Power Electronics Material And Bonded Interfaces .

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Thermal Management andReliability of AutomotivePower Electronics andElectric MachinesSreekant NarumanchiNational Renewable Energy LaboratoryEmail: sreekant.narumanchi@nrel.gov; Phone: 303-275-4062Team: Kevin Bennion, Emily Cousineau, Doug DeVoto, Xuhui Feng,Bidzina Kekelia, Ram Kotecha, Joshua Major, Gilbert Moreno, PaulParet, Jeff TomerlinInternational Workshop on Integrated Power PackagingToulouse, FranceApril 26, 2019

Research Pathway to Electrification Vehicle architecture change– Driven by long-range BEVs andneed for commonality for productionscale Greater fleet applications of BEVs– Mobility as a Service– Driving increase in reliability (15years/300K miles) Long-range BEVs– Driving need for high-rate powertransfer – high-power charging Innovations to overcome gaps– Understanding the physics of newmaterials– Quantifying the impact of new designsPhoto from the 2017 Electrical and Electronics Technical 17/11/f39/EETT%20Roadmap%2010-27-17.pdfSignificant volume reduction (factor of 10)Improved reliability (factor of 2)Lower cost (50% lower)BEV: Battery Electric VehicleNREL 2

Future Power Electronics Designs – Gaps andChallengesElectrical boardPower moduleCapacitors Planar power electronics construction Reduction in volume/size by a factor of 10 – thermal and reliabilitychallenges Materials innovations needed (electrical, thermal, mechanical, and magneticproperties)NREL 3

NREL APEEM Research Focus AreasPower ElectronicsThermalManagementAdvanced PackagingDesigns andReliabilityElectric MotorThermalManagementPhotos by Gilbert Moreno, NRELPhotos by Doug DeVoto, NRELPhoto by Kevin Bennion, NRELAPEEM: Advanced Power Electronics and Electric MotorsNREL 4

Power Electronics Thermal Management Compact, power-densewide-bandgap (WBG)device-based powerelectronics require Higher-temperaturerated components andmaterials Advanced heat transfertechnologies System-level ctEncapsulantDie AttachSubstrateAttachMetalized SubstrateBase Plate and Integrated CoolingAdvancedcoolingComponent-level andsystem-level heattransferPhoto by Gilbert Moreno, NRELNREL 5

Thermal Strategy to Reach a Power Density of 100 kW/LDevicepackagingDefine thethermal target toachieve 100 kW/LDesign thecooling strategiesConvectivecoolingCooling fluidHeat load (100 kW inverter): 2,150 WMaximum device temperature: 250 CModule and cold plate volume: 240 mLVolumetric thermal resistance target:21 cm3-K/WPhoto by Gilbert Moreno,NRELDielectric cooling (single-phase heat transfer) planarpackage conceptNREL 6

Dielectric Cooling ConceptCooling of the busbars/electricalinterconnects tolower capacitor andgate drivertemperaturesImproved cooling (single-phase) viajet impingement and finned surfacesDielectric fluidElectricalleadElectrical conductorMOSFETElectrical conductorInexpensive dielectric materialEliminates expensiveceramic materialsMOSFET: metal–oxide–semiconductor field-effect transistorImproved performance overconventional direct-bond-copper(DBC)-based designsNREL 7

Cooling System Design: Modeling ResultsDesigned fluid manifold todistribute flow to 12 devices Reduced size: 120 mL total coldplate and power modulevolume Total flow rate: 4.1 Lpm at 0.33psi pressure drop Reduced pumping power:80% lower parasitic powercompared to 2014 HondaAccord Hybridinlet18mmoutlet94 mmComputer-aided design model of the cold plate with finnedheat spreadersImage by Gilbert Moreno, NRELResults using Alpha 6 fluid at Tinlet 65 CNREL 8

Experimental ValidationDesigned the heaters To simulate devices and dissipate 700 W/cm26.35-mm-diametercartridge heaterTemperature [ C]Completed cold plate fabrication 3D printed using inexpensive, lightweightplastic to test prototype Cold plate can be fabricated using conventionalmanufacturing methodscopper blockPhoto by Gilbert Moreno, NRELNylon cold plate manifoldprototypePhoto by Paul Paret, NRELPhoto Credit: Gilbert Moreno (NREL)thermocoupleholes (2)Cartridge heater design-temperature contoursfor the 718 W/cm2 heat flux conditionCold plate size comparedto cell phoneNREL 9

Advanced Power Electronics Packaging Performanceand Reliability Improve reliability of new (hightemperature/WBG) technologies Develop predictive and remaininglifetime models Package parametric nectDie AttachSubstrateAttachMetalized SubstrateBase PlateBonded InterfaceMetalized SubstrateSintered SilverBase PlatePhoto by Paul Paret, NRELCrack Propagation in Pressure-Assisted (30 – 40 MPa) SinteredSilverNREL 10

Approach – aTechHybridsilverLow pressureassistedHigh-TemperatureBonded MaterialAlNCu-AlNRELAlSiCCu-Al bond – SEM image1SEM: scanning electron microscope1 Photo by Darshan Pahinkar, Georgia Tech2 Photo by G.-Q. Lu, Virginia TechNanosilverPressurelessHybrid-silver – SEM image2Cu: copper, Al: aluminum, Sn: tinAlN: aluminum nitrideAlSiC: aluminum silicon-carbideNREL 11

Sintered Silver Reliability EvaluationTop ViewCopper – Invar CouponsSide ViewsPhoto by Douglas DeVoto, NRELCTE 1CTE 1CTE 1CTE 2CTE 2CTE 2Φ 25.4 mmThermal loadTemperature ( C)2001000-1000510Time (min) 152025Photo by Joshual Major, NRELThermal platform for thermal cyclingSubject CTE-mismatched samples bonded with the material of interest to thermal cyclingfrom -40 C to 200 CObtain C-SAM images of the bond material at periodic cycling intervalsEstimate crack growth rate from C-SAM images through image analysisC-SAM: C-mode scanning acoustic microscopeCTE: co-efficient of thermal expansionNREL 12

Thermal Cycling of Pressure-Assisted Sintered Samples(3 MPa)C-SAM images of sinteredsilver from Cu side100%80%Crack Percentage0 cycles0 cycles Invar side100 cycles Invar Side0 cycles Cu side100 cycles Cu side100 cycles60%40%22 mm20%0%101622Bond Diameter (mm) Four samples were cycled for each diameter case. Failure ( 20% crack growth) may have occurredwithin 50 cycles. Crack growth rate was higher on the Invar side.16 mm10 mmNREL 13

Images of Defect PropagationInvarCopperPhotos by Joshua Major, NRELSintered SilverCross-Sectional Microscopic Images of Crack Propagation in Sintered Silver Mode of crack propagation was found to be a combination of cohesive and adhesive failuremechanisms.Presence of different crack modes possibly indicates the strong impact of both global (Cuand Invar) and local (silver and Invar) CTE mismatch.Multiple cracks observed explain the difference in C-SAM images/crack percentagecalculations from Cu and Invar side.NREL 14

Organic Direct-Bond-Copper Substrate ThermalPerformance Substrates were placed between diode and coldplate.A transient power pulse was applied to the package,and the decay of the temperature in the diode wasmonitored over time to establish the resistancecapacitance network for the package.ODBC thermal performance is similar to AlN.Photo by Douglas DeVoto, NRELThermal Resistance of Sample Package1.2001.1121.1001.0711.1181.082RTH (K/W)1.0451.0000.9170.900T3ster TestSetup0.800Cu5.0 mmSi3N4AlNODBCAl2O3HPS 9%Al2O3Si3N4 AMB0.8/0.32/0.8 mm 0.3/0.38/0.3 mm 1.0/0.025/1.0 mm 0.3/0.38/0.3 mm 0.3/0.32/0.3 mmODBC: Organic Direct-Bond-CopperSi3N4 AMB: Silicon nitride atomic metal brazingAlN: Aluminum nitrideAl2O3: Aluminum oxideNRELHPS: High-performance substrate 15

ODBC Reliability Thermal Shock: -40 C to 200 C, 5-minute dwellsThermal Aging: 175 CPower Cycling: 40 C to 200 CODBC substrates have reached 5,000 thermalshock cycles, 1,900 thermal aging hours, and2,200 power cycles No significantdecrease inelectrical or thermalperformance hasbeen observed.Photo by Douglas DeVoto, NRELSubstrates Undergoing AgingPhoto Credit: Douglas DeVoto, NRELPower Cycling Test SetupNREL 16

Electric Motor Thermal Management Increase current density, power densityIncrease reliabilityHigher voltages and switching frequenciesUnderstand material properties as afunction of temperature and materiallifetime Advanced cooling strategiesStator Cooling JacketStatorRotorPhoto Credit: Kevin Bennion, NRELPhotos by Doug DeVoto, Emily Cousineau, Kevin Bennion and Bidzina Keklia, NRELNREL 17

Transmission Fluid Jet Impingement CoolingActive ConvectiveCooling Direct Impingement Cooling for MotorWindingsQuantify impact of new or alternative cooling approachesfor ATF cooling of motors.Characterize impact of new cooling fluids.ATF: automatic transmission fluidPhotos by Kevin Bennion and Bidzina Kekelia, NRELNREL 18

ATF Orifice Jet ImpingementHeat transfer coefficients (HTC) for ATF at Tfluid 70 C Temperature of thecooled surface affectsHTC values:Tsurface h Experiments ongoingto evaluate impact ofvarying otherparameters on HTC:– incidence angle– nozzle distancefrom target surfaceNREL 19

Material/Interface Thermal CharacterizationStator-to-case thermalcontact resistanceStator laminationsLiner-to-stator thermalcontact resistanceWinding-to-liner thermalcontact resistanceCross-slot winding thermalconductivitySlot windingsSlot liner or ground insulationIllustration by Kevin Bennion, NRELNREL 20

Motor Lamination Thermal Contact ResistanceTCR: thermalcontactresistance Validated model with experimental data using multiple materials.Results published in J. E. Cousineau, K. Bennion, D. DeVoto, and S. Narumanchi, “ExperimentalCharacterization and Modeling of Thermal Resistance of Electric Machine Lamination Stacks,”International Journal of Heat and Mass Transfer, vol. 129, pp. 152–159, Feb. 2019.NREL 21

Multiple Research Activities and ProjectsThermal management and reliability of electric-drivevehicle power electronics and electric machines; highpower fast chargingAdvanced WBG power electronics and thermalARPA-Emanagement techniquesDOE AMO PowerAmericaManufacturing WBG power electronicsEnergy-efficient, high-power-density, high-speedAMO Next- Generationintegrated medium-voltage-drive systems for criticalElectric Machinesenergy applicationsAMO Medium-Voltage Power Grid-tied power electronicsDOE VTO Electrification R&DElectronicsAMO Traineeship in PowerEngineeringTraineeship and curriculum development leveragingWBG power electronicsBringing lab-developed technology closer toTechnology Commercialization commercialization/productionDOD agency and industry-funded projects in the broadDOD and Industry-Fundedareas of thermal management and reliabilityProjects in the areas of power electronicsNREL Laboratory Directedprognostics and ultra-WBG power electronicsR&D: Research and DevelopmentResearch and DevelopmentpackagingVTO: Vehicle Technologies OfficeARPA-E: Advanced Research Projects Agency- EnergyAMO: Advanced Manufacturing OfficeNREL 22DOD: Department of Defense

Summary Low-cost, high-performance thermal management technologies are helpingmeet aggressive power density, specific power, cost, and reliability targets forpower electronics and electric machines. NREL is working closely with numerous industry and research partners to helpinfluence development of components that meet aggressive performance andcost targets through:o Development and characterization of cooling technologieso Thermal characterization and improvements of passive stack materials and interfaceso Reliability evaluation, lifetime, and physics-of-failure models. Thermomechanical reliability and lifetime estimation models are importantenablers for industry in cost- and time-effective design.NREL 23

Acknowledgments:For more information, contact:Susan RogersElectric Drive Technologies ProgramVehicle Technologies OfficeAdvanced Manufacturing OfficeU.S. Department of EnergyNREL APEEM Team LeaderSreekant Narumanchisreekant.narumanchi@nrel.govPhone: 303-275-4062Industry and Research PartnersIndustry OriginalEquipmentManufacturersFord, General Motors, Fiat-Chrysler Automobiles, John Deere, Tesla, Toyota,CaterpillarSuppliers/Others3M, NBETech, Curamik, DuPont, Energetics, GE Global Research, GE Aviation,Indian Integrated Circuits, Semikron, Kyocera, Sapa, Delphi, Btechcorp, ADATechnologies, Remy/BorgWarner, Heraeus, Henkel, Wolverine Tube Inc.,Wolfspeed, Kulicke &Soffa, UQM Technologies, nGimat LLCwww.nrel.govAgenciesDARPA, U.S. Army Research LaboratoryNational LaboratoriesOak Ridge National Laboratory, Ames Laboratory, Argonne National Laboratory,Sandia National LaboratoriesUniversitiesVirginia Tech, University of Colorado Boulder, University of Wisconsin, CarnegieMellon University, Texas A&M University, North Carolina State University, OhioState University, Georgia Tech, University of Missouri Kansas City, North DakotaState University, University of Maryland

Power Electronics Thermal Management . Design the cooling strategies Device packaging Convective cooling Cooling fluid Thermal Strategy to Reach a Power Density of 100 kW/L Define the thermal target to . prognostics and ultra-WBG power electronics packaging ARPA-E Advanced WBG power electronics and thermal management techniques

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