MC74HC4094A8-Bit Shift and StoreRegisterHigh Performance Silicon Gate CMOSThe MC74HC4094A is a high speed CMOS 8 bit serial shift andstorage register. This device consists of an 8 bit shift register and latchwith 3 state output buffers. Data is shifted on positive clock (CP)transitions. The data in the shift register is transferred to the storageregister when the Strobe (STR) input is high. The output buffers areenabled when the Output Enable (OE) input is set high. Two serialoutputs (QS1, QS2) are available for cascading multiple devices.www.onsemi.comMARKINGDIAGRAMS16SOIC 16D SUFFIXCASE 751B16Features1 Wide Operating Voltage Range: 2.0 to 6.0 V Low Power Dissipation: ICC 10 mA In Compliance with the Requirements Defined by JEDEC HC4094AGAWLYWW116Standard No. 7ANLV Prefix for Automotive and Other Applications RequiringUnique Site and Control Change Requirements; AEC Q100Qualified and PPAP CapableThese are Pb Free Devices1611AWL, LYY, YWW, WG, GTypical Applications Serial to Parallel Conversion Remote Control Storage RegisterHC4094AALYWGGTSSOP 16DT SUFFIXCASE 948F Assembly Location Wafer Lot Year Work Week Pb Free Package(Note: Microdot may be in either location)ORDERING INFORMATIONSee detailed ordering and shipping information in the packagedimensions section on page 10 of this data sheet. Semiconductor Components Industries, LLC, 2015February, 2015 Rev. 21Publication Order Number:MC74HC4094A/D
QP711112DFigure 1. Pin Assignment241D2D3OE91015Figure 2. Logic Symbol2D3CP1STR15OEFigure 3. IEC Logic Symbol8 – Stage Shift Register8 – Bit Storage Register3 – Stage OutputsQP04QP15QP26QP37QP414QP513Figure 4. Functional Diagramwww.onsemi.com2QP612QP711QS210QS19
MC74HC4094ASTAGE 0DSTAGES 1 TO 6QDQDSTAGE OEQP0QP1 QP2 QP3 QP4 QP5 QP6Figure 5. Logic Diagramwww.onsemi.com3QP7QS2
MC74HC4094AMAXIMUM RATINGSSymbolParameterValueUnit– 0.5 to 7.0VDC Input Voltage (Referenced to GND)– 0.5 to VCC 0.5VDC Output Voltage (Referenced to GND)– 0.5 to VCC 0.5VVCCDC Supply Voltage (Referenced to GND)VinVoutIinDC Input Current, per Pin 20mAIoutDC Output Current, per Pin 35mAICCDC Supply Current, VCC and GND Pins 75mAPDPower Dissipation in Still Air,500450mWTstgStorage Temperature– 65 to 150 CSOIC Package†TSSOP Package†Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any ofthese limits are exceeded, device functionality should not be assumed, damage may occur andreliability may be affected.†Derating SOIC Package: – 7 mW/ C from 65 to 125 CTSSOP Package: 6.1 mW/ C from 65 to 125 CRECOMMENDED OPERATING CONDITIONSSymbolVCCVin, VoutParameterDC Supply Voltage (Referenced to GND)MinMaxUnit2.06.0V0VCCV–55 125 C0001000500400nsDC Input Voltage, Output Voltage(Referenced to GND)TAOperating Temperature, All Package Typestr, tfInput Rise and Fall Time(Figure 1)VCC 2.0 VVCC 4.5 VVCC 6.0 Vwww.onsemi.com4This device contains protectioncircuitry to guard against damagedue to high static voltages or electricfields. However, precautions mustbe taken to avoid applications of anyvoltage higher than maximum ratedvoltages to this high impedance circuit. For proper operation, Vin andVout should be constrained to therange GND v (Vin or Vout) v VCC.Unused inputs must always betied to an appropriate logic voltagelevel (e.g., either GND or VCC).Unused outputs must be left open.
MC74HC4094AFUNCTIONAL TABLEINPUTSPARALLEL OUTPUTSSERIAL OUTPUTSCPOESTRDQP0QPnQS1QS2 LXXZZQ’6NC LXXZZNCQP7 HLXNCNCQ’6NC HHLLQPn 1Q’6NC HHHHQPn 1Q’6NC HHHNCNCNCQP7Notes1. H HIGH voltage levelL LOW voltage levelX don’t careZ high impedance OFF stateNC no change LOW to HIGH CP transition HIGH to LOW CP transitionQ’6 the information in the seventh register stage is transferred to the 8th register stage and QSn output at the positive clock edgeCLOCK INPUTCPDATA INPUTDSTROBE INPUTSTROUTPUT ENABLE INPUTOEINTERNAL Q’0FF0OUTPUTQP0INTERNAL Q’6FF6OUTPUTQP6SERIAL OUTPUTQS1SERIAL OUTPUTQS2Z stateZ stateFigure 6. Timing Diagramwww.onsemi.com5
MC74HC4094ADC CHARACTERISTICSGuaranteed LimitsSymbolVIHVILVOHVOLParameterMinimum High Level InputVoltageMaximum Low Level InputVoltageMinimum High Level OutputVoltageMaximum Low Level OutputVoltageVCC (V) 555C to 255C 855C 05.95.95.9VIN VIH or VIL, IOUT 2.4 mA3.02.752.72.6VIN VIH or VIL, IOUT 4 mA184.108.40.206.1VIN VIH or VIL, IOUT 5.2 mA6.05.755.75.6VIN VIH or VIL, IOUT 20 VIN VIH or VIL, IOUT 2.4 mA3.00.250.30.4VIN VIH or VIL, IOUT 4 mA220.127.116.11.4VIN VIH or VIL, IOUT 5.2 mA6.00.250.30.4Test ConditionsVOUT 0.1 V or VCC – 0.1 V IOUT 20 mAVOUT 0.1 V or VCC – 0.1 V IOUT 20 mAVIN VIH or VIL IOUT 20 mAVVVIINMaximum Input LeakageCurrentVIN VCC or GND6.0 0.1 1 1mAIOZMaximum Tri State OutputLeakage CurrentVIN VCC or GNDVOUT VCC or GND6.0 0.5 5 10mAICCMaximum Quiescent SupplyCurrentVIN VCC or GND6.04.04080mAwww.onsemi.com6
MC74HC4094AAC CHARACTERISTICS (tf tr 6 ns, CL 50 pF)Guaranteed LimitsSymbolParametertPHL, tPLH Maximum Propagation DelayCP to QS1tPHL, tPLH Maximum Propagation DelayCP to QS2tPHL, tPLH Maximum Propagation DelayCP to QPntPHL, tPLH Maximum Propagation DelaySTR to QPntPZH, tPZL Maximum 3 State Output Enable TimeOE to QPntPHZ, tPLZ Maximum 3 State Output Enable TimeOE to QPntTHL, tTLHtWtWtSUMaximum Output Transition TimeMinimum Clock Pulse WidthHigh or LowMinimum Strobe Pulse WidthHighMinimum Set up TimeD to CP 855C 1255CUnitnsTest ConditionsVCC (V) 555C to 255CFigure 6.01417202.05065753.03035454.51013156.091113Figure 7Figure 7Figure 8Figure 9Figure 9Figure 7Figure 7Figure 8Figure 10www.onsemi.com7nsnsnsnsnsnsnsnsns
MC74HC4094AAC CHARACTERISTICS (tf tr 6 ns, CL 50 pF)Guaranteed LimitsSymboltSUththfMAXParameterMinimum Set up TimeCP to STRMinimum Hold TimeD to CPMinimum Hold TimeCP to STRMinimum Clock Pulse FrequencyTest ConditionsVCC (V) 555C to 255CFigure 8Figure 10Figure 8Figure 7 855C 06543.01814124.53024206.0352824nsnsMHzCinMaximum Input Capacitance 101010pFCoutMaximum Output Capacitance 151515pFCPDPower Dissipation Capacitance (Note 2) 140140140pF2. CPD is defined as the value of the IC’s equivalent capacitance from which the operating current can be calculated from:ICC(operating) CPD x VCC x fIN x NSW where NSW total number of outputs switching and fIN switching frequency.www.onsemi.com8
MC74HC4094AAC WAVEFORMS1/fMAXCP InputCP Input50%twtPLHQPn, QS1OutputtsutPHLSTR Input50%50%tPHLtPLHtPLHQPn Output50%tTLHtPHL50%tTHLFigure 8. Waveforms showing the strobe(STR) to output (QPn) propagation delays,the strobe pulse width, the clock set upand hold times for the strobe input.Figure 7. Waveforms showing the clock(CP) to output (QPn, QS1, QS2) propagationdelays, the clock pulse width and themaximum clock frequency.tfthtWtTHLtTLHQS2 Output50%tr90%OE Input50%10%ÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉtsutPZLtPLZQPn Output:Low to OffOff to LowD Input50%10%tPZHtPHZ90%QPn Output:High to OffOff to HighOutputsDisabledOutputsEnabledtsuthth50%QPn, QS1, QS2Output50%OutputsEnabled50%CP Input50%The shaded areas indicate whenthe input is permitted to change forpredictable output performance.Figure 9. Waveforms showing the 3 stateenable and disable times for input OE.Figure 10. Waveforms showing the dataset up and hold times for the data input.www.onsemi.com9
MC74HC4094ATEST CIRCUITSTEST POINTTEST *Includes all probe and jig capacitance1 kWCL*CONNECT TO VCC WHENTESTING tPLZ AND tPZL.CONNECT TO GND WHENTESTING tPHZ AND tPZH.*Includes all probe and jig capacitanceFigure 11. AC Characteristics Load CircuitsORDERING INFORMATIONPackageShipping†MC74HC4094ADGSOIC 16(Pb Free)48 Units / RailMC74HC4094ADR2GSOIC 16(Pb Free)2500 / Tape & ReelMC74HC4094ADTGTSSOP 16(Pb Free)96 Units / RailMC74HC4094ADTR2GTSSOP 16(Pb Free)2500 / Tape & ReelNLVHC4094BDTR2G*TSSOP 16(Pb Free)2500 / Tape & ReelDevice†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Q100 Qualified and PPAPCapable.www.onsemi.com10
MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSSOIC 16CASE 751B 05ISSUE KDATE 29 DEC 2006SCALE 1:1 A 16NOTES:1. DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSIONS A AND B DO NOT INCLUDE MOLDPROTRUSION.4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.5. DIMENSION D DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBAR PROTRUSIONSHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE DDIMENSION AT MAXIMUM MATERIAL CONDITION.9 B 1P8 PL0.25 (0.010)8MBSGRKFX 45C T 10.003.804.001.351.750.350.490.401.251.27 .050 BSC0.0080.0090.0040.009070.2290.2440.0100.01916 PL0.25 (0.010)MT BSASSTYLE 1:PIN SEEMITTERNO NO E 2:PIN ENO CONNECTIONCATHODECATHODENO CONNECTIONANODECATHODECATHODEANODENO CONNECTIONCATHODECATHODENO CONNECTIONANODECATHODESTYLE 3:PIN 18.104.22.168.22.214.171.124.126.96.36.199.188.8.131.52.COLLECTOR, DYE #1BASE, #1EMITTER, #1COLLECTOR, #1COLLECTOR, #2BASE, #2EMITTER, #2COLLECTOR, #2COLLECTOR, #3BASE, #3EMITTER, #3COLLECTOR, #3COLLECTOR, #4BASE, #4EMITTER, #4COLLECTOR, #4STYLE 4:PIN 184.108.40.206.220.127.116.11.18.104.22.168.22.214.171.124.STYLE 5:PIN 126.96.36.199.188.8.131.52.184.108.40.206.220.127.116.11.DRAIN, DYE #1DRAIN, #1DRAIN, #2DRAIN, #2DRAIN, #3DRAIN, #3DRAIN, #4DRAIN, #4GATE, #4SOURCE, #4GATE, #3SOURCE, #3GATE, #2SOURCE, #2GATE, #1SOURCE, #1STYLE 6:PIN ANODEANODEANODEANODEANODEANODEANODESTYLE 7:PIN 18.104.22.168.22.214.171.124.126.96.36.199.188.8.131.52.SOURCE N‐CHCOMMON DRAIN (OUTPUT)COMMON DRAIN (OUTPUT)GATE P‐CHCOMMON DRAIN (OUTPUT)COMMON DRAIN (OUTPUT)COMMON DRAIN (OUTPUT)SOURCE P‐CHSOURCE P‐CHCOMMON DRAIN (OUTPUT)COMMON DRAIN (OUTPUT)COMMON DRAIN (OUTPUT)GATE N‐CHCOMMON DRAIN (OUTPUT)COMMON DRAIN (OUTPUT)SOURCE N‐CHCOLLECTOR, DYE #1COLLECTOR, #1COLLECTOR, #2COLLECTOR, #2COLLECTOR, #3COLLECTOR, #3COLLECTOR, #4COLLECTOR, #4BASE, #4EMITTER, #4BASE, #3EMITTER, #3BASE, #2EMITTER, #2BASE, #1EMITTER, #1SOLDERING ONS: MILLIMETERSDOCUMENT NUMBER:DESCRIPTION:98ASB42566BSOIC 16Electronic versions are uncontrolled except when accessed directly from the Document Repository.Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.PAGE 1 OF 1ON Semiconductor andare trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others. Semiconductor Components Industries, LLC, 2019www.onsemi.com
MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSTSSOP 16CASE 948F 01ISSUE B16DATE 19 OCT 20061SCALE 2:116X K REF0.10 (0.004)0.15 (0.006) T UMT USVSKSÉÉÉÇÇÇÇÇÇÉÉÉK12XL/2169J1B U LSECTION N NJPIN 1IDENT.N810.25 (0.010)M0.15 (0.006) T USA V NOTES:1. DIMENSIONING AND TOLERANCING PERANSI Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSION A DOES NOT INCLUDE MOLDFLASH. PROTRUSIONS OR GATE BURRS.MOLD FLASH OR GATE BURRS SHALL NOTEXCEED 0.15 (0.006) PER SIDE.4. DIMENSION B DOES NOT INCLUDEINTERLEAD FLASH OR PROTRUSION.INTERLEAD FLASH OR PROTRUSION SHALLNOT EXCEED 0.25 (0.010) PER SIDE.5. DIMENSION K DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.08 (0.003) TOTALIN EXCESS OF THE K DIMENSION ATMAXIMUM MATERIAL CONDITION.6. TERMINAL NUMBERS ARE SHOWN FORREFERENCE ONLY.7. DIMENSION A AND B ARE TO BEDETERMINED AT DATUM PLANE W .NFDETAIL E W C0.10 (0.004) T SEATINGPLANEDHGDETAIL 50 1.200.050.150.500.750.65 BSC0.180.280.090.200.090.160.190.300.190.256.40 BSC08INCHESMINMAX0.193 0.2000.169 0.177 0.0470.002 0.0060.020 0.0300.026 BSC0.0070.0110.004 0.0080.004 0.0060.007 0.0120.007 0.0100.252 BSC08GENERICMARKING DIAGRAM*SOLDERING ENT NUMBER:DESCRIPTION:16X1.2698ASH70247ATSSOP 16DIMENSIONS: MILLIMETERSXXXXALYWG or G Specific Device Code Assembly Location Wafer Lot Year Work Week Pb Free Package*This information is generic. Please refer todevice data sheet for actual part marking.Pb Free indicator, “G” or microdot “ G”,may or may not be present.Electronic versions are uncontrolled except when accessed directly from the Document Repository.Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.PAGE 1 OF 1ON Semiconductor andare trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others. Semiconductor Components Industries, LLC, 2019www.onsemi.com
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8-Bit Shift and Store Register High Performance Silicon Gate CMOS The MC74HC4094A is a high speed CMOS 8 bit serial shift and storage register. This device consists of an 8 bit shift register and latch with 3 state output buffers. Data is shifted on positive clock (CP) transitions. The data in the shift register is transferred to the .
21 INPUT: Select a TV input source. 22 SHIFT: Press and hold this button then press buttons 0-9 to directly select TV input Shift-1 VIDEO Shift-2 N/A Shift-3 HDMI 3 Shift-4 USB Shift-5 Component Shift-6 N/A Shift-7 N/A Shift-8 HDMI 1 Shift-9 HDMI 2 Shift-0 TV Tuner Shift-ON Power Toggle
Windows XP Professional 32-Bit/64-Bit, Windows Vista Business 32-Bit/64-Bit, Red Hat Enterprise Linux WS v4.0 32-bit/64-bit, Red Hat Enterprise Desktop v5.0 32-bit/64-bit (with Workstation Option), SUSE Linux Enterprise (SLE) desktop and server v10.1 32-bit/64-bit Resources Configuration LUTs
SHIFT-F5. Change the window to a 3D Window SHIFT-F6. Change the window to an IPO Window SHIFT-F7. Change the window to a Buttons Window SHIFT-F8. Change the window to a Sequence Window SHIFT-F9. Change the window to an Outliner Window SHIFT-F10. Change the window to an Image Window SHIFT-F11. Change the window to a Text Window SHIFT-F12.
8127FS–AVR–02/2013 4. Register Summary Note: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page 0x3F SREG I T H S V N Z C Page 12 0x3E SPH Stack Poin
Jan 25, 2016 · Windows 10 (32-bit and 64-bit) Windows 8.1 (32- bit and 64-bit) Windows 8 (32-bit and 64-bit) Windows 7 (32-bit and 64-bit) Java version of API and Wizard: Ubuntu 11.0.4, MacOS 10.7 and 10.8; Java 8 Supported Virtualization Environments: Support for
Microsoft Windows 7, 32-bit and 64-bit Microsoft Windows 8 & 8.1, 32-bit and 64-bit Microsoft Windows 10, 32-bit and 64-bit Microsoft Windows Server 2008 R2 Microsoft Windows Server 2012, 64-bit only RAM: Minimum 2 GB for the 32-bit versions of Microsoft Windows 7, Windows 8, Windows 8.1, and Windows 10.
Windows Desktop Windows 7 (32-bit and 64-bit) KB4054518 must be installed on Windows 7 (32-bit and 64-bit) systems. For more information, read the KB article here.* Windows 7 Embedded (32-bit and 64-bit) KB4054518 must be installed on Windows 7 Embedded (32-bit and 64-bit) systems. For more information, read the KB article here.*
Avaya one-X Agent User Guide Work-at-Home and JDZ Users This document provides instructions on installing and using the Avaya one-X Agent application. Note: Avaya one-X Agent is currently supported by Windows 7 32-bit or 64-bit with Service Pack 1; Windows 8 32-bit or 64-bit; Windows 8.1 32-bit or 64-bit; and Windows 10 32-bit or 64-bit. Contents
Full disk encryption (FDE), file/folder encryption, USB encryption and email encryption are all supported features. FULLY VALIDATED ESET Endpoint Encryption is FIPS 140-2 validated with 256-bit AES encryption. ALGORITHMS & STANDARDS AES 256 bit, AES 128 bit, SHA 256 bit, SHA1 160 bit, RSA 1024 bit, Triple DES 112 bit, Blowfish 128 bit. OS SUPPORT Support for Microsoft Windows 10, 8, 8.1 .
23. coupling for corkscrew and 24. lanyard hole 25. bit wrench 26. bit case with 27. – bit Hex 3 28. – bit Hex 4 29. – bit Phillips 0 30. – bit Phillips 3 31. – bit Torx 10 32. – bit Torx 15 33. space for additional bits 34. mini screwdriv
Implementation o Load bit o Read logic o Write logic Multi-bit register Bit out load in if load(t-1) then out(t) in(t-1) else out(t) out(t-1) 1-bit register o Register’s width: a trivial parameter o Read logic o Write logic Bit. . . w-bit register out load in w w Bit Bit Aside: Hardware Simulation Relevant topics from the HW simulator tutorial:
The MIPS instruction srl shifts all the bits in the 32-bit data word to the right from 1 to 31 places. Vacated positions are filled with zeroes. At the end of an n-bit right shift, the n left positions will be 0. Bits shifted out are eliminated. After an n-bit right shift, the original n bits at the right are lost. Each bit shifted 3 .
Windows XP Professional 32-bit 6.3.03i or later Windows XP Professional 64-bit 9.1i or later Windows Vista 32- and 64-bit 9.2 or later Windows 7 Professional 32- and 64-bit 13.1 or later Red Hat Enterprise Linux WS 3.0 32-bit 7.1i or later Red Hat Enterprise Linux WS 3.0 64-bit 9.1i or later Red Hat Enterprise Linux WS 4.0 32-bit 8.2i or later
Cryptographic Key Usage 23 K: 128-bit master key.Put into USIM and HSS by carrier CK & IK: 128-bit Cipher key and Integrity key KASME: 256-bit local master, derived from CK & IK KeNB: 256-bit key used to derive additional keys NASenc & NASint: 256/128-bit key protecting NAS RRCenc & RRCint: 256/128-bit key protecting RRC UPenc: 256/128-bit key protecting UP traffic
12-bit 10-bit 8-bit 2.7v – 5.5v 2.7v – 5.5v 2.7v – 5.5v 2.5lsb 1lsb 0.5lsb ltc2640-lz12 ltc2640-lz10 ltc2640-lz8 ltdhw ltdjb ltdjg 2.5v (4095/4096) 2.5v (1023/1024) 2.5v (255/256) zero zero zero clr clr clr 12-bit 10-bit 8-bit 2.7v – 5.5v 2.7v – 5.5v 2.7v – 5.5v 2.5lsb 1lsb 0.5lsb ltc2640-hm12 ltc2640-hm10 .
Can be used to insert all Blum press-in hinges Part no. Knock-in tool ZME.0710 Machine drill bits Part no. Ø5 mm drill bit (RH) M01.ZB05.D2 R Ø5 mm drill bit (LH) M01.ZB05.D3 L Ø8 mm drill bit (LH) M01.ZB08.03 L Ø10 mm drill bit (RH) M01.ZB10.02 R Ø10 mm drill bit (LH) M01.ZB10.03 L Ø20 mm drill bit (RH) M01.ZB20.02 R Ø35 mm drill bit .
1/4 in. Drive 5/32 in. Hex Bit Socket 1 1/4 in. Drive Hex Bit SAE Sockets Model SKU # Total Piece Count: 5 1/4 in. Drive 2.5 mm Hex Bit Socket H3DHBS532 621789 1 1/4 in. Drive 3 mm Hex Bit Socket H3DHBS316 622336 1 1/4 in. Drive 4 mm Hex Bit Socket H3DHBS732 623160 1 1/4 in. Drive 5 mm Hex Bit Socket H3DHBS14 623460 1 1/4 in. Drive 6 mm Hex Bit .
ADJUSTING THE THROW Adjusting the throw of your new JBR Short Throw Shift Plate kit only takes a few minutes. 1. Gain access to the shift plate using the instructions above. 2. Unbolt the shift plate from the counter weight and rotate the shift plate on to its side with the shift cable still attached. 3.
Jan 01, 1980 · Fourth Shift Release 7.50 Fourth Shift Basics 7 Fourth Shift Basics Using Fourth Shift The Fourth Shift program contains a wide variety of features allowing you to enter, view, and
Algae: Lectures -15 Unit 1: Classification of algae- comparative survey of important system : Fritsch- Smith-Round Ultrastructure of algal cells: cell wall, flagella, chloroplast, pyrenoid, eye-spot and their importance in classification. Structure and function of heterocysts, pigments in algae and Economic importance of algae. Unit 2: General account of thallus structure, reproduction .