Improved SiC Leadless Pressure Sensors For High .

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Improved SiC Leadless Pressure Sensors For HighTemperature, Low and High Pressure ApplicationsAlexander A. Ned, Anthony D. Kurtz, Glenn Beheim,Fawzia Masheeb, and Sorin StefanescuPresented by:Alexander A. NedKulite Semiconductor Products, Inc.Presented at the 21st Transducer WorkshopLexington Park, MD June 22-23, 2004Sensing Requirements High TemperaturesHigh VibrationTypically 25 psi Up To Few Thousand psiStatic and DynamicSiC Piezoresistive Sensors Expected To Replace Si For Γ 700 C All SiC Design Leadless Packaging ApproachKulite Semiconductor Products, Inc.Presented at the 21st Transducer WorkshopLexington Park, MD June 22-23, 20041

SiC SensorPiezoresistorsMetalNn 6H-SiCPp 6H-SiCNn-typebulk 6H-SiCDiaphragmCross-Sectional View of SiC SensorKulite Semiconductor Products, Inc.Presented at the 21st Transducer WorkshopLexington Park, MD June 22-23, 2004Leadless SiC Sensor ChipMetal Contacts500µmPiezoresistorsDiaphragmKulite Semiconductor Products, Inc.Presented at the 21st Transducer WorkshopLexington Park, MD June 22-23, 20042

Micromachined Diaphragm in SiC Sensor ChipKulite Semiconductor Products, Inc.Presented at the 21st Transducer WorkshopLexington Park, MD June 22-23, 2004Leadless vs. Wirebonded Packaging Methods-with wirebonding-without wirebonding: leadlesssensor chipwirebondsmetal contactspinsconductive pastesensorchippinspackagepackageKulite Semiconductor Products, Inc.Presented at the 21st Transducer WorkshopLexington Park, MD June 22-23, 20043

Sensor Cover Attached to the Sensor Chip UsingHigh Temperature Glass FritSiC coverGglass fritsNon-ConductiveGlass FritSiC pressure sensor chipKulite Semiconductor Products, Inc.Presented at the 21st Transducer WorkshopLexington Park, MD June 22-23, 2004Schematic Cross-Sectional View of the CompositeSensor-Cover ChipHermetic CavitySiC coverContact ThroughHoles to be Filledwith ConductiveGlass Metal FritGglassfritsSiC pressure sensor chipKulite Semiconductor Products, Inc.Presented at the 21st Transducer WorkshopLexington Park, MD June 22-23, 20044

Schematic Drawing of the Sensor HeaderMounting SurfaceCovered With NonConductive Glass FritContact pinsMountingsurfaceGlassKulite Semiconductor Products, Inc.Presented at the 21st Transducer WorkshopLexington Park, MD June 22-23, 2004Schematic Drawing of the Packaged Sensor StructureSensor chipApplied t pinsKulite Semiconductor Products, Inc.Presented at the 21st Transducer WorkshopLexington Park, MD June 22-23, 20045

Leadless SiC SensorKulite Semiconductor Products, Inc.Presented at the 21st Transducer WorkshopLexington Park, MD June 22-23, 2004Leadless SiC SensorKulite Semiconductor Products, Inc.Presented at the 21st Transducer WorkshopLexington Park, MD June 22-23, 20046

Summary SiC vs. Si Low and High Pressure SiC Sensors Fabricatedand Packaged 25-1000 psi Sensor Performance up to 600 CDemonstrated Sensor Performance Consistent With PreviouslyReported Data Low Pressure Sensing – Thin SiC Diaphragm– Finite Element Analysis Sensor Optimization¾ Leadless SiC Sensor Chip¾ Leadless AssemblyKulite Semiconductor Products, Inc.Presented at the 21st Transducer WorkshopLexington Park, MD June 22-23, 20047

Kulite Semiconductor Products, Inc. Presented at the 21st Transducer Workshop Lexington Park, MD June 22-23, 2004 Sensor Cover Attached to the Sensor Chip Using High Temperature Glass Frit SiC pressure sensor chip SiC cover Non-Conductive Gglass frits Glass Frit Kulite Semiconductor

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