PRELIMINARY APPLICATION SPECIFICATION
PRELIMINARY APPLICATION SPECIFICATIONSEARAY BOARD TO BOARDINTERCONNECT SYSTEM45970 / 46556 SMT Plug Connector(shown with kapton padfor pick and place)45971 / 46557 SMT Receptacle Connector(shown with kapton padfor pick and place)REVISION:5ECR/ECN INFORMATION:EC No: UCP2008-****DATE: 2007/09/19DOCUMENT NUMBER:AS-45970-001TITLE:SHEET No.APPLICATION SPECIFICATION FORSEARAY INTERCONNECT SYSTEM1 of 17CREATED / REVISED BY:CHECKED BY:APPROVED BY:Tim GregoriAdam StanczakJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC
PRELIMINARY APPLICATION SPECIFICATIONTable of ContentsSectionPage1.0 Scope32.0 Product Description3333332.12.22.32.42.5Product Names and Series NumbersMolex Part Number Configuration 45970 / 46556 PlugMolex Part Number Configuration 45971 / 46557 ReceptacleConnector Assembly Mated Stack Height OptionsDimensions, Materials, Platings, and Markings3.0 Applicable Documents and Specifications34.0 Mating and Un-Mating of Connectors444566777884.1 Recommendations for MatingFigure 1: Housing Mating Polarization FeaturesFigure 2: Housing Rough Alignment FeaturesFigure 3: Straight Mating ConditionFigure 4: Zipper Mating ConditionFigure 5: NOT Recommended Zipper Mating Condition4.2 Recommendations for Un-MatingFigure 6: Straight Un-Mating ConditionFigure 7: Zipper Un-Mating ConditionFigure 8: NOT Recommended Zipper Un-Mating Condition5.0 Multi-Connector Processing910115.1 Process LimitationsFigure 9: Constrained Board AlignmentFigure 10: Free Floating Board Alignment6.0 Soldering Process Recommendations121212131313141515166.16.26.36.4PCB LayoutSolder Paste Stencil LayoutPlacementSolder ReflowFigure 11: Thermocouple PlacementFigure 12: Sn/Pb Sample Reflow ProfileFigure 13: Pb Free Sample Reflow Profile6.5 Inspection (Post Process)6.6 Rework and Repair7.0 Electrical RecommendationsREVISION:5ECR/ECN INFORMATION:EC No: UCP2008-****DATE: 2007/09/19DOCUMENT NUMBER:AS-45970-00117TITLE:SHEET No.APPLICATION SPECIFICATION FORSEARAY INTERCONNECT SYSTEM2 of 17CREATED / REVISED BY:CHECKED BY:APPROVED BY:Tim GregoriAdam StanczakJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC
PRELIMINARY APPLICATION SPECIFICATION1.0 SCOPEThis document is NOT intended to be the final process definition nor is it intended to constraindesign. This document contains guidelines and settings will vary according to the process andequipment used. The document addresses the manufacturing techniques and end-usageconsiderations for Molex’s SEARAY parallel board to board interconnect system. Thissystem consists of various height surface mount receptacles and plugs that are combined toget particular board to board stack height internconnects. Various circuit sizes are alsoavailable. This document is a guideline for process development and customers with varyingequipment, materials, and processes will develop individual processes to meet their needs.The customer is encouraged to contact Molex with any questions regarding the application ofthis product.2.0 PRODUCT DESCRIPTION2.1 Product Names and Series NumbersSMT Plug ConnectorsSeries: 45970 / 46556 (Slim)SMT Receptacle ConnectorsSeries 45971 / 46557 (Slim)2.2 Molex Part Number Configuration 45970 / 46556 Plug(See applicable sales drawings for information)2.3 Molex Part Number Configuration 45971 / 46557 Receptacle(See applicable sales drawings for information)2.4 Connector Assembly Mated Stack Height Options(See applicable sales drawings for information)2.5 Dimensions, Materials, Platings, and Markings(See applicable sales drawings for information)3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONSProduct Specification:Sales Drawing :Sales Drawing :PCB Footprint :PCB Footprint :Packaging:Packaging:REVISION:5ECR/ECN INFORMATION:EC No: UCP2008-****DATE: 2007/09/19DOCUMENT NUMBER:AS-45970-001PS-45970-001SD-45970-001 (Plug); SD-46556-001 (Plug Slim)SD-45971-001 (Receptacle) ; SD-46557-001 (Receptacle Slim)SD-45970-001; SD-46556-001 - Sheet 2 (Plug)SD-45971-001; SD-46557-001 - Sheet 2 (Receptacle)PK-45970-001; PK-45970-002 (Plug)PK-45971-001; PK-45971-002 (Receptacle)TITLE:SHEET No.APPLICATION SPECIFICATION FORSEARAY INTERCONNECT SYSTEM3 of 17CREATED / REVISED BY:CHECKED BY:APPROVED BY:Tim GregoriAdam StanczakJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC
PRELIMINARY APPLICATION SPECIFICATION4.0 MATING AND UN-MATING OF CONNECTORS4.1 Recommendations for Mating:Connector mating occurs after both have been surface mounted to their respectivecircuit boards. Each customer should evaluate how the boards are going to be handledand make the determination of which connector is mounted on which board.Each receptacle connector is designed with polarizing rib features, mating alignment slotfeatures and a circuit #1 indicator (see figure 1). Each plug connector is designed withpolarizing slot features, mating alignment keys and a circuit #1 indicator (see figure 1).Each plug slot accepts the corresponding receptacle rib during mating and eachreceptacle slot accepts the corresponding plug key. The combination of these featuresorient the connectors and discourage improper mating.ReceptaclePlugCircuit #1IndicatorSlotsRibsKeysSlotsCircuit #1IndicatorFigure 1: Housing Mating Polarization Features(Note: Terminals not shown for clarity)Place the main board on a solid surface with the connector up. Remove the pick andplace kapton pad from both connectors by peeling it away from the connector housing.Take special care to not contact the terminal blades on the plug or receptacle.Quarantine suspect assemblies for damaged or bent terminal inspection. Connectorswith damaged or bent terminals should not be used.This system is not designed with guide pins. Rough alignment is required prior toconnector mating as misalignment of .037” (1.0mm) could damage the connectorhousings. Alignment of the connectors is achieved through mating the alignment slots ofthe receptacle housing to the alignment keys of the plug housing (see figure 2).REVISION:5ECR/ECN INFORMATION:EC No: UCP2008-****DATE: 2007/09/19DOCUMENT NUMBER:AS-45970-001TITLE:SHEET No.APPLICATION SPECIFICATION FORSEARAY INTERCONNECT SYSTEM4 of 17CREATED / REVISED BY:CHECKED BY:APPROVED BY:Tim GregoriAdam StanczakJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC
PRELIMINARY APPLICATION SPECIFICATIONGenerous lead-in edges on these features will allow the user to ‘blind-mate’ theconnectors.Plug KeysReceptacleSlotsFigure 2: Housing Rough Alignment Features(Note: Terminals not shown for clarity)Place the secondary board over the main board oriented such that the circuit #1indicators of both connectors line up with each other. Apply a force normal to thesecondary board directly behind the location of the connector until the connector housingis fully seated and the circuit boards are parallel to one another. It is recommended thatthe SEARAY connectors be mated straight, as shown in figure 3, however whenmating the larger circuit counts (400 circuits to 500 circuits) less force is required if thetwo connectors are zippered together, as shown in figure 4. Zipper mating can be startedfrom either end.REVISION:5ECR/ECN INFORMATION:EC No: UCP2008-****DATE: 2007/09/19DOCUMENT NUMBER:AS-45970-001TITLE:SHEET No.APPLICATION SPECIFICATION FORSEARAY INTERCONNECT SYSTEM5 of 17CREATED / REVISED BY:CHECKED BY:APPROVED BY:Tim GregoriAdam StanczakJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC
PRELIMINARY APPLICATION SPECIFICATIONMating DirectionCircuit #1 indicatorFigure 3: Straight Mating Condition10 Max.Figure 4: Zipper Mating ConditionREVISION:5ECR/ECN INFORMATION:EC No: UCP2008-****DATE: 2007/09/19DOCUMENT NUMBER:AS-45970-001TITLE:SHEET No.APPLICATION SPECIFICATION FORSEARAY INTERCONNECT SYSTEM6 of 17CREATED / REVISED BY:CHECKED BY:APPROVED BY:Tim GregoriAdam StanczakJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC
PRELIMINARY APPLICATION SPECIFICATIONFigure 5: NOT RECOMMENDED Zipper Mating ConditionThere is no active latching mechanism in the connector system so assembledconnectors must be handled with care. If shipped in the mated condition packaging testsshould be conducted to verify there is no damage to the assembly.4.2 Recommendations for Un-Mating:It is recommended that the SEARAY connectors be un-mated straight, as shown infigure 6, however when un-mating the larger circuit counts (400 circuits to 500 circuits)less force is required if the two connectors are zippered apart, as shown in figure 7. UnZipper un-mating can be started from either end.Un-mating DirectionFigure 6: Straight Un-Mating ConditionREVISION:5ECR/ECN INFORMATION:EC No: UCP2008-****DATE: 2007/09/19DOCUMENT NUMBER:AS-45970-001TITLE:SHEET No.APPLICATION SPECIFICATION FORSEARAY INTERCONNECT SYSTEM7 of 17CREATED / REVISED BY:CHECKED BY:APPROVED BY:Tim GregoriAdam StanczakJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC
PRELIMINARY APPLICATION SPECIFICATION7 Max.Figure 7: Zipper Un-Mating ConditionFigure 8: NOT RECOMMENDED Zipper Un-Mating ConditionREVISION:5ECR/ECN INFORMATION:EC No: UCP2008-****DATE: 2007/09/19DOCUMENT NUMBER:AS-45970-001TITLE:SHEET No.APPLICATION SPECIFICATION FORSEARAY INTERCONNECT SYSTEM8 of 17CREATED / REVISED BY:CHECKED BY:APPROVED BY:Tim GregoriAdam StanczakJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC
PRELIMINARY APPLICATION SPECIFICATION5.0 MULTI-CONNECTOR PROCESSING(Note: CTE differences between PCB / fixturing during reflow must be considered regarding connector locations)5.1 Process LimitationsWhen using multiple connectors on a PCB, care must be taken to ensure properalignment and figures 9 and 10 illustrate the placement limitations for these connectors,but do not take into account the spacing required for additional components or automaticplacement / rework equipment.For applications requiring more than two connectors per board, please contact Molex.Minimum spacing shall be dictated by circuit routing best practices.REVISION:5ECR/ECN INFORMATION:EC No: UCP2008-****DATE: 2007/09/19DOCUMENT NUMBER:AS-45970-001TITLE:SHEET No.APPLICATION SPECIFICATION FORSEARAY INTERCONNECT SYSTEM9 of 17CREATED / REVISED BY:CHECKED BY:APPROVED BY:Tim GregoriAdam StanczakJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC
PRELIMINARY APPLICATION SPECIFICATIONEnd-to-EndSide-to-Side0.13 [.005] MAX Variation0.13 [.005] MAX VariationMIN(Ends)See Note0.13 [.005]0.13 [.005]MINMAX(Centerlines)VariationMAX.013 [.005] MAX Variation0.13 [.005]MAX.013 [.005] MAX Variation0.13 [.005]MAX8 DegreesMAXFigure 9: Constrained Board AlignmentREVISION:5ECR/ECN INFORMATION:EC No: UCP2008-****DATE: 2007/09/19DOCUMENT NUMBER:AS-45970-001TITLE:SHEET No.APPLICATION SPECIFICATION FORSEARAY INTERCONNECT SYSTEM10 of 17CREATED / REVISED BY:CHECKED BY:APPROVED BY:Tim GregoriAdam StanczakJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC
PRELIMINARY APPLICATION SPECIFICATIONEnd-to-EndSide-to-Side0.20 [.008] MAX Variation0.20 [.008] MAX VariationMIN(Ends)See Note0.20 [.008]0.20 [.008]MINMAX(Centerlines)VariationMAX.020 [.008] MAX Variation0.20 [.008]MAX.020 [.008] MAX Variation0.20 [.008]MAX10 DegreesMAXFigure 10: Free Floating Board AlignmentREVISION:5ECR/ECN INFORMATION:EC No: UCP2008-****DATE: 2007/09/19DOCUMENT NUMBER:AS-45970-001TITLE:SHEET No.APPLICATION SPECIFICATION FORSEARAY INTERCONNECT SYSTEM11 of 17CREATED / REVISED BY:CHECKED BY:APPROVED BY:Tim GregoriAdam StanczakJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC
PRELIMINARY APPLICATION SPECIFICATION6.0 SOLDERING PROCESS RECOMMENDATIONS45970 / 46556 SMT PLUG CONNECTOR45971 / 46557 SMT RECEPTACLE CONNECTOR6.1 PCB LayoutSee the applicable Sales Drawings for an illustration of the recommended PCB layout.Contact Molex if further assistance is required.The connector should be placed on a copper defined pad of diameter .025”. (Ref. SalesDrawings for exact detail) utilizing an OSP board finish.Solder mask must be registered correctly to within 0.003” of the pad edge.Recommended clearance or keep out area allowed for reworking of this component is.200” all the way around the perimeter of the part. See the applicable Sales Drawing foran illustration of the recommended Keep Out Area. Contact Molex if further assistance isrequired. Instructions from the repair equipment manufacturer should be followed wherenecessary. Sensitive components can be either electrically sensitive or mechanicallysensitive such as micro BGA components.Vias should not be placed on pads.A solder dam should be created using solder mask when a land goes to a via which isclose to the pad, this will avoid wicking of the solder from the pad into the via.Legends around the perimeter of the connector are recommended to aid in handplacement situations.6.2 Solder Paste Stencil LayoutSee the applicable Sales Drawing for an illustration of the recommended PCB layout.Contact Molex if further assistance is required.For ease of use a no-clean paste is recommended.The stencil thickness should be .0050” and aperture size in the stencil should be.035” diameter.6.3 PlacementVerify that your pick and place equipments Z axis can accommodate the height of theproduct and the depth travel require to clear the trays. Reference the applicable Salesand Packaging Drawings for dimensions. The connector will be supplied in anti –staticthermoformed plastic trays or embossed tape and reel. Each tray will have a first circuitindicator corresponding to the location of the first circuit on the connector.REVISION:5ECR/ECN INFORMATION:EC No: UCP2008-****DATE: 2007/09/19DOCUMENT NUMBER:AS-45970-001TITLE:SHEET No.APPLICATION SPECIFICATION FORSEARAY INTERCONNECT SYSTEM12 of 17CREATED / REVISED BY:CHECKED BY:APPROVED BY:Tim GregoriAdam StanczakJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC
PRELIMINARY APPLICATION SPECIFICATIONFor ease of pick-up, the connector has a removeable kapton pad fitted for vacuum pickup and automated SMT machine placement. Care should be taken when removing thekapton pad after placement to avoid any damage to exposed terminal blades.Connectors should be placed with enough pressure to ensure that the leads touch downon the copper pads (this would normally be 250 to 300 grams or where placementpressure is not adjustable a negative placement height).Placement should be within a tolerance band of .002” and placement equipment meetingthis accuracy should be used.6.4 Solder ReflowThe PCB containing the connector should be reflowed in compliance with themanufacturers data sheet for the paste used.It is recommended that the soak time be long enough to allow temperature equalizationof the whole area under the connector and the time above liquidus be long enough fortotal reflow.Correct reflow should be confirmed by placing 3 thermocouples underneath theconnector, one (1) on the leading corner position, one (2) in the middle and one (3) onthe trailing corner as shown in figure 11 (drilling through the PCB may have to beundertaken to accomplish this). This will need to be done on both the plug andreceptacle since differences in their general construction may effect the amount of timerequired to reach reflow temperatures.Direction of travelthrough ovenFigure 11: Thermocouple PlacementREVISION:5ECR/ECN INFORMATION:EC No: UCP2008-****DATE: 2007/09/19DOCUMENT NUMBER:AS-45970-001TITLE:SHEET No.APPLICATION SPECIFICATION FORSEARAY INTERCONNECT SYSTEM13 of 17CREATED / REVISED BY:CHECKED BY:APPROVED BY:Tim GregoriAdam StanczakJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC
PRELIMINARY APPLICATION SPECIFICATIONThe lead free version of this component is suitable for processing through thetemperatures used in lead free processes but should not be subjected to temperatures inexcess of 250 C.The connector may be cleaned using a suitable cleaning agent to remove any residue orcontaminants. When cleaning is required it is recommended that the pick up cap beremoved and the connector be rotated 180 after cle aning process to allow excesscleaning solution to drain. Extra care should be taken to ensure that it is completely drybefore electrical testing.Figure 12: Sn/Pb Sample Reflow Profile(sample profile only – be sure to follow solder profile guidelines of solder paste being used)REVISION:5ECR/ECN INFORMATION:EC No: UCP2008-****DATE: 2007/09/19DOCUMENT NUMBER:AS-45970-001TITLE:SHEET No.APPLICATION SPECIFICATION FORSEARAY INTERCONNECT SYSTEM14 of 17CREATED / REVISED BY:CHECKED BY:APPROVED BY:Tim GregoriAdam StanczakJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC
PRELIMINARY APPLICATION SPECIFICATIONFigure 13: Pb Free Sample Reflow Profile(sample profile only – be sure to follow solder profile guidelines of solder paste being used)6.5 Inspection (Post Process)The connector may be examined visually for damage and cleanliness.The solder joints can be inspected using x-ray equipment or other establishedconventional methods.Electrical testing can be performed with a customer designed system for both in circuitand application testing. However, care should be taken that the design of this equipmentdoes not cause damage to the housing or the terminals.REVISION:5ECR/ECN INFORMATION:EC No: UCP2008-****DATE: 2007/09/19DOCUMENT NUMBER:AS-45970-001TITLE:SHEET No.APPLICATION SPECIFICATION FORSEARAY INTERCONNECT SYSTEM15 of 17CREATED / REVISED BY:CHECKED BY:APPROVED BY:Tim GregoriAdam StanczakJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC
PRELIMINARY APPLICATION SPECIFICATION6.6 Rework and RepairIt is recommended that a commercially available hot air rework station be used for therepair of this product, many of these repair stations are readily available and theselected manufacturer is a matter of individual customer choice. It is very important thatthe correct nozzle be used for this operation. Some of the connectors are taller, larger,and therefore have more mass in comparison to other SMT devices and these attributesneed to be considered in nozzle selection.Before commencing with the repair, a rework kapton pad, similar to the originalremovable kapton pad should be fitted onto the connector to allow vacuum pick-up.Removal can then be accomplished either by using a temperature ramp of 3 degrees Cper second from 25 to 150 degrees C and then through liquidus or by baking the wholePCB in an oven at 100 degrees C for at least 30 minutes and then taking throughliquidus. The time in soak and above liquidus should be sufficient to allow the solder toreflow underneath the connector and avoid damaging pads.Soak time and temperature is dependent on the type of solder used and should conformto the paste manufacturer’s guidelines.Once the full reflow has been achieved the connector should be removed using avacuum pick-up taking care to not have motion parallel to the board if done by hand.This removed connector should now be discarded as it cannot be reused.Before replacing the connector the residual solder on the pads should be removed usingeither a vacuum scavenging system or by hand using a skilled operator. It isrecommended that the pads be pasted again using a .005” thick stencil. Where this isnot possible a highly skillled operator can deposit sufficent solder on the pads manually.Using this method the pads must be fluxed before reflow. This method requires highlyskilled experienced operators and is not recommended.The fresh connector can then be replaced either using the silkscreen outline on the PCBfor placement or by using the repair tool where the repair tool has a split image prismvision system allowing the operator to see the leads superimposed on the pads.Once the connector has been placed on the PCB it should be reflowed using the reflowprofile developed for the rework process. When determining this profile initially, correctreflow should be confirmed by placing 3 thermocouples underneath the connector, onein the leading corner position, one in the middle and one on th trailing corner (drillingthrough the PCB may have to be undertaken to
preliminary application specification revision: ecr/ecn information: sheet no. 5 ec no: ucp2008-**** date: 2007/09/19 title: application specification for searay interconnect system 2 of 17 document number: created / revised by: checked by: approved by:
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