HP Data Center Efficiency For The Next Generation

HP Data CenterEfficiency For TheNext GenerationPete DeaconCanadian Portfolio ManagerPower and Cooling Services

The HP differenceIndustry-wide expertise,global reach2 HP operations span more than170 countries Understands power curve,from processor to data centerinfrastructure Holistic approach todata center efficiency—data center as a whole Active in power and coolingindustry standards bodies:ASHRAE, Uptime Institute,Green Grid, EPA30 September2008Proven solutions Drives advances in efficientsystems, flexible designs,and power optimizationMore than 1000 patentsfor advances in Power &Cooling technology Pioneering work by HP Labs inthe use of computational fluiddynamics (CFD) in modelingairflow in the data center Acquisition of EYP MissionCritical

Data Centers need your attention now!!3 Average age of data centers is over15 years old. Power consumption persquare foot almost tripled from 40watts to 100 watts !!1 By 2010 more than half of datacenters will have to relocate to newfacilities or outsource someapplications2 Power failures and limits on poweravailability will interrupt data centeroperations at more than 90 percentof all companies over the next fiveyears230 September20081 Dave Edwards, Morgan Stanley , Always On Stanford Summit 072 AFCOM’s Data Center Institute, AFCOM 2006

Facilities & IT:A new level of dialog Fact 1: Data center power density up 10x inthe last 10 years 2.1kW/rack (1992); 14kW/rack (2006) Customers often do not fill their racks to capacitydue to power/cooling constraints Fact 2: Increasing processor power Moore’s law confronting the laws of physics Fact 3: Energy costs going up 3-year energy cost roughly equivalent to acquisitioncost (U.S.); in Europe, it could be as high as 2X Larger proportion of IT spend dedicated to energy Fact 4: Iterative power life cycle Can take as much power to cool the heat generatedfrom a system as it takes to power the system Fact 5: Over-provisioning Many data centers are over-provisioned with coolingand yet still have hot spots430 September2008

Power and Cooling“A study of 19 computer rooms with more than200,000 square feet of combined floor space doneby the Uptime Institute, a research group, foundthey had 2.6 times the cooling capacity required,but wasted more than 60% of capacity because ofpoorly designed layouts and airflow, among otherdeficiencies. As a result, more than 10% of theserver racks ran too hot.”“New Cooling TechnologiesTackle Data Center Heat”,Information Week,Sep 25, 2006530 September2008

Smart Cooling Solutionsbridges the gap between IT and FacilitiesDatacenter power consumption4% AC power conversion33%Servers &StorageIndustry focused here63%coolingof theCoolingofITthegearITgearHP also focused hereFacilitiescooling of the IT gearIT departmentservers and storage85% of the World’s Data Centers 11HP,Christopher Malone, PhD, Christian Belady, P.E., “Metrics to Characterize Data Center & IT Equipment Energy Use”, Digital Power Forum,Richardson, TX (September 2006) & “How to Minimize Data Center Utility Bills”, HP C. Belady, P.E., Sept 2006,630 September2008

Delivering energy efficient solutions for theIT Power & Cooling Chain Data Center & FacilitiesEnergy SavingsOptimizing from chip to chiller Dynamic Smart Cooling Modular Cooling System Power Distribution Rack Three Phase UPSManageability Tools Insight Power Manager and iLO 2 Dynamic Capacity Management Thin Provisioning & Data de-duplication VirtualizationSystems BladeSystem Enclosures Thermal Logic PARSEC enclosure cooling Active Cool FansServers & Storage Efficient Power Supplies Energy Optimized Servers Small Form Factor Drives Low Power Processors Low Power Memory“Chip to Chiller”Services Thermal Zone Mapping, Data Center Assessments, Data Center Site Preparation7730 September2008ISS-1 – HP RestrictedUp to 33% ofEntire DataCenter Power

HP’s Smart Cooling SolutionsPotential energy savings100%20%80%30%45%Energy SavingsOptimizationcan significantly impactdata center capacityCoolingPower60%IT40%20%0%PUE 3.0TypicalTypicalPUE 2.4BestPracticesBestPracticesPUE 2.0Static SmartCoolingCFDPUE 1.6HP labsprototypes/CloselyfutureCouplingPotential capacity increases100%80%Optimization cansignificantly impactenergy usage60%CoolingPowerAdditional ITIT25%40%50%85%20%0%BestStatic Smart PUE 1.6HP labsPUE 2.4PUE ady, "Metrics to characterize Data Center & IT Equipment Energy Use," Digital Power Forum, Richardson, TX (September or2006)DSC82008PUE 3.0Typical

HP Smart Cooling Solutions930 September2008

All available for enivornments with multi-vendor equipment.Static Smart Cooling SolutionsHP delivers three static Smart Cooling SolutionsHP ThermalQuickAssessmentHP ThermalIntermediateAssessment Visual inspection 2 D Under floor modeling Data measurements Thermal modeling and“what if’s” Basic report andrecommendations 2 weeks Extensive report andrecommendations 2-4 weeks1030 September2008HP ThermalComprehensiveAssessment 3D under- and above- floormodeling Thermal prediction/zonemapping Comprehensive report andrecommendations 4-8 weeks

HP Smart Cooling: before and afterAfterAirConditionerHot AisleCold AisleCold AisleHot AisleHot AisleTemperaturebalanceimprovingHot AisleRacks30 September2008Hot AisleCold AisleCold AisleCold AisleHotAisleCold AisleCold AisleCold AisleSource: Chandrakant Patel, HPHot AisleCold Aisle11HotAisleCold AisleBefore

Dynamic Smart CoolingA power & cooling data center management solution Provides thermal sensing at the rack level The distributed temperature sensing devices signal the software to rebalance thecooling Energy (power) consumption is smoothly managed by controlling the CRACs andsupplying cooling dynamicallySensor and ControlNetworkVFD Blower SpeedControllerVariableCapacityCRAC UnitRack Intake Air ThermalSensorsSystem Management Controller Sensor Network/Data DepositoryChilled WaterSupply Loop1230 September2008 Up System Status Evaluation Thermal System Controlto 50% savings in cooling costs, experimental data from HP Labs

Benefits of HP Power and CoolingServices Cooling design improvements Proper placement & provisioning ofCRACs and airflow panels Supply air temperature Supply air volume Sizing and location of panels Ideal locations for high-densityequipment Significant opportunities forenergy savingsIdentification of IT capacity gainsCarbon footprint reduction 1330 September2008

Reducing your carbon footprintIf the world used HP power saving solutions The world’s data centers could save over 4billion/yr in US currency equivalents15 American data centers could cut carbonemissions up to 9 million tons each year16– Equivalent to taking 5 million autos offthe road every year Asia could curb its growing need for energy– China now emits more carbon into theatmosphere than any other country17– By 2010 Asia will be the largestconsumer of primary energy18– By 2020 China & India will produce morecarbon emissions than the USA &Europe combined191430 September2008

HP cares about customers & climateHelping to Sustain the Environment Recycled 1 billion pounds of electronics –goal of 2 billion by 2010 HP will reduce our own energy usage by20% by the year 2010 The environment is an HP tradition –Design for Environment launched in 1992 A founding partner with ongoing supportfor the EPA Energy Star ProgramNovember 2006: HP & World Wildlife Fundjoint initiative to cut HP greenhouse gas emissions.May 2007: HP plans to allocate more than 2 million in cash1530 September2008and HP equipment to WWF to establish three projects aimedat addressing the causes and consequences of climatechange.

Summary1630 September2008 Proven solutions to customer’sspace, power and coolingchallenges in the data center Effective and efficient coolingstrategies for high-densityequipment using thermalmodeling tools and techniques Simplify the addition of newequipment to your data center Results in facilities optimizedfor reliability, maintainability,and energy efficiency

The Road to Improvement“Correctly managing power and cooling issues in missioncritical environments requiresan end-to-end approachincluding:use of more energy efficientserversefficient approaches toproviding power and coolingdynamic power and coolingmanagementconsulting and supportservices to provide power andcooling expertise to ITmanagement”Jed Scaramella, Matt Healey IDC, May 20071730 September2008

Thank you !

ResourcesData Center Services HP.com: www.hp.com/services/datacenterservices30 September 200819

Copyright information Copyright 2007 Hewlett-Packard Development Company, L.P. .Itanium is a trademark or registered trademark of Intel Corporation orits subsidiaries in the U.S. and other countries. Microsoft andWindows are U.S. registered trademarks of Microsoft Corporation.UNIX is a registered trademark of The Open Group. Linux is a U.S.registered trademark of Linus Torvalds The information containedherein is subject to change without notice. The only warranties for HPproducts and services are set forth in the express warrantystatements accompanying such products and services. Nothingherein should be construed as constituting an additional warranty. HPshall not be liable for technical or editorial errors or omissionscontained herein. For additional information on HP products and services, visit us atwww.hp.com/go/servers and www.hp.com/go/enterprisesubject to change without notice30 September 200820