EE559 Lab Tutorial 3 Virtuoso Layout Editing Introduction

3. To select one or several objects at a time, press the Shift key while selecting. To deselect one or several objects after they have been selected, press the Ctrl key andselect.5EditingObjectsThere are several functions that are commonly used to edit objects. They include: move, copy,delete, stretch and merge. Should you require more advanced editing methods, please refer to theEditing Objects section in the Virtuoso Layout Editor User Guide.3.5.1 Moving Objects To move an object, change to full selection mode and select the object(s). Notice thatwhen you move the cursor within the selected object, the pointer changes to four arrows.This indicates that the object(s) can be moved by clicking and dragging. Alternatively, you can choose to select Edit -› Move from the drop down menu or use theMove icon on the left. The Move window appears. After you have selected the object(s),the CIW will prompt you for a reference point (start point) for the move. Click on thereference point for the move, and drag the pointer to the destination point. The object willbe moved with respect to the reference point. Note that in the Move window, there is a Change To Layer option. This will allow you tomove and change the object from one layer to another without having to redraw theobject. Check the box to enable the Change To Layer function and move the object asusual. You can rotate or flip the object (sideways or upside down) by clicking the Rotate,Sideways and Upside Down buttons in the Move window before placing the object. Youcan also do the same by using the right click on the mouse after you have selected thereference point for the move. Shortkey for move function is ‘m’.3.5.2 Copying Objects To copy an object, select Edit -› Copy or use the Copy icon after you have selected theobject(s). After the copy window appears, select the object(s) to be copied. The CIW willprompt you for a reference point (start point) for the copy. Click on the reference pointfor the copy, and drag the pointer to the destination point. The object will be copied withrespect to the reference point. Shortkey for copy function is ‘c’. To copy and paste multiple copies of the object, type in the number of copies in either theRows or Columns fields and place the objects in the cellview as usual. To copy and paste an array of copied objects, enter both rows and columns. The CIW willprompt you to place the first object of the array. After you have placed the first object,8

continue to place the second column of the array. The distance between the first objectand the second will determine the spacing and orientation between the rest of thecolumns. After you have placed the columns, click to place the rows of the array andcomplete the array. Similarly, the distance between the first and second rows willdetermine the spacing and orientation between the rest of the rows. Note that in the Copy window, there is a Change To Layer option. This will allow you tocopy and change the object from one layer to another without having to redraw theobject. Check the box to enable the Change To Layer function and copy the object asusual. You can rotate or flip the object (sideways or upside down) by clicking the Rotate,Sideways and Upside Down buttons in the Copy window before placing the object. Youcan also do the same by using the right click on the mouse after you have selected thereference point for the move.3.5.3 Deleting Objects To delete an object, change to full selection mode and select the object(s). Select Edit -›Delete or press the Delete key.3.5.4 Stretching Objects To stretch an object, switch to partial selection mode and select the object(s) at its cornersand edges. Notice that when you move the cursor within the selected object, the pointerchanges to an arrow pointing to a line. This indicates that the object(s) can be stretched atthe corners or edges by clicking and dragging. Alternatively, you can choose to select Edit -› Stretch from the drop down menu or usethe Stretch icon on the left. The Stretch window appears. Leave the Lock Angles optionon unless you need to form nonorthogonal shapes. After you have selected the edge(s) tobe stretched, the CIW will prompt you for a reference point (start point) for the stretch.Click on the reference point for the stretch, and drag the pointer to the destination point.The object will be stretched with respect to the reference point. Shortkey for stretchfunction is ‘s’.3.5.5 Merging Objects 3.You can use the merge function to merge two objects of the same layer. To mergeobjects, select the objects to be merged, then select Edit -› Merge.6S avingtheDesignTo save the design, select Design -› Save or click the Save icon on the left.9

4 Inverter Layout : Design Rules & Mask layersThe pictures in this section present an inverter layout very similar to the one you are about tocreate. The only significant difference should be the transistor widths. The inverter you createshould have transistor widths matching the values you determined in tutorial 1. Please gothrough all the pictures and gather the information as a whole.This layout is in the style of standard cells used for automated placement and routing of randomlogic. This does not, however, mean that this style of layout is bad for custom layout. It has somevery useful features. In particular, It is designed so that multiple instances of the cell can be connected together by abutment(i.e., placed immediately to the left and right of each other). The power, ground, input,and output connections line up and will be connected. Of course, you may wish to havethe input and output not line up so that you can have the power and ground connectionsconnect up without necessarily connecting the input and output together. The layout lends itself to a left to right signal flow in the metal layer (used for the inputand output) as well as vertical signal flow for short distances in polysilicon. If other types of logic cells have the same layout spacing between power and ground,then cells of various types can be chained together easily. The final layout should look like as in the below figure.10

4.1RDesignules Design rules are a set of rules (usually supplied by the manufacturer) that specify aminimum size or spacing requirements between layers of the same type or of differenttypes. This provides a safety margin for various process variations, to ensure that yourdesign will still have reasonable performance after your circuit is fabricated. Note that the technology file you specified in the first tutorial defines the design rules thatwill be used to check your design. It also defines how the drawing layers are translatedinto masks for the IC. The design rule file used is divaDRC.rul. The file can be foundin the /package/eda/cells/ncsu-cdk-1.5.1/local/techfile directory.11

4.2M askLayersThe mask layers are the various layers shown in the above diagram and are used to definethe location and size of the devices and nets. Each layer can be treated as an individuallayer meaning that two different layers have no electrical connection between them eventhough they happen to overlap. The layers are typically in different colors and shading(displayed in the Layer Selection Window) and are defined by the display.drf file.The file can be found in the /package/eda/cells/ncsu-cdk-1.5.1/local/cdssetup/ directory.4.2.1 Diffusion Areas for Source, Drain, and Substrate Contacts Rectangles on the active layer are used to define the region where doping is to be applied(except under the polysilicon gate) to form the source and drain of each transistor. For anNMOS transistor, the doping will be n . For a PMOS transistor, this doping will be p . Itwill be shown later how the type of doping is actually specified.12

Rectangles on the poly layer are used to define the strips of polysilicon used to form thegate of each transistor and to provide short distance connections between transistors inthe inverter. The intersection of an active and poly region defines the channel of a transistor. Since theminimum size of active is 0.45µ and poly is 0.30µ, this means that the minimumtransistor width must be 0.45µ and the minimum length must be 0.30µ. Note that in some cases, it may not be possible to draw an active area as a simplerectangle. The area may have to be one width at the source and drain to accommodate therequired clearance around source and drain contacts. It then may need to be notched toobtain the necessary transistor width for the intersection with poly. The active layer is also used to define regions that must be doped to allow a bulk(substrate or well) contact. In p-substrate, the doping must be p type. In an N-well13

(where PMOS transistors are placed), the doping must be n type. Note that there aresquare active layers in the above inverter layout example to form the bulk contacts. Rectangles on the n-select and p-select layers are used to control the type of dopantapplied to each diffusion area. Note that these areas must extend past the diffusion area(active) by at least 0.26µ.4.2.2 N-well Regions PMOS transistors must be located in substrate with N type doping. The substrate for thePMOS transistors is formed by diffusing N type dopant into regions of the normally ptype substrate. Rectangles in the nwell layer define these regions in which PMOStransistors can be placed.14

4.2.3 Contacts 0.30µ x 0.30µ squares drawn on the contact (cc) layer will cause metal plugs to beplaced into contact with the diffusion areas to form source, drain, and substrate or wellcontacts. 0.30µ x 0.30µ squares drawn on the contact layer will cause metal plugs to be placedinto contact with the poly areas to form poly contacts. Metal placed on layer metal1 will connect with these contacts.4.2.4 Metal Power Ground and Signal Routing Layers Rectangles on the metal1 layer define regions of aluminum to be placed in the first metallayer. In this case metal1 is used for all inputs and outputs to the inverter. A 0.30µ x 0.30µ square on contact provides a metal plug to connect routing on layermetal1 to polysilicon routing below on the poly layer. In the 0.24µ TSMC process, there are several other metal layers available (metal2,metal3 and so on). We are not going to use it in this layout since it is not needed.However, in larger more complex layouts, both layers will be needed. Often it is a wisepractice to route all signals horizontally on one layer and vertically on another layer.15

To connect the metal1 layer to the metal2 layer, a square on via is used. To connect themetal2 layer to the metal3 layer, a square on via2 is used. You can connect other metal layers together using the appropriate via layers. Forexample, to connect the metal2 layer to the metal3 layer, a square on via23 is used.5 Layout VerificationAfter you have completed the layout, you need to perform several verification procedures toensure that the layout does not violate any design rules and does actually correspond with theschematic design that you have made earlier.5.1CRD esignuleRheck(DC)DRC checks your layout against physical design rules defined in the divaDRC.rulfile. It will display error information if it finds any part in the layout that violates thedesign rules. Note that this is only a physical design check and does not verify the actualperformance or functionality of the layout design. The file can be found in e directory.16

To run DRC, select Verify -› DRC from the drop down menu. Check that the Rules fileand the Rules library fields are correct in the DRC window. Click OK to start. If there are any errors, it will be reported in the CIW. A blinking polygon, called an errormarker, appears in the cellview at the location of the error. To view the errors and get a brief description of the error, select Verify- Markers -›Explain and click on any error marker. The marker will be highlighted in yellow toindicate that it is selected. A window named marker text will appear that containsinformation about the cellview that contains the error and the rule that was violated. To quit the Explain command, press the Esc key. To remove the markers, select Verify -› Markers -› Delete All. The Delete All Markerswindow appears. Click OK to remove the markers. If any errors are reported, make changes to the layout and re-run DRC until all errorshave been fixed.17

5. For large complex designs, it is possible to run an incremental DRC. This means that thesystem will keep track of any changes you made since the last DRC and it will checkonly the changes made. This will make DRC run faster as it does not have to re-checkevery part of the design. To turn on incremental DRC, set the Checking Limit to incremental in the DRC window. It is also possible to run a DRC on a specific area. To do this, set the Checking Limit toarea in the DRC window, and click on the Sel by Cursor button. Select the area on thecellview that you want a DRC to be performed on by clicking on the first point of therectangle followed by the second point. The coordinates of the points will be entered.2ConnectivityExtractionBefore performing a Layout Versus Schematic (LVS) check, you need to extract the connectivityform the layout cellview by running the Extract program. The Extract program uses rules definedin the technology file to recognize devices and establish electrical connections or nets. It willcreate an extracted cellview that shows the nets. To run the Extract program, select Verify -› Extract. In the Extractor window, select flat as the Extract Method. A flat extract method is usedbecause parasitic capacitance values can vary between different instances of the samecell, thus each cell must be extracted. Turn on Join Nets With Same Name. This will merge nets with the same names whilesuppressing warning messages about different nets that have the same name. To select the types of parasitics that are to be extracted, click the Set Switches button inthe Extractor window. In the Set Switches window that appears, select the type ofparasitics that are to be extracted (typically parasitic capacitances). Click OK when doneselecting. Click OK or Apply in the Extractor window to create the extracted views. The extraction rules appear in the CIW as the extract program executes. When theextraction is complete, a message saying that the extracted cellview is saved will beshown. To view the extracted cellview, select File -› Open from the CIW. It should be under thesame library and cell name. Select the extracted view name and click OK. The extracted cellview appears on top of the layout cellview. Notice that the extractedcellview is similar to the layout, but the gates now have symbols at one end. Displayednext to the symbols are the gate width and length.18

To display the electrical connections, open the Display Options window and select Nets.Click Apply when done.19

5.The corresponding extracted cellviews with/without the switch Extract parasiticcaps are both show in the figures below.3CVLayoutversusSchematic(LS)heckAs its name implies, the LVS program performs a comparison of the schematic to the physicallayout. It will use both the extracted view and the schematic view of the layout. If you did notcreate an extracted view, LVS will not work.5.3.1 Running LVS To run LVS, select Verify -› LVS. If a LVS Form Contents Different window appears, click OK to continue.20

In the LVS window, fill in the schematic and extracted fields either with the Browse orSel by Cursor button. If you choose to use the Sel by Cursor button

first tutorial (NCSU_TechLib_tsmc03 ) defines the layers and colors that will be available to you in the LSW . The other window is the layout window ( Virtuoso Layout Editing ) where you perform the