090715 SprayTec PUPL FINAL REPORT V3 - CORDIS
PROJECT NO: COOP-CT2005 - 018271SPRAYTECLow cost thermally sprayed and structured conductive layers for powerelectronic printed circuit boardsCo-operative Research (Craft)Horizontal Research Activities Involving SMEsPublishable Final Activity ReportDate of issue of this report: July 2009Start Date: 15th November 2005Duration: 36 MonthsVersion 03Project Co-Ordinator: Fraunhofer-Gesellschaft zur Förderung der angewandtenForschung e.V. on behalf of Fraunhofer-Technologie-Entwicklungsgruppe (TEG)Project co-funded by the European Commission within the Sixth Framework Programme(2002-2006)Dissemination LevelPU PublicPP Restricted to other programme participants (including the Commission Services)RE Restricted to a group specified by the consortium (including the Commission Services)CO Confidential, only for members of the consortium (including the Commission Services)X
1PROJECT INFORMATION.32PROJECT EXECUTION .42.1Motivation. 42.2Project objectives and achievements. 52.3Work performed . 62.4Thermal spraying processes . 82.532.4.1Atmospheric Plasma Spraying (APS) technology .102.4.2PureCoat technology .10Completed test prototypes . 11PLAN FOR DISSEMINATION AND USE .13FP6 - CRAFTCEC Contract No. COOP-CT-2003-5082252FINAL REPORTVersion 03 – July 2009
1 PROJECT INFORMATIONPROJECT NO:FP6-018271CONTRACT NO:COOP-CT-2005-018271TITLE OF PROJECT:SPRAYTECLow cost thermally sprayed and structuredconductive layers for power electronic printedcircuit boardsCOORDINATOR:Fraunhofer-Gesellschaft zur Förderung derangewandten Forschung e.V.SME EXPLOITATION MANAGER: ContechSME CONTRACTORS:1PNC Natryskiwanie Cieplne Powłok s.c., Poland2Lifco Industrie, France3Contech Electronic GmbH & Co KG, Germany4P4Q Electronic S.L., Spain5Technosert Electronic GmbH, Austria6Sirio Panel SPA, ItalyOTHER ENTERPRISE / END USER CONTRACTORS:7Infineon Technologies AG, Germany8Hella KGaA Hueck & Co., Germany9APtronic AG, Germany10 Metallisation Ltd., UK11 Würth Elektronik GmbH & Co. KG, GermanyRTD PERFORMER CONTRACTORS:12 Fraunhofer-Technologie-Entwicklungsgruppe (TEG), Germany13 Pera Innovation Ltd., UK14 Zentrum für Aufbau- und Verbindungstechnik GmbH, GermanyFP6 - CRAFTCEC Contract No. COOP-CT-2003-5082253FINAL REPORTVersion 03 – July 2009
2PROJECT EXECUTION2.1MotivationNowadays, electronic modules on Printed Circuit Boards (PCB) are glued to the heatsink (e.g. FR4). Although thermally conductive glues are used, the thermal resistanceof the junction limits the achievable power density of the modules. Thus the heatsinks, which are essential parts of the module’s housings, have to be dimensionedmuch bigger than needed solely by the dissipated power. Higher thermal conductivityat the PCB / heat-sink junction would therefore allow to significantly reducing the sizeof such modules, saving space, weight and material.State of the art in manufacturing of the module substrates for PCBs is done by gluingthe different material – slices (Aluminium and Alumina) together. Gluing the differentlayers is the start of the process of manufacturing module substrates.In SprayTec, thermal spraying will be used toreplace the gluing - process in themanufacturing of module substrates bydirect thermal spraying of the materials oneafter another. The adhesive characteristics oflayers sprayed onto materials such asceramics and metals will be improved. Alsothe manufacturing process time will bereduced by using of thermal sprayingtechnology.Thermal sprayed coatings are used extensively for a wide range of industrialapplications. The technique generally involves the spraying of molten powder or wirefeedstock, the melting being achieved by oxy - fuel combustion or an electric arc(plasma). The molten particles are accelerated by the flame, followed by impactingonto a properly prepared substrate, usually metallic. To adapt this process to spraythe substrates of PCB’s, several barriers like the implementation of the right materialsor the adjusting of the PCB manufacturing process have to be overcome through thehelp of the European consortium.FP6 - CRAFTCEC Contract No. COOP-CT-2003-5082254FINAL REPORTVersion 03 – July 2009
2.2Project objectives and achievementsThe overall objective of the SPRAYTEC project is to develop low cost thermallysprayed and structured conductive layers for power electronic printed circuit boardsand to gain an understanding of thermal spraying principles as well as materials forprinted circuit boards. The industrial benefit of thermal spray coatings is theachievement of cost – effective production of high thermally resistant PCBs.The technology of APS (Atmospheric Plasma Spraying), PureCoat and HVOF (HighVelocity Oxy-Fuel-spraying) allows tailoring of components or specific areas tocounteract damaging effects, prolonging the life of new parts or providing costeffective repair of worn parts. Thermal spraying also allows use of cheaper substratematerials such aluminium and is a flexible technology for the spraying of differentlayer materials to provide a cost effective product with high thermally resistance.The understanding of the thermal spraying principle, the use of applicable materialsand suitable processes for thermal sprayed of PCBs has been build up by the SMEpartners. Especially detailed knowledge and the influence of the different parameterslike layer thickness, layer porosity, sealing of copper and ceramic layers have beengained and opened new markets for the SME.The main requirements from customers to the new PCBs are a high dielectricstrength, high thermal conductivity and good thermal shock resistance.The figure on the right shows the layer composition of thestructured coppernew PCBs.aluminaAluminium was chosen as substrate material to get betteraluminiumheat abstraction and alumina has best characteristics for theisolator layer. The copper layer for the circuit path is appliedFig.: layer composition ofby lift-off technique of steel masks. Hence thethe new PCBsresultant reduction of copper consumption is also one bigbenefit of the SprayTec technology.Due to the different coefficients of expansion between aluminium and ceramic, anadditional bonding agent interlayer is used to reduce the thermal stresses and toobtain better adhesion values.In the development of the technology, thermal sprayed PCBs provide a cost efficientand fast solution, with low start up costs and fast lead times to prototypes. Inaddition, quick turnaround can be achieved and low cost changes are possible, hencethere is high design flexibility. In the process of thermal sprayed layers the use ofplastic materials is reduced to a minimum, thus the thermal sprayed PCBs areespecially suited to high temperature applications. Only ceramic and metals are beprocessed. Costly and time consuming sticking and soldering processes are replacedFP6 - CRAFTCEC Contract No. COOP-CT-2003-5082255FINAL REPORTVersion 03 – July 2009
by thermal spraying method. With this method, coatings with low porosity and highthermal shock resistance were realised.Furthermore, new test methods to verify the capabilities of thermal sprayed PCBshave been developed. The significantly improved thermal conductivity and the use ofsmaller heat sinks enhanced the usability for high temperature applications in thepower electronic market.The SME partners built up detailed knowledge about thermal sprayed PCBs byunderstanding the requirements and possible enhancement of the customer needs insectors such as automotive and power electronics including the knowledge of theindustrial implementation of the SprayTec technology.The greatest benefits will be for SME partners, which can use the new thermalsprayed power PCBs to improve their power electronic components in various areasas functionality, module size, module weight and different design.The close collaboration of the partners enabled the development of a new PSU(Power Supply Unit) and a new LED panel for automotive lighting.It turned out that the SprayTec technology is more suitable to high temperatureapplications like the IMS (Insulated Metal Substrate) technology than to assemblingtechnologies like DBC (Direct Copper Bonding). The joining techniques contrary tothe thermal sprayed PCBs differ primarily in the lamination processes of the copperand dielectric layer by gluing and costly etching processes.Following table shows the project results in comparison to conventional power PCBs.aimed changeachievedchangeThermal conductivity 60% 25%Increased adhesion 50%9Weight power PCBs- 30%9Costs of materials compared to IMS technology- 20%- 90%Production cost compared to DBC process- 60 %- 80%Feature2.3Work performedThe project started with a detailed scientific characterisation of the sprayingtechnology, the characterisation of the suitable materials for the different layers andthe definition of the market requirements on the thermal sprayed PCBs.FP6 - CRAFTCEC Contract No. COOP-CT-2003-5082256FINAL REPORTVersion 03 – July 2009
To fulfil the market requirements of thermally sprayed PCBs, the required tests andtests methods have been defined.To perform different test methods optimally, special masks were developed anddesigned for laser cutting of thin steel. These masks were placed on the samples withceramic layer. The structured copper layer was sprayed by lift off the masks.Step 1: Designing the electronic circuitStep 2: PCB DesignStep 3: Manufacturing of steel maskStep 4: copper sprayed finished PCBFig.: Designing of a circuit for a MOSFET assemblyThe process, as is shown in figure above, starts with the PCB layout design which isturned into a steel circuit mask and a second mask.FP6 - CRAFTCEC Contract No. COOP-CT-2003-5082257FINAL REPORTVersion 03 – July 2009
Following tests have been performed in accordance of IPC-TM-650: 2.4microsections of sprayed samples for layer thickness measurements,structure analysis by microscopyadhesion test ofo dielectric layer - substrateo dielectric layer - copper layersurface roughness testsdielectrical breakdown tests [ASTM - D149]thermal conductivity teststemperature storage and temperature cycle testsThermal spraying processesThermal spraying is a general term to describe all methods in which the coating isformed from melted or semi-melted droplets. In thermal spraying the material is inthe form of powder and is fed into the flame produced by a spray gun, where itmelts and the formed droplets are accelerated towards the substrate to be coated.The thermal and kinetic energy of the flame can be produced either with burningmixtures of fuel gas and oxygen, or by using an electrical power source.Based on the energy source, thermal spray methods can be divided into a few maingroups: plasma spray methods, flame spray methods, high velocity oxy-fuel methods,electrical arc methods and cold gas methods.FP6 - CRAFTCEC Contract No. COOP-CT-2003-5082258FINAL REPORTVersion 03 – July 2009
Fig.: Thermal spraying principle and influences1In thermal spraying the coating is built up from the lamellas formed by rapidsolidification of the melted or semi-melted droplets attached to the substrate. Atypical structure for the coating is a pancake – like lamellar structure, where theflattening degree and adhesion between the lamellas, together with the coatingmaterial itself, define the main properties of the coating. In SprayTec two sprayingmethods are applied – APS and PureCoat .1Erja Turunen. “Diagnostic tools for HVOF process optimization” ESPOO 2005, VTT PUBLICATIONS 583FP6 - CRAFTCEC Contract No. COOP-CT-2003-5082259FINAL REPORTVersion 03 – July 2009
2.4.1 Atmospheric Plasma Spraying (APS) technologyAtmospheric Plasma Spray (APS) is a method where theenergy is based on the plasma produced by ionising aninert gas, typically mixture of argon and hydrogen orhelium, between the anode and cathode of the spraygun. Due to the high energetic ionized plasma, thetemperature of the plasma is very high, as high as10000ºC. The speed of the plasma is approximately 400m/s. Due to the high process temperature, APS whichenables good melting of the ceramic particle is often usedto produce a ceramic coating.2.4.2 PureCoat technologyPurecoat is an arc spraying process that uses awire feedstock melted by an arc. Because of thisit is not possible to produce unmelted particles.This thermal metal spraying process has beendeveloped which is reported to be able to givecoatings of near high velocity oxy-fuel (HVOF)quality at less than half the cost. The process,known as Purecoat , has been developed inthe UK by Metallisation Limited, in collaborationwith six other companies in Europe. ThePurecoat process uses a computer-designedspray head which solves clogging and oxidationproblems encountered with conventional metalspraying in the open air. It produces coatings ofa quality close to that of the feedstock metal.FP6 - CRAFTCEC Contract No. COOP-CT-2003-50822510FINAL REPORTVersion 03 – July 2009
2.5Completed test prototypesAll sprayed samples were soldered with reflow technology construction units on thecopper layer. All samples were soldered by the steps:1.2.3.4.5.6.structured copper layer with steel masksurface finishingsolder stop lacquersolder paste printingmounting of componentsreflow / vapour phase solderingLike other lamps, high – power LEDs generate heat. The SprayTec technology placesimportance on heat management by selecting material compositions with good heatdissipation. This assures that the LED modules remain below the critical temperaturezone and operate at full capacity throughout their lives. The company Technosertdesigned a layout to make soldering tests, thermography tests and breakdownvoltage tests with sprayed and mounted samples.Thermal spraying of a test structure for LED mounting:Fig.: sprayed copper layer and solder steelmaskFig.: after solder paste printingFig.: mounted high-power LEDsFig.: Thermal sprayed PCB in operationFP6 - CRAFTCEC Contract No. COOP-CT-2003-50822511FINAL REPORTVersion 03 – July 2009
Project partner APtronic designed a layout to make soldering tests and breakdownvoltage tests with sprayed and mounted sample. The following pictures show theadjustable current sink:Fig.: thermal sprayed copper layerFig.: 300μm steel mask for soldering paste printingFig.: assembly current sinkFig.: assembly current sink in detailFurther realised LED application designed by consortium partner Technosert fromAustria.Fig.: Aluminium angle assemblywith 6 high power LEDsThe table on next page showstemperaturevaluesatdifferentpositions on the sample. Themeasurements were accomplished withthe following parameters: long timetest with 4 x 27 - resistances,parallel connected Rges 7,00,temperature 24 – 27 C.Fig.: Aluminium angle assembly operationFP6 - CRAFTCEC Contract No. COOP-CT-2003-50822512FINAL REPORTVersion 03 – July 2009
All pictures are taken with IR camera during the tests.All samples show very good heat dissipation into all directions.3 PLAN FOR DISSEMINATION AND USEExploitable knowledge and its useWithin the project knowledge was created that is going to be used after the projectfor the benefit of the SME partners. The most important aspects are summarisedbelow.In preparation for exploitation, the consortium formed an exploitation committee,lead by APtronic, Contech, Technosert and P4Q and assisted by the other SMEconsortium members like Würth Elektronik who have understanding of the market,applicable regulations and the existing client base.The major target of this project is creating a business for the SME partners by sellingthe technology (Automotive, Aerospace, rail, lighting technology). Although the endusers within the consortium (APtronic, Sirio Panel, P4Q, Technosert, Contech) will usethe technology themselves, the consortium has to also take the opportunity of sellingthe technology / system to the industry outside the partnership. It is also possible forthe SME partners to create a spin off / legal entity in order to market the technologytogether. Currently the company APtronic started a pilot project with app. 300 piecesof a working product. Metallisation is willing to produce the hundreds of samples forthis pilot project and will profit from sales of machines.FP6 - CRAFTCEC Contract No. COOP-CT-2003-50822513FINAL REPORTVersion 03 – July 2009
At the end of the project there was a discussion with all project partners regardingapplication fields for the developed product. As an interesting field to use the PCB’s theLED technology was mentioned. Fraunhofer made a market analyse in particular themarket for the LED technology which was presented at the final management meeting. Anincreasing market for LED technology is predicted for the future. Regarding cost benefit &cost effectiveness for the manufacturing of PCB’s by using thermal spraying method thecompany Metallisation analysed the costs for the production. The manufacturing iscompetitive to existing manufacturing techniques.Dissemination of knowledgeDuring the project a high number of dissemination activities took place. Besidespublished papers and articles the technology was also presented on congresses (FEDCongress 2007 & IMAPS Conference 2007). Partners visited trade fairs to promote thenew product to the following sectors: automotive, electronic engines, consumerelectronics. Articles about the new products have been published in professional journals.More trade show presentations and end – user experts workshops are planned onceAPtronic developed the working prototype to a completed product in 2009. A furtherpresentation will be held by Fraunhofer at the SMT 2009 in Nuremberg.FP6 - CRAFTCEC Contract No. COOP-CT-2003-50822514FINAL REPORTVersion 03 – July 2009
“Diagnostic tools for HVOF process optimization” ESPOO 2005, VTT PUBLICATIONS 583 . FP6 - CRAFT 10 FINAL REPORT CEC Contract No. COOP-CT-2003-508225 Version 03 – July 2009 2.4.1 Atmospheric Plasma Spraying (APS) technology Atmospheric Plasma Spray (APS) is a method where the energy is based on the plasma produced by ionising an .
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