MOLEX BUSBAR SOLUTIONS
MOLEXBUSBAR SOLUTIONSPower solutions made simple.
BUSBARS POWERSOLUTIONS MADESIMPLEBusbars are the backbone ofpower distribution. Molex appliesits decades of Busbar experienceto partner with customers,providing feedback on theirdesigns, recommending solutions,prototyping and more. By workingso closely with customers, we strivefor the following goals. To enhance the performanceof our customers’ endproducts with reliable busbarsolutions. To streamline manufacturingprocesses and offer costsavings through suggesteddesign improvements. To shorten our customers’product development byproviding front end designsupport. To provide consumptionflexibility with a globalmanufacturing footprint.
Manufacturing CapabilitiesFlexible Grounding JumpersCustom lengthsFlat braidCustom endsStocking packages are available through distributionFlexible BusbarsRound and flat braid versionsInsulated and uninsulated versionsStacked braid versionsFlex/rigid combined solutionsMolex connector solutionsRigid BusbarsCapabilitiesSwaging of rodEdge bend and complex formingTin, Nickel and Silver platingPowder coat insulationBrazing and weldingValue AddMolex connector solutionsPEM insertion and attachmentKittingLaminated BusbarsAlternating layers of conductors and insulationMylar, Nomex, Rigid Plastic, FR4Space SavingsEase of assembly in customer applicationsFeaturesMolex connector solutionsImproved heat dissipationLow characteristic impedancePowder coat solutionsTin, Nickel and Silver plating
Coeur CST High-CurrentInterconnect SystemMoving power from point A to B is crucial in today’s electrically run world. Customers are looking for innovativeways to connect busbars that offer different methods of attachment to busbars, multiple form factors, andsolutions to tolerance concerns. Molex has developed the Coeur CST Interconnect System. This system has formfactors of 3.4mm, 6.00mm, and 8.00mm to cover a wide range of amperage needs ranging from 30.0A up to 200Aand offers press-fit, weld, and screw attach methods to the busbar for options depending on busbar thicknessor space constraints. The system also offers a unique float feature providing up to 1.0mm of float to mitigatepin to socket axial misalignment when mating busbar-to-busbar or busbar-to-PCB. The Coeur CST High-CurrentConnector can be used in all your busbar design solutions.Capable of 30.0 to above 200.0A current ratingOffers a scalable design to meet a wide range of high-current applicationsMultiple contact beamsProvide optimized electrical performanceUnique socket float feature provides an industryleading 1.0mm of float off the center positionNo added deflection on contactsLow mating forcesAttach methods to busbar PCBs and wireinclude press-fit, SMT, screw, crimp and weldProvides design flexibility for a range of high-current applicationsOne common contact design in all CST socketsregardless of form factor sizesProvides a low profile height solution across entire current rangeWire to Busbar solutionsTouch-safe available10 AWG thru I/O AWG crimp rangePositive latchingVertical male headers screw attached to busbar600V rating in configurationApplicationsData Center SolutionsCircuit BreakersData StorageInstrumentationPDUServersUPS/battery storageIndustrialPower eSwitches
Production CapabilitiesBusbar Machine Process DefinitionsWaterjetHigh-pressure water mixed withStamping and formingoperationsPEM insertion andassembly operationsan abrasive to cut hard materialsCoil and strip processing in customPress-fit insertion of self-clinchinginto complex shapes. Best for low-die sets to achieve high-speedthreaded and unthreaded studs andvolume and prototype jobs.production with extreme accuracy.nuts.CNC MillsLaminationSolder dipComputerized program that operatesUse of heat and pressure to insulate oneComponents are dipped in a moltena rotating cylindrical cutting toolthat can move in multiple axes toachieve the desired shape. Can belinked with CAD models to programthe cut path.or multiple busbars in an adhesive-lineddielectric. Offers improved thermal andelectrical performance and improvesease of assembly when mounting in thesystem.solder bath and bond together uponcooling.Heat shrink value addUse of heat to shrink and secureelectrical insulation to a conductor.Turret-style punchingHi-PotAutomated metal sheet fabricationHi-Pot test is a nondestructive testusing a rotation of many tools to cutcomplex shapes up to 0.25” thick.Semi-Automaticproduction of bar stockmaterialCutting, forming, and edge bendingof bar stock. Saves on material by notnesting on a sheet and producing scrap.that verifies the adequacy of thebusbar insulation. The standard testvoltage is 2X (operating voltage) 1000V.BrazingTwo or more metal items are joinedtogether by melting and flowing afiller metal into the joint. Used inhigher temperature applicationsthan soldering.Wire braid assemblyFlexible power distributioncomponent that eliminates problemscaused by vibration in a system.
Get customized insights at: molex.comOrder No. 987652-0181USA/0k/GF/KC/2019.08 2019 Molex
Flat braid Custom ends Stocking packages are available through distribution Flexible Busbars Round and flat braid versions Insulated and uninsulated versions Stacked braid versions Flex/rigid combined solutions Molex connector solutions Rigid Busbars Capabilities Swaging of rod Edge bend and
BusBar DistriBution system 60mm BusBar systems Spec-00507 L 1 BusBar systems suBJeCt to CHanGe WitHout notiCe eQuiPment ProteCtion SPEC-00507 BusBar system oVerVieW inDustry stanDarDs Fuseholders: UL 4
2) Busbar distance is the same as busbar thickness for busbar numbers 2, 3 and 4; Distance for twin groups for 4 is 50mm. Ibusbar Ichart x k1 x k2x k3 x k4 x k5 Ibusbar: Current value of the said busbar [A] Ichart: Current value stated in Chart 1 [A] k1,k2,k3,k4,k5: Multipliers [1] Calculation of copper busbar current carrying capacity
Jul 26, 2021 · 6. High-level Busbar Mapping Steps The busbar mapping process is completed through a sequenced transfer of information between the CPUC, CEC, and CAISO. It is an iterative process, as demonstrated by Figure 1. Figure 1. Flowchart of the busbar mapping process
This document has been developed by ENTSO-E and it is intended to present the fundamentals of the busbar protection and all stages of its engineering (design, settings, commissioning and maintenance). The report is based on responses received from European TSOs to a questionnaire on busbar protection.
7 "Busbar" and "substation" are used interchangeably in this document. A busbar, a specific connection point within a substation, is the more accurate term. The mapping process need only identify the applicable substation to connect a resource, so long as the availability of a feasible busbar there has been considered.
7 "Busbar" and "substation" are used interchangeably in this document. A busbar, a specific connection point within a substation, is the more accurate term. The mapping process need only identify the applicable substation to connect a resource, so long as the availability of a feasible busbar there has been considered.
conventional substation. Process bus busbar relay can have IEEE 1588 boundary clock capability. All merging units are synchronized to the same source, the busbar protection relay, the sampled values streams can be aligned and used for the low impedance busbar differential protection.
on the work of its forty-seventh session, which was held in New York, from 7-18 July 2014, and the action thereon by the United Nations Conference on Trade and Development (UNCTAD) and by the General Assembly. In part two, most of the documents considered at the forty-seventh session of the Commission are reproduced. These documents include .
