IPC-A-610C Telecom Addendum

7m ago
9 Views
0 Downloads
3.47 MB
61 Pages
Last View : 1m ago
Last Download : n/a
Upload by : Alexia Money
Transcription

IPC-A-610DCTelecom AddendumAugust 2009A standard developed by IPCAssociation Connecting Electronics Industries

The Principles ofStandardizationIn May 1995 the IPC’s Technical Activities Executive Committee (TAEC) adopted Principles ofStandardization as a guiding principle of IPC’s standardization efforts.Standards Should: Show relationship to Design for Manufacturability(DFM) and Design for the Environment (DFE) Minimize time to market Contain simple (simplified) language Just include spec information Focus on end product performance Include a feedback system on use andproblems for future improvementNoticeStandards Should Not: Inhibit innovation Increase time-to-market Keep people out Increase cycle time Tell you how to make something Contain anything that cannotbe defended with dataIPC Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay theproper product for his particular need. Existence of such Standards and Publications shall not inany respect preclude any member or nonmember of IPC from manufacturing or selling productsnot conforming to such Standards and Publication, nor shall the existence of such Standards andPublications preclude their voluntary use by those other than IPC members, whether the standardis to be used either domestically or internationally.Recommended Standards and Publications are adopted by IPC without regard to whether their adoption may involve patents on articles, materials, or processes. By such action, IPC does not assumeany liability to any patent owner, nor do they assume any obligation whatever to parties adoptingthe Recommended Standard or Publication. Users are also wholly responsible for protecting themselves against all claims of liabilities for patent infringement.IPC PositionStatement onSpecificationRevision ChangeIt is the position of IPC’s Technical Activities Executive Committee that the use and implementationof IPC publications is voluntary and is part of a relationship entered into by customer and supplier.When an IPC publication is updated and a new revision is published, it is the opinion of the TAECthat the use of the new revision as part of an existing relationship is not automatic unless requiredby the contract. The TAEC recommends the use of the latest revision.Adopted October 6, 1998Why is therea charge forthis document?Your purchase of this document contributes to the ongoing development of new and updated industrystandards and publications. Standards allow manufacturers, customers, and suppliers to understandone another better. Standards allow manufacturers greater efficiencies when they can set up theirprocesses to meet industry standards, allowing them to offer their customers lower costs.IPC spends hundreds of thousands of dollars annually to support IPC’s volunteers in the standardsand publications development process. There are many rounds of drafts sent out for review andthe committees spend hundreds of hours in review and development. IPC’s staff attends and participates in committee activities, typesets and circulates document drafts, and follows all necessaryprocedures to qualify for ANSI approval.IPC’s membership dues have been kept low to allow as many companies as possible to participate.Therefore, the standards and publications revenue is necessary to complement dues revenue. Theprice schedule offers a 50% discount to IPC members. If your company buys IPC standards andpublications, why not take advantage of this and the many other benefits of IPC membership aswell? For more information on membership in IPC, please visit www.ipc.org or call 847/597-2872.Thank you for your continued support. Copyright 2009. IPC, Bannockburn, Illinois, USA. All rights reserved under both international and Pan-American copyright conventions. Anycopying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited andconstitutes infringement under the Copyright Law of the United States.

IPC-A-610DC Telecom AddendumDeveloped by the Telecom IPC-A-610 Addendum Task Group (7-31bc) ofthe Product Assurance Committee (7-30) of IPCUsers of this standard are encouraged to participate in thedevelopment of future revisions.Contact:IPC3000 Lakeside Drive, Suite 309SBannockburn, Illinois60015-1249Tel 847 615.7100Fax 847 615.7105

August 2009IPC-A-610DCAcknowledgmentMembers of the Telecom IPC-A-610 Addendum Task Group have worked together to develop this document. We would liketo thank them for their dedication to this effort. Any document involving a complex technology draws material from a vastnumber of sources. While the principal members of the Telecom IPC-A-610 Addendum Task Group (7-31bc) of the Product Assurance Committee (7-30) are shown below, it is not possible to include all of those who assisted in the evolution ofthis standard. To each of them, the members of the IPC extend their gratitude.Product AssuranceCommitteeIPC-A-610 TelecomAddendum Task GroupTechnical Liaisons of theIPC Board of DirectorsChairMel ParrishSTI ElectronicsChairDarrin DodsonAlcetel-LucentPeter BigelowIMI Inc.Sammy YiAptina Imaging CorporationMembers of the IPC-A-610 Telecom Addendum Task GroupTom Bennett, Adtran Inc.Trevor Bowers, Adtran Inc.Darrin Dodson, Alcatel-LucentChristopher Sattler, AQS - AllQuality & Services, Inc.Joe Bartnicki, Fujitsu NetworkCommunicationsSteven Smith, Fujitsu NetworkCommunicationsMichael Nadreau, HenkelCorporationBai Chun Xiang, HuaweiTechnologies Co., Ltd.Stephen Tisdale, Intel CorporationVasu Vasudevan, Intel CorporationGirish Wable, Jabil Circuit, Inc. (HQ)Beverley Christian, Research InMotion LimitedJennifer Day, Sanmina-SCIOfer Cohen, Seabridge Ltd., ASiemens CompanyMel Parrish, STI ElectronicsTodd Herman, TellabsBob Willis, The SMART GroupSPECIAL ACKNOWLEDGMENTWe would like to provide special acknowledgment to the following member for providing pictures and illustrations thatare used in this revision.Darrin Dodson, Alcatel-Lucentii

Telecom Addendum0.1 Scope This addendum provides requirements to be used in addition to, and in some cases, in place of, those published inIPC-A-610D to ensure that electrical and electronic assemblies meet requirements for customers requiring Telecordia GR-78CORE compliance.Where content criteria are not supplemented, the Class 2 requirements of IPC-A-610D apply.0.1.1 Purpose When required by procurement documentation/drawings, this Addendum supplements or replaces specificallyidentified requirements of IPC-A-610D.0.1.2 Precedence Customer contractual requirements take precedence over this Addendum, referenced standards and userapproved drawings. In the event of a conflict between this Addendum and the applicable documents cited herein, this Addendumtakes precedence. Where referenced criteria of this addendum differ from the published IPC-A-610D, this addendum takes precedence.0.1.3 Existing or Previously Approved Designs This Addendum shall not constitute the sole cause for the redesign of previously approved designs. When drawings for existing or previously approved designs undergo revision they should be reviewedand changes made that allow for compliance with the requirements of this Addendum.0.1.4 UseThis Addendum is applicable for rigid single sided, double sided, and multilayer boards.This Addendum shall not to be used as a standalone document.Where criteria are not supplemented, the Class 2 requirements of IPC-A-610D apply. Criteria defined in IPC-A-601D as ‘‘processdefects’’ for class 2 shall be treated as defective, unless otherwise stated in this Addendum.If an IPC-A-610D requirement is changed or added by this Addendum, the clause is identified and that entire IPC-A-610D clauseor subordinate clause is replaced by the criteria in this Addendum.The clauses modified by this Addendum do not include subordinate clauses unless specifically stated (e.g., 1.4 does not include1.4.1). Clauses, Tables, Figures, etc., in IPC-A-610D that are not listed in this Addendum are to be used as-published.In this addendum, as in the published IPC-A-610D, in case of conflict or discrepancy, the description or written criteria always take precedence over the illustrations.The surface insulation resistance and the electromigration resistance of the finished PBA shall be in accordance with GR-78CORE. This is relevant for no-clean assembly processes, which should be used preferably, as well as for fluxes which are intendedto be cleaned, and for SMC adhesives.Solder alloy shall comply with J-STD-006 or equivalent.0.1.5 Additional Referenced Standards Telcordia GR-78-CORE Generic Requirements for the Physical Design and Manufacture of Telecommunications Products and Equipment (http://telecom-info.telcordia.com).A-610DCAugust 20091

Telecom Addendum1.4.5 Electrical ClearanceThese criteria replace all of 1.4.5 in published IPC-A-610D.Minimum electrical clearance for products built to this document is specified as 0.13 mm [.005 in].4.1.3 Hardware Installation – Threaded FastenersThese criteria replace all of 4.1.3 in published IPC-A-610D.Defect Less than one and one-half thread extends beyond thethreaded hardware, (e.g., nut) unless thread extensionwould interfere with other component. Thread extension more than 3 mm [0.12 in] plus one andone-half threads for bolts or screws up to 25 mm [0.984 in]. Thread extension more than 6.3 mm [0.248 in] plus one andone-half threads for bolts or screws over 25 mm [0.984 in]. Bolts or screws without locking mechanisms.4.1.3.1 Hardware Installation – Threaded Fasteners – TorqueThese criteria replace all of 4.1.3.1 in published IPC-A-610D.When connections are made using threaded fasteners they must be tight to ensure the reliability of the connection. When splitring type lock washers are used, the threaded fastener must be tight enough to compress the lock washer. Fastener torque value,if not specified, shall be specified by engineering documentation.Acceptable Fasteners are tight and split-ring lock washers, when used,are fully compressed. Fasteners torque values are within the limits as specified bydrawing, or as specified by engineering documentation.Defect Split-ring lock washer not compressed. Fasteners are not properly torqued within the limits specifiedby drawing, or as specified by engineering documentation.4.1.3.2 Hardware Installation – Threaded Fasteners – WiresCriteria in published IPC-A-610D 4.1.3.2 are not applicable to users of this addendum.2August 2009A-610DC

Telecom Addendum4.3.2 Connector Pins – Press Fit PinsThese criteria replace all of 4.3.2 in published IPC-A-610D.Acceptable Damaged nonfunctional lands for single and double-sidedboards are acceptable if firmly attached to board in unliftedareas.Defect Any functional annular ring which is lifted.4.4.1 Wire Bundle Securing – GeneralThese criteria replace all of 4.4.1 in published IPC-A-610D.Metal cable clamps shall not be used unless they are insulated.Acceptable The wires are secured in the wire bundle. Cable ties are cut flush with the locking head.Defect Spot tie wrap or knot is loose. Wire bundle is loose. Cable tied with an improper knot. This tie may eventuallyloosen. Restraining devices, clamps, plastic ties, lacing cord, etc.damages the wiring insulation or cable by compression. End of cut tie wrap protrudes past the face of the lockinghead.4.5.2 Routing – Bend RadiusThis replaces Table 4-1 in 4.5.2 of published IPC-A-610D. All of the rest of 4.5.2 in published IPC-A-610D is applicable.IPC-A-610DC Table 4-1Minimum Bend Radius RequirementsCable TypeIPC-A-610DCBare bus or enamel insulated wire2XInsulated wire and flat ribbon cable2XCable bundles with no coax cables2XCable bundles with coax cables5XCoaxial cables5XCAT5 Ethernet cable4XFiber Optic Cable - Buffered and Jacketed Single FiberLarger jacketed fibersA-610DC1 inch or as specified by the manufacturer15X cable diameter or as specified by the manufacturerAugust 20093

Telecom Addendum4.5.3 Routing – Coaxial CableThese criteria replace all of 4.5.3 in published IPC-A-610D.Defect Inside bend radii does not meet the criteria of Table 4-1.Defect Spot ties or tie wraps that cause any deformation of coaxialcables.5.2.1 Soldering Anomalies – Exposed Basis MetalThese criteria replace all of 5.2.1 in published IPC-A-610D.Process Indicator Exposed basis metal on component leads, conductors orland surfaces from nicks or scratches provided conditionsdo not exceed the requirements of 7.1.2.3 for leads and10.2.9.1 for conductors and lands.5.2.2 Soldering Anomalies – Pin Holes/Blow HolesThese criteria replace all of 5.2.2 in published IPC-A-610D.Process Indicator Blowholes, pinholes, voids, etc., providing the solder connection meets all other requirements.7.1 Component MountingUse 7.1 published criteria in IPC-A-610D with this added statement:The presence of engineering approved spacers or insulators, used to improve manufacturability, shall not be cause for rejection.4August 2009A-610DC

Telecom Addendum7.1.7 Component Mounting – Radial Leads – HorizontalThese criteria replace all of 7.1.7 in published IPC-A-610D.Target The component body is in flat contact with the board’s surface.Acceptable Component in contact with board on at least one sideand/or surface.Note: When documented on an approved assembly drawing,a component may be either side mounted or end mounted.The side or surface of the body, or at least one point of anyirregularly configured component (such as certain pocketbookcapacitors), needs to be in full contact with the printed board.The body shall be bonded or otherwise secured to the boardto prevent damage when vibration and shock forces areapplied.Defect Component not secured.7.1.8 Component Mounting – ConnectorsThese criteria replace all of 7.1.8 in published IPC-A-610D.These criteria apply to soldered connectors and unsoldered press fit connectors. For connector pin criteria see 4.3. For connector damage criteria see 9.5.Connector module/pin misalignment, defined in this section, is to be measured at the connector lead-in area/hole (for receptacles)or at the pin tip (for pin headers).In cases where an assembly connector is composed of two or more identical connector modules, it shall not be permissible tomix modules manufactured by different suppliers.A-610DCAugust 20095

Telecom Addendum7.1.8.1 Connector Mounting – Heat StakingAdded criteria in this addendum.Heat Stake/Press Peg Appearance After heat staking, theheat staked heads shall meet the requirements shown onFigure 7-1 of this specification. The heat staked heads shall not have any loose flash orloose fractured pieces. PWB conductor paths and solder-resist areas adjacent tothe heat staked heads shall not be damaged by the heatstaking process.ABIPC-610D-C07-001Figure 7-1A. 1.680 0.20 mm max. heightB. Max. diameter of 4.0 0.2 mmMissing or Nonconforming Heat Stakes On any connector, heat stakes (press pegs) may be missing or not conforming to the requirements provided that they are not higher than1.6 mm [0.062 in] above the PWB, and each nonconformingheat stake (press peg) is bounded on either side by two heatstakes (press pegs) that are conforming. The outer two heatstakes (press pegs) on either end of the connector must conform to production requirements.TargetFigure 7-26August 2009A-610DC

Telecom Addendum7.1.8.1 Connector Mounting – Heat Staking (cont.)Acceptable 50% of the heat stake is present. No loose or fractured flash pieces.Figure 7-3Defect 50% of the heat stake is present. Loose flashing from heat stake process (see Figure 7-5).Figure 7-4A-610DCAugust 20097

Telecom Addendum7.1.8.1 Connector Mounting – Heat Staking (cont.)Figure 7-57.1.8.2 Connector Mounting – Soldered Connectors –Right Angle – Pin Spacing 2.5 mm [0.098 in]Added criteria in this addendum.Target Connector is mounted flush with the surface of the board.Figure 7-6Acceptable Connector-to-board spacing is equal to or less than 0.25mm [0.010 in] (not shown).Defect Connector to board spacing is greater than 0.25 mm [0.010in] (not shown).8August 2009A-610DC

Telecom Addendum7.1.8.3 Connector Mounting – Soldered Connectors –Right Angle – Pin Spacing 2.5 mm [0.098 in]Added criteria in this addendum.Target Connector is mounted flush with the surface of the board(A). All modules of a multi-part connector are aligned and aremounted flush to adjoining modules (B).Figure 7-7Acceptable Connector-to-board spacing is equal to or less than 0.13mm [0.005 in] (not shown). Maximum misalignment is 0.25 mm [0.010 in] across thefaces (contact openings) of all modules (connectors) in theconnector lineup (see Figure 7-8(A)).DefectFigure 7-8 Connector-to-board spacing is greater than 0.13 mm [0.005in] (not shown). Maximum misalignment is 0.25 mm [0.010 in] across thefaces (contact openings) of all modules (connectors) in theconnector lineup (see Figure 7-8(A)).A-610DCAugust 20099

Telecom Addendum7.1.8.4 Connector Mounting – Soldered Connectors – Vertical Shrouded PinHeaders and Vertical Receptacle Connectors – (2 mm - 2.54 mm Pin Spacing)Added criteria in this addendum.Target Connector is mounted flush with the surface of the board. All modules of a multi-part connector are aligned and aremounted flush to adjoining modules (not shown).Acceptable Connector-to-board spacing is equal to or less than 0.13mm [0.005 in] (not shown).Figure 7-9 Individual module contact openings, requiring alignment, areequal to, or less than, 0.25 mm [0.010 in], with adjacentmodules (not shown). Maximum misalignment between anytwo modules/pins in the connector lineup is 0.25 mm[0.010 in] (not shown).Defect Connector-to-board spacing is greater than 0.13 mm [0.005in]. Maximum misalignment between any two modules/pins inthe connector lineup is 0.25 mm [0.010 in] (not shown).Figure 7-1010August 2009A-610DC

Telecom Addendum7.1.8.5 Connector Mounting – Compliant Pin ConnectorsAdded criteria in this addendum.7.1.8.5.1 Connector Mounting – CompliantPin Connectors – Pin Spacing 2.5 mmAdded criteria in this addendum.Target Connector is mounted flush with the surface of the board.Figure 7-11Acceptable Connector-to-board separation is less than or equal to 0.25mm [0.010 in] (not shown). Connector tail pins protrude through, or are flush with, thesurface of the board (not shown). Connector tail pins are of equal length from pin to pin withinthe same row (not shown).Defect Connector-to-board separation is greater than 0.25 mm[0.010 in]. Connector tail pins do not protrude through, or are not flushwith, the surface of the board (not shown). Connector tail pins are not of equal length from pin to pinwithin the same row (not shown).Figure 7-12A-610DCAugust 200911

Telecom Addendum7.1.8.5.2 Connector Mounting – Compliant PinConnectors – Right Angle, Pin Spacing 2.5 mmAdded criteria in this addendum.Target Connector is mounted flush with the surface of the board. Connector pins of similar modules are of equal length frompin to pin within the same row. Shield (if applicable) is installed according to the fabricationdesign requirements (see Figure 7-14). All modules of a multi-part connector are aligned and aremounted flush to adjoining modules (see Figure 7-15).Figure 7-13Figure 7-14Figure 7-1512August 2009A-610DC

Telecom Addendum7.1.8.5.2 Connector Mounting – Compliant PinConnectors – Right Angle, Pin Spacing 2.5 mm (cont.)Acceptable Connector-to-board spacing is equal to or less than 0.13mm [0.005 in] (see Figure 7-16).Figure 7-16 Maximum misalignment is 0.25 mm [0.010 in] across thefaces (contact openings) of all modules (connectors) in theconnector lineup (see Figure 7-17). Connector tail pins protrude through, or are flush with, thesurface of the board. Connector tail pins of similar modules are of equal lengthfrom pin to pin within the same row.Figure 7-17Defect Connector-to-board spacing is greater than 0.13 mm [0.005in] (see Figure 7-18). Maximum misalignment is 0.25 mm [0.010 in] across thefaces (contact openings) of all modules (connectors) in theconnector lineup. Connector tail pins do not protrude through, or are not flushwith, the surface of the board. Connector tail pins of similar modules are not of equal lengthfrom pin to pin within the same row.Figure 7-18A-610DCAugust 200913

Telecom Addendum7.1.8.5.3 Connector Mounting – Compliant Pin Connectors – Vertical ShroudedPin Headers and Vertical Receptacle Connectors (2 mm - 2.54 mm Pin Spacing)Added criteria in this addendum.Target Connector is mounted flush with the surface of the board. All modules/pins of a multi-part connector are aligned andare mounted flush to adjoining modules.Figure 7-19Acceptable Connector-to-board spacing (A) is equal to or less than 0.13mm [0.005 in] from any edge or corner(not shown). Connector tail pins protrude through the board and are ofequal length from pin to pin (not shown). (This is not applicable when design, PCB thickness or length of specifiedcomponent leads prevents pin protrusion.) Maximum misalignment between any two modules/pins inthe connector lineup is 0.25 mm [0.010 in] (not shown).Figure 7-20Defect Connector-to-board spacing is greater than 0.13 mm [0.005in] at any edge or corner (not shown). Connector tail pins do not protrude through the board (notshown). Connector pins protruding through the board are not ofequal length from pin to pin (not shown). Maximum misalignment between any two modules/pins inthe connector lineup is 0.25 mm [0.010 in].Figure 7-1214August 2009A-610DC

Telecom Addendum7.1.10 Component Mounting – Front Panel Mounted LEDsAdded criteria in this addendum.There are no illustrations for these criteria.Target Through-hole mounted LEDs are centered in the mountinghole. The tops of through-hole mounted LEDs protrude from thesurface of the panel.Acceptable The tops of through-hole mounted LEDs are flush with thesurface of the panel. Three or more LEDs mounted in a row on a panel arealigned center to center and height.Defect Front panel mounted LEDs are recessed below the surfaceof the panel.7.1.11 Component Mounting – Conductive CasesAdded criteria in this addendum.Where a potential for shorting (violation of minimum electrical clearance) exists between conductive component bodies, at leastone of the bodies will be protected by an insulator.7.5.1 Supported Holes – Axial Leaded – HorizontalThese criteria replace all of 7.5.1 in published IPC-A-610D.Defect Component height exceeds user-determined dimension (H). Components dissipating greater than 1 Watt are mountedless than 1.5 mm [0.059 in] above the board surface.7.5.5.1 Supported Holes – Solder – Vertical fill (A)These criteria replace all of 7.5.5.1 in published IPC-A-610D.Where large areas of copper (e.g., ground or power planes) or other heat sinks (e.g., heavy component leads) are connected toPTHs in PCBs, or where pin-in-paste processes are used on thick PCBs results in insufficient vertical solder fill and/or secondaryside land wetting, hole fill shall be sufficient to ensure that the minimum pin-wetted length within the barrel is at least .047 inchregardless of board thickness.A-610DCAugust 200915

Telecom Addendum7.5.5.7 Supported Holes – Solder Conditions – Meniscus in SolderThese criteria replace all of 7.5.5.7 in published IPC-A-610D.Defect Does not meet requirements of Tables 7-6 or 7-7. Coating meniscus is in the plated through hole. Coating meniscus is embedded in the solder connection.8.2 SMT ConnectionsThese criteria replace all of 8.2 in published IPC-A-610D.SMT connections must meet the criteria of 8.2.1 through 8.2.14, as appropriate.Where a potential for shorting (violation of minimum electrical clearance) exists between conductive component bodies, at leastone of the bodies will be protected by an insulator.9.5.1 Component Damage – Connectors – KeysAdded criteria in this addendum.Acceptable Keying slots or holes are free of cracks, chips, or foreignmaterial that could interfere with the mating pin, blade, oralignment device (not shown).Defect Keying slots or holes have cracks, chips, or foreign materialthat interferes with the mating pin, blade, or alignmentdevice (not shown).Some connectors, e.g., FutureBus , have key tabs wherekeys may be inserted. To prevent damage during handling ofthe finished circuit pack, it is permissible to remove the keytabs at the extreme ends of the connector line-up (A) after theconnectors are installed. In addition, a maximum of two (2)additional key tabs may be removed (if damaged during subsequent handling) provided that the following criteria are met: Broken tabs are trimmed flush to the connector body.Figure 9-1 Two (2) missing tabs are not next to each other on a givenmodule.A. End tab key Two (2) missing tabs are not the end tabs on adjacent connector modules (A). Tabs that secure required keys shall not be damaged.16August 2009A-610DC

Telecom Addendum9.5.1 Component Damage – Connectors – Keys (cont.)Acceptable Any removed tab is trimmed flush.Figure 9-2Defect Tab not trimmed flush to connector body.Figure 9-39.5.2 Component Damage – Connectors – Surface DamageAdded criteria in this addendum.Acceptable Chips, burn blemishes, or handling damage on connectorsurface do not extend into the contact lead-in surface.Figure 9-4A-610DCAugust 200917

Telecom Addendum9.5.2 Component Damage – Connectors – Surface Damage (cont.)Acceptable At the rate of one per assembly, the connector shieldattachment device or retaining method may be damaged ormissing provided that all of the following conditions are met: It is not the first or last such device located at either end ofthe individual module. The shield is adequately secured and does not interferewith alignment or prevent mating with shrouded pin headercontacts. The retaining device is flush or below flush with the connector housing.Figure 9-5Defect Chips, burns, or handling damage on connector surface,which extends into the contact lead-in surface. Connector body is damaged/deformed. The shield is not adequately secured and/or interferes withthe alignment or prevents mating with shrouded pin headercontacts (see Figure 9-8).Figure 9-6 The number of damaged connector shield attachmentdevices or retaining methods exceeds one per assembly(not shown). The retaining device is not flush or below flush with the connector housing (not shown).Figure 9-718August 2009A-610DC

Telecom Addendum9.5.2 Component Damage – Connectors – Surface Damage (cont.)Figure 9-8For electrically enhanced (EE) connectors, it shall be permissible to have three (3) missing ground contacts on the bottomside per PWB provided the following criteria are met: Damaged ground contacts shall be trimmed flush to theground shield (see Figure 9-10). Only one (1) missing ground contact per connector moduleis allowed. No damage to the top-side ground contacts is permitted.Figure 9-9Figure 9-10A-610DCAugust 200919

Telecom Addendum9.6 Component Damage – RelaysAdded criteria in this addendum.Acceptable Minor scratches, cuts, chips, or other imperfections that donot penetrate the case or affect the seal (not shown).BCDefect Scratches, cuts, chips, or other imperfections that penetratethe case or affect the seal (A, B).A The case is bulging or swollen (C).IPC-610D-C09-011Figure 9-1120August 2009A-610DC

Telecom Addendum9.7 Component Damage – Transformer Core DamageAdded criteria in this addendum.Acceptable Chips and/or scratches on exterior edges of core are permissible, providing they do not extend into core mating surfaces and do not exceed 1/2 the thickness of the core.Figure 9-12Defect Chip in the core material is located on mating surface. Chip extending greater than 50% of the core thickness. Cracks in the core material.Figure 9-13A-610DCAugust 200921

Telecom Addendum10.1 Gold Fingers (Contact Fingers)These criteria replace all of 10.1 in published IPC-A-610D.The term contact area is defined as the area that encompasses all points that could be contacted by the mating connector contacts under all tolerance conditions. This includes the area from the edge of the PCB to the fully mated contact position, butexcludes copper exposed by chamfering the leading edge of the PCB.Gold plating shall normally extend 0.51 mm [0.020 in] above the shoulder of the contact. In situations where an extension wouldinclude holes in the gold plated area, the gold plating line shall end just below the pad of the hole. A demarcation line showingcopper and/or discolored tin-lead shall not exceed 0.051 mm [0.002 in].For the purpose of interpreting requirements on defects and surface variations on the gold-plated surface of a connector finger(see Figure 10-1), the following definitions shall apply:Pits:A pit is a sharply defined depression in the gold-plated surface that does not extend through the underlyingcopper.Indentations:An indentation is a gradual depression in the gold-plated surface resulting from a shallow imperfection in theunderlying material. An indentation has no discernible sharp or jagged edges.Scratches:A gold scratch is an abrasion in the gold-plated surface that alters or removes the gold plate and produceseither exposed copper or nickel, or sharp, jagged edges. However, abrasions that merely mar or polish (burnish) the gold-plated surfaces are not considered scratches.Pores:A pore is any defect other than a pit or a scratch in the gold surface that exposes the underlying copper ornickel.Pinholes:A pinhole is any defect that extends through the underlying copper to the base material. A pinhole may or maynot be gold plated.Nodules:A nodule is a volume of metal, generally round or elongated as a ridge, which projects above the surroundinggold surface. When nodules are very

Members of the Telecom IPC-A-610 Addendum Task Group have worked together to develop this document. We would like to thank them for their dedication to this effort. Any document involving a complex technology draws material from a vast number of sources. While the principal members of the Telecom IPC-A-610 Addendum Task Group (7-31bc) of the Prod-

Related Documents:

Venodyne boots- calf/thigh VasoPress DVT System IPC Vascutherm IPC Thrombus pumps - calf/thigh IPC Thromboguard IPC Sequential pneumatic hose IPC Sequential compression device IPC IPC Rapid inflation asymmetrical compression (RIAC) devices IPC Pneumatic intermittent impulse compression device Plexipulse-calf/thigh IPC

Ipc Module Ipc - IPC Manager Used to initialize IPC and synchronize with other processors. Application must call Ipc_start and Ipc_attach. Two startup protocols Ipc.ProcSync_ALL - all processors start at same time Ipc.ProcSync_PAIR - host processor starts first Configuration Ipc.procSync configures startup protocol When using Ipc.ProcSync_ALL, Ipc_attach is .

IPC-A-610, Acceptability of Electronic Assemblies IPC-A-610EC, Telecommunications Addendum to IPC-A-610 (in development) *IPC-J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies IPC-A-600, Acceptability of Printed Boards IPC-6012, Qualification and Performance Specification for Rigid Printed Boards

Atlantic-ACM 2002 International Wholesale Carrier Report Card. One of the Top International Carriers 0 2000 4000 6000 8000 10000 12000 14000 KDDI TelMex Singapore Telecom Teleglobe PTT Telecom (KPN) PCCW HK Telecom Bell Canada Telefonica China Telecom Swisscom iBasis Telecom Italia Cable & Wireless Sprint France Telecom Deutsche Telecom British .

discussed. IPC-6011, IPC-6012C, J-STD-003B and IPC-A-600H Block 3: 1400-1500 (Including one coffee break) Electronic Assembling and Soldering. What is a lead free process. Acceptability and Requirements for Electronic Assemblies will be discussed using IPC Standards; J-STD-001F, IPC-610F, IPC-7711/21B and IPC-620B

IPC-3, IPC-5 USER MANUAL REV. 2.04 7 TEKNIC, INC.PHONE (585)784-7454 IPC-3 SPECIAL SAFETY NOTE Unlike the IPC-5, the IPC-3 is an open frame power supply. As such, there are user-accessible, hazardous voltage points present on the device.

IPC-4101 Specification for Base Materials for Rigid and Multilayer Printed Boards IPC-4101 December 1997 Supercedes IPC-L-108, IPC-L-109, IPC-L-112, IPC-L-115 IPC-AM-361 TheInstitutefor Interconnecting andPackaging ElectronicCircuits A standard developed by the Institute for Interconnecting

2 The LIS Project Team United States Prof. Richard K. Lester IPC (Project Director) Prof. Danny Breznitz Georgia Institute of Technology Shiri M. Breznitz IPC Prof. Alok Chakrabarti New Jersey Institute of Technology Dr. Jean-Jacques Degroof IPC Wei Gao IPC Dr. Sachi Hatakenaka IPC Carlos Martínez-Vela IPC Prof. Michael J. Piore IPC Prof. Sean Safford University of Chicago

IPC Certifications which could include any or all of the following: IPC J-STD-001, IPC-A-600, IPC-A-610, IPC-WHMA-A-620, and IPC-7711/21. An Associates in Applied Science with a focus on manufacturing could also be applicable to this occupation. Industry-Sector Technical Competencies . Blueprint Reading

courses (IPC -A-600, IPC-A-610, IPC/WHMA -A-620, IPC- 6012 and Designer Certification) and courses that include workmanship skills demonstration (J -STD-001 and IPC-7711/7721). The effective date of this P&P docu

IPC-A-600 Acceptability of PCBs IPC-SM-840 Qualification and Performance Specification of Permanent Solder mask IPC 4101 Specification for Base Materials for Rigid and Multilayer Printed Boards IPC 4104 Specification for High Density Interconnect (HDI) Layers and Boards IPC 4552 ENIG IPC 4553

ipc 5 – 64 64.9 400 2 600 97.3 210 250 14.40 ipc 6 – 80 80.7 400 2 400 121.0 210 250 30.90 ipc 6 – 100 101.3 400 2 200 151.9 210 250 36.10 ipc 6 – 125 126.2 400 2 200 189.3 210 250 43.70 ipc 7 – 160 160.

Developed by the OEM council of the IPC, IPC-1720A categorized an electronic assembly manufacturer's capabilities and supplies the OEM customer with detailed, substantive information. IPC-1720A July 2004 A standard developed by IPC _ _ 2215 Sanders Rd, Northbrook, IL 60062-6135 Tel. 847.509.9700 Fax 847.509.9798 www.ipc.org

Re: ADDENDUM SEVEN - DELAWARE STATE POLICE - TROOP 3- BID PACK 1 Dover, Delaware 2011116.00 ADDENDUM SEVEN The addendum forms a part of the contract documents and modifies the original bidding documents dated, October 9, 2013, modified by Addendum No. 1 dated 10-18-2013, Addendum No. 2 dated

16-20 IPC-7711B/7721B Rework, “Modification and Repair of Electronic Assemblies” Certified IPC Trainer (CIT) Certification Madison, AL FEBRUARY 06-08 IPC-A-610E “Acceptability of Electronic Assemblies” - Certified IPC Application Specialist(CIS) Certification Madison, AL 13-16 IPC/WHMA-A-620 “Requirements and Acceptance for Cable and .

IPC 2010–2011 IPC-A-610E, Acceptability of Electronic Assemblies p. 3 J-STD-001E, Requirements for Soldered Electrical and Electronic Assemblies p. 3 IPC-A-600H, Acceptability of Printed Boards p. 9 IPC-6012C, Qualification and Performance Specification for Rigid Printed Boards p. 9

IPC-A-600 – Acceptability of Printed Boards IPC-TM 650 – Test Methods IPC-2221/2222 – Generic Standard on Printed Board Design, IPC-2223 Sectional Design Standard for Flexible Printed Boards, IPC-2226 Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

Contents v Cisco IOS IP Configuration Guide Suppressing Forward and Reverse Record Options IPC-26 Specifying the NHRP Responder Address IPC-26 Changing the Time Period NBMA Addresses Are Advertised as Valid IPC-26 Configuring a GRE Tunnel for Multipoint Operation IPC-27 Configuring NHRP Server-Only Mode IPC-27 Enabling

approved acc. to internal test specification (on request) subject to automotive requirements on the basis of IEC 60352-5 1 acc. to IPC-4101 C 2 acc. to IPC-A600H Class 3, IPC-6011 Class 3, IPC-6012 C Class 3, IPC-TM-650 and Perfag 2F/3D 3 other FR-base materials and PC-board layouts the

ANIMAL NUTRITION Tele-webconference, 27 November, 10 and 11 December 2020 (Agreed on 17 December 2020) Participants Working Group Members:1 Vasileios Bampidis (Chair), Noël Dierick, Jürgen Gropp, Maryline Kouba, Marta López-Alonso, Secundino López Puente, Giovanna Martelli, Alena Pechová, Mariana Petkova and Guido Rychen Hearing Experts: Not Applicable European Commission and/or Member .