SOP-QA-08.12 Printed Circuit Board Acceptability
STANDARD OPERATINGPROCEDUREPROPRIETARY NOTICEThis material contains proprietaryinformation. Any disclosure without prior,written permission from Universal AvionicsSystems Corporation is strictly prohibited.PRINTED CIRCUIT BOARDACCEPTABILITYAPPROVALSPROCESS OWNERDARREN EVANSQUALITY REPRESENTATIVEMIKE DRABEKSOP-QA-08.12 REV 161. PURPOSE AND SCOPEThis document provides a reference and a standard for printed circuit board acceptability forproducts manufactured by Universal Avionics Systems Corporation (UA).The acceptability criteria outlined in this document will be used to provide our board vendorsthe level of quality expected by UA. Furthermore, this document will be used as a qualitycontrol tool to verify the level of quality being accepted into UA stock.2. RESPONSIBILITY The Area Supervisor or a designated individual will implement this procedure andprovide trained personnel.3. DEFINITIONS None4. PROCEDUREThis document is divided into the following subjects that are specific to UA requirements: PANEL PLATING MARKING SOLDER MASK DIMENSIONAL CHARACTERISTICS CLEANLINESS TESTING X-OUTS FLAMMABILITY SOLDERABILITY SOLDER SAMPLES CERTIFICATE OF CONFORMANCE SERIALIZATION PACKAGING TEST COUPONSOP-QA-08.12REV 16Page 1 of 5The controlled copy of this document resides in a protected area of the Universal Avionics Systems CorporationDocument Control System. Printed copies are uncontrolled and for reference only.
4.1. Panel Plating Copper plating on panel increases rigidity and reduces warpage.ACCEPTANCE CRITERIA. Solid copper on all layers around perimeter and on webbingshall not be removed except to meet .125 copper to edge distance requirements. UA’spanelized board drawings call for solid copper to be present on all layers. Many times,the panel frame does not allow for the resins to flow during lamination causing the frameto be much thicker than the board itself. Although the frame will be discarded after theboard is populated by UA, the assembly process requires that the board and panelthicknesses match as closely as possible. To achieve this, the outer layers should besolid copper and all inner layers shall be cross hatched.4.2. Marking Vendor Logo and Date Code. Vendor Logo or MIL Cage code and Date Codeidentify the manufacturer of the PCB and the date of manufacture.o ACCEPTANCE CRITERIA. Vendor Logo and Date Code shall be silkscreenednot plated and shall not be obscured by components. Date code shall notexceed one year from date of delivery. Electrical Test Stamps. Electrical Test (ET) stamping on the PCB indicates thattesting operations are complete.o ACCEPTANCE CRITERIA. Test stamp shall be placed on the PCB, not theframe. If there is no room on the PCB for the marking, please notify UA for adeviation.4.3.Solder Mask Mask Type. Mask type needs to be specified to control manufacturing processes.o ACCEPTANCE CRITERIA. All circuit boards purchased by UA shall bemanufactured as Solder Mask Over Bare Copper (SMOBC) with a green liquidphotoimageable solder mask with a matte, satin or semi-gloss finish per IPCSM-840 Class 3.o Some fine pitch boards require the use of LDI soldermask. This is acceptableand note that the material will be a higher gloss than the matte finish. Thickness. Thickness refers to the amount of solder mask that is covering thecircuit board.o ACCEPTANCE CRITERIA. Minimum thickness of solder mask is 0.0007 andMaximum thickness of solder mask is 0.001 inches over conductors.4.4.Dimensional Characteristics and Tolerances Holes.o ACCEPTANCE CRITERIA. All holes to be within .005 inches from their trueposition.SOP-QA-08.12REV 16Page 2 of 5The controlled copy of this document resides in a protected area of the Universal Avionics Systems CorporationDocument Control System. Printed copies are uncontrolled and for reference only.
Etching.o ACCEPTANCE CRITERIA. Etch tolerance shall be /- 20%. Etch tolerancespecified is measured deviation between etch board and UA supplied masterGerber data. Flatness.o ACCEPTANCE CRITERIA. The board shall have no more than 0.70% bow ortwist when measured per IPC-TM-650, method 2.4.22. Co-planarity of pads. After HASL the surface of the pads need to be within acertain level of variation.o ACCEPTANCE CRITERIA. Average coplanarity of lands shall not deviate morethan .0006”.4.5.Cleanliness 4.6.ACCEPTANCE CRITERIA. When tested in accordance with IPC-TM-650, method2.3.26, bare boards must measure 2.0 micrograms per square inch or less of sodiumchloride (NaCl) equivalent.Testing and InspectionElectrical test required using ASCII file to create netlist when supplied. If ASCII file is notprovided, use extracted Gerber data to create netlist. 100% Automatic OpticalInspection (AOI) required on all layers.4.7.X-Outs X-outs must be present on both sides on the non-conforming PCB. X-outs in PCB Panels are acceptable per the following: Boards per panelMax X-outs per panel2 to 415 to 829 and more3Number of panels in each lot delivered with X-outs must be 10%. 4.8.Package X-out panels separately by lot and identify packaging as containing X-outpanels.FlammabilityPCB raw materials must meet their respective UL flammability requirements (94V-0).4.9.Solder SamplesSolder samples are used for engineering process development and solderabilityevaluation. One solder sample PCB shall be supplied with each first article deliveredSOP-QA-08.12REV 16Page 3 of 5The controlled copy of this document resides in a protected area of the Universal Avionics Systems CorporationDocument Control System. Printed copies are uncontrolled and for reference only.
4.10.Certificate of ComplianceA certificate of compliance certifies that the PCBs were manufactured in compliance withthis document and all applicable drawings and specifications. 4.11.ACCEPTANCE CRITERIA. A Certificate of Compliance shall accompany each lot ofPCBs. A Certificate of Conformance must have the PCB part number, date code,revision, manufacturer’s name and address and signature. If an IPC document isspecified, it must match the document specified on the board drawing. Referencesection 4.13 for details on the structural integrity certification requirements.SerializationPCB serialization is used to track cross-section reports from vendors. 4.12.ACCEPTANCE CRITERIA. PCBs shall be serialized. Etching or stamping isacceptable. Serialization should be made on PCB surface, not PCB frame unlessspace does not permit. Serial numbers must be unique per panel, not per board.PackagingPCBs shall be individually packaged, or vacuum sealed in bundles in ESD safepackaging to avoid chaffing. Slip sheets can be used if boards are sealed in groups, notindividual. X-outs shall be packaged per paragraph 4.7.4.13.Test Coupons Structural Integrity cross-section analysis reports are required to be delivered witheach shipment. Serial number information needs to be indicated on the paperworkto ensure that all boards received have been examined per IPC-6012 or IPC-6013class III acceptability standards. The potted cross-section samples shall be maintained at the supplier.5. ASSOCIATED DOCUMENTSDocument TypeDocument NumberTitleExternalIPC-TM-650IPC Test MethodsExternalANSI/J-STD-003Solderability Tests for Printed CircuitsExternalIPC-SM-840Qualification and Performance of Permanent SolderMaskExternalIPC-600Acceptability of Printed BoardsExternalIPC-6011Generic Performance Specification for Printed BoardsExternalIPC-6012Qualification and Performance Specification for RigidPrinted BoardsExternalIPC-6013Qualification and Performance Specification for FlexiblePrinted BoardsFormFRM-ADM-08.12Supplier Deviation Request FormSOP-QA-08.12REV 16Page 4 of 5The controlled copy of this document resides in a protected area of the Universal Avionics Systems CorporationDocument Control System. Printed copies are uncontrolled and for reference only.
6. REVISION HISTORYDateRevisionChanges7/11/201815Updated Section 4.3 to add “semi-gloss” soldermask to the acceptancecriteria.10/16//201916Updated Section 4.3 to add “Satin” soldermask finish to acceptancecriteria. Updated requirement in Section 4.19.SOP-QA-08.12REV 16Page 5 of 5The controlled copy of this document resides in a protected area of the Universal Avionics Systems CorporationDocument Control System. Printed copies are uncontrolled and for reference only.
Printed copies are uncontrolled and for reference only. 1. PURPOSE AND SCOPE This document provides a reference and a standard for printed circuit board acceptability for products manufactured by Universal Avionics Systems Corporation (UA). The acceptability criteria outlined in this document will be used to provide our board vendors
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