Methods For Analyzing Solder Joint Problems, With .

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16-17th February at Tallinn Polytechnic SchoolIPC SEMINAR 2016for Producing Rigid Printed Board AssembliesWhere is theCopper?Providing critical information about IPC StandardsSpeaker: Lars Wallin,IPC European RepresentativeRevision March 1, 2015

IPC Seminar Day 1in EnglishBlock 1: 0900-1100 (Including one coffee break)What quality and reliability problems occur in PCB? Survey of different types of hardware problems, which can occur in the productionchain of a PCB’s for electronic products. What risks are involved with a Lead Free process? What costs are involved with quality and reliability problems?Requirements for the electronic designers and CAD operators. What project leaders, product owners and electronic designers need to know beforethey start to develop a new electronic product. IPC Class 1, 2 or 3, Level A, B or C? Material Declaration? Basic Data and Specifications in CAD design for the electronic designer? Which tasks and responsibilities do CAD operators require? Mechanical tolerances for bare boards? Basic Data and Specifications provided by the CAD operator for the bare boardmanufacture. IPC-2221B, IPC-2222A and IPC-7351B will be discussed plus others relevant IPCstandards for electronic design and CAD.Block 2: 1100-1200Principals of Bare Board manufacturing. What does a Bare Board cost? Which standard and special base material exists for Bare Boards today? Environmental aspects for base material choices? Which different thicknesses of Cu and dielectric can a bare board consists of? What effect has RoHS had on material properties Tg, Td, Dk & Df? CAF. IPC-4101D will be discussed as well as other relevant IPC standards for basematerials.

Lunch 1200-1300Block 3: 1300-1400Principals of Bare Board manufacturing (cont). Manufacturing of a 2-Layer bare board. Manufacturing of a 4-Layer bare board. Different surface finishes pluses and minuses Standards dealing in Qualifications and Acceptability of Printed Boards will bediscussed. IPC-6011, IPC-6012C, J-STD-003B and IPC-A-600HBlock 3: 1400-1500 (Including one coffee break)Electronic Assembling and Soldering. What is a lead free process. Acceptability and Requirements for Electronic Assemblies will be discussed usingIPC Standards; J-STD-001F, IPC-610F, IPC-7711/21B and IPC-620B Comparing the cost of prototyping vs. large volume of PCBA Comparing cost of scrapping vs. repairing (Real world examples are provided)Block 4: 1500-1600Discussion on Cleaning and Conformal Coating. Why Cleaning, Measuring and Lacking? Is Clean Really Clean? Cleaning requirements? Different methods of cleaning PCBAs?Checklist Requirements Why is a Checklist useful in the production chain of a PCBA’s? How many parameters are there? Before orders are sent out, what parameters do Project leaders, CAD operators andthe Purchasing department control? Which IPC Standards should I use?One copy of the IPC Checklist will be provided to each attendee.

IPC Seminar Day 2 in EnglishMeeting IPC Class 3 ProductionBlock 1: 0900-1130 (Including one coffee break)Being able to design and produce large quantities of high-tech PCBs accordingto IPC Class 3 requirements, involves control over many production factors.Knowledge of over 70 IPC Standards is critical to meeting IPC Class 3 requirements.The combination of these two factors is demanding but ultimately can lead to a highreturn on investment. This workshop will provide attendees the tools to meet theIPC Class 3 requirements for both external and internal production yield goals.Demands for producing IPC Class 3 through the entireelectronic supply chain.The Workshop will cover the following areas: What do Project Leaders and Electronic Designers need to specify in order to meetthe demands for IPC Class 3? IPC standards you would use are presented and explained What is required from the CAD department in order to manufacture bare boards thatmeet IPC Class 3? IPC standards you would use are presented and explained How can the purchasing department secure bare boards that meet IPC Class 3requirements? IPC standards you would use are presented and explained How can the assembly and soldering departments know they are meeting thedemands of IPC Class 3 requirements? IPC standards you would use are presented and explained

IPC TroubleshootingBlock 2: 1130-1430 (Including lunch 1200-1300)In this workshop, we will study two real cases. Using various methods to analyze theproblem, we will recommend solutions to ensure the problem will not reoccur.My Solder Joints Are Not Perfect, Why?Methods for Analyzing Solder Joint Problems, With Recommendationsto Solve the ProblemsThis Workshop will cover two case studies, using IPC Class 3 requirements forsolder joints. In these cases, bad solder joints can be hard to find! These casestudies will help answer your questions on class 3 requirements, root causes andthe identified costsCase Study 1: The solder doesn’t fill the plated through holes in order to meet the IPC Standard forClass 3 requirements. What is the Root Cause or Causes? What is the cost?Case number 2: Tomb Stoning of 0402 components, is a defect according to IPC Class 3requirements. What is the Root Cause or Causes? What can such a problem cost?Coffee Break: 1500-1515Block 3: 1515-1545Summary, Questions and Adjourned

Association Connecting Electronics Industries IPC STANDARDS —EVERYTHING YOU NEED FROM START TO FINISHEnd-ProductSMT epairIPC-7711/21SolderabilityIPC J-STD-002IPC J-STD-003Stencil terialsIPC J-STD-004IPC J-STD-005IPC-HDBK-005IPC r MaskIPC-SM-840Copper FoilsIPC-4562Acceptability Standard forManufacture, Inspection, & Testingof Electronic EnclosuresIPC-A-630Requirements and Acceptance forCable and Wire Harness AssembliesIPC-A-620Acceptability ofElectronic AssembliesIPC-A-610Requirements for SolderedElectronic AssembliesIPC J-STD-001/IPC-HDBK-001, IPC-AJ-820Acceptability of Printed BoardsIPC-A-600Qualifications for Printed BoardsIPC-6011, 6012, 6013, 6017, 6018Base Materials for Printed BoardsIPC-4101, 4104, 4202, 4203, & 4204Design & Land PatternsIPC-2221, 2222 & 2223 7351Data Transfer and ElectronicProduct DocumentationIPC-2581 Series, IPC-2610 SeriesAdvancedPackagingIPC J-STD-030IPC-7092IPC-7093IPC-7094IPC-7095Storage& HandlingIPC J-STD-020IPC J-STD-033IPC J-STD-075IPC-1601Test MethodsIPC-TM-650IPC-9631IPC-9691Electrical 4IPC-4556High nIPC-1751IPC-1752IPC-1755Learn about IPC standards at www.ipc.org/standardsDECEMBER 2014

discussed. IPC-6011, IPC-6012C, J-STD-003B and IPC-A-600H Block 3: 1400-1500 (Including one coffee break) Electronic Assembling and Soldering. What is a lead free process. Acceptability and Requirements for Electronic Assemblies will be discussed using IPC Standards; J-STD-001F, IPC-610F, IPC-7711/21B and IPC-620B

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