SCOPE: MICROPROCESSOR SUPERVISORY CIRCUITS Device Type .

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SCOPE:MICROPROCESSOR SUPERVISORY CIRCUITSDevice Type0102Generic NumberMAX696(x)/883BMAX697(x)/883BCase Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:Case OutlinePackage CodeOutline LetterMil-Std-1835MAXIM SMDJEEGDIP1-T16 or CDIP2-T1616 LEAD CERDIPJ16LP2CQCC1-N2020 Pin Leadless ChipL20Absolute Maximum RatingsTerminal VoltageVCC for 01 . -0.3V to 6.0VVCC for 02 . 0.3VVBATT for 01 . -0.3V to 6.0VGND for 02 . -0.3VAll other Inputs 1/ . -0.3V to (VOUT 0.5V)Input CurrentVCC . 200mAVBATT . 50mAGND . 20mAOutput CurrentVOUT . Short-circuit protectedAll other outputs . 20mARate of Rise, VCC, VBATT . 100V/µsLead Temperature (soldering, 10 seconds) . 300 CStorage Temperature . -65 C to 160 CContinuous Power Dissipation . TA 70 C16 lead CERDIP(derate 10.0mW/ C above 70 C) . 800mW20 lead LCC(derate 9.1mW/ C above 70 C) . 727mWJunction Temperature TJ . 150 CThermal Resistance, Junction to Case, ΘJC:Case Outline 16 lead CERDIP. 50 C/WCase Outline 20 leadless Chip carrier . 20 C/WThermal Resistance, Junction to Ambient, ΘJA:Case Outline 16 lead CERDIP. 100 C/WCase Outline 20 leadless Chip carrier . 110 C/WRecommended Operating ConditionsAmbient Operating Range (TA) . -55 C to 125 CSupply Voltage Range (VCC) . 3.0V to 5.5VNOTE 1: The input voltage limits on PFI and WDI may be exceeded if the input current is limited toless than 10mA.Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.These are stress ratings only, and functional operation of the device at these or any other conditions beyondthose indicated in the operational sections of the specifications is not implied. Exposure to absolute maximumrating conditions for extended periods may affect device reliability.----------------------------Electrical Characteristics of MAX696/697/883Bfor /883B and SMD 5962-9312519-2554Page 2 ofRev. D8

TABLE 1. ELECTRICAL TESTS:TESTOperating VoltageRangeSymbolCONDITIONS-55 C TA 125 C 2/Unless otherwise specifiedGroup TSupply CurrentICCBATTERY-BACKUP SWITCHINGOutput VoltageVOUTIOUT 1mAOutput VoltageBattery-BackupModeSupply Current(Excludes IOUT)BATTIOUT 50mAIOUT 250µA, VCC VBATT-0.2VWatchdog TimeoutPeriod, ExternalClockMinimum WDIInput Pulse WidthRESET OutputVoltageVCC-0.31,2,301OUTIOUT 1mA12,3IOUT -------VVCC-0.5VBATT0.1V4701IBATTSupply Current inVCC 0V, VBATT 2.8VBattery-BackupModeBattery StandbyBATT5.5V VCC VBATT 1VLeakage CurrentSLKGBattery-Switchover BATTPower-Up or Power-DownThreshold, VCC toSWTHVBATTBATT ON OutputBATTISINK 1.6mAVoltageONOUTBATTBATT ON OutputBATT ON VOUTONIOSShort-CircuitCurrentBATT ON 0V, VCC 0VRESET AND WATCHDOG TIMINGLow-LineLLINVCC 5V, 3VThresholdReset TimeoutRDELOSC SEL High, VCC 5VDelayWatchdog Timeout WDINTLong period, VCC 5VPeriod, InternalOscillatorShort period, VCC 5VISOURCE 1µA, VCC -2000.020.02 0977682003003.51025secAll910,11Long periodShort periodVIL 0.4V, VIH 4.0V, VCC 5VµA9,10,11All910,119,10,11AllElectrical Characteristics of MAX696/697/883Bfor /883B and SMD 5962-93125All19-2554Page 3 ofmsClockCyclesnsVRev. D8

TESTRESET OutputVoltageLOWLINE OutputVoltageRESET OutputVoltageWDO OutputVoltage HighWDO OutputVoltage LowOutput ShortCircuit CurrentWDI InputThreshold LogicLowWDI InputThreshold LogicHighSymbolRVOLLLVOHLLVOLCONDITIONS2/-55 C TA 125 CUnless otherwise specifiedDevicetypeISINK 1.6mALimitsMinLimitsMaxAll0.4010.41,2,3ISINK 400µA, VCC 0VISOURCE 1µA, VCC 5VUnitsV3.5AllV1,2,30.4ISINK 800µAISOURCE 1µA, VCC 5V3.5VRVOH1,2,3RVOLWDOAll0.4ISINK 1.6mAISOURCE 1µA, VCC 5V1,2,3All3.5VVOHWDO2,3ISINK 800µA0.4V25µA0.80.4VVOLWDIVILRESET, WDO, RESET,LOWLINEVCC 5VNOTE 3WDIVIHVCC 5VIOSNOTE 31,2,3All1.012,3All101023.53.82,3All0102All4.0VWDI VOUTWDI VCCWDI 0VWDI Input CurrentGroup ASubgroup15050-50µAWDIINWDI VOUTWDI VCCWDI 0VPOWER-FAIL DETECTORPFI ncePFI Input CurrentPFIINLLIN InputLLIN1CurrentPFOVOHPFO OutputVoltagePFOVOLPFOIOSPFO Short-CircuitSource 80VCC 3V, 5V1,2,3All1.21.4VVCC 3V, nAISOURCE 1µA, VCC 5V1AllISINK 1.6mAPFI VIH, PFO 0VV2,31,2,3Electrical Characteristics of MAX696/697/883Bfor /883B and SMD 5962-931250.4All1.02519-2554Page 4 ofµARev. D8

TESTSymbolCHIP-ENABLE GATINGCE IN ThresholdCEVILLogic LowCE IN ThresholdCEVIHLogic HighCE INPICE IN Pull-UpCurrentCEVOHCE OUT OutputVoltage HighCE Output Voltage CEVOLLowCE PropagationtPDCEDelayOSCILLATOROSC IN InputOSCIINCurrentOSC SEL InputOSCPull-Up CurrentSELINOSC IN Frequency OSCRangeINfrqOSC IN Frequency OSCINCONDITIONS-55 C TA 125 C 2/Unless otherwise specifiedGroup C RCE 1µA1,2,3020.49VCC 5Vns25010,11OSC SEL 0V, VCC 5VOSC SEL 0V, COSC 47pFNOTE 4V15002VCC 5VµAVOUT-0.5ISOURCE 800µAISINK l9,10,119kHzNOTE 2: VCC full operating range, VBATT 2.8V.NOTE 3: WDI is guaranteed to be in the mid-level (inactive) state if WDI is floating and VCC is in the operatingrange. WDI is internally biased to 38% of VCC with an impedance of approximately 125kΩNOTE 4: Typical for design purposes only but not tested.01010202Package16 pin CERDIP20 pin LCC16 pin CERDIP20 pin LCC----------------------------ORDERING 883BMAX697MLP/883BSMD A5962-9312501M2CElectrical Characteristics of MAX696/697/883Bfor /883B and SMD 5962-9312519-2554Page 5 ofRev. D8

TERMINAL CCVOUT4GNDVCC5BATT ONGND6NCLOWLINE7OSC INBATT ON8OSC SEL9PFI10OSC 1920---------------------------LOWLINEOSC 697L20NCTESTNCVCCLLINNCGNDOSC INOSC SELLOWLINEPFIPFOWDICE OUTCE INWDORESETRESETWDORESETRESETElectrical Characteristics of MAX696/697/883Bfor /883B and SMD 5962-93125OSC INOSC SELNCPFIPFOWDICE OUTNCCE INWDORESETRESET19-2554Page 6 ofRev. D8

QUALITY ASSURANCESampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in MilStd-883.Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015:1. Test Condition, A, B, C, or D.2. TA 125 C minimum.3. Interim and final electrical test requirements shall be specified in Table 2.Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B,C, and D inspection.Group A inspection:1. Tests as specified in Table 2.2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted.Group C and D inspections:a. End-point electrical parameters shall be specified in Table 1.b. Steady-state life test, Method 1005 of Mil-Std-883:1. Test condition A, B, C, D.2. TA 125 C, minimum.3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883.TABLE 2.ELECTRICAL TEST REQUIREMENTSMil-Std-883 Test RequirementsInterim Electric ParametersMethod 5004Final Electrical ParametersMethod 5005Group A Test RequirementsMethod 5005Group C and D End-Point Electrical ParametersMethod 5005*Subgroupsper Method 5005, Table 111*, 2, 3, 9, 10, 111, 2, 3, 9, 10, 111PDA applies to Subgroup 1 only.---------------------------Electrical Characteristics of MAX696/697/883Bfor /883B and SMD 5962-9312519-2554Page 7 ofRev. D8

Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015: 1. Test Condition, A, B, C, or D. 2. TA 125 C minimum. 3. Interim and final electrical test requirements shall be specified in Table 2. Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B,

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