RFMS 2020: Connector To PCB Interface - Molex

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RFMS 2020: Connector to PCB InterfaceJean Louis MendesBDM/FEA RF & MicrowaveE-mail:Jeanlouis.mendes@molex.comMolex Confidential InformationMobile: 4670 59464 Reserved. Unauthorized Reproduction/Distribution is Prohibited.1 Molex,LLC –57All Rights

Interface Analysis PCB Analysis Connector interface Analysis— PCB Launch effect RF Performances improvement Conclusion2Molex Confidential Information Molex, LLC – All Rights Reserved. Unauthorized Reproduction/Distribution is Prohibited.

PCB Analysis SMPM Connector (73300044x)— Frequency up to 30GHz PCB— Dielectric : Megatron6 Er 3.6 TanDelta 0.002 Simulation HFSS3PCB Strucure25 um75 um due to Layer 1 impedance25 um205 um due to Pad Width25 um400 um due to PCB StudyMolex Confidential Information Molex, LLC – All Rights Reserved. Unauthorized Reproduction/Distribution is Prohibited.Layer 1Diel 1Layer2Diel 2Layer3Diel 3Layer4

50Ω Line simulationLine WidthL1 thicknessD1 thicknessGND ClearenceGND ClearenceLine WidthLayer 1 GND ClearenceDiel 1L1 ThicknessLayer 2 D1 ThicknessErCalculated Impedance135um200um25um75um3.46um49.7OhmLine Length 20mmImpedance is 50OhmIL below 0.6 dB up to 30GHzRL below -35dB up to 30GHz4Molex Confidential Information Molex, LLC – All Rights Reserved. Unauthorized Reproduction/Distribution is Prohibited.

50Ω Line simulationSMPM Design 2SMPM connectorLine WidthL1 thicknessD1 thickness Connector Placed directly on PCBRL below-15dB5RL above-10dBMolex Confidential Information Molex, LLC – All Rights Reserved. Unauthorized Reproduction/Distribution is Prohibited.GND ClearenceGND ClearenceLine WidthLayer 1 GND ClearenceDiel 1L1 ThicknessLayer 2 D1 ThicknessErCalculated Impedance150um200um25um75um3.46um49.7OhmClipping PlaneThe first effect is due to Pad width.Some opening has to be done in order tokeep a 50Ohm structure

50Ω Line simulationSMPM Design 3add Diel-2 100 umThicknessAnd perform openingConnector Hided21 Opening done on layer 2SMPM connectorPAD WidthL1 thicknessD1 thicknessL2 Thickness6GND ClearenceGND ClearenceLine WidthGND ClearenceLayer 1 L1 ThicknessDiel 1D1 ThicknessLayer 2 L2 ThicknessD2 ThicknessTotal ThicknessErCalculated ImpedanceClipping Plane1Layer 1Layer 2Layer 3550um200um25um75um25um200Um300um3.4649.7OhmMolex Confidential Information Molex, LLC – All Rights Reserved. Unauthorized Reproduction/Distribution is Prohibited.2By Opening Layer 2 we improve:1. the line response2. We improve the overall responseBut it’s Not Enough

50Ω Line simulationSMPM Design 4add Diel-3 100 umThicknessAnd add openingConnector Hided21Clipping Plane Opening done on layer 2SMPM connectorLine Width700umGND Clearence200umGND ClearenceGND ClearenceLayer 1 L1 Thickness25umDiel 1D1 Thickness75umLayer 1 L2 Thickness25umDiel 1D2 Thickness200umLayer 1 L3 Thickness25umDiel 1D3 Thickness100umTotal thickness400umEr3.46Molex Confidential InformationCalculated Impedance49.7Ohm Molex, LLC – All Rights Reserved. Unauthorized Reproduction/Distributionis Prohibited.PAD WidthL1 thicknessD1 thicknessL2 ThicknessD2L3D3L47Layer 1Layer 2Layer 3Layer 4Could be compareat stripLine12By Opening Layer 2 and 3 Weimprove:1. The line response again2. The overall responseBut it’s still Not EnoughFrom now need to knowwhat is inside the connector

50Ω Line simulationSMPM Design 5Increase Diel-3 ThicknessConnector Hided21Clipping PlaneSMPM connectorL1 thicknessD1 thicknessL2 ThicknessD2L3D3L48GND ClearenceGND ClearenceCould be compareat stripLine1 Opening done on layer 2PAD WidthLayer 1Layer 2Layer 3Layer 4Line WidthGND ClearenceLayer 1 L1 ThicknessDiel 1D1 ThicknessLayer 1 L2 ThicknessDiel 1D2 ThicknessLayer 1 L3 ThicknessDiel 1D3 ThicknessTotal thicknessErCalculated 3.4649.7OhmMolex Confidential Information Molex, LLC – All Rights Reserved. Unauthorized Reproduction/Distribution is Prohibited.2By increasing the dielectric Thickness:1. We improve the line responseagain2. We open even more the dielectricbelow the Connector we improvethe overall responseFrom now need to knowwhat is inside the connector

50Ω Line simulationSMPM Design 6Some option for improving RLConnector Hided21Clipping Plane Opening done on layer 2SMPM connectorL1 thicknessD1 thicknessL2 ThicknessD2L3D3L49Line Width700umPAD WidthGND Clearence200umGND ClearenceGND ClearenceLayer 1 L1 Thickness25umDiel 1D1 Thickness75umLayer 1 L2 Thickness25umDiel 1D2 Thickness200umLayer 1 L3 Thickness25umDiel 1D3 Thickness200umTotal thickness500umEr3.46Molex Confidential InformationCalculated Impedance49.7Ohm Molex, LLC – All Rights Reserved. Unauthorized Reproduction/Distributionis Prohibited.Layer 1Layer 2Layer 3Layer 4Could be compareas stripLine12By Filtering1. We improve the simulationresponse again2. By closing partially theopening we didn’t improve somuch the simulation response.But we improve the RFperformances (next slide)For further improvement: We need toknow the “inside” of the connector

RF Performance The Red Line is from Design 6 (Filter)RL has been degrade around 10GHzBut the Interface response has improvedabove 20GHz10Molex Confidential Information Molex, LLC – All Rights Reserved. Unauthorized Reproduction/Distribution is Prohibited.

Some Other Parameter To Play2/ Opening Distance1/ GND ClearenceThe Customer Should KnowOur Team is Ready to help. Help to design and/or optimizethe PCB launch for you3/ Opening Thickness11Molex Confidential Information Molex, LLC – All Rights Reserved. Unauthorized Reproduction/Distribution is Prohibited.

Molex Confidential Informationregisteredof Reserved.Molex, LLCUnauthorizedin the United Statesof America and mayisbeProhibited.registered in other countries; all other trademarks listed herein belong to their respective owners.12Molex is aMolex,LLCtrademark– All RightsReproduction/Distribution

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