Based Sensors to MonitorWeapon Health9.9.4.2 Nanotechnology-Based Sensors to MonitorBattlefield Environmental Conditions9.9.5 MEMS-Based Gyros and Applications9.9.6 MEMS-Based Accelerometers and Applications9.9.7 Material Requirements and Propertiesfor MEMS- and NT-Based Sensors and Devices9.9.7.1 Introduction9.9.7.2 Material Requirements for Fabricationof MEMS Sensors and Devices9.9.7.3 Properties of Materials Requiredfor Mechanical Design of MEMS Devices9.9.7.4 Properties of Materials Requiredfor Thermal Design of MEMS 3374374374376376379379379380380381382383
1.8.1 Nanotechnology-Based Laser Scanning Systems 30 1.8.2 MEMS-Based Sensors for Detection of Chemical and Biological Threats 31 1.8.3 Potential Applications of Nanophotonic Sensors and Devices 31 1.8.4 MEMS Technology for Photonic Signal Processing and Optical Communications 32 1.9 MEMS Technology for Medical Applications 33 1.10 MEMS .
JAWAHARLAL NEHRU TECHNOLOGICAL UNIVERSITY ANANTAPUR B. Tech III-ISem. (ECE) L T P C 3 1 0 3 15A04506 -MEMS & MICRO SYSTEMS (MOOCS-I) UNIT I Introduction:Introduction to MEMS & Microsystems, Introduction to Microsensors, Evaluation of MEMS, Microsensors, Market Survey, Application of MEMS, MEMS Materials, MEMS
MEMS based IMUs are displacing other technologies MEMS gyros are making great strides in displacing ring laser gyroscopes (RLG) and fiber optic gyroscopes (FOG). Conventional systems typically 7-8,000 each. The new MEMS systems will be considerably lighter and should cost 1,200 to 1,500 each. 10 of the top 12 IMU suppliers are .
MEMS Resonators The highest frequency, though, is limited by the thickness of the material. For t ˇ15 m, the frequency is about 200MHz. MEMS resonators have been demonstrated up to GHz frequencies. MEMS resonators are an active research area. . Crystal and MEMS Oscillators (XTAL) .
Nanotechnology in Cancer 15 years Perspective 2020 NSF Nanoscale Science and Engineering Portal Piotr Grodzinski . Number of nanotechnology R01 applications to NCI has been growing rapidly; Alliance Nanotechnology program acted as a seed and enabler to expanding NCI nanotechnology
nanotechnology can provide to breast cancer therapy, nanotechnology may in fact become the panacea for scientists, practitioners, and patients. Workshop 4: Nanotechnology in Cosmetics Nanotechnology is being used today in various aspects of cosmetic manufacturing. It is believed that this new technolo-gy can improve the product quality and .
Other examples of sensors Heart monitoring sensors "Managing Care Through the Air" » IEEE Spectrum Dec 2004 Rain sensors for wiper control High-end autos Pressure sensors Touch pads/screens Proximity sensors Collision avoidance Vibration sensors Smoke sensors Based on the diffraction of light waves
Micro-Masonry of MEMS Sensors and Actuators Yong Zhang, Hohyun Keum, Kidong Park, Rashid Bashir, and Seok Kim Abstract—Micro-masonry is a route to microassembly that involves elastomeric-stamp-based micromanipulation and direct bonding. This paper presents the assembly of MEMS mechanical sensors and actuators using micro-masonry .
This, too, is still basic to conventional literary criticism and is also open to seriou objection. De Wette in 1805 assigned Deuteronomy to the time of Josiah, such that pentateuchal matter considered dependent on Deuteronomy would be still later than it; 160 years later this is still commonly held, despite opposition. In the first half of the 19th century rival theses arose alongside the .
