COLOR MONITOR SERVICE MANUAL - Lcd-television

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Internal Use www.LGEservice.com/techsup.htmlCOLOR MONITORSERVICE MANUALCHASSIS NO. : LM12AMODEL:CAUTION(E1942S (E1942S-**A)) **Same model for ServiceBEFORE SERVICING THE UNIT,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

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CONTENTSSPECIFICATIONS . 2ADJUSTMENT . 14PRECAUTIONS . 4TROUBLESHOOTING GUIDE . 16TIMING CHART . 8WIRING DIAGRAM . 19DISASSEMBLY . 9EXPLODED VIEW.20BLOCK DIAGRAM . 11REPLACEMENT PARTS LIST .22DESCRIPTION OF BLOCK DIAGRAM.12SCHEMATIC DIAGRAM . 26SPECIFICATIONS1. LCD CHARACTERISTICSType: TFT Color LCD ModuleActive Display Area : 18.5 inch diagonalPixel Pitch: 0.3 (H) x 0.3 (V)Size: 430.3(H) x 254.6(V) x 10.5 (D)Color Depth: 16.7M colors(6-bit with A-FRC)Electrical Interface: 1ch-LVDSSurface Treatment: Anti-Glare, Hard Coating(3H)Operating Mode: Normally WhiteBacklight Unit: White LED4. MAX. RESOLUTIONAnalog: 1366 x 768@60Hz5. POWER SUPPLY5-1. Power Adaptor(Built-in Power)Input : AC 100-240 V , 50/60 Hz, 1.0A5-2. Power ConsumptionMODE2. OPTICAL CHARACTERISTICS2-1. Viewing Angle by Contrast Ratio 10POWER ON (NORMAL)H/V SYNC VIDEO POWER CONSUMPTION LED COLORON/ONACTIVEless than 18 W(max)less than 15 W(typ)REDREDHorizontal: Left: 85 , -85 (Typ) Right: 85 , -85 (Typ)STAND BYOFF/ON OFFless than 0.3 WBLINKINGVertical: Top: 75 , -85 (Typ) Bottom: 75 , -85 (Typ)REDSUSPENDON/OFF OFFless than 0.3 W2-2. LuminanceBLINKINGRED: 200(min),250(Typ)(Full white pattern,0.70V),DPMS OFFOFF/OFF OFFless than 0.3 WBLINKINGWARMPOWER S/W OFFOFFless than 0.3 W:150(min)(Full whitepattern,0.70V),MEDIUMEfficiency:Super Energy Saving On/Off OnREDup to30%: 150(min)(Full white pattern,0.70V),COOL6. ENVIRONMENT2-3. Contrast Ratio : 700(min), 1000(TYP)6-1. Operating Temperature : 10 C 35 C (50 F 95 F)DFC - 5000 000 : 1(TYP)6-2. Relative Humidity: 10% 80% (Non-condensing)3. SIGNAL (Refer to the Timing Chart)6-3. MTBF: 30,000 HRS with 90%3-1. Sync SignalConfidence level Type: Separate SyncLamp Life: 30,000 Hours (Min)3-2. Video Input Signal1) Type2) Voltage Level3) Input Impedance3-3. Operating FrequencyAnalog:HorizontalVertical: R, G, B Analog: 0 0.7 V: 75 Ω: 30 61kHz: 56 75HzCopyright2010 LG Electronics. Inc. All right reserved.Only for training and service purposes7. DIMENSIONS (with TILT)WidthDepthHeight: 44.1 cm (17.36 '' ): 34.9 cm ( 13.7 '' ): 16.8 cm ( 6.61 '')8. WEIGHT (with TILT/SWIVEL)Net. WeightGross Weight-2-: 2.1 kg (4.62 lbs): 3.2kg (7.04 lbs)LGE Internal Use Only

PRECAUTIONWARNINGWARNING FOR THE SAFETY-RELATED COMPONENT. There are some special components used in LCDmonitor that are important for safety. These parts aremarked on the schematic diagram and thereplacement parts list. It is essential that these criticalparty.(Analog Only)h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)AIBMCompatible PCVideo SignalGenerator915105615CNotusedPARALLEL PORT131RS232C255VPARALLELOFF14ONFPower inlet (required)5V4.7K4.7K220RWEPOMONITOCSTASRYNVGPower Select Switch(110V/220V)Power LEDONE5V4.7KOFF74LS06V-SControl LineC116174LS06BE ST SwitchBF V-Sync On/Off Switch(Switch must be ON.)Figure 1. Cable ConnectionCopyright2010 LG Electronics. Inc. All right reserved.Only for training and service purposes-1 -LGE Internal Use Only

TROUBLESHOOTING GUIDE1. NO POWERNO POWER(POWER INDICATOR OFF)NOCHECK1IC102 PIN3(5V)CHECK ADAPTER(19V)YES2NOIS IC103 PIN25(3.3V)31CHECK IC102 PIN3 (5V)PIN27(1.2V)YES41NOCHECK IC103 PIN 42,43PULSECHECK CRYSTAL(X100)YESCHECK IC103Waveforms1IC102 PIN3 (5V)23IC103 PIN27 (1.2V)IC103 PIN 25 (3.3V)4IC103 PIN42,431.2VCopyright2010 LG Electronics. Inc. All right reserved.Only for training and service purposes-1 -LGE Internal Use Only

2. NO RASTER (OSD IS NOT DISPLAYED) - MAINNO RASTER(OSD IS NOT DISPLAYED)CHECKINOCIC504(1.2V)YES1NOI1. CHECK PINSOLDERING CONDITION2. CHECK3. TROUBLE INYESCHECKI(V-SYNC)NOAnd (H-SYNC)CHECK CONNECTION LINEFROM D-SUB TOYESTROUBLE IN CABLEOR LCD MODULECopyright2010 LG Electronics. Inc. All right reserved.Only for training and service purposes-1 -LGE Internal Use Only

3. TROUBLE IN DPMTROUBLE IN DPMNOCHECKCHECK PCPC IS GOINGINTO DPM MODEYES12ICHECKNOSYNC PULSECHECK H/V SYNC LINEYESTROUBLE IN IC103Waveforms1H-SYNC2V-SYNCCopyright2010 LG Electronics. Inc. All right reserved.Only for training and service purposes-1 -LGE Internal Use Only

WIRING DIAGRAMAUO:EAD61905268CMI:EAD61905281EADMAIN BOARD6631900011SEAD38438703Copyright2010 LG Electronics. Inc. All right reserved.Only for training and service purposes-1 -LGE Internal Use Only

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P/NO : MFL67122126JANUARY.2012Printed in China

unplug the receiver AC power cord from the ACpower source before;a. Removing or reinstalling any component, circuitboard module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electricalplug or other electrical connection.c. Connecting a test substitute in parallel with anelectrolytic capacitor in the receiver.CAUTION: A wrong part substitution or incorrectpolarity installation of electrolytic capacitors mayresult in an explosion hazard.d. Discharging the picture tube anode.2. Test high voltage only by measuring it with anappropriate high voltage meter or other voltagemeasuring device (DVM, FETVOM, etc) equipped witha suitable high voltage probe.Do not test high voltage by "drawing an arc".3. Discharge the picture tube anode only by (a) firstconnecting one end of an insulated clip lead to thedegaussing or kine aquadag grounding system shieldat the point where the picture tube socket ground leadis connected, and then (b) touch the other end of theinsulated clip lead to the picture tube anode button,using an insulating handle to avoid personal contactwith high voltage.4. Do not spray chemicals on or near this receiver or anyof its assemblies.5. Unless specified otherwise in this service manual,clean electrical contacts only by applying the followingmixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator;10% (by volume) Acetone and 90% (by volume)isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual,lubrication of contacts in not required.6. Do not defeat any plug/socket B voltage interlockswith which receivers covered by this service manualmight be equipped.7. Do not apply AC power to this instrument and/or any ofits electrical assemblies unless all solid-state deviceheat sinks are correctly installed.8. Always connect the test receiver ground lead to thereceiver chassis ground before connecting the testreceiver positive lead.Always remove the test receiver ground lead last.Copyright2010 LG Electronics. Inc. All right reserved.Only for training and service purposes9. Use with this receiver only the test fixtures specified inthis service manual.CAUTION: Do not connect the test fixture ground strapto any heat sink in this receiver.Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can bedamaged easily by static electricity. Such componentscommonly are called Electrostatically Sensitive (ES)Devices. Examples of typical ES devices are integratedcircuits and some field-effect transistors andsemiconductor "chip" components. The followingtechniques should be used to help reduce the incidence ofcomponent damage caused by static by static electricity.1. Immediately before handling any semiconductorcomponent or semiconductor-equipped assembly, drainoff any electrostatic charge on your body by touching aknown earth ground. Alternatively, obtain and wear acommercially available discharging wrist strap device,which should be removed to prevent potential shockreasons prior to applying power to the unit under test.2. After removing an electrical assembly equipped withES devices, place the assembly on a conductivesurface such as aluminum foil, to prevent electrostaticcharge buildup or exposure of the assembly.3. Use only a grounded-tip soldering iron to solder orunsolder ES devices.4. Use only an anti-static type solder removal device.Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient todamage ES devices.5. Do not use freon-propelled chemicals. These cangenerate electrical charges sufficient to damage ESdevices.6. Do not remove a replacement ES device from itsprotective package until immediately before you areready to install it. (Most replacement ES devices arepackaged with leads electrically shorted together byconductive foam, aluminum foil or comparableconductive material).7. Immediately before removing the protective materialfrom the leads of a replacement ES device, touch theprotective material to the chassis or circuit assemblyinto which the device will be installed.CAUTION: Be sure no power is applied to the chassisor circuit, and observe all other safety precautions.8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motionsuch as the brushing together of your clothes fabric orthe lifting of your foot from a carpeted floor cangenerate static electricity sufficient to damage an ESdevice.)-4-LGE Internal Use Only

General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron andappropriate tip size and shape that will maintain tiptemperature within the range or 500 F to 600 F.2. Use an appropriate gauge of RMA resin-core soldercomposed of 60 parts tin/40 parts lead.3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use amall wire-bristle (0.5 inch, or 1.25cm) brush with ametal handle.Do not use freon-propelled spray-on cleaners.5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normaltemperature.(500 F to 600 F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static,suction-type solder removal device or with solderbraid.CAUTION: Work quickly to avoid overheating thecircuitboard printed foil.6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normaltemperature (500 F to 600 F)b. First, hold the soldering iron tip and solder the strandagainst the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction ofthe component lead and the printed circuit foil, andhold it there only until the solder flows onto andaround both the component lead and the foil.CAUTION: Work quickly to avoid overheating thecircuit board printed foil.d. Closely inspect the solder area and remove anyexcess or splashed solder with a small wire-bristlebrush.IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong)through which the IC leads are inserted and then bent flatagainst the circuit foil. When holes are the slotted type,the following technique should be used to remove andreplace the IC. When working with boards using thefamiliar round hole, use the standard technique asoutlined in paragraphs 5 and 6 above.Removal1. Desolder and straighten each IC lead in one operationby gently prying up on the lead with the soldering irontip as the solder melts.2. Draw away the melted solder with an anti-staticsuction-type solder removal device (or with solderbraid) before removing the IC.Copyright2010 LG Electronics. Inc. All right reserved.Only for training and service purposesReplacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil padand solder it.3. Clean the soldered areas with a small wire-bristlebrush. (It is not necessary to reapply acrylic coating tothe areas)."Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads asclose as possible to the component body.2. Bend into a "U" shape the end of each of three leadsremaining on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to thecorresponding leads extending from the circuit boardand crimp the "U" with long nose pliers to insure metalto metal contact then solder each connection.Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistorleads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of thecircuit board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.Diode Removal/Replacement1. Remove defective diode by clipping its leads as closeas possible to diode body.2. Bend the two remaining leads perpendicular y to thecircuit board.3. Observing diode polarity, wrap each lead of the newdiode around the corresponding lead on the circuitboard.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solderjoints of the two "original" leads. If they are not shiny,reheat them and if necessary, apply additional solder.Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit boardhollow stake.2. Securely crimp the leads of replacement componentaround notch at stake top.3. Solder the connections.CAUTION: Maintain original spacing between thereplaced component and adjacent components and thecircuit board to prevent excessive componenttemperatures.-5-LGE Internal Use Only

Circuit Board Foil RepairExcessive heat applied to the copper foil of any printedcircuit board will weaken the adhesive that bonds the foilto the circuit board causing the foil to separate from or"lift-off" the board. The following guidelines andprocedures should be followed whenever this condition isencountered.At IC ConnectionsTo repair a defective copper pattern at IC connections usethe following procedure to install a jumper wire on thecopper pattern side of the circuit board. (Use thistechnique only on IC connections).1. Carefully remove the damaged copper pattern with asharp knife. (Remove only as much copper asabsolutely necessary).2. carefully scratch away the solder resist and acryliccoating (if used) from the end of the remaining copperpattern.3. Bend a small "U" in one end of a small gauge jumperwire and carefully crimp it around the IC pin. Solder theIC connection.4. Route the jumper wire along the path of the out-awaycopper pattern and let it overlap the previously scrapedend of the good copper pattern. Solder the overlappedarea and clip off any excess jumper wire.Copyright2010 LG Electronics. Inc. All right reserved.Only for training and service purposesAt Other ConnectionsUse the following technique to repair the defective copperpattern at connections other than IC Pins. This techniqueinvolves the installation of a jumper wire on thecomponent side of the circuit board.1. Remove the defective copper pattern with a sharpknife.Remove at least 1/4 inch of copper, to ensure that ahazardous condition will not exist if the jumper wireopens.2. Trace along the copper pattern from both sides of thepattern break and locate the nearest component that isdirectly connected to the affected copper pattern.3. Connect insulated 20-gauge jumper wire from the leadof the nearest component on one side of the patternbreak to the lead of the nearest component on theother side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire isdressed so the it does not touch components or sharpedges.-6-LGE Internal Use Only

TIMING Pixels)-V(Lines) H(Pixels)-V(Lines)-H(Pixels)-V(Lines)-H(Pixels) V(Lines) H(Pixels) V(Lines) H(Pixels)-V(Lines)-H(Pixels)-V(Lines)-H(Pixels) V(Lines) H(Pixels) V(Lines) ht2010 LG Electronics. Inc. All right reserved.Only for training and service purposesFront-7-Porch(D)720 X 400640 x 480640 x 480800 x 600800 x 600832 x 6241024 x 7681024 x 7681366 x768LGE Internal Use Only

DISASSEMBLY-Set#1Place the monitor face Down on the cushion or soft cloth.#2Remove the stand body and atand base from the product.#31. Pull the front cover upward.2. Then, let the all latches are separated.3. Put the front face down.#4Disassemble back cover.2010 LG Electronics. Inc. All right reserved.CopyrightOnly for training and service purposes- -LGE Internal Use Only

E1942C/S Block DiagramLED Panel19’’InchBLOCK DIAGRAMCopyright 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes-9-LGE Internal Use Only

DESCRIPTION OF BLOCK DIAGRAM1. Video Controller Part.This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to thedigital video signal using a pixel clock.The pixel clock for each mode is generated by the PLL.The range of the pixel clock is from 28MHz to 85MHz in E1942S caseThis part consists of the Scaler, ADC convertor, TMDS receiver and LVDS transmitter.The Scaler gets the video signal converted analog to digital, interpolates input to 1366 X768 resolution signal and outputs 8-bit R, G, B signal to transmitter.2. Power Part.TThis part consists of one regulator convert power.From 19V to 5V.19V is provided by adapter.5V is provided for LCD panel .Also, 5V is converted 3.3V by regulator.Converted Power is provided for IC in the main board.Boost converter of LED block converters 19V to AUO M185XW01 VF is 34V ,CMI M185BGE-L22 is 24.8Vand operates back-light LED strings of module in E1942S case.3. MICOM Part.This part is include video controller part. And thi

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