Executive Presentation For AirFrame Open Edge Server

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OPEN EDGETomi Männikkö HW Architect, NOKIA25th June, 20191 2018 Nokia

AirFrame open edge server: 5G performance in compact sizeFirst x86 solution designed to fully support edge / far-edge cloud deploymentsARCHITECTUREEnvironmental19” compatible: fits in any 600mm deep cabinetCompact form factor: 3RU high chassisSleds either 1RU or 2RU highFully front-operated (cabling, open rack-liketool less serviceability) Support for high end accelerators High availability: No SPOFs, redundant fans, hot swap storage Redundant fans; air flow configurable front to rear/rear to front Full NEBS compliancy,seismic zone 4 [GR-63Core, GR-1089-Core] Extended operatingtemperature range:-5C. 45C [ETSI EN300019-1-3 Class 3.2]DIMENSIONSPOWERMANAGEMENTCOMMODITY 130.6 (3RU) x 440 x 430 mm (Hx W x D) Ca. 12.0 kg / 26.5 lbs. (Chassiswith PSU’s and RMC) 2N redundant AC & DCpower supplies Power fed to sleds throughbackplane 400W per 1U sled All sleds managed throughsingle interface in RMC unit On board BMC(in server sleds) Memories, disks and NICsfrom common AirFrameportfolioUltra-small footprint2 2018 Nokia support on server sleds

AirFrame open edge server – 1U sledIntel Xeon SP next genProcessor (single socket) Intel Xeon SP, up to 24cores, 2,4GHzChipset Intel C621/C627Thermal Max. CPU TDP support: 205W Four redundant fans per node; air flow front torear/rear to frontDimensions, weight 41 x 215x 427mm (H x W x D) 3.4 kg / 7.5 lbs.****) Server node with CPU and heatsink3 2018 NokiaMemory DIMM slots: 6 typical (8 max) DIMM type: 16GB / 32GB /64GB - DDR4 RDIMM 2933MHzStorage 2x 2,5” Hot-plug bays for 7/9.5mm SATA / NVMe drives 2x internal M.2 2280 or 22110devicesManagement Redfish, IPMI v2.0 Compliant,on board BMC Access through RMC unitSecurity TPM 1.2/ 2.0Expansion Slots 1x PCIe Gen3 x16 OCPmezzanine slot 1x PCIe Gen3 x16 FHHL PCIe slot

AirFrame open edge server – 2U sledIntel Xeon SP next genProcessor (single socket) Intel Xeon SP, up to 24cores, 2,4GHzChipset Intel C621/C627Thermal Max. CPU TDP support: 250W Two redundant dual rotor fans per node; air flowfront to rear/rear to frontDimensions, weight 83 x 215x 427mm (H x W x D) 4.7 kg / 10.4 lbs.****) Server node with CPU and heatsink4 2018 NokiaMemory DIMM slots: 6 typical (8 max) DIMM type: 16GB / 32GB /64GB - DDR4 RDIMM 2933MHzManagement Redfish, IPMI v2.0 Compliant,on board BMC Access through RMC unitStorage 2x 2,5” Hot-plug bays for7/9.5/15 mm SATA / NVMedrives 2x 2,5” Hot-plug bays for 7/9.5mm SATA / NVMe drives 2x internal M.2 2280 or 22110devicesSecurity TPM 1.2/ 2.0Expansion Slots 1x PCIe Gen3 x16 OCPmezzanine slot 1-2x PCIe Gen3 x8/x16 FHHL slot 1x PCIe Gen3 x16 FHFL double wideslot

Open Edge Chassis building blocksChassis (3RU)AC PSUDC PSURMC unit5 2018 NokiaAirFrame open edge server Public

Open Edge server storage options6Solid State Disks (SATA) Form factor: Interface: hot-plug2.5”, 7/9 mmSATASolid State Disks (NVMe) Form factor: Interface: hot-plug2,5”, 7mm /15mmPCIeFlash device on-board Form factor: Interface: Dual M.2 riseron motherboardM.2 (2280/22110)SATA / PCIe 2018 Nokia

HW details7 2018 NokiaAirFrame open edge server Public

Open edge chassis overviewKey specifications 3U, 19” mountable (EIA-310 compatible) 130.6 x 440 x 430 mm (H x W x D) 1U and 2U, half width sleds are supported Redundant, centralized power supply 2000 W max power feed capacity, 80 Platinum AC (100.127/ 200.240 VAC) and DC (-48 VDC) options Sled power feed capacity 400 W (1U sled), 700 W(2U sled), 12 VDC8 2019 Nokia

Open edge chassis overviewKey specifications Cooling: Fan units are part of sled solution Air flow direction configurable: front to rear/rear to front Chassis management controller (RMC) PSU management (control, sensors, .) Management Ethernet interface to sleds 1 GE to all sleds via backplane 1x 1 GE (RJ45) 2x 10 GE (SFP ) front panel interface forexternal connectivity and chaining of multiple chassis Power distribution board and chassis backplaneprovide connectivity between RMC, sleds andPDUs9 2019 Nokia

Open edge chassis front viewPSU110 2018 NokiaPSU2RMC1U / 2U sleds

1U and 2U sleds are supported Open edge chassis allows flexibleinstallation of both 1U and 2Usleds5x 1U Supported configurations are 5x 1U 3x 1U 1x 2U 1x 1U 2x 2U A support bracket for 1U sled isremoved when installing a 2Usled (tool-less)11 2018 Nokia1x 1U 2x 2U

Server sled, 1UKey specifications 1U, half width215 mm x 41 mm x 423 mm (W x H x D)Power consumption 400 W, maxSingle-socket CPU, Intel Xeon Scalable Family,Thermal Design Power (TDP): max. 205 WPCH options: Intel C621, C627 (with QAT)Memory: 6 x DDR4-2933 2 x Intel Optane PMMSingle riser for disks and add-in cardsExtension slots PCIe x16, FHHL, 75 W OCP Mezzanine 2.0, PCIe x16 Storage 12 2019 Nokia2 x hot-plug SSD, SATA/NVMe, 2.5 ”, 7/9.5 mm2 x M.2 SSD, SATA/NVMe, 2280/22110

Server sled, 2UKey specifications 2U, half width215 mm x 83.6 mm x 423 mm (W x H x D)Power consumption 700 W, maxSingle-socket CPU, Intel Xeon Scalable Family,Thermal Design Power (TDP): max. 250 WPCH options: Intel C621, C627 (with QAT)Memory: 6 x DDR4-2933 2 x Intel Optane PMMSingle riser for disks and add-in cardsExtension slots (depending on riser option) 1 x PCIe x16, FHFL, dual-wide, 300 W max1-2 x PCIe x8/x16, FHHL, 75 W maxOCP Mezzanine 2.0, PCIe x16 Storage 132 x hot-plug SSD, SATA/NVMe, 2.5 ”, 7/9.5 mm2 x hot-plug SSD, SATA/NVMe, 2.5 ”, 7/9.5/15 mm2 x M.2 SSD, SATA/NVMe, 2280/22110 2019 Nokia

RMCManagement unitChassis management controller (RMC) PSU management (control, sensors, .) Control and supervision of PSUs Access to sensor data (voltages, currents, powerconsumption) RMC controller from AST2500 family USB debug port in front panel On-board unmanaged Ethernet switch simplifies HWmanagement connectivity 14Single management interface for entire chassis 1 GE management Ethernet interface to all sleds via backplane(1000BASE-T) 1x 1 GE (RJ45, 1000BASE-T) 2x 10 GE (SFP ) front panel interface for external connectivity andchaining of multiple chassis 2018 Nokia

Key environmental and regulatory compliancyOperating conditions Operating temperature range: -5 C 45 C [ETSI EN300019-1-3 Class 3.2] Short term operating temperature: -5 C to 55 C [GR-63CORE] Operating humidity: 5 % to 95 %EMC15Safety Seismic tolerance EN300386 (v1.6.1) FCC CFR47 15 (class A), CISPR 22/32 (class A) CISPR 24 TEC/EMI/TEL-001/01/FEB-09 and TEC/IR/SWN2MB/07/MAR-10 GR-1089-CORE 2018 NokiaGR-63-CORE (Zone 4)Acoustic noise IEC 62368-1:2014GR-1089-CORE (electrical safety, grounding andbonding)GR-63-CORE (equipment room criteria)Fire resistance GR-63-CORE (shelf level criteria)

Nokia contribution to OCP Nokia has contributed Open edge server chassis specification and design files and applied forOCP accepted recognition. The contribution has been accepted by the Open Compute Telco/openEdge workgroup andOCP incubation committee in March 2019. Telcos/openEdge Wiki GE16 2018 Nokia

Please join the open edge ecosystem development- Dial-in into regular Open edge project callsVisit Nokia booth at coming Regional OCP Summit inAmsderdam17 2018 Nokia

Thank you18 2018 Nokia

AirFrame open edge server –1U sled Intel Xeon SP next gen Processor (single socket) Intel Xeon SP, up to 24cores, 2,4GHz Chipset Intel C621/C627 Thermal Max. CPU TDP support: 205W Four redundant fans per node; air flow front to rear/rear to front Management Redfi

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