3 M Reverse Battery Protection Switch - STMicroelectronics

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VN5R003H-E3 mΩ reverse battery protection switchDatasheet production dataFeaturesMax supply voltageVCC-16 to 41 VOperating voltage rangeVCC-16 to 28 VOn-state resistanceRON3 mΩGA P GC FT00135HPak General– Optimized electromagnetic emissions– Very low electromagnetic susceptibility– Compliant with European directive2002/95/ECDescriptionThe VN5R003H-E is a device made usingSTMicroelectronics VIPower technology. It isintended for providing reverse battery protectionto an electronic module.Protections– Automatic switch off in case of negativeinput voltage– Electrostatic discharge protectionThis device has two power pins (Drain andSource) and a control pin IN. If the IN voltageversus Drain is negative the device is turned on.Application A negative voltage of Drain pin versus INautomatically turns off the device. When IN is leftopen, device is in OFF-state and behaves like apower diode between Source and Drain pins.Reverse battery protection of an electroniccontrol unitTable 1.Device summaryOrder codesPackageHPAKSeptember 2013This is information on a product in full production.TubeTape and reelVN5R003H-EVN5R003HTR-EDoc ID 17602 Rev 61/20www.st.com1

ContentsVN5R003H-EContents1Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.1Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.2Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82.3Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 124.1562/20HPAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155.1ECOPACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155.2HPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155.3HPAK suggested land pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175.4Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Doc ID 17602 Rev 6

VN5R003H-EList of tablesList of tablesTable 1.Table 2.Table 3.Table 4.Table 5.Table 6.Table 7.Table 8.Table 9.Table 10.Table 11.Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1Pin function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Power section for reverse battery mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Electrical transient requirements (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Electrical transient requirements (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Electrical transient requirements (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14HPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Doc ID 17602 Rev 63/20

List of figuresVN5R003H-EList of figuresFigure 1.Figure 2.Figure 3.Figure 4.Figure 5.Figure 6.Figure 7.Figure 8.Figure 9.Figure 10.Figure 11.Figure 12.Figure 13.Figure 14.4/20Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Maximum pulsed drain current (VBATT 13 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Battery supplied systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Switched systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 12HPAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . 13Thermal fitting model of a single-channel HSD in HPAK . . . . . . . . . . . . . . . . . . . . . . . . . . 13HPAK package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15HPAK suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17HPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17HPAK tape and reel (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Doc ID 17602 Rev 6

VN5R003H-E1Block diagram and pin descriptionBlock diagram and pin descriptionFigure 1.Block diagramSOURCEINDRIVERDRAINTable 2.Pin functionNameDrainSourceINFunctionPower MOS drainPower MOS sourceControl pinDoc ID 17602 Rev 65/20

Block diagram and pin descriptionFigure 2.VN5R003H-EConfiguration diagram (top view) 1 - SOURCE2 - SOURCE3 - IN4 - DRAIN5 - NC6 - SOURCE7 - SOURCETAB - DRAIN * 3*&)7 6/20Doc ID 17602 Rev 6

VN5R003H-E2Electrical specificationsElectrical specificationsFigure 3.Current and voltage e maximum ratingsStressing the device above the rating listed in Table 3 may cause permanent damage to thedevice. These are stress ratings only and operation of the device at these or any otherconditions above those indicated in the operating sections of this specification is not implied.Exposure to the conditions in table below for extended periods may affect device reliability.Table 3.Absolute maximum ratingsSymbolValueUnit-16 to 41VSource or Drain current60A-IS, -IDReverse currents60AEMAXInductive clamp energyL 2 mH, VD 0 V, IN open, IS 0, Tjstart 25 C0.9JVESDElectrostatic discharge(Human Body Model: R 1.5 KΩ; C 100 pF)- All terminals5000VVESDCharge device model (CDM-AEC-Q100-011)1000VJunction operating temperature-40 to 150 CStorage temperature-55 to 150 CVSIS, IDTjTstgParameterSource power terminal DC voltage (reverse battery mode)Doc ID 17602 Rev 67/20

Electrical specifications2.2VN5R003H-EThermal dataTable 4.Thermal dataSymbolParameterRthj-case Thermal resistance junction-caseRthj-amb2.3Thermal resistance junction-ambient (mounted on FR4using 6 cm2 copper pad)Unit0.5 C/W42 C/WElectrical characteristicsTable 5.Power section for reverse battery mode(1)SymbolParameterTest conditionsMin.Typ.VSOperating supply voltage—-1613Max. Unit28VVCLPDSDrain-Source clampvoltageVD 0 V, IN open, IS -5 A1723VVCLPDINDrain input clampvoltageVIN 0 V, ID 20 mA4152VSource drain voltageIN open, IS 10 A; Tj 25 CVFRONIINIIN(REV)On state resistancebetween SOURCE andDrain terminals0.85IS 10 A; Tj 25 C;8 V VCC 28 VVS 13 V , VIN 0 VReverse input currentVS -16 V, VIN 0 VVS -16 V, VD 0 V, IN open1. Operating conditions: 40 C Tj 150 CDoc ID 17602 Rev 6V3mΩIS 10 A; Tj 150 C;8 V VCC 28 VInput currentIOUT rev Output reverse current8/20Max.5.523mA-20mA-1.5-0.5mA

VN5R003H-EElectrical specificationsTable 6.ISO 7637-2:2004(E)Test pulseElectrical transient requirements (part 1)Test levels(1)IIIIV1(2)-75 V-100 V2a 37 V3aNumber ofpulses ortest timesBurst cycle/pulserepetition timeDelays andImpedanceMin.Max.5000 pulses0.5 s5s2 ms, 10 Ω 50 V5000 pulses0.2 s5s50 µs, 2 Ω-100 V-150 V1h90 ms100 ms0.1 µs, 50 Ω3b 75 V 100 V1h90 ms100 ms0.1 µs, 50 Ω4-6 V-7 V1 pulse—100 ms, 0.01 Ω 65 V 87 V1 pulse—400 ms, 2 Ω(3)5b1. The above test levels must be considered referred to VCC 13.5 V except for pulse 5b.2. The device does not turn Off once the ISO pulse is applied.3. Valid in case of external load dump clamp: 40 V maximum referred to ground.Table 7.Electrical transient requirements (part 2)Test level results(1)ISO 7637-2:2004(E)Test pulseIIIIV1CC2aCC3aCC3bCC4CC5b(2)CC1. Transient pulses have been applied with the INPUT pin grounded with R1 5Ω.2. Valid in case of external load dump clamp: 40V maximum referred to ground.Table 8.Electrical transient requirements (part 3)ClassContentsCAll functions of the device are performed as designed after exposure to disturbance.EOne or more functions of the device are not performed as designed after exposure todisturbance and cannot be returned to proper operation without replacing the device.Doc ID 17602 Rev 69/20

Electrical specificationsFigure 4.VN5R003H-EMaximum pulsed drain current (VBATT 13 V)0D[LPXP 3XOVHG 'UDLQ &XUUHQW &,PD[ & 3XOVH VHF Note:PCB FR4 area 58 mm x 58 mm, PCB thickness 2 mm, Cu thickness 35 mm,Copper areas: minimum pad lay-out and 2 cm210/20Doc ID 17602 Rev 6 * 3*&)7

VN5R003H-E3Application informationApplication informationFigure 5 shows the solution for systems supplied directly from the battery. If the systemgoes into Stand-by mode, the transistor T1 is switched off by the microcontroller with zeroquiescent current. System is still supplied through the PowerMOS body diode.Figure 5.Battery supplied systems,*1,7,21 6:,7& 67R V\VWHP VXSSO\'92/7 *(5(*8/ 7259EDW& 5*( 3803& 5*(3803 &,15 7 ("1( '5 Figure 6 refers to a solution for systems supplied after the ignition switch. Low quiescentcurrents are not strictly required, so resistor R1 can be directly connected to ground.Figure 6.Switched systems67R V\VWHP VXSSO\'92/7 *(5(*8/ 7259EDW& 5*( 3803& 5*(3803 &,15 ("1( '5 Doc ID 17602 Rev 611/20

Package and PC board thermal dataVN5R003H-E4Package and PC board thermal data4.1HPAK thermal dataFigure 7.PC boardNote:Layout condition of Rth and Zth measurements (Board finish thickness 1.6 mm /- 10%, board double layer, boarddimension 78 mm x 86 mm, board material FR4, Cu thickness 70 µm (front and back side), thermal vias separation1.2 mm, thermal via diameter 0.3 mm /- 0.08 mm, Cu thickness on vias 25 µm, footprint dimension 6.4 mm x 7 mm).Figure 8.Rthj-amb vs PCB copper area in open box free air condition57 MBDPE & : 57 MDPE 3&% &X KHDWVLQN DUHD FPA ("1( '5 12/20Doc ID 17602 Rev 6

VN5R003H-EPackage and PC board thermal dataFigure 9.HPAK thermal impedance junction ambient single pulse 7 & : &X FP &X FP &X IRRW SULQW 7LPH V * 3*&)7 Figure 10. Thermal fitting model of a single-channel HSD in HPAKGAPGCFT 00133Note:The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections(power limitation or thermal cycling during thermal shutdown) are not triggered.Doc ID 17602 Rev 613/20

Package and PC board thermal dataVN5R003H-EEquation 1: pulse calculation formulaZ THδ R TH δ Z THtp ( 1 – δ )where δ tP/TTable 9.14/20Thermal parameterArea/island (cm2)FootprintR1 ( C/W)0.01R2 ( C/W)0.15R3 ( C/W)1R4 ( C/W)8R5 ( C/W)48282112R6 ( C/W)312416C1 (W.s/ C)0.005C2 (W.s/ C)0.05C3 (W.s/ C)0.08C4 (W.s/ C)0.4C5 (W.s/ C)0.81.43C6 (W.s/ C)369Doc ID 17602 Rev 6

VN5R003H-EPackage and packing information5Package and packing information5.1ECOPACK In order to meet environmental requirements, ST offers these devices in different grades ofECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com.ECOPACK is an ST trademark.5.2HPAK mechanical dataFigure 11.HPAK package dimensionGAPGCFT00134Doc ID 17602 Rev 615/20

Package and packing informationTable 10.VN5R003H-EHPAK mechanical dataData book mmRef. ��L4—0.601.00R0.20——V2—0 8 Doc ID 17602 Rev 6

VN5R003H-E5.3Package and packing informationHPAK suggested land patternFigure 12. HPAK suggested pad layout(a)All dimensions are in mm.5.4Packing informationFigure 13. HPAK tube shipment (no suffix)ACBBase q.tyBulk q.tyTube length ( 0.5)ABC ( 0.1)753000532621.30.6All dimensions are in mm.a. The land pattern proposed is not intended to over-rule User's PCB design, manufacturing and solderingprocess rulesDoc ID 17602 Rev 617/20

Package and packing informationVN5R003H-EFigure 14. HPAK tape and reel (suffix “TR”)REEL DIMENSIONSAll dimensions are in mm.Base q.tyBulk q.tyA (max)B (min)C ( 0.2)FG ( 2 / -0)N (min)T (max)250025003301.51320.216.46022.4TAPE DIMENSIONSAccording to Electronic Industries Association(EIA) Standard 481 rev. A, Feb 1986Tape widthTape hole spacingComponent spacingHole diameterHole diameterHole positionCompartment depthHole spacingWP0 ( 0.1)PD ( 0.1/-0)D1 (min)F ( 0.05)K (max)P1 ( 0.1)16481.51.57.52.752All dimensions are in mm.EndStartTopNo componentsComponentsNo componentscovertape500mm minEmpty components pocketssaled with cover tape.User direction of feed18/20Doc ID 17602 Rev 6500mm min

VN5R003H-E6Revision historyRevision historyTable 11.Document revision historyDateRevisionChanges23-Jun-20101Initial release.06-Jul-20102Updated Table 4: Thermal data.06-Oct-20103Added Figure 4: Maximum pulsed drain current (VBATT 13 V)18-Nov-20104Changed document status from target specification to datasheet.Table 3: Absolute maximum ratings:– Removed VD rowTable 5: Power section for reverse battery mode– IIN: added maximum valueTable 6: Electrical transient requirements (part 1)– Added Note 2Updated Figure 5: Battery supplied systems and Figure 6: Switchedsystems17-Apr-20125Updated Figure 4: Maximum pulsed drain current (VBATT 13 V)19-Sep-20136Updated DisclaimerDoc ID 17602 Rev 619/20

VN5R003H-EPlease Read Carefully:Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve theright to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at anytime, without notice.All ST products are sold pursuant to ST’s terms and conditions of sale.Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes noliability whatsoever relating to the choice, selection or use of the ST products and services described herein.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of thisdocument refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party productsor services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of suchthird party products or services or any intellectual property contained therein.UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIEDWARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIEDWARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWSOF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFESUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B)AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONSOR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS ATPURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT ISEXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRYDOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED AREDEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY.Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately voidany warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, anyliability of ST.ST and the ST logo are trademarks or registered trademarks of ST in various countries.Information in this document supersedes and replaces all information previously supplied.The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. 2013 STMicroelectronics - All rights reservedSTMicroelectronics group of companiesAustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of Americawww.st.com20/20Doc ID 17602 Rev 6

– Electrostatic discharge protection Application Reverse battery protection of an electronic control unit Description The VN5R003H-E is a device made using STMicroelectronics VIPower technology. It is intended for providing reverse battery protection to an electronic module. This devic

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