Printed Electronics: Manufacturing Technologies And .

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Printed Electronics:Manufacturing Technologies and ApplicationsChuck ZhangSchool of Industrial & Systems Engineering (ISyE) andGeorgia Tech Manufacturing Institute (GTMI)May 12, 2014

Presentation OutlineIntroduction to Georgia Tech ManufacturingInstituteOverview of printed electronics technologyand applicationsAerosol Jet Printing (AJP) processApplication case studiesThe information presented herein cannot be duplicatedor extracted without permission from GTMI

chiningSIXTHINKINGHATSSustainableDesign emsEngineeringThe information presented herein cannot be duplicatedor extracted without permission from GTMI

IndustrialDesignPrecisionMachiningNano & Bio& yInformationSystemsRoboticsPublic PolicySIXTHINKINGHATSSustainableDesign &ManufacturingAdditiveManufacturingSupply Chain& novationInstituteThe information presented herein cannot be duplicatedor extracted without permission from GTMI

Preliminary Design of GTMI Operating SystemxRLxRL14Measure & sReadiness &CommercializationEnablers (design,infrastructure,policy, MEP, SC&L,.)Intellectual leadershipin basic researchxRLxRL710Sector ProductsRequirementsValidation“Pull”Deployment leadership with stakeholdersto commercialize innovative products and servicesTranslational leadership for acceleratedcampus-wide synergy and interdisciplinary readinessThe information presented herein cannot be duplicatedor extracted without permission from GTMI

Translational Research inAdditive Manufacturing at GTMIAdditive manufacturing/3D printing process andequipment development (e.g., metal, polymer andcomposites part manufacturing)Computational modeling and simulation of additivemanufacturing/printed electronics processesAdvanced materials development for additivemanufacturing/printed electronicsApplication development and demonstration ofadditive manufacturing/printed electronicsThe information presented herein cannot be duplicatedor extracted without permission from GTMI

Technology Revolutions in ElectronicsCurrentPastFuture – Beyond Silicon(Printed Electronics)Organic circuits onpolymeric substrateFlexible solar cellsThin flexible batterye-paperThe information presented herein cannot be duplicatedor extracted without permission from GTMI

Grand Challenges: Cross-Cutting TechnologyAreas for Advanced Manufacturing Advancing Sensing, Measurement, and Process Control Advanced Materials Design, Synthesis, and Processing Visualization, Informatics, and Digital ManufacturingTechnologies Sustainable Manufacturing Nanomanufacturing Flexible Electronics Manufacturing Biomanufacturing and Bioinformatics Additive Manufacturing Advanced Manufacturing and Testing Equipment Industrial Robotics Advanced Forming and Joining TechnologiesReport To The President on CapturingDomestic Competitive Advantage InAdvanced Manufacturing, Executive Office ofthe President, President’s Council of Advisorson Science and Technology, July, 2012.

Grand Challenges: Cross-Cutting TechnologyAreas for Advanced Manufacturing Advancing Sensing, Measurement, and Process Control Advanced Materials Design, Synthesis, and Processing Visualization, Informatics, and Digital ManufacturingTechnologies Sustainable Manufacturing Nanomanufacturing Flexible Electronics Manufacturing Biomanufacturing and Bioinformatics Additive Manufacturing Advanced Manufacturing and Testing Equipment Industrial Robotics Advanced Forming and Joining TechnologiesReport To The President on CapturingDomestic Competitive Advantage InAdvanced Manufacturing, Executive Office ofthe President, sensor array ) Sensor reverts back once the reaction is complete Easy integration with electronics (antennas, RFmodules) Standoff detection using wireless operation Passive (battery-free) sensor operation Small size, low-cost, no maintenance Interrogation distance up to 100m feasibleThe information presented herein cannot be duplicatedor extracted without permission from GTMI

Challenges for Trace Detection Low vapor pressure of explosives makes sensingdifficult 10 parts per billion for TNT 10 parts per trillion for RDX, PETN Require high sensitivity to detect vapors Interference in background (selectivity) Standoff range limited by power and technologyThe information presented herein cannot be duplicatedor extracted without permission from GTMI

Prototype Device Two or three terminal device Chemiresistor and/or impedancemeasurement Currently applied to detectchemical compounds andradiationThe information presented herein cannot be duplicatedor extracted without permission from GTMI

Nanomaterial-based ChemresistorCharacteristics Sensitive Up to 50 parts per billion Selective Functions in the presence of contaminants Quick-response Less than 1 second in exposure Reversible Reverts back to original state Repeatable Same response over timeThe information presented herein cannot be duplicatedor extracted without permission from GTMI

Nanomaterial Sensing Film FabricationMethods ComparisonFabricationMethodCNT epeatability QualityControlCostBrush PaintingNoneChemical Hoodlong curing timePersonnel dependent,relative lack of controlLaborAir SprayCoatingPrefers Medium toHigh ViscositySolutionChemical HoodFace Mask &Mask for DeviceSolution concentrationAir pressureSpray Nozzle SelectionLaborSpin CoatingPrefers HighViscosity SolutionChemical HoodMask for DeviceSolution concentrationHigh Speed Control(RPM)EquipmentDip CoatingPrefers HighViscosity SolutionChemical HoodMask for DeviceSolution concentrationMotor Speed Control(RPM)LaborInk Jet PrintingPrefers Medium toHigh ViscositySolutionChemical HoodSolution concentrationInk Jet Nozzle CloggingEquipmentThe information presented herein cannot be duplicatedor extracted without permission from GTMI

Ink-Jet Printing Results50 micronInk-jet printing pattern3 x 3 arrayInk-jet printedInterdigitated Electrode(IDE) SensorOptical Phtographyof the ink-jet printedsensing filmThe information presented herein cannot be duplicatedor extracted without permission from GTMI

Aerosol Jet Printed Sensing FilmSensor #1Sensor #2Sensor #3Aerosol jet printed sensing film on pre-fabricated interdigitated electrodes (top).Wirebonding completed sensor packages (bottom).The information presented herein cannot be duplicatedor extracted without permission from GTMI

NO2 Gas Sensing ComparisonInk-jet printed sensing for 50 ppmNO2 gas ( 3.5%)Aero-sol jet printed sensing for 20ppm NO2 gas ( 15%)The information presented herein cannot be duplicatedor extracted without permission from GTMI

Ongoing Project: Printing ofOrganic Transistors Uniform gate distance andlow line edge roughness arerequired for good transistorperformance Multilayer and multimaterial deposition isneeded AJP organic transistorsperformed better than thosemade by ink jet printing GTMI is developing processmonitoring and controlmethods for improvingprinted line qualityIn collaboration with Dr. BernardKippelen @ GT-ECEThe information presented herein cannot be duplicatedor extracted without permission from GTMI

Ongoing Project: Printing of2.4 GHz Antenna Fast and cost effectivemanufacturing comparedto conventionallithography process Conformal antenna onvarious surfaces Low temperatureprocessing suitable forpolymer substrates Performance matchingsimulation resultsIn collaboration

Grand Challenges: Cross-Cutting Technology Areas for Advanced Manufacturing Advancing Sensing, Measurement, and Process Control Advanced Materials Design, Synthesis, and Processing Visualization, Informatics, and Digital Manufacturing Technologies Sustainable Manufacturing Nanomanufacturing Flexible Electronics Manufacturing .

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