CSPEMI400 - SIM Card EMI Filter Array With ESD Protection
CSPEMI400GSIM Card EMI Filter Arraywith ESD ProtectionProduct DescriptionThe CSPEMI400G is an EMI filter array with ESD protection,which integrates three pi filters (C R C) and two additional channelsof ESD protection. The CSPEMI400G has component values of 20 pF 47 W 20 pF, and 20 pF 100 W 20 pF. The parts includeavalanche type ESD diodes on every pin, which provide a very highlevel of protection for sensitive electronic components that may besubjected to electrostatic discharge (ESD). The ESD diodes connectedto the filter ports safely dissipate ESD strikes of 10 kV, exceeding themaximum requirement of the IEC 61000 4 2 international standard.Using the MIL STD 883 (Method 3015) specification for HumanBody Model (HBM) ESD, the pins are protected for contactdischarges at greater than 25 kV.The ESD diodes on pins A4 and C4 ports are designed andcharacterized to safely dissipate ESD strikes of 10 kV, well beyondthe maximum requirement of the IEC 61000 4 2 internationalstandard.This device is particularly well suited for portable electronics (e.g.mobile handsets, PDAs, notebook computers) because of its smallpackage format and easy to use pin assignments. In particular, theCSPEMI400G is ideal for EMI filtering and protecting data lines fromESD for the SIM card slot in mobile handsets.The CSPEMI400G is available in a space saving, low profile ChipScale Package with lead free finishing.Features Three Channels of EMI Filtering, each with ESD ProtectionTwo Additional Channels of ESD Only Protection 10 kV ESD Protection (IEC 61000 4 2, Contact Discharge) 25 kV ESD Protection (HBM)Greater than 30 dB of Attenuation at 1 GHz10 Bump, 1.960 mm x 1.330 mm Footprint Chip Scale Package(CSP)These Devices are Pb Free and are RoHS Complianthttp://onsemi.comWLCSP10CASE 567BLMARKING DIAGRAM AGAG CSPEMI400GORDERING INFORMATIONDeviceCSPEMI400GPackageShipping†CSP 10(Pb Free)3500/Tape & Reel†For information on tape and reel specifications,including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging SpecificationBrochure, BRD8011/D.Applications SIM Card Slot in Mobile Handsets I/O Port Protection for Mobile Handsets, Notebook Computers,PDAs, etc. EMI Filtering for Data Ports in Cell Phones, PDAs or NotebookComputers Semiconductor Components Industries, LLC, 2012January, 2012 Rev. 41Publication Order Number:CSPEMI400/D
CSPEMI400GELECTRICAL SCHEMATICR1R2A1C1CA2C2CCCGNDR1A3C3CA4C5CCCR1 100 WR2 47 WB1,B2PACKAGE / PINOUT DIAGRAMSTable 1. PIN DESCRIPTIONSTypePinDescriptionEMIFilterA1EMI Filter with ESD Protection for RSTSignalC1EMI Filter with ESD Protection for RSTSignalAA2EMI Filter with ESD Protection for CLKSignalBC2EMI Filter with ESD Protection for CLKSignalDeviceGroundB1Device GroundB2Device GroundEMIFilterA3DAT EMI Filter with ESD ProtectionEMIFilterTop View(Bumps Down View)4123OrientationMarking(see Note) AGCBottom View(Bumps Up View)C3DAT EMI Filter with ESD ProtectionESDChannelA4ESD Protection Channel VCC SupplyESDChannelC4ESD Protection ChannelOrientationMarkingC1A1A1C2C3 C4B1B2A2A3A4CSPEMI400GCSP PackageNote: Lead free devices are specified by using a “ ” characterfor the top side orientation mark.SPECIFICATIONSTable 2. ABSOLUTE MAXIMUM RATINGSParameterRatingUnits 65 to 150 CDC Power per Resistor100mWDC Package Power Rating300mWStorage Temperature RangeStresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above theRecommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affectdevice reliability.Table 3. STANDARD OPERATING CONDITIONSParameterOperating Temperature Rangehttp://onsemi.com2RatingUnits 40 to 85 C
CSPEMI400GTable 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)SymbolMinTypMaxUnitsR1Resistance of R180100120WR2Resistance of R2384756WCCapacitanceVIN 2.5 VDC, 1 MHz,30 mV ac162024pFStand off VoltageI 10 mAILEAKDiode Leakage CurrentVBIAS 3.3 VVSIGSignal VoltagePositive ClampNegative ClampILOAD 10 mAILOAD 10 mAVESDIn system ESD Withstand Voltagea) Human Body Model, MIL STD 883, Method 3015b) Contact Discharge per IEC 61000 4 2(Notes 2 and 4)Clamping Voltage during ESD DischargeMIL STD 883 (Method 3015), 8 kVPositive TransientsNegative Transients(Notes 2, 3 and 4)fC1Cut off frequencyZSOURCE 50 W, ZLOAD 50 WR 100 W, C 20 pF77MHzfC2Cut off frequencyZSOURCE 50 W, ZLOAD 50 WR 47 W, C 20 pF85MHzVSTANDOFFVCLParameterConditions6.0V3005.6 1.56.8 0.89.0 0.4nAVkV 25 10V 12 71. TA 25 C unless otherwise specified.2. ESD applied to input and output pins with respect to GND, one at a time.3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clampingvoltage is measured at Pin C1.4. Unused pins are left open.http://onsemi.com3
CSPEMI400GPERFORMANCE INFORMATIONTypical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)Figure 1. A1 C1 EMI Filter PerformanceFigure 2. A2 C2 EMI Filter Performancehttp://onsemi.com4
CSPEMI400GPERFORMANCE INFORMATION (Cont’d)Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)Figure 3. A3 C3 EMI Filter PerformanceFigure 4. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5 VDC)http://onsemi.com5
CSPEMI400GAPPLICATION INFORMATIONThe CSPEMI400G provides a bidirectional filter and protector for all the signals and the power line on the SIM (subscriberidentity module) card connector. SIM cards are found in all GSM cellular phones and in some other handheld devices or cardreaders. The ESD diodes protect the controller against possible ESD strikes that may occur when the connector pins are exposedduring direct contact, or during insertion of the SIM card into the card slot. The EMI filter suppresses all high frequency noise,preventing the unwanted EMI signals from both entering and exiting the main board. The signals that interface with the SIMcard are the Reset, the Clock and the bidirectional data I/O, as shown in Figure 5.Note: One channel of the CSPEMI400G with a zenerdiode is not shown on the diagram.Figure 5. Typical Application Diagram for the SIM Card InterfaceFor best filter and ESD performance, both GND bumps (B1, B2) of the CSPEMI400G should be directly connected to theGround plane. A small capacitor of about 1 mF is required next to the VCC pin of the SIM connector in order to improve stabilityof the SIM card supply rail.http://onsemi.com6
CSPEMI400GAPPLICATION INFORMATIONParameterValuePad Size on PCB0.240 mmPad ShapeRoundPad DefinitionNon Solder Mask defined padsSolder Mask Opening0.290 mm RoundSolder Stencil Thickness0.125 mm 0.150 mmSolder Stencil Aperture Opening (laser cut, 5% tapered walls)0.300 mm RoundSolder Flux Ratio50/50 by volumeSolder Paste TypeNo CleanPad Protective FinishOSP (Entek Cu Plus 106A)Tolerance Edge To Corner Ball 50 mmSolder Ball Side Coplanarity 20 mmMaximum Dwell Time Above Liquidous60 secondsMaximum Soldering Temperature for Lead free Devices using a Lead free Solder Paste260 CNon Solder Mask Defined Pad0.240 mm DIA.Solder Stencil Opening0.300 mm DIA.Solder Mask Opening0.290 mm DIA.Figure 6. Recommended Non Solder Mask Defined Pad IllustrationTemperature (5C)2502001501005001:00.02:00.03:00.0Time (minutes)4:00.0Figure 7. Lead free (SnAgCu) Solder Ball Reflow Profilehttp://onsemi.com7
MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSWLCSP10, 1.96x1.33CASE 567BL 01ISSUE OSCALE 4:1PIN A1REFERENCE2XÈÈDADATE 26 JUL 2010NOTES:1. DIMENSIONING AND TOLERANCING PERASME Y14.5M, 1994.2. CONTROLLING DIMENSION: MILLIMETERS.3. COPLANARITY APPLIES TO SPHERICALCROWNS OF SOLDER BALLS.BEDIMAA1A2bDEeDeE0.05 C2X0.05 CTOP VIEWÉÉÉÉÉÉOptiGuard Option0.05 CA2RECOMMENDEDSOLDERING FOOTPRINT*A0.05 CNOTE 3A1MILLIMETERSMINMAX0.720.560.210.270.40 REF0.290.351.96 BSC1.33 BSC0.50 BSC0.435 BSCCSIDE VIEW0.25SEATINGPLANEA10.25PACKAGEOUTLINEeD10X0.05 C A B0.03 C0.87eD/2beEC0.44B0.50PITCHA1 2 34 5 6BOTTOM VIEWDOCUMENT NUMBER:DESCRIPTION:98AON49820EWLCSP10, 1.96X1.3310X0.25DIMENSIONS: MILLIMETERS*For additional information on our Pb Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.Electronic versions are uncontrolled except when accessed directly from the Document Repository.Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.PAGE 1 OF 1ON Semiconductor andare trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others. Semiconductor Components Industries, LLC, 2019www.onsemi.com
ON Semiconductor andare trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patentcoverage may be accessed at www.onsemi.com/site/pdf/Patent Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liabilityarising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/orspecifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customerapplication by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are notdesigned, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classificationin a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorizedapplication, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, andexpenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if suchclaim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. Thisliterature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATIONLITERATURE FULFILLMENT:Email Requests to: orderlit@onsemi.comON Semiconductor Website: www.onsemi.com TECHNICAL SUPPORTNorth American Technical Support:Voice Mail: 1 800 282 9855 Toll Free USA/CanadaPhone: 011 421 33 790 2910www.onsemi.com1Europe, Middle East and Africa Technical Support:Phone: 00421 33 790 2910For additional information, please contact your local Sales Representative
during direct contact, or during insertion of the SIM card into the card slot. The EMI filter suppresses all high frequency noise, preventing the unwanted EMI signals from both entering and exiting the main board. The signals that interface with the SIM card are the Reset, the Clock and th
EMI FILTER There are several types of filters, for example, passive EMI filter, active EMI filter and hybrid EMI filter. However, the passive EMI filter is simpler than others. A typical procedure used in [4, 5] is considered to design power line EMI filter. A basic network topology is used, C-L-C for DM filter and L-C
4 Q: I am trying to read my SIM card, and the only entry in the phonebook is "See iDen phbk", how can I see the real contacts on the SIM card? A: This means that you have a Nextel iDEN SIM card. The 1.x versions of SIM Manager do not support such SIM cards, which is why you should update to SIM Manager 2.x, which is compatible with Nextel SIM cards.
Design of EMI Filter for Boost PFC Circuit www.iosrjournals.org 54 Page Figure 7: Result of Simulink model of bridge rectifier without EMI filter The circuit with EMI filter is shown below in which the distortion is reduced with combining the bridge rectifier and inductor EMI filter.
Getting a SIM card A nano-SIM (not included) is required in order to set up and use your watch. Contact your network operator to request a nano-SIM with a voice and data plan. Standard Micro Nano Inserting the SIM card Remove the SIM card cover and insert the SIM card. Once inserted, push the SIM card gen
mini-SIM (2FF) micro-SIM (3FF) nano-SIM (4FF) 5 . 3. Insert the micro-SIM card gently into the card tray in the direction shown in the figure below until it clicks. Then close the micro-SIM card cover. Note: To remove the micro-SIM card, gently press the micro-SIM card in until it clic
Caution: Make sure you use the correct size SIM card and don’t cut the SIM card. SIM card insert graphic. After the battery is removed, the SIM card is inserted in the slot on the left with the clipped corner to the upper left. The SDcard is inserted in the right slot. Nano SIM SIM Insert the SIM card with the gold contacts down.
2 SIM card 2 (secondary) 3 microSD card CAUTION Ensure you use only Nano size SIM cards. Do not cut larger SIM cards to fit. 1. Insert SIM card(s) a. Remove tray Insert ejection tool into the tray hole and push to eject tray for SIM and microSD cards. This tray is designed to fit two Nano SIM cards, or one Nano SIM card and one microSD card .
Loughborough College Local Offer Des Gentleman Learner Services Manager des.gentleman@loucoll.ac.uk . 2 Regulation 3 Special Educational Needs and Disability (Information) Regulations (2014) School/College Name: Loughborough College Address: Radmoor Road, Loughborough, Leicestershire Telephone Number: 01509 618375 Principal and CEO: Jo Maher Executive Lead Learner Services: Heather Clarke .
