Planar E Cores - Elna Magnetics
Application NotePhilips Magnetic ProductsPlanar E CoresPhilipsComponents
Planar E CoresContents1. Introduction2. Advantages of planar technology2.a. Design advantages2.b. Manufacturing advantages2.c. Limitations2.d. Integrated versus stand-alone2.e. Gluing versus clamping3. Applications3.a. Power conversion3.b. Pulse transmission4. Product range4.a. Material grades4.b. Cores for gluing4.c. Cores for clamping4.d. Packing5. Design5.a. Core choice5.b. Winding design6. Manufacturing6.a. Assembly6.b. Mounting6.c. Soldering7. Literature & sample boxes8. Type number system1Philips Magnetic Products34445566667781216181818191919192020
Planar E core transformers2Philips Magnetic Products
1. IntroductionPlanar magnetics offer an attractive alternative toconventional core shapes when low profile magnetic devicesare required. Basically this is a construction method ofinductive components with windings made of printedcircuit tracks or copper stampings separated by insulatingsheets or constructed with multi-layer circuit boards. Thesewindings are placed between low-profile ferrite cores.Planar devices can be constructed in several ways. Theclosest to conventional devices is a stand-alone componentto replace components on a mono-layer or any other circuitboard. The height of a stand-alone component can bereduced by sinking the core through a slot in the motherboard until its windings rest on the mother board. Onestep further is a hybrid type, where part of the windings arein the mother board while others are joined as a separatemulti-layer circuit board. The mother board must haveslots cut out to accept the ferrite core. The last version isachieved by total integration in a multi-layer mother board.stand-alonestand-alone sunkenJust like for wire-wound components, the core halves canbe assembled either by gluing or by clamping, dependingon the capabilities and preferences of the manufacturer.Philips Components manufacture a range of planar E cores,which is presented in this brochure. In addition, a wholerange of low profile RM cores is available. For moreinformation, please consult our DATA HANDBOOKMA01 or Product Selection Guide.hybridintegratedFig.1 Several types of planar devices3Philips Magnetic Products
2.Advantages of planar technologyGood heat management leads to very high throughputpower density, up to twice the value for conventionaltransformers. Very good repeatability of parasitics enableshigh switching frequencies and resonant topologies. Coresare available in material 3F4 for switching frequencies up to3 MHz.There are many advantages of planar magnetic technologyover conventional wire-wound inductive components.An obvious advantage is a very low build height, whichpromotes planar in dense rack-mount and portableequipment.Planar magnetics are very well suited for design of highperformance switch-mode power converters. Low ACcopper losses and good coupling increase conversionefficiency. Levels higher than 95 % can be achieved,provided that the core is ungapped or only has a moderateair gap. In addition, low leakage inductance reduces voltagespikes and oscillations that can damage MOSFETs andincrease interference emission.Planar technology is straight forward and reliable inproduction. Advantages and limitations are listed infollowing tables.2.a. Design advantagesFeature Mechanical characteristicsVery low profileCompact and rigid construction Electrical characteristicsLittle skin and proximity effect in flat copper tracksGood coupling of closely stacked transformer windingsExcellent repeatability due to fixed winding layout Heat managementHigh core surface (cooling) to volume (dissipation) ratioCompact coil with good heat conductionLarge core surface for heat sink contact2.b. Manufacturing advantagesFeature Forward integrationNo coil former requiredNo separate windings requiredNo pinning / leads requiredIndependence of component assembler ManufacturabilityNo winding operationNo soldering operationCompatible with SMD technology ReliabilityNo winding errors / short circuitNo solder contact and-aloneIntegratedxxxxxxxxxxx4Philips Magnetic Productsxx
2.c. LimitationsFeature GeneralStand-aloneOnly if multi-layer mother boardCost of planar windings versus copper wire (1)Design & production knowledge needed by board assemblerEvery design needs its own prefab winding DesignLow copper cross-section to window area ratioParasitic capacitance limits winding design possibilitiesDesigns with large air gap are unfavourable ManufacturingThe batch to batch spread can’t be compensated with the turnsIntegratedxxxxxxxxxxxxxxxxNote (1) The price of multi-layer PCB is coming down. Overall cost : no coil former and smaller core.2.d. Integrated versus stand-aloneSunken stand-alone components reduce the build heightwithout changing component layout.Hybrid components make use of the mother board tracksto reduce the number of stand-alone tracks, whereas theseare completely eliminated with an integrated component.Combinations of the foregoing types are also possible. Forexample, a power converter could have the primarywinding and mains filter choke (fixed) in the mother boardand the secondary winding and output choke (custom) instand-alone PCB’s (see Fig. 2).Integrated planar components are used if the complexity ofthe surrounding circuitry already demands for multi-layerPCB. Typical applications can be found in low powerconversion and signal processing and use mostly E / platecombination of the small sizes. Main design considerationsfor planar here are flatness and high frequency electricalcharacteristics.Stand-alone components are used otherwise. Typicalapplications can be found in high power conversion anduse mostly E / E combination of the large sizes. Maindesign consideration for planar here is heat management.The type of windings depends partly on the current rating.Low :multi-layer PCB (most compact) or stackedmono-layer PCB (standard windings)Medium : stacked flex foil leadframes (thick tracks) orceramic substrates (good heat conduction)High : self-supporting leadframes (nut & bolt type)transformer secondarymains filter choketransformer primaryFig.2 Hybrid design with planar magnetics.5Philips Magnetic Productsoutput choke
3.Applications2.e. Gluing versus clampingThe choice between gluing and clamping depends mainlyon the capabilities and preferences of the manufacturer, butalso the application requirements can favour one of thetwo.The first applications for planar E cores were in powerconversion. Correspondingly, material grades weremedium and high frequency power ferrites. The inductanceof the mains filter choke can be increased by substitutingthe power ferrite for a high permeability grade. In pulsetransmission, a wideband transformer between pulsegenerating IC and cable provides isolation and impedancematching. For an S or T-interface, this should also be ahigh permeability ferrite. Cores in the high permeabilitymaterial 3E6 have been added to our range. A listing ofapplications, likely to profit from planar, is given below. Reasons for gluingSimple production automationUniform core cross-section (saturation)Low build height (no clamp arc)Smaller PCB cut-out (integrated version)Fixation of cores to the PCB (no rattle/noise) Reasons for clamping3.a. Power conversion ComponentsClean assembly processNo environmental influence on assembly processNo problems in high temperature applicationNo increase of parasitic gap (high permeability)power transformer, output or resonant choke(s), mainsfilter choke AC/DC converter (mains-fed power supply)Stand-alone SMPSBattery charger (mobile phone, portable computers)Instrumentation & control DC/DC converter (distributed or battery-fed powersupply)Power converter modulesTelecommunications network switch (distributed supply)Mobile phone (main power supply)Portable computer (main power supply)Electric car (traction voltage to 12 V down converter) AC/AC converter (mains-fed power supply)Compact fluorescent lampsInduction heating, welding DC/AC inverter (battery-fed power supply)Mobile phone (LCD backlighting)Portable computer (LCD backlighting)Gas discharge car headlamp (ballast)Car rear window heating (step-up converter)3.b. Pulse transmission Componentwideband transformerS0 interface (subscriber telephone line)U interface (subscriber ISDN line)T1/T2 interface (trunk line between network switches)ADSL interface (Asynchronous Digital Subscriber Line)HDSL interface (High Digital Subscriber Line)6Philips Magnetic Products
4. Product rangePhilips Components offer an extensive product range ofplanar E cores. Sizes range from 14 to 64 mm. The crosssectional area is always uniform for the basic version forgluing to make optimum use of the ferrite volume. Everysize has an E core and corresponding plate (PLT). A coreset consists of either an E core and a plate or two E cores,in which case the winding window height doubles. Thesmallest 3 sizes also have an E/PLT version for clamping.The E core has recesses (E/R) while the plate has a slot(PLT/S). A clamp (CLM) snaps into the recesses andprovides a firm grip, pressing the plate on two points. Theslot prohibits the plate from sliding out even in case ofstrong shocks or vibrations and provides alignment. For theE / E combination there are no clips.All sizes are available in power materials 3F3 (frequenciesup to 500 kHz) and 3F4 (500 kHz - 3 MHz). The largest5 sizes are also available in 3C85 (frequencies up to 200kHz), as large cores are often used in low frequency, highpower applications. The smallest 3 sizes are available inhigh permeability 3E6 (µi12000) as well for mains filterchokes and wideband transformers.All E cores in power materials can be gapped, preferably ina standard range of AL values. Every AL value correspondsto 2 slightly different gaps, depending on whether themating part is another E core or a plate (P). Default isasymmetric gap (A) ; the mating part is a plate or anungapped E core. The largest 5 sizes have their largest gapssymmetrical (E) ; the mating part is an identical gapped Ecore.For an overview of the type number system :see section 8.4.a. Material gradesPARAMETERSYMBOL UNITInitial permeabilityµi-Saturation flux densityat Field strengthRemanenceCoercivityPower loss density(typical, sinewaveexcitation)BsHBrHcPvmTA/mmTA/mkW/m3Curie temperatureResistivity (DC)DensityTcρoCΩmg/cm3TEST CONDITIONS3C853F33F43E6f 10 kHz, B 0.1mT,T 25 oCf 10 kHz, T 25 oC2000180090012000 5003000 160 15100120 200 2 4.8 500 4503000 150 60200180140240 220 10 4.7 400oCT 25T 25 oCf 25kHz, B 200mT, T 100 oCf 100kHz, B 100mT, T 100 oCf 500kHz, B 50mT, T 100 oCf 1MHz, B 30mT, T 100 oCf 3MHz, B 10mT, T 100 oCT 25 oCT 25 oC7Philips Magnetic Products3000 150 157050180300 200 2 4.8250 100 4 130 0.5 4.9
4.b. Cores for gluing (without recess)DCCBF E AABE core (E)plate (PLT)dimensions (mm)effective core parametersCore (mm2)massof corehalf(g)1.4330020.714.5 0.6ABCDE14/3.5/5(E-E combination)14 0.33.5 0.15 0.12 0.1PLT14/5/1.5(E-PLT combination)14 0.35 0.11.5 0.05---1.1624016.714.5 0.5E18/4/10(E-E combination)18 0.354 0.110 0.22 0.114 0.34 0.10.61696024.339.5 2.4PLT18/10/2(E-PLT combination)18 0.3510 0.22 0.05---0.51480020.339.5 1.7E22/6/16(E-E combination)21.8 0.45.7 0.115.8 0.33.2 0.116.8 0.45 0.10.414255032.578.5 6.5PLT22/16/2.5(E-PLT combination)21.8 0.415.8 0.32.5 0.05---0.332204026.178.5 4E32/6/20(E-E combination)31.75 6.35 20.32 3.18 0.64 0.13 0.41 0.1324.9min6.35 0.130.323538041.7129 13PLT32/20/3(E-PLT combination)31.75 20.32 3.18 0.64 0.41 0.13--0.278456035.9129 10E38/8/25(E-E combination)25.48.2638.14.45 0.76 0.13 0.51 0.130.2721020052.6194 25PLT38/25/4(E-PLT combination)3.8125.438.1 0.76 0.51 0.13E43/10/28(E-E combination)43.2 0.99.5 0.13PLT43/28/4(E-PLT combination)43.2 0.9E58/11/38(E-E combination)-EcorefactorΣ l/A(mm-1)311 0.25 0.0530.23 7.62min 0.15---0.226846043.7194 1827.9 0.65.4 0.1334.7min8.1 0.20.2761390061.7225 3527.9 0.64.1 0.13---0.2261150050.8225 2458.4 1.210.5 0.1338.1 0.86.5 0.1350min8.1 0.20.2682460081.2305 62PLT58/38/4(E-PLT combination)58.4 1.238.1 0.84.1 0.13---0.2242080068.3305 44E64/10/50(E-E combination)64.01 10.2 50.805.153.80 1.27 0.13 1.02 0.13 1.0710.2 0.20.1564070079.7511 100PLT64/50/5(E-PLT combination)64.01 50.85.08 1.27 1.02 0.13-0.1363550069.6511 78--1) Amin Ae8Philips Magnetic Products
Core ing LT38/25/4E160 - EA160 - PE250 - EA250 - PA315 - EA315 - PA400 - EA400 - PA630 - EA630 - P6425 / 7350E250 - EA250 - PE315 - EA315 - PE400 - EA400 - PA630 - EA630 - PA1000 - EA1000 - P7940 / 9290A100 - EA100 - PA160 - EA160 - PA250 - EA250 - PA315 - EA315 - P2700 / 3100A160 - EA160 - PA250 - EA250 - PA315 - EA315 - PA400 - EA400 - PA630 - EA630 - P4300 / 5000E160 - EA160 - PE250 - EA250 - PA315 - EA315 - PA400 - EA400 - PA630 - EA630 - P5900 / 6780A100 - EA100 - PA160 - EA160 - PA250 - EA250 - PA315 - EA315 - P1550 / 1800A160 - EA160 - PA250 - EA250 - PA315 - EA315 - PA400 - EA400 - PA630 - EA630 - P2400 / 2900E160 - EA160 - PE250 - EA250 - PA315 - EA315 - PA400 - EA400 - PA630 - EA630 - P3200 / 3700high µhalvescore HALVES for use in combination with an ungapped E core or plate3C853F3A63 - EA63 - PA100 - EA100 - PA160 - EA160 - P1100 / 13003F4A63 - EA63 - PA100 - EA100 - PA160 - EA160 - P650/7803E65600 / 6400E160 - EA25 - EA25 - P1100/1300 E250 - EA250 - PE315 - EA315 - PE400 - EA400 - PA630 - EA630 - PA1000 - EA1000 - P8030 / 9250E315 - EA315 - PE400 - EA400 - PE630 - EA630 - PA1000 - EA1000 - PA1600 - EA1600 - P8480 / 9970E630 - EA630 - PE1000 - EA1000 - PA1600 - EA1600 - PA2500 - EA2500 - PA3150 - EA3150 - P14640/16540E250 - EA250 - PE315 - EA315 - PE400 - EA400 - PA630 - EA630 - PA1000 - EA1000 - P7250 / 8500E250 - EA250 - PE315 - EA315 - PE400 - EA400 - PA630 - EA630 - PA1000 - EA1000 - P7310 / 8700E315 - EA315 - PE400 - EA400 - PE630 - EA630 - PA1000 - EA1000 - PA1600 - EA1600 - P7710 / 9070E630 - EA630 - PE1000 - EA1000 - PA1600 - EA1600 - PA2500 - EA2500 - PA3150 - EA3150 - P13300/15050E250 - EA250 - PE315 - EA315 - PE400 - EA400 - PA630 - EA630 - PA1000 - EA1000 - P3880 /4600E250 - EA250 - PE315 - EA315 - PE400 - EA400 - PA630 - EA630 - PA1000 - EA1000 - P3870 / 4660E315 - EA315 - PE400 - EA400 - PE630 - EA630 - PA1000 - EA1000 - PA1600 - EA1600 - P4030 / 4780E630 - EA630 - PE1000 - EA1000 - PA1600 - EA1600 - PA2500 - EA2500 - PA3150 - EA3150 - P6960 / 792013500 / 15500 22000 / 26000gapped core half with symmetrical gap (E). AL 160 nH measured in combination with an Equal-gapped E core half.gapped core half with asymmetrical gap (A). AL 25 nH in combination with an ungapped E core half.gapped core half with asymmetrical gap (A). AL 25 nH in combination with a plate.ungapped core half. AL 1100/1300 nH measured in combination with an ungapped half / plate.AL value (nH) measured at Bˆ 0.1 mT, f 10 kHz, T 25 CAL tolerance:E43/10/28 5% 8% 10% 25% 40% 30%9Philips Magnetic Products
Properties under power conditionsCorecombinationE E14-3F3E PLT14-3F3E E14-3F4E PLT14-3F4E E18-3F3E PLT18-3F3E E18-3F4E PLT18-3F4E E22-3F3E PLT22-3F3E E22-3F4E PLT22-3F4E E32-3C85E PLT32-3C85E E32-3F3E PLT32-3F3E E32-3F4E PLT32-3F4E E38-3C85E PLT38-3C85E E38-3F3E PLT38-3F3E E38-3F4E PLT38-3F4E E43-3C85E PLT43-3C85E E43-3F3E PLT43-3F3E E43-3F4E PLT43-3F4E E58-3C85E PLT58-3C85E E58-3F3E PLT58-3F3E E58-3F4E PLT58-3F4E E64-3C85E PLT64-3C85E E64-3F3E PLT64-3F3E E64-3F4E PLT64-3F4B(mT) at250 A/m10 kHz100 oC 300 300 250 250 300 300 250 250 300 300 250 250 320 320 320 320 250 250 320 320 320 320 250 250 320 320 320 320 250 250 320 320 320 320 250 250 320 320 320 320 250 250core loss (W)25 kHz200 mT100 oC 0.84 0.71 1.60 1.35 100 kHz100 mT100 oC 0.033 0.027 0.11 0.092 0.28 0.23 0.97 0.82 0.59 0.50 1.80 1.50 1.20 1.00 2.50 2.10 1.60 1.35 4.40 3.75 2.70 2.30 7.30 6.40 4.50 3.95 10Philips Magnetic Products400 kHz50 mT100 oC 0.060 0.048 0.19 0.16 0.50 0.40 1.00 0.85 2.00 1.65 2.70 2.25 4.70 4.00 7.80 6.80 1 MHz30 mT100 oC 0.090 0.072 0.29 0.24 0.77 0.62 1.60 1.36 3.00 2.50 4.20 3.50 7.40 6.25 12.0 10.53 MHz10 mT100 oC 0.11 0.088 0.35 0.29 0.90 0.72 2.00 1.70 3.50 2.90 5.00 4.15 8.00 6.80 15.0 13.0
3.2min.5.3min.R min.R n.R 0.8max.16.2max.22.4min.E22/6/16-coreFig.3 PCB cut out proposal for glued cores11Philips Magnetic Products
4.c. Cores for clampingDCCBF E AABE core with recess (E/R)E14/3.5/5/Rmounting partsdimensions (mm)effective core parametersCore typePLT14/5/1.5/Splate with slot nation)core factorΣ l/A(mm-1)-1.15-0.498-0.324eff. volumeVe (mm3)-230-830-2100eff. lengthle (mm)-16.4-20.3-26.1eff. areaAe (mm2)-14.2-40.8-80.4min. areaAmin (mm2)-10.9-35.9-72.6mass ofcore half (g) 0.6 0.5 2.4 1.7 6.5 4A14 0.314 0.318 0.3518 0.3521.8 0.421.8 0.4B3.5 0.15 0.14 0.110 0.25.7 0.115.8 0.3C5 0.11.8 0.0510 0.22.4 0.0515.8 0.32.9 0.05D2 0.1-2 0.1-3.2 0.1-E11 0.25-14 0.3-16.8 0.4-F3 0.05-4 0.1-5 0.1-CLME14/PLT14E18/PLT1812Philips Magnetic ProductsE22/PLT22
E14/3.5/5/RE18/4/10/RE22/6/16/RMatching platesPLT14/5/1.5/SPLT18/10/2/SPLT22/16/2.5/Score HALVES for use in combinationwith a plateCore 00-P1800A630-P50003F43E6A63-P12806400155002900AL value (nH) measured at Bˆ 0.1 mT, f 10 kHz, T 25 C26000AL tolerance: 3% 5% 8% 25% 40% 30%gapped core half with asymmetrical gap (A), AL 63 nH measured in combination with a plate.ungapped core half, AL 1280 nH measured in combination with a plate.Properties under power conditionsCorecombinationE PLT14-3F3E PLT14-3F4E PLT18-3F3E PLT18-3F4E PLT22-3F3E PLT22-3F4B(mT) at250 A/m10 kHz100 oC 300 250 300 250 300 250Core loss (W) at25 kHz200 mT100 oC 100 kHz100 mT100 oC 0.032 0.12 0.29 13Philips Magnetic Products400 kHz50 mT100 oC 0.058 0.20 0.52 1 MHz30 mT100 oC 0.086 0.30 0.803 MHz10 mT100 oC 0.11 0.37 0.93
13.6E14/3.5/5-core5.5 801.3514 0.23.2min.2.5min.0.20.1R0.35.3min.2.15.4 R 8/4/10-coreR 0.8max.17.64.25min.2801.35 18 0.22.5min.0.40.10.4min.R0.16.6 16-coreR 0.8max.5.25min.21.420. 8022 0.216.3min.2.8min.R0.40.18.7 .5 PCB cut out proposal for clamped coresFig.4 Clamps for E/PLT combinations.14Philips Magnetic Products
PLTPLT/SEE/RFig.6 The different core shapes available for planar E transformers.15Philips Magnetic Products
4.d. PackingStandard packing for Planar E cores and Plates is a plasticblister tape. The plastic material (PET) is environmentallyfriendly.all cavities closedPaperorientation holePETlLHGlue areasPw6,2Sfree from burrsboxblister tapeFig.7 Blister tape packing.Cores in blister tapeBlister sizePitch (P)27.5 mm38.5 mmBox size (LxWxH)355 x 70 x 210 mm310 x 90 x 248 mmProducts / blister340 x 60 mm295 x 82 mmCore sizeBlisters / boxCore halves / boxBlister widthE14/3.5/5E18/4/10E22/6/165050252000200050060 mm60 mm82 mmClamps in bulkClamp sizeCLM-E14/PLT14CLM-E18/PLT18CLM-E22/PLT22Box size4020clamps / box170 x 100 x 70 mm170 x 100 x 70 mm170 x 100 x 70 mm16Philips Magnetic Products500025001500W
For E14/3.5/5 and E18/4/10, a prototype version of tapeon reel packing has been developed to facilitate automaticmounting with SMD pick & place equipment. Thepacking method is in accordance with IEC-286, part 3.The plastic material (0.3 mm PET) is environmentallyfriendly. Plates have the same packing as the correspondingE cores.5.4 0.2E14/3.5/59.9 0.324 0.311.5 0.114.6 0.24.1 0.31.5 0.10.32.251.75 0.14 0.11.5 0.14 0.28 0.1Fig.8 Tape on reel packing for E14/3.5/5.10.5 0.2E18/4/100.32.251.75 0.14 0.11.5 0.116 0.14.5 0.2Fig.9 Tape on reel packing for E18//4/10.Cores in tape on reelCore size PitchTape widthReel diameterE14/3.5/5E18/4/1024 mm32 mm330 mm330 mm8 mm16 mmCore halves / reel200090017Philips Magnetic Products18.7 0.212.4 0.332 0.328.4 0.114.2 0.15.6 0.32 0.1
5. Design5.b.Winding designDC resistanceOften used copper track heights are 35 and 70 µm. If thecopper cross-section is not enough for an acceptable DCresistance, then tracks can be connected in parallel for all orpart of the turns.AC resistanceAC copper losses due to skin and proximity effect are lowerfor flat copper tracks than for round wire with the samecross-sectional area. Eddy currents induced in the vicinityof a gap can be reduced by deleting a few turns where the5.a. Core choiceflux density is maximum and perpendicular to the windingFlux densityThe improved heat management allows for up to twice the plane. The E / plate combination has somewhat less straypower loss of a conventional design with the same magnetic flux than the E / E combination because of the gapposition.volume, so optimum flux density will be higher than for aLeakage inductanceconventional design.With vertically stacked windings, the magnetic couplingAir gapLarge air gaps are not favourable in a planar design because will be very strong and coupling factors close to 100 % canbe achieved (Fig.10a).of stray flux. The flux fringing factor depends on the ratioof winding window height to air gap length, which is lower Parasitic capacitancefor a flat core. If the window height is only a few times the The former will lead to higher inter-winding capacitance.This capacitance can be reduced by projecting the tracks ofgap length and the window breadth is several times thea winding in between the tracks of the adjacent windingcentre post width, then even considerable flux crossingbetween core top and bottom will occur. More flux fringing (Fig.10b).Furthermore, the repeatability of the capacitance allows forand flux crossing lead to higher eddy current loss in theeither compensating it in the rest of the circuit or using itwinding.in a resonant design. In the latter case, a high capacitancecould be chosen on purpose by placing the tracks ofadjacent windings face to face (Fig.10c).In order to make full use of the advantages of planartechnology, the design concept must be different from awire-wound design. A few points are highlighted below. Fora complete design procedure of planar power transformerswith examples, see the brochure “ Design of Planar Powertransformers”. For a completely worked-out example of aDC/DC converter, see the brochure "25 Watt DC/DCconverter using integrated planar magnetics".a)b)c)Fig.10 Different winding designs18Philips Magnetic Products
6. Manufacturing6.a.AssemblyStand-alone : not essentially different from conventional.For glue and curing proposals, see the application note"Gluing of ferrite cores". The high permeability ferrite 3E6should not be glued between the mating faces, because theparasitic gap reduces effective permeability. Glue can beapplied on the sides of the outer legs (Fig. 11).Clamping is done by first pressing the clamp into the snapfit and then aligning the plate in transversal direction.Integrated : assembly is combined with mounting.dot of gluedot of glue6.b. MountingStand-alone : through-hole or SMD, not essentiallydifferent from conventional.The flat core surface is well suited for pick & place systems.Integrated : can best be done in 2 steps.1). Glue one core half to the PCB. The same glue can beused as for attaching SMD components and this step islogically combined with SMD mounting on the same PCBside.Fig.11 Gluing of planar E cores2). Glue or clamp the second core half to the first one. Thesame remarks apply here as for stand-alone assembly.6.c. SolderingOnly applicable for stand-alone transformers.In case of reflow soldering, hot air convection is preferredover IR radiation heating, because it equalises thetemperature differences. With standard IR radiationheating, the good thermal conduction of the planarcomponent can lead to a too low solder paste temperatureor there can be a too high PCB temperature if radiationpower is increased. In case of IR reflow soldering, it isadvised to use modified solder paste and/or PCB material.19Philips Magnetic Products
7. Literature & sample boxes25 Watt DC/DC converter using integrated planar magneticsGluing of Ferrite CoresDesign of Planar Power TransformersSAMPLEBOX7 : Small planar E cores in 3F3SAMPLEBOX8 : Medium planar E cores in 3C85 & 3F39398 236 260119398 083 200119398 083 390114322 020 851314335 000 409718.Type number systemAll planar core type numbers correspond to a core half.Therefore two core halves have to be ordered in the rightcombination. There are 4 core half types combined to 3types of core sets :E E, E PLT and E/R PLT/S. The last one iscompleted with a clamp (CLM).E14/3.5/5/R-3F3-A100-Pmating partP: combine wit plateE: combine with E corecore typecore size(ungapped: 3dim.)(gapped: 2dim.)clamp recess(if recessed: /R)materialAL value (nH)CLM-E18/PLT18PLT14/5/1.5/S-3F3core typematerialaccessory typecore size(always 3dim.)gap typeA: asymmetrical gapE: symmetrical gapE coreclamp slot(if slotted: /S)Plate20Philips Magnetic Productscorresponding E core(only main dim.)corresponding plate(only main dim.)Clamp
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1. Introduction 3 2. Advantages of planar technology 4 2.a. Design advantages 4 2.b. Manufacturing advantages 4 2.c. Limitations 5 2.d. Integrated versus stand-alone 5 2.e. Gluing versus clamping 6 3. Applications 6 3.a. Power conversion 6 3.b. Pulse transmission 6 4. Product range 7 4.a. Material grades 7 4.b. Cores for gluing 8 4.c. Cores for .
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Planar magnetic devices offer several advantages over their conventional counterparts. This paper dis-cusses the magnetic fields within the planar structure and their effects on the distribution of high fre-quency currents in the windings. Strategies for optimizing planar design are presented, and illustrated with design examples.File Size: 1MBPage Count: 26Explore further(PDF) Design, Modeling, and Analysis of a Compact Planar .www.researchgate.netMagnetics Design Handbook - Texas Instrumentswww.ti.comHow to Create a Planar Transformer PCB Layout Blogs Altiumresources.altium.comMagnetics Designer: Transformer and Inductor Design and .www.intusoft.comPlanar Transformer Prototyping Kit - Farnellwww.farnell.comRecommended to you b
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Planar Drawings A planar drawing is a drawing in which edges do not intersect each other in the drawing (for example, the drawings (a), (b), and (c) in Figure 5.1 are planar drawings, and the drawing (d) is a non-planar drawing). Planar drawings are normally easier to understand than non-planar drawings, i.e., drawings with edge-crossings .
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Detour Some results: Any planar graph has a planar straight-line drawing where edges do not intersect [Fary's theorem]. A graph is planar iff it has no subgraphs isomorphic with K5 or K3,3 [Kuratowski's theorem]. A graph is planar iff it has a dual graph. Any planar graph has at least one vertex of degree 5. There are a number of efficient algorithms for planarity .
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