Goddard Modular SmallSat Architecture (GMSA) Hardware .
Goddard Modular SmallSat Architecture(GMSA) Hardware PresentationJames Fraction – GMSA C&DH LeadNASA Goddard Space Flight CenterCode 561: Flight Data Systems and Radiation Effects BranchTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.1
Acronym SB:PSE:PTC:SCEB:SPI:SRAM:Actuator BoardAttitude Control SystemAnalog-to-Digital ConverterBattery Charge RegulatorBattery Charge Regulator ExtenderBackplaneController Area NetworkCommand and Data HandlingCore Flight ExecutiveCore Flight SystemCurrent Interrupt Device (CID).Commercial Off-The-ShelfCoarse Sun SensorDirect Energy TransferGoddard Modular SmallSat ArchitectureGeneral Purpose Input OutputField Programmable Gate ArrayInter-Integrated CircuitLow-Voltage Differential SignalingMagnetoresistive Random Access MemoryNot AndPower Distribution UnitPower Switches BoardPower System ElectronicsPositive Temperature Coefficient (PTC)SmallSat Common Electronics BoardSerial Peripheral InterfaceStatic Random Access MemoryTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.2
Content Summary Introduction – Pages 4 through 6 GMSA C&DH Information – Pages 7 through 17 GMSA PSE Information – Pages 18 through 27 Environmental Testing – Pages 28 through 30 Future Work – Pages 31 through 32 Point of Contact – Pages 33 through 34To be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.3
INTRODUCTIONTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.4
Introduction The Goddard Modular SmallSat Architecture (GMSA) is an in-house initiative thataddresses the need for developing high reliability SmallSat technology within aminimum 6U SmallSat volume. The purpose of GMSA is to have a spacecraft architecture that can enable highreliable, long duration SmallSat missions that operate in harsh radiationenvironments. Typically commercial off-the-shelf (COTS) hardware that is currently availabledoes not provide the overall reliability and radiation tolerance that is needed forcertain types of missions. GMSA is an in-house development effort that is focused on meeting thesemission needs.To be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.5
Introduction GMSA follows a modular, flexible, and extensible small satellite implementationapproach GMSA can accommodate spacecraft subsystems developed both within NASAand outside of NASA The initial GMSA hardware development involved the design and assembly ofmultiple board assemblies that implements the Command and Data Handling(C&DH) subsystem the Power System Electronics (PSE) subsystem functionalitywithin the satellite.To be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.6
GMSA C&DH INFORMATIONTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.7
C&DH Primary Functions C&DH hardware consists of the following two boards: SmallSat Common Electronics Board (SCEB) Adapter Board GMSA C&DH supports the following features: TID 20 kradSEL immune2 years mission including activation and checkout (does not include storage)Uses flight qualified parts for higher reliability.To be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.8
SCEB Architecture Block DiagramProcessor Board100 MHzOscGPIO and I2C signalsJ4 – PSE6 3.3V to 1.8VBuck Regulator 3.3V 5VTo SRAM 1.2VVoltageMonitor 1.8V to 1.2VLinear RegulatorJ1 – JTAGJ2 – EthernetJ5 –SpacecraftInterfaceJ6 –DebugConnectorResetSupervisoryChipFPGAJTAG signals6Debug signals62Thermistor8RS422 signalsOtherAdapterBoardSignals 57PORRS422 driver signalsfrom FPGARS422 Tx8RS422 Rx42744 GB Flash(4G x 8)PowerSwitchPower Switch Control Signal3.3VFPGA1.2V & 1.8VOscillatorMemory377110 MB SRAM(2M x 39)36Debug signalsJ3 –AdapterBoardConnectorDigital Logic ICConnectorThermistor0.25 MBMRAM(256K x 8)ResetAnalog /Power MosfetsTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.9
SCEB Primary Functions RTG4 FPGA supports the following features: TID 100 krad SEL immune Host embedded soft processor core and core flight executive (cFE) Currently using an embedded Cobham Gaisler LEON3FT Host Attitude Control System (ACS) electronics algorithmsDiscrete I/O interfacesBuilt-in RX clock recovery block with good jitter tolerance for SpaceWireJTAG connector interface On board voltage regulation Use a point-of-load converter to generate 1.8V for SRAM core voltage and linearregulator voltage input Use a linear regulator to generate 1.2 V for FPGA core voltage Supervisory Reset CircuitTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.10
SCEB Primary Functions Multiple memory modules Cobham 10 MB SRAM Run FSW applications 3D-Plus SEU immune 0.25 MB MRAM Store FSW boot code and emergency FSW recovery applicationsSubstitute for PROM in typical C&DH architecture 3D-Plus 4 GB NAND Flash Store multiple FSW images, HK data, and science dataFlash device shall have a power switch to mitigate SEFIs Multiple I/O options 4 RS-422 drivers and 4 RS-422 receivers Interface for up to 4 additional RS-422 drivers and 4 RS-422 receivers populated on the Adapter BoardInterface for 4 LVDS drivers and 4 LVDS receivers populated on the Adapter Board1 dedicated CAN bus interface2 dedicated spacecraft SPI interfaces each with 2 slave select signals2 dedicated spacecraft I2C interfaces1 dedicated I2C interface to the PSE1 dedicated I2C interface to the SCEB Adapter Board for controlling multiple multiplexers and 16general purpose inputs / outputs (GPIO) 4 inputs from the SCEB Adapter Board that are 5V tolerant ADC I/Os Driver signals for 3 H-bridge drivers on the SCEB Adapter Board To be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.11
Adapter Board Architecture Block DiagramTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.12
Adapter Board Primary Functions Housekeeping functionality 16 thermistor interfaces (using voltage divider circuit)Voltage monitoring interface ( 1.2V and 1.8V from SCEB)Voltage and current monitoring( 3.3V, 5V, 12V, and battery voltage from PSE)3 science instrument multiplexer inputs3 PSE multiplexer inputsOne 32-bit I/O expander to control two onboard multiplexersOne 12-bit serial output analog-to-digital converter (ADC) Magnetorquer H-Bridge Driver Interface 6 Coarse Sun Sensor (CSS) current-to-voltage conversion circuits Connector interface to SCEB Connector(s) interfacing to the rest of the spacecraftTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.13
Additional Information Target C&DH Assembly Power Consumption: 3 Watts C&DH Total Mass 419.86 goooSCEB (Processor Board): 135 gAdapter Board: 258.55 gC&DH Assembly Hardware: 26.31 grams Temperature Ranges:ooC&DH survival temperature range: -40C to 65CC&DH operating temperature range: -20C to 50C Individual Board Dimensions: 90 mm x 90 mm C&DH Assembly Dimensions: 116.56 mm x 44.35 mm x 92.51 mm (LxWxH)To be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.14
Reconfiguration in Flight Capability to reprogram MRAM device while in flight to reload cFE/cFS appsstored in it. Evaluated the potential of reprogramming the RTG4 FPGA design while in flightooAt the time of development Microsemi was still in the process of completing radiationtesting of this functionality.We took the conservative approach and assumed that once the RTG4 wasprogrammed on the ground prior to flight it would not be changed after launch.To be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.15
GMSA C&DH Test Configuration PhotoSCEBBreakout BoardAdapter BoardTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.16
GMSA C&DH Mechanical Assembly PhotosTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.17
GMSA PSE INFORMATIONTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.18
PSE Primary Functions GMSA PSE supports the following features: TID 20 kradSEL immune2 years mission including activation and checkout (does not include storage)Uses flight qualified parts for higher reliability.PSE is a Direct Energy Transfer (DET) system with the battery connected directly to theelectrical bus. Any excess solar array power that is not needed for battery recharge orSpacecraft loads is shunted.PSE provides charging capabilities for a Li-Ion battery utilizing voltage and current chargecontrol. The shunt control technique is a linear sequential full shunt which provides asimple solar array interface.This DET topology can support both 3-axes stabilized and spinner SmallSat.The PSE includes all the circuits needed to perform telemetry and command functionusing I2C interfaced with the C&DH.The PSE is designed, tested, and verified to meet launcher vehicle safety requirements.6U size SmallSat. PSE manages and distributes 6 Amp maximum input current from SolarArray in a volume of 1U (10cm x 10cm x 10cm).Works compatibly with GMSA Li-Ion battery that provides 80 Watts power.To be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.19
PSE Primary Functions Unregulated Primary (Bus) Voltage Un-Switched Vbus in the range of 10.8V to 12.6V, nominal voltage of 11.1V: used atActuator Card. Switched Vbus:o Quantity 1: 1A S/C Heater and Quantity 1: 1A Transmitter RFo Deployment Bus (at Actuator Card): Provide 3A pulse for deployable loads: Antenna, MagneticBoom, Solar Array.o Propulsion System: 3A pulse. Regulated Secondary Voltage 12V @2A max, Quantity 3 switched services to instruments. 5V @ 1.5A max, Quantity 1 un-switched service to C&DH, Quantity 5 switched servicesto ACS. 3.3V @1.5A max, Quantity 1 un-switched service to C&DH, optional services to ACS. Current sense (monitor) : Solar Array, Battery, Loads ( 12V, 5V, 3.3V). Thermistor Sensor There’re thermistors located on Solar Array, Battery, BCR, PDU, and PSB for temperaturemonitor.To be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.20
PSE Architecture Block DiagramTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.21
PSE Card Assembly Description Battery Charge Regulator Extender (BCRX) card expands the power inputhandling capabilities for missions with high input power (2A-6A) fromsolar array. Battery Charge Regulator (BCR) card provides battery charge control tocommanded voltage and current levels. Any excess power that is not usedby the spacecraft or to recharge the battery is dissipated in linearsequentially operated shunts. Power Distribution Unit (PDU) card converts and distributes all loadsecondary voltages which include: 12V, 5V, and 3.3V.To be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.22
PSE Card Assembly Description Power Switches Board (PSB) card distributes primary and secondaryvoltages to the un-switched essential and switched non-essential loads.This board provide 10 switches, each switch can provide max outputcurrent of 1A. Actuator Board (AB) card distributes primary Battery (Bus) voltage fordeployable loads (like the solar array or magnetic boom) and high powerprimary loads (like the transmitter and/or propulsion sub-system). Backplane Board (BP)card connects all the PSE cards together to share thepower Bus, secondary power, and I2C lines.To be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.23
Li-Ion Battery Description The GMSA Li-Ion battery is an in-house design with nine Li-Ion rechargeable type18650 cells.o It is packed in 3S3P configuration with 3 strings in parallel.o Each string has 3 cells in series.o The battery will provide power to SmallSat during eclipse period and will sustain abus voltage in the range of 10.8V to 12.6V. The GMSA Battery is packed with ICR18650J cells.o This cell is manufactured by MoliCel, this cell was tested and recommended byNASA Johnson Space Center. Each battery cell used in GMSA Battery has an internal positive temperaturecoefficient (PTC) current limiting device. The PTC is used to limit short circuitcurrent on an individual cell level.o This device is completely passive and functions without any inputs from the rest ofthe battery pack systems.To be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.24
Li-Ion Battery Description Each battery cell used in the GMSA Battery has an internal Current InterruptDevice (CID).o This device serves to protect the cell from excessive internal pressure.o In such a case the CID will break and electrically disconnect the cell.o High internal pressure is generally caused by over-temperature or other failuresthat then result in over-temperature. Battery capacity 80W, nominal voltage of 11.1V. Battery pack mass: 580 g Battery dimensions: 90mm x 90mm x 80mm (W x D x H)To be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.25
Additional Information PSE Total Mass 542 g Secondary Voltage:ooRegulation: 5% for each secondary output.Voltage Ripple: 100mV Pk-Pk for each secondary output. Temperature Ranges:ooooPSE survival temperature range: -40C to 65CBattery charging limited below 10CPSE operating temperature range: 0C to 40CBattery operating temperature range: 10C to 30C Individual Board Dimensions:ooPSE Backplane: 100 mm x 90 mmAll other PSE cards: 100 mm x 90 mm PSE Assembly Dimensions: 134 mm x 125.65mm x 96.39mm (LxWxH)ooBetween 94 mm to 96.39 mm for the height (depending on BP screws used)These dimensions include the bracket for the battery connector (10 mm)To be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.26
PSE and Battery AssemblyGMSA Li-Ion 80W BatteryGMSA Power System Electronics (PSE)To be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.27
ENVIRONMENTAL TESTINGTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.28
GMSA C&DH Vibration Test PhotoTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.29
GMSA Hardware Thermal Vacuum Testing PhotoTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.30
FUTURE WORKTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.31
Future Work Integrate multiple COTS devices and NASA science instruments to the GMSA C&DHand PSE hardware in a Flatsat environment Use GMSA C&DH hardware as a flight software test string to develop cFE/cFS appsconducive with SmallSat missions Evaluate alternative processor core options that can be implemented to do thefollowing:o Enhance GMSA C&DH FPGA design optionso Provide different cost options for customers Evaluate part selection and qualification options for future missionsTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.32
POINT OF CONTACTTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.33
Contact Information For more information about the GMSA C&DH boards and the MemoryCard please contact:James FractionNASA – Goddard Space Flight CenterCode 561: Flight Data Systems and Radiation Effects BranchTelephone Number: 301-286-2094E-mail Address: james.e.fraction@nasa.gov For more information about the GMSA PSE boards please contact:Hanson NguyenNASA – Goddard Space Flight CenterCode 563: Power Systems BranchTelephone Number: 301.286.4776E-mail Address: hanson.nguyen@nasa.govTo be presented by James Fraction at the IEEE Space Computing Conference, Pasadena, CA, July 30 to August 1, 2019.34
4 RS-422 drivers and 4 RS-422 receivers Interface for up to 4 additional RS- 422 drivers and 4 RS-422 receivers populated on the Adapter Board Interface for 4 LVDS drivers and 4 LVDS receivers populated on the Adapter Board 1 dedicated CAN bus interface 2 dedicated s
Goddard offers hundreds of internship opportunities each year across four campuses located at: Goddard Space Flight Center, Greenbelt, Maryland Wallops Flight Facility, Wallops Island, Virginia Goddard Institute for Space Studies, New York City Independent Verification and Validation Facility, Fairmont, West Virginia
Modular: 18" x 36" (45.7 cm x 91.4 cm) Stratatec Patterned Loop Dynex SD Nylon 100% Solution Dyed 0.187" (4.7mm) N/A ER3 Modular, Flex-Aire Cushion Modular, Conserv Modular, ethos Modular 24" x 24": 18" x 36": Coordinate Group: Size: Surface Texture: Yarn Content: Dye Method: Pile Height Average: Pattern Match: Modular
modular cnc router plans 2009v1 copyright modular cnc @2009 for personal use only item no. part number description vendor material cost qty. 1 mc-z-001 drive end plate modular cnc hdpe 10.00 1 2 mc-z-002 end plate modular cnc hdpe 8.00 1 3 mc-z-003 top plate modular cnc hdpe 12.50 1 4 mc-z-005 linear rod speedy metals 1018 crs 3.00 2
What is Computer Architecture? “Computer Architecture is the science and art of selecting and interconnecting hardware components to create computers that meet functional, performance and cost goals.” - WWW Computer Architecture Page An analogy to architecture of File Size: 1MBPage Count: 12Explore further(PDF) Lecture Notes on Computer Architecturewww.researchgate.netComputer Architecture - an overview ScienceDirect Topicswww.sciencedirect.comWhat is Computer Architecture? - Definition from Techopediawww.techopedia.com1. An Introduction to Computer Architecture - Designing .www.oreilly.comWhat is Computer Architecture? - University of Washingtoncourses.cs.washington.eduRecommended to you b
replaces higher cost bellows-seated valves in many applications. The proprietary Goddard GRAFOIL stem packing system provides excellent performance when the valve operates in liquid hydrogen service. Goddard 231 Series Globe Valves Top Entry: Rugged stainless steel * soft se
Liquid Cryogenic Delivery Systems Goddard 302, 306, 310, 322, 326 Bronze Gate Valves Goddard 232 Series Stainless Steel Globe Valve Goddard 222, 206LL, 206GF and 206ULL Bronze Globe Valves RegO CG series cryogenic check valves RegO PRV9400 series RegO 15578 Pressure Gauges RegO B
Discovery, an SR-71 Blackbird, Concorde, and even the Enola Gay. Also on display, were numerous Goddard related items. There was a Goddard 1935 A-Series Rocket as well as random rocket parts created and used b
influence of ideological values on the policies and practices of America’s criminal justice systems. Recently, however, a trend toward critical analysis of the behavior of police, courts, and corrections has emerged that focuses exclusively on ideology as the analytical tool of choice. For example, Barlow (2000), and Bohm and Haley (2001) include extensive discussion of the influence of .
