HANDYLINK APPLICATION SPECIFICATION

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HANDYLINK APPLICATION SPECIFICATIONHANDYLINK I/O CONNECTORS44828 SMT ReceptacleConnector45560 SMT CradleConnector45339 and 45593Plug Connector ModulesREVISION:A1ECR/ECN INFORMATION: TITLE:EC No: UCP2006-0***DATE: 2005/09/01DOCUMENT NUMBER:AS-44828-001SHEET No.APPLICATION SPECIFICATIONHANDYLINK I/O CONNECTOR SYSTEM1 of 22CREATED / REVISED BY:CHECKED BY:APPROVED BY:T. Gregori/ M. SimmelMarc SimmelJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC

HANDYLINK APPLICATION SPECIFICATIONTable of N:A1ScopeProduct DescriptionApplicable Documents and SpecificationsMating and Un-Mating of Connectors4.1 Recommendations for Mating and Un-Mating4.2 Mating Alignment TolerancesSoldering Process Recommendations5.1 44828 SMT Receptacle Connector5.1.1 PCB Layout5.1.2 Solder Paste Stencil Layout5.1.3 Reflow Profile5.1.4 Inspection5.2 45560 SMT Cradle Connector5.2.1 PCB Layout5.2.2 Solder Paste Stencil Layout5.2.3 Reflow Profile5.2.4 Inspection5.3 45339 Plug Module for Wire Termination5.3.1 Applicable Wire Sizes5.3.2 Wire Preparation5.3.3 Inspection5.4 45593 Plug Module for PCB Termination5.4.1 PCB Layout5.4.2 InspectionMechanical Design Recommendations6.1 Mechanical Fasteners and Support6.1.1 Receptacle Connector6.1.2 Plug Connector Modules6.1.3 Cradle Connector6.2 Ingress Protection6.3 Plug Cable Over-Molding6.3.1 Wire Soldering6.3.2 Encapsulation6.3.3 Strain Relief6.3.4 Final Over-Molding6.4 Design Best Practices6.4.1 Plug Over-mold Designs6.4.2 Cradle DesignsElectrical Recommendations7.1 Power Considerations7.2 High Speed Signal Transmission44667781011142121ECR/ECN INFORMATION: TITLE:EC No: UCP2006-0***DATE: 2005/09/01DOCUMENT NUMBER:AS-44828-001SHEET No.APPLICATION SPECIFICATIONHANDYLINK I/O CONNECTOR SYSTEM2 of 22CREATED / REVISED BY:CHECKED BY:APPROVED BY:T. Gregori/ M. SimmelMarc SimmelJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC

HANDYLINK APPLICATION SPECIFICATION1.0 SCOPEThis specification addresses the manufacturing techniques and end-usage considerations forMolex’s 0.8mm pitch HandyLink I/O Connectors. The common contact interface used inthis family of connectors consists of a flat pad mated to a radiussed edge on a compressionspring blade. The flat pad is enclosed by plastic in an over-molded receptacle housing whichprovides a sealed ineterface to facilitate ingress protection. The compression spring bladesare extremely durable and are capable of sustaining over 20,000 mating cycles. Two“passive” latches counteract the compression springs to keep the connector pairs mated butenable simple disconnection by the end-user.The customer is encouraged to contact Molex with any questions regarding the application ofthis product.2.0 PRODUCT DESCRIPTION2.1 Product Names and Part NumbersSMT Receptacle ConnectorsSeries: 44828SMT Cradle ConnectorsSeries 45560 (Perpendicular and Parallel Mating)Plug Connector ModulesSeries 45339 (Wire Termination)Series 45593 (PCB Termination)2.2 Dimensions, Materials, Platings, and Markings(See applicable sales drawings for information)3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONSProduct SpecificationPS-44828-001Sales DrawingSD-44828-162Sales DrawingSD-45560-160, SD-45560-161, SD-45560-162Sales DrawingSD-45339-160, SD-45593-160REVISION:A1ECR/ECN INFORMATION: TITLE:EC No: UCP2006-0***DATE: 2005/09/01DOCUMENT NUMBER:AS-44828-001SHEET No.APPLICATION SPECIFICATIONHANDYLINK I/O CONNECTOR SYSTEM3 of 22CREATED / REVISED BY:CHECKED BY:APPROVED BY:T. Gregori/ M. SimmelMarc SimmelJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC

HANDYLINK APPLICATION SPECIFICATION4.0 MATING AND UN-MATING OF CONNECTORSThis section describes the preferred methods for mating and un-mating the HandyLink connectors.4.1Recommendations for Mating and Un-MatingThis connector system utilizes a “passive” latching feature. There is no button to press to latchor unlatch. To latch, simply push the plug into the receptacle (the connectors are polarized todiscourage improper mating). To unlatch, simply grip the plug body firmly and pull it straight outof the receptacle.4.2Mating Alignment Tolerances4.2.a 44828 Receptacle to 45339 or 45593 Plug ConnectorsThe HandyLink plug and receptacle have been appropriately designed and toleranced to bemated and unmated by hand. The connectors’ alignment features are manufactured withclearances to allow axial mating mis-alignment, as illustrated in the Figure 1, below:Figure 1. Receptacle to Plug Connector Axial Alignment (units: mm)REVISION:A1ECR/ECN INFORMATION: TITLE:EC No: UCP2006-0***DATE: 2005/09/01DOCUMENT NUMBER:AS-44828-001SHEET No.APPLICATION SPECIFICATIONHANDYLINK I/O CONNECTOR SYSTEM4 of 22CREATED / REVISED BY:CHECKED BY:APPROVED BY:T. Gregori/ M. SimmelMarc SimmelJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC

HANDYLINK APPLICATION SPECIFICATION4.2Mating Alignment Tolerances (continued)4.2.b 44828 Receptacle to 45560 Cradle ConnectorsThe HandyLink receptacle and cradle connectors’ alignment features are manufactured withclearances to allow some axial mating mis-alignment as illustrated in the Figure 2, below:Figure 2. Receptacle to Cradle Connector Axial Alignment (units: mm)NOTE: Mating misalignment may significantly influence the long-term durability of theconnectors. The risk of housing wear diminishes with increasing the accuracy of connectoralignment.4.3Clearances Between Mated PartsThe HandyLink connectors are designed such that the corresponding ‘front’ faces fully engageand then spring back 0.20mm to the final mated condition. This ‘over-travel clearance’ assuresthat the components of the passive latching system engage. Please see Section 6.4 DesignBest Practices for further detailed information.REVISION:A1ECR/ECN INFORMATION: TITLE:EC No: UCP2006-0***DATE: 2005/09/01DOCUMENT NUMBER:AS-44828-001SHEET No.APPLICATION SPECIFICATIONHANDYLINK I/O CONNECTOR SYSTEM5 of 22CREATED / REVISED BY:CHECKED BY:APPROVED BY:T. Gregori/ M. SimmelMarc SimmelJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC

HANDYLINK APPLICATION SPECIFICATION5.0 SOLDERING PROCESS RECOMMENDATIONS5.144828 SMT Receptacle Connector5.1.1 PCB LayoutSee the applicable Sales Drawing for an illustration of the recommended PCB layout.Contact Molex if further assistance is required.5.1.2 Solder Paste Stencil LayoutSee Sales Drawing for solderable surfaces. Contact Molex if further assistance is required.5.1.3 Reflow ProfileWhile the production solder reflow profile is typically established by the customer, based on theirspecific application, generic reflow profiles can be found in Product Specification PS-44828-001.The profiles are provided for reference purposes only.5.1.4 InspectionSolder joints should be inspected using established conventional methods.5.245560 SMT Cradle Connector5.2.1 PCB LayoutSee the applicable Sales Drawings for illustrations of the recommended PCB pad layouts.Contact Molex if further assistance is required.5.2.2 Solder Paste Stencil LayoutSee Sales Drawing for recommended PCB pad layout and solder paste thickness.5.2.3 Reflow ProfileWhile the production solder reflow profile is typically established by the customer, based on theirspecific application, generic reflow profiles can be found in Product Specification PS-44828-001.The profiles are provided for reference purposes only.5.2.4 InspectionSolder joints should be inspected using established conventional methods.REVISION:A1ECR/ECN INFORMATION: TITLE:EC No: UCP2006-0***DATE: 2005/09/01DOCUMENT NUMBER:AS-44828-001SHEET No.APPLICATION SPECIFICATIONHANDYLINK I/O CONNECTOR SYSTEM6 of 22CREATED / REVISED BY:CHECKED BY:APPROVED BY:T. Gregori/ M. SimmelMarc SimmelJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC

HANDYLINK APPLICATION SPECIFICATION5.345339 Plug Module for Wire Termination5.3.1 Applicable Wire SizesCopper conductor size: 22 to 34 AWG (stranded wires are recommended for flexibility) may be used,however, 22 to 28 AWG conductors are necessary to transmit 1.5 Amperes DC continuously.Maximum insulation diameter: 1.6mmNOTE: Small conductor sizes are suitable for the transmission of digital signals, and may improvewire bundle flexibility and harness workability.5.3.2 Wire PreparationStrip length: 2.0 2.5mmPre-tinning is recommended.5.3.3 InspectionSolder joints should be inspected using established conventional methods.5.445593 Plug Module for PCB Termination5.4.1 PCB LayoutSee the applicable Sales Drawing for an illustration of the recommended PCB hole layout.5.4.2 InspectionSolder joints should be inspected using established conventional methods.REVISION:A1ECR/ECN INFORMATION: TITLE:EC No: UCP2006-0***DATE: 2005/09/01DOCUMENT NUMBER:AS-44828-001SHEET No.APPLICATION SPECIFICATIONHANDYLINK I/O CONNECTOR SYSTEM7 of 22CREATED / REVISED BY:CHECKED BY:APPROVED BY:T. Gregori/ M. SimmelMarc SimmelJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC

HANDYLINK APPLICATION SPECIFICATION6.0 MECHANICAL MOUNTING RECOMMENDATIONS6.1Mechanical Fasteners and Support6.1.1 Receptacle ConnectorMolex recommends that the receptacle connector be mounted within the end-applicationenclosure such that it is recessed by 1.6 to 2.4mm from the outermost faces and with a 0.10mmmaximum clearance with the casing inner walls. Such a recess provides multiple advantages interms of protecting the contact surfaces from accidental impact with foreign objects, providingmechanical support when the mating plug connector assembly is torqued by abusive handling,and helps to reduce direct contact with hand oils or other contamination. See Figures 3A and3B, below, for recommendations on recess dimensions.Figure 3A. Receptacle Connector Recess When Mating with the Plug Only (units: mm)Figure 3B. Receptacle Connector Recess When Mating with the Plug or Cradle Connectors(units: mm)Wherever possible, the 0.10 maximum clearance condition with the receptacle should beminimized by utilizing a clam-shell style package design.REVISION:A1ECR/ECN INFORMATION: TITLE:EC No: UCP2006-0***DATE: 2005/09/01DOCUMENT NUMBER:AS-44828-001SHEET No.APPLICATION SPECIFICATIONHANDYLINK I/O CONNECTOR SYSTEM8 of 22CREATED / REVISED BY:CHECKED BY:APPROVED BY:T. Gregori/ M. SimmelMarc SimmelJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC

HANDYLINK APPLICATION SPECIFICATION6.1.2 Plug Connector ModuleThe plug connector module is intended to be used as a part of a assembly using either directwire soldering (45339) or using an intermediary PCB (45593). Overmolding and/or clam shellstyle covers must be used to protect the wire connections and the appropriate service loops andwire strain reliefs must be incorporated in a cable assembly to prevent damage during use.Please refer to section 6.3 for further details about the over-molding process.If the connector module is used as a stand-alone component on a PCB, the mating interfacemust be adequately supported. Please refer to section 6.4.2 for further details concerningcradle design recommendations.6.1.3 Cradle ConnectorThe cradle connector is designed to be fastened to the PCB with screws. See Sales Drawingsfor recommended screw size and positions. Please refer to section 6.4.2 for further detailsconcerning cradle design recommendations.REVISION:A1ECR/ECN INFORMATION: TITLE:EC No: UCP2006-0***DATE: 2005/09/01DOCUMENT NUMBER:AS-44828-001SHEET No.APPLICATION SPECIFICATIONHANDYLINK I/O CONNECTOR SYSTEM9 of 22CREATED / REVISED BY:CHECKED BY:APPROVED BY:T. Gregori/ M. SimmelMarc SimmelJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC

HANDYLINK APPLICATION SPECIFICATION6.2Ingress ProtectionIngress protection, as described by IEC 60529, is a function of the customer’s enclosure. TheHandyLink Receptacle Connector has been designed to facilitate enclosure design wheningress protection is required. The interfaces between the metal and plastic components of theconnector are sealed to discourage intrusion of dust and liquid through the connector into theenclosure. The customer is expected to design an appropriate seal around the periphery of theconnector to adequately seal the finished enclosure. Contact Molex for additional information.Gaskets may be applied to the top andsides, or front surfaces.The bottom surface, once soldered, forms acontinuous seal with the PCBFigure 4. Sealing to achieve ingress protection with the receptacle connectorREVISION:A1ECR/ECN INFORMATION: TITLE:EC No: UCP2006-0***DATE: 2005/09/01DOCUMENT NUMBER:AS-44828-001SHEET No.APPLICATION SPECIFICATIONHANDYLINK I/O CONNECTOR SYSTEM10 of 22CREATED / REVISED BY:CHECKED BY:APPROVED BY:T. Gregori/ M. SimmelMarc SimmelJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC

HANDYLINK APPLICATION SPECIFICATION6.3Plug Cable Over-Molding6.3.1 Wire SolderingThis section provides an outline of the recommended plug cable over-molding practicesfor the 45339 and 45593 plug connector modules. The 45339 connector (a 16-circuit wiretermination version) is shown, below, prior to soldering. Please note the following features:Latch soldertails (2 places)Wire soldertails (2 rows)Cavities under the latches (2 places)Figure 5. Soldertail side of the plug connectorPre-tinned wires should be terminated to the appropriate solder tails working in sequenceand one row at a time, taking care that the insulation does not become exposed more than1mm from the end of the terminals. The completed assembly after soldering of the wires isshown below. Dressing of the wires should be avoided until after the soldering andencapsulation processes are complete.Figure 6.Plug Soldering Set-UpNOTE: The wire bundlemust be properly supportedor clamped as shown,during soldering andhandling, to avoiddislodging terminals orlatches from the housingprior to encapsulation,application of a strain relief,and the final over-mold.REVISION:A1ECR/ECN INFORMATION: TITLE:EC No: UCP2006-0***DATE: 2005/09/01DOCUMENT NUMBER:AS-44828-001SHEET No.APPLICATION SPECIFICATIONHANDYLINK I/O CONNECTOR SYSTEM11 of 22CREATED / REVISED BY:CHECKED BY:APPROVED BY:T. Gregori/ M. SimmelMarc SimmelJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC

HANDYLINK APPLICATION SPECIFICATION6.3.2 EncapsulationThe next step after soldering is to pre-seal or encapsulate the back end of the connectorand hold the wires in place using a silicone sealant or a low-pressure Macro-melt polyamideadhesive molding. The sealant will prevent accidental shorting between adjacent terminalsand discourage intrusion of over-mold resin into the terminal and latch cavities. Anillustration of the pre-seal coverage is shown below. Care must be taken to ensure that noencapsulant enters the terminal or latch cavities.Figure 7.Encapsulated plugconnectorAn alternate method is to combine one or more molded ‘covers’ to block entire sectionswhere void circuits are present, then use a pre-seal or encapsulant to hold the wiresseparate. This is illustrated below.Figure 8.Covered andencapsulated plugconnectorNOTE: The sealant or cover should enclose the cavities under the latches, whether or notwires are soldered to the latches. Omission of this step would allow the final over-mold resinto extrude into cavities in the housing that could disable latch and terminal function.REVISION:A1ECR/ECN INFORMATION: TITLE:EC No: UCP2006-0***DATE: 2005/09/01DOCUMENT NUMBER:AS-44828-001SHEET No.APPLICATION SPECIFICATIONHANDYLINK I/O CONNECTOR SYSTEM12 of 22CREATED / REVISED BY:CHECKED BY:APPROVED BY:T. Gregori/ M. SimmelMarc SimmelJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC

HANDYLINK APPLICATION SPECIFICATION6.3.3 Strain ReliefMolex strongly recommends the use of a crimp barrel or ferrule over the wire bundle(including ground or drain wire) that also captures the cable jacket and tension member, ifused. This will uniformly distribute mechanical loads through the wire bundle and providemechanical support to the cable jacket and tension member.Figure 9.Crimp barrel installed6.3.4 Final Over-MoldingThe final PVC over-mold may be injection-molded to completely cover the prepared cableassembly to provide an esthetically pleasing finished product. Please see Section 6.4.1 fora discussion of design best practices for the over-mold.Figure 10.Finished over-mold(shown transparent)REVISION:A1ECR/ECN INFORMATION: TITLE:EC No: UCP2006-0***DATE: 2005/09/01DOCUMENT NUMBER:AS-44828-001SHEET No.APPLICATION SPECIFICATIONHANDYLINK I/O CONNECTOR SYSTEM13 of 22CREATED / REVISED BY:CHECKED BY:APPROVED BY:T. Gregori/ M. SimmelMarc SimmelJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC

HANDYLINK APPLICATION SPECIFICATION6.4Design Best PracticesThe information provided so far in this document has been related to the basic usage conditionsof the HandyLink connectors. The sections that follow contain important information andguidelines for design that apply to specific applications or industrial design constraints for theend-product accessories. In all cases, Molex advises that prototype assemblies be used asearly in the design and development cycle as possible to simulate and assess true usageconditions in the actual end-products.Please contact Molex for technical assistance with design feasibility studies or design reviews.6.4.0 Mating Over-Travel ClearanceThe HandyLink connectors are designed such that the corresponding ‘front’ faces fully engageand then spring back 0.20mm to the final mated condition. This ‘over-travel clearance’ assuresthat the components of the passive latching system engage, as illustrated in Figure 11. Thisclearance must be accommodated in all device and accessory designs top assure properfunction.Receptacle Connector0.20mm over-travelclearance betweenconnectors when matedHookLatchPlug ConnectorFigure 11. Cut-away views of mated connectorsREVISION:A1ECR/ECN INFORMATION: TITLE:EC No: UCP2006-0***DATE: 2005/09/01DOCUMENT NUMBER:AS-44828-001SHEET No.APPLICATION SPECIFICATIONHANDYLINK I/O CONNECTOR SYSTEM14 of 22CREATED / REVISED BY:CHECKED BY:APPROVED BY:T. Gregori/ M. SimmelMarc SimmelJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC

HANDYLINK APPLICATION SPECIFICATION6.4.1 Plug Over-Mold DesignsSupplemental guide features to align the connectors during mating or un-mating are stronglyrecommended if any of the following conditions are present:o A great deal of curvature in the end product (such as that illustrated, below);o The accessory cable is stiff or bent abruptly;o The mass of the end-product itself is greater than 1000grams and is likely to experiencemore than 1g of acceleration during use or under vibration;o The cable connection and disconnection cycles are numerous (more than 5000 cycles);o There is significant risk of the end users pulling at connections in off-axis directions.Figure 12. Example of an application with a great degree of curvature near the connectorinterface.REVISION:A1ECR/ECN INFORMATION: TITLE:EC No: UCP2006-0***DATE: 2005/09/01DOCUMENT NUMBER:AS-44828-001SHEET No.APPLICATION SPECIFICATIONHANDYLINK I/O CONNECTOR SYSTEM15 of 22CREATED / REVISED BY:CHECKED BY:APPROVED BY:T. Gregori/ M. SimmelMarc SimmelJoe ComerciTEMPLATE FILENAME: PRODUCT SPEC[SIZE A](V.1).DOC

HANDYLINK APPLICATION SPECIFICATIONSupplemental guide features may be incorporated into or complement the over-mold design asillustrated in Figures 12 and 13:Contouring with a LipTo provide mechanical support for torque out of the axial plane of the connectors, the overmold must be designed to mimic the outer surfaces of the end product and include a lip such asillustrated below. NOTE: The axial clearance condition between the connectors noted in section4.2 must be maintained.oSurfaces are contouredto mimic the end productOff-axisTorquedirectionsOver-molded lipFigure 13. Example of an over-mold with contouring and a lipThis type of design will provide support for the end-user to hold the product by the connectoror where a heavy or stiff accessory cable is used.REVISION:A1ECR/ECN INFORMATION: TITLE:EC No: UCP2006-

application specification revision: ecr/ecn information: sheet no. a1 ec no: ucp2006-0*** date: 2005/09/01 title: application specification handylink i/o connector system 1 of 22 document number: created / revised by: checked by: approved by: as-44828-001 t. gregori/ m. simmel marc simmel joe comerci

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