PROCEEDINGS OF THE TECHNICAL CONFERENCE
PROCEEDINGSOF ERTECHNlSCHEINFORMATIONSBIBLIOTHEKUB/TIB Hannover116 981210FOURTH ANNUALINTERNATIONALELECTRONICSPACKAGING CONFERENCEOCTOBER 29,30,31,1984
TABLE OF CONTENTSSESSION 1Title: "Designing with Surface Mount Techniques"Chairman: Joe B. Aeddington, Jr. SSE Technologies, Concord, NC.1. "Design Economics of Surface Mount PCB's," Steve Kalenik and Bert Anderson,Hewlett Packard, Andover, MA.32. "Increased CamrxmBnt Packing Density Utilizing SMD and Wave Soldering," RussStrobel, Motorola, Inc., Boynton Beach, FL.143. "High Density Interconnects for Si*," tarry W. Burgess, Interconnect TechnologyCorp, Aloha, OK.204. "Automatic Inspection Requirerrnnts for Leadless Chip Carrier Assembly," PaulHeller, Enton All, Division, Deer Park, NY.275. "Tberral Analvsis of Chip Carrier Compatible Substrates," Patrick J. Atnick and C.r. Buckley, r- :Donncll Douglas Electronics, Co., St. Charles, NJO.34SESSION 2Title: "Board Level Interconnection Technologies"Chairman: John L. Grant, Augat Inc. Attleboro, MA.1. "Flex Circuit Direct Pressure Interconnections," Herran Gordon Rogers Corn.Chandler, AZ and Scott S Simpson and J.X. Mersereau, Rogers Corp, Rogers, CT.432. "Electrical Characteristics of Unilayer II - A Discrete Wire Alternative toMultilayer PWB's," John L. Grant, Augat Inc., Attleboro, MA.543. "Button Board - A few Technology Interconnect,"System? Group, Redondo Beach, CA.75R. Smolley, TRW Electronic4. "Arditive Update: high Density Trends for Commercial Printed ivirina Boards," LenSnookler, Kollinorgen Corporation, Aquebogue, NY.925. "Microv ire Applications for Surface Ntiunted Components," Marc Motazedi, PCK'feciinology Div./Kollmorgen,Melville, NY.SESSION 3Title: "CAU/CAlw for Electronic Packaqinq"Chairman: Kene Sandeau, Kartin Marietta Aerospace, Orlando, FL.Co-Chairman: Jack Arabian, Digital Enuioment Corp. Andover, ,YA.1. "rh-: Unlc of .vorkcell Controllers in A Computer Integrated tvanufacturing' pvirorr.-Ti-," Vichael Schwartz, Diaital rrruiprnent Corp, Andover, ,VA.;. "]".f r iT;t'!:: Surface ' ounh Arr,e:rhly SyntPi;; U t i l i z i n g v\orkcell ControllerIcciir,olf .:v," Steven L. Pierce, D i g i t a l mjioirfint Corp., Andover, ' "A.3. "Co'ru* -r Aidoa ?Ter-;ian of" Kvt.rid C i r c u i t s , " D. h. Brov/nstone, S c i e n t i f i cGilculatioriS, I n c . , Houston, 'I'X.103115
4. "Computer Aided Desian - Solids Modelinq," Hamilton Clark, Martin MariettaAerospce, Orlando, FL1255. "CAD/CAP. Improves P.\B Yields," willian E. McEachnie, Martin Marieta Aerospace,Orlando, FL.1326. "Computer Aided Design Verification (CADV) - The Missinq Element in the CAD/CAMhouation," Roy F. Shaul'and Frank W. Haining, IBM Corp., Hndicott, W.148SESSION 4Title: "Soldering For SMT"Chairman: Douglas Peck, Dyna/Pert-HIC, Corcord, MA.Co-Chairman: Don Spigarelli, Dyna/Pert-HTC, Concord, MA.l."SMD Wavesoldering- An Update", Dr. ArminLtd., lontreal, Quebec, CANADARahn, and William Down, Electrovert,1632. "Solder Attachment of SMD's in a Low Volume Production Environment", Norman R.Roffey, Honeywell, Inc, Clearwater, FL. 573. "The Creep of SN60 Solder Alloy and Its Impact on Leadless Chip Carriers," David0. Ross, Fuuhes Aircraft, Fullerton, CA. 814. "Sequential Solderinq Techniques for Mixed Technology Assemblv", Emory C. cSarth,XeTel, Austin, TX.1885. "One St?p Soldering for Type II Circuits", i\. James Kail and James L. Finney,Dyna/Pert-HTC, Concord, MA.191SESSION 5Title:"System Packaging Using Hiah level Integration,"Chairman: Ernel Kinkier, Motorola Inc., N'esa AZ.Co-Chairman: Wulf Knausenberger,A T & T liell Labs, Whippany,NJ1. "Surface Mounting Fine Pitch Chip Carriers," Karl Rosengarth, Jr. and Ernel R.Ainkler, Motorola Inc., Phoenix, AZ.2032. "Package and Interconnect Development for Future VLSI/VHSIC Devices," John E.Fennimore and Gerard J. Plite, Martin Marietta Orlando Aerospace, Orlando, FL.2173. "Packaging of a Performance Driven VAX," Jim McRlroy, Digital Equipment Corp.,Marlboro, MA.2294. ",\ireablility of Surface iMounted Components," John Yarlott, IBM, Austin,TX.2355. "Mosaics Wafer Scale WHIP Packaging Systems," Dr. Robert Johnson, Mosaic Systems,Troy, .VI.245
SESSION 6Title: "Topics in Microwave Packaqing"Chairman: Ralph Taylor, TRAK Microwave Corporation, Tampa, FL.1. "Hermetic Sealing of Microwave Packages," Ralph Taylor,Tampa, FL.TRAK Microwave Corp.,2."Packaging Using CAD/CAM - A Microwave Example," Jere Kessler, RockwellInternational Corp, Dallas, TX.2493."Thermal Managment of Millimeter Wave Communications Equipment at ExtremeAmbients," C. L. Jacobs, Sperry Corporation, Clearwater, FL.4. "'Monolithic Microwave Integrated Circuits - Interconnection and PackagingConsiderations," K. fi. Bhasin, A.N. Downey, G. E. Ponchak, R. R. Romanofsky, G.i\.Anzic, D. J. Connollv, NASA-Lewis Research Center, Cleveland, OH.825SESSION 7Title:"New Materials and Techniaues for Surface Mountinq"Chairnian: lames welt rlen,Vvelterlen Inc.,La Jolla,CACo-Chaimwn: William Roland, Honeywell Inc., Clearwater, FT,l."A Novel,Tow Cost,Hermetic,Leaded Chip Carrier Technology-Part One-DesignFeatures," John Walker, Northern Telecom, Ontario, CANADA2612. "A Novel, low Cost, Hermetic, Leaded Chip Carrier Technology, PartTwo-performance, Costs and Infrastructure," John Walker,Northern Telecom, Ontario,CANADA3. "Electro Deposited Copper On Ceramic and its Application in SMT," Ron Delanev,Ceraform Products, Colleyvilie, TX.2874. "The Onen Via Chip Carrier - How Viable an Alternative?" Charles Williams andJohn Kridok, Texas Instruments, Inc. Dallas, TX.2935. "Packaging Desian of a SiC Ceranic Multi-Chip Rain Module," Ken Okutani, KanjiOtsuka, Kunizo Sahara and Kazuycshi Satoh, Device Development Center of HitachiT.td., Tokyo, Japan. 299SESSION 8Title:"Thermal Control of Electronic Packages"Chairman: L. Buller, IBM Corp., Austin, TX.Co-Chairnan: S. Furkay, IBM Corp., Essex Junction, VT.1. "Theory ana Application oF Contact Resistance Concepts to the Thermal Control of.Electronics", Dr. M."'. Yonanovich, Univeristy of: »\aterloo, Waterloo, Ontario, CA,\Al.y?. " R e l i a b i l i t y I.Tijjfict ol Thor/iial Desion", I. Ooshay, Tt\w,Redcndo teach, CA.3073. ":','--nt Transfer 'Jroi Arrays of Flat Packs in a Channel Flow", H. .-.i-tz, Clark.sonCollege, i otsda:.!, i-.'i anii P. ijvksiiocrn, Habcock and K i l c o . ,318
;. "li'-nvii « ! i stance of Grid Pin Packager/1, B. Bender, G. BottlikXerox Corp., hi segundo, CA.and D. Mord,327organized by the ASME K-16 Committee on Heat Transfer in Electronic EquipmentSESSION 9Title: Lead Compliance and Solder Integrity of Surface Mount PackagesChairman: John Balde, IDC, Flemington, NJ.1. Problems in the Shift to Leaded \. Balde, IDC, Flemington, NJ.Chip Carrier Constructions - An Overview," John2. "A Strain Range Partitioning Procedure for Solder Fatiaue," M.C. Shine, L. R.rox, and J. n1. Sofia, Digital Enuinment Corp., Andover, MA.3433463."Laser Holography Permits Observation of the Stress Induced in the Substrate Dueto Package/Board Expansion Mismatch," Dimitry G. Grabbe, AMP Inc., Harrisbura, PA.4. "Test Method Considerations for SMT Solder Joint Reliability," Werner Engelrrraier,AT & T Bell labs, Whippany, NJ.3605. "interim Report on the Test Results of the Ir ,fc, 'lest Program," Philip Schwarz,fiJ':-J Communication, Northlake, IL.SESSION 10Title: "Lasers for Electronic Packaging"Chairman: Joseph A. Scordato, Laserage 'technology Group, Southeast Facility,Altanonta Springs, FL.Co-Chairman: Herb Duryea, Laserage Technology Group, San Marcos, CA.1. "Cost effective Laser Machined Ceramics for High Volumne Applications," HerbDuryea and Jim Byruin, Laserage lechnology Group, San Marcos, CA.3782. "Tight Tolerance Laser Triinning of Thick Film Resistors," Dale Spring, Lastsc,Inc., Aloha, Ok.3813. "Laser Engraving for Microelectronic Package Marking," Rick Stevenson, Controllaser Corporation, Orlando, FL.3834. "YAr, ljassr Welding and Marking of Hvbriri Metal Packaces," John Wasko, JtC Iviser,Saddleorook, \J.r . "Pulseo YAG Uiser voiding of Electronic Packages," Steve Bolin, Raytheon laserCenter, Burlington, w. . "l wr Marking in the Electronics Ireinstry," L. Hall Mealy, Jr., SiqnodeCorporation, Glenview, IL.3927. "U-iwr Soldering tor Electronic Packaginq", Wayne Penn and Fob Butts, PennResearch Corp., Kennesaw, GA.399H. "Considerations of Lasers to Microsolderinq of Sr Ds to PWBs", John Lampe and EarlI.ish, !var i Arietta Aerosnace, Orlando, Ft,.405
SESSION 11Title: "Enhanced Air Cooling of Electronic PackagesChairman: L. Frank, Hughes Aircraft Co., Long Beach, CA.Co-Chairman: S. Furkay, IBM Corp., Essex Junction, VT.1. "Gate Array Low Velocity Cooling", J. Kessler, Rockwell International, Dallas,TX.4332. "Experimental Comparison of Pin Fin Configurations for Extended Surface HeatTransfer in Space Applications", M. Taylor, Honeywell, Clearwater, FL.4413. "Integral CAP Heat Sink Assembly for the IBM 4381 Processor", R. Biskeborn, J.-iorvath, and B. Hultmark, IBM, Hopewell Junction, NY.4684. "Blower Performance Enhanceinents in the IBM 4381 Computer", N. Timko, IBM,ilnuicott, NY.4755. "Validity of One Heat Transfer Correlation to Various Shaped Ducts via HydraulicDiameter Concept", L. Yeh, RCA Corp., Canden, NJ.483Organized by the ASME K-16 Committee on Heat Transfer in Electronic EauinmontSESSION 12Pi tie: "Optical and High Speed Interconnection ivDrkshop,"Chairman: Wes Townsend, A T & T , Princeton, NJ.Co-Chairman: Dinitry Grabbe, AMP. Inc.,Middletown, PA.1. " m e Role of Discrete wiring in High Speed Electronics," Tom Buck, PCKTechnologies, Multiwirs Div., Hicksville, NY.4932. "Thick Film Processing for High Speed Circuit Applications," Francis Merti ,\illiar Newell and Steve Konsowski, Westinghou.se Electric Co., Baltimore, MD.501SESSION 13T i t l e : "Blind and Buried Vias"Chairman: G. F. Jacky, Tektronix, I n c , Beaverton, ORCo-Chairman: P h i l i p J . Boddy, A T & T , Bell Labs, Richmond, VA.1. "Sor - Dosian/Process Considerations Concernina Blind and Buriec] Vias in P r i n t e dC i r c u i t i/vsrds," George G. V\er!i/.':v -.:'.:. l--r-ir,Y A. H a i i i n a , IBM Corp, Endicott, NY.507 . "i'rcji.'uction of "iechanically D r i l l e d Buried Via Multilayer Printed C i r c u i t Boards- I wo !. i M.VJ ron t Approaches," RoU rt G. Kilrury, Sperry Corporation, St. Paul, MN.5143. "MuH.-lnynr Ceranic Via Formation Technology," Alan V. Hall and Felix u. Zykoff,Ii;-". Coi:: iny, Hc-pcwcjll J e t . , NY.5184. " u]*:if le Functions of Blind Cat-.nar Vias in Pcly'imide Multilayer S t r u c t u r e s , "Hc.n il.i! C. Chalnian and Eugene Nooavich, Aucat iicrotec, Newbury Park, CA.525
5. "Buried Vias .for Multilayer Board Applications," Dr. M. U. Rao and Dr. R. R.Holmes, AT & T-Bell Laboratories, Richmond, VA.SESSION 14Title: "System Design Philosophy"Chairman: Francis Dance, Hadco Corp, Salem, NHCo-Chairman: Stephen Ahlbrand, Johns HoDkins Applied Physicas Laboratory, Laurel MD.l."The Fourth Electronic Revolution- The Impact on System Packaging," Maurice Sage,BPA, Dorking, Great Britain.5352. "Designing-In and Buildinq-In Reliability: An Operational Definition withExamples from Electronic Packaging Products," R. J. Usell, Jr. and B. S. Rao,Burroughs Corp, San Diego, CA.5403. "Design and Development for Unique Applications and Environments," Stephen D.Ahlbrand, Johns Hopkins Applied Physics Laboratory, Laurel, MD.5544. "A CompetitiveWhippany, NJ.Packaging Trade Off Study," Doug Schmidt et al, AT & T bell Labs,5. "The Role of Manufacturing Technology in Product Design," Dale Dorinsky,Motorola, Inc., Ft. Lauderdale, FL.565SESSION 15T i t l e : Advanced Concepts for E l e c t r o n i c Cooling"Chairman: C. Johnson, B e l l Labs, Whippany, NJ.Co-Chairman: L. B u l l e r , IBM Corp., Austin, TX.1. Panel Discussion: "Proposed NSF Research for Thermal Systems", c h a i r e d by Dr. w.* i n e r , Georgia I n s t i t u t e of Technology, A t l a n t a , GA.2. "Heat Pipe Cooling Techniques for High Density Printed Wiring Boards", K. Sekhon,Hughes Aircraft Co., F u l l e r t o n , CA.5753. "Liquid Cooling lechniques for High Power Density E l e c t r o n i c Packagina," L.S t r a t t a n , Hughes A i r c r a f t Co., El Segundo, CA.5864. "Convective Immersion Cooling of P a r a l l e l V e r t i c a l P l a t e s " , A. Bar-Cohen and H.Schweitzer, Ben-Gurion University, Beer-Sheva, I s r a e l5965. "True Temperature vseasureinent of E l e c t r o n i c Components Using I n f r a r e dThermographv", j . K a l l i s , A. Kamuals, and R. S t o u t , Hughes A i r c r a f t Co., El Segundo,616Orqanizeu by the ASM', K - 1 6 C a m i t t e e on Heat Transfer in E l e c t r o n i c E q u i o n t
SESSION 16Title: "Electronic Packaging and Joining With Metals"Chairman: Paul Zarlingo, Olin Brass, East Alton, IL.1. "A Bis.nuth-Tin Alloy for Hermetic Solder Seals," Kamal-Jeet Singh Dogra,\artin Marietta Orlando Aerospace, Orlando, FL.6312. "Thermal Shock Te.sting of Glass-to-Metal Seals in Microelectronics/Effect ofPackage Lid," Klod Kokini,University of Pittsburg, Pittsburg, PA.6373. "The Use of Thermogravirnetric Analysis — T G A — in Predicting OutqassinoCharacteristics of Electrically Conductive Adhesive," Alexander A. Oscilowski andDavid L. Sorrells, Texas Instrument, Dallas, TX.6524. "Computer-aided Solderability Testing for Receiving Inspection," J. Gordon Davyand Randy Skold, Westinghouse Defense Center, Baltimore, MD.6595. "Solder Joint Failure in RF Connector-Cable Interfaces," Ronald L. SuttonDavi'j Lanoreaux,Motorola, Scottsdale, AZ.6766. "Cooper Wire Ball Bondinq," John Kurtz, Donala CousensKairchild Send conductor Corp., So. Portland, ME.andand Mark Dufour,688SESSION 17Title: "tii/;h Density Packages ant'. Their Interconnection to PCB's"Chair-;v,n: Gary Geschwind, Raycheir,, Menlo Park, CA.1. " iioh Density Packaging for VHSlC/Vf,SI lievices," Stanley M. Stuhlbarg, HughesAircraft Corp., Newport Leach, CA.7. "Cpe of Discrete Soloer Colunms to Mount LCCC on Fpoxy Glass Prinfsd Circuitt/oaros," Gabe Cherian, Raychem Corp., Menlo Park, CA.7013. "iiiah I/O Package Altsmatives," Tom Rooars, lnteraird.es Corporation, San Diego,7U'-. "Shane Me:x ry t-ffect Alloys as an Interconnection Technology for Hiah Densitv ICi*ickaijes," Regis Flot, Raychem, Corporation, .venlo Park, CA.7175. "Integrated Decoupling Capacitor Packaues for VHSIC," tvi. Christian Val ann r;.'ir rard, Comoagnie D'Infor:nati.7ue Militaire, Spatiale et Aaronautique, Velizy?KKAi-'CK.731c "\jr,w Microsoldering Tochnoloriy ai-.n I t s Annlication to VT.SI", i»luneo CJshi:m, kvohoi.-.ntoh, Ichiroh I s h i , Hidakazu Konura, Hitachi L t d . , Prot!uction hngineorinr? ip-wr.'-'n752 A.,
SESSION 18Title: "Surface Mounting Technology Utilization"Chairman: Don Brown, D.Brown Associates, Inc., Warrinaton, PA1. "SurfaceMounted IC Device Quality Perspective at NCR," Vino Mody, NCRCorporation, wichita, KS.7552. "Surface Mount Applications (A Users View)," Don Cook, Novatech, Inc., Ann Arbor,MI.3. "Field and Factory Repair and Replacement of Surface Mountable Components," JimBousell, Pace Inc., Laurel, MD4. "Designing SMT for Productivity," Emory C Garth, XeTel, Austin, TX.7625. "An Experience with Cu/INVAK/Cu and IXC's in Avionicand Steve Livingston, Litton-Anecon, College Park, MD.770Equipment," Bob PiocenteSESSION 19Title: Polymeric MaterialsChairman: Douglas tortenson, Honeywell, Inc. Minneapolis, MN.1. "Protective Thin Film Coatings by Plasma Polymerization," R. K. Sadhir,v.estinghouse R & D Center, Pittsburgh, PA.7892. "Parylene Conformal Coatings for Printed Circuit Board Applications," RogerOlsen, Nova 'Iran Corporation, Clear Lake, Wl.8043. "Sort-Testina Polymer Thick Film Conductor Inks," G. F. Jacky and Merlin J.Bernards, Tektronix, Inc. Beaverton, OR.8104. "Particle Size-Compaction and Its Effect on Conductive Coatinqs, Adhesives andInks," Brian B. Achenbach and Tom Hughes, Advanced Coatings and Chemicals, TempleCity, CA.818
Chairman: Ralph Taylor, TRAK Microwave Corporation, Tampa, FL. 1. "Hermetic Sealing of Microwave Packages," Ralph Taylor, TRAK Microwave Corp., Tampa, FL. 2."Packaging Using CAD/CAM - A Microwave Example," Jere Kessler, Rockwell 249 International Corp, Dallas, TX. 3."Thermal Managment of Millimeter Wave Communications Equipment at Extreme
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