Instruction MI IDP10-F - Cascade Automation

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MI IDP10-FInstructionMay 2010I/A Series Pressure TransmittersIDP10 Differential Pressurewith FOUNDATION Fieldbus CommunicationInstallation, Operation, Calibration, Configuration, and Maintenance

MI IDP10-F – May 2010

ContentsFigures. vTables. vi1. Introduction .General Description .Reference Documents .Transmitter Identification .1123Standard Specifications . 5Product Safety Specifications . 10ATEX and IECEx Warnings . 12ATEX Compliance Documents . 12IECEx Compliance Documents . 122. Installation .Transmitter Mounting .Process Mounting .Manifold Mounted Transmitter .Pipe or Surface Mounting .Standard Mounting Bracket .Universal Mounting Bracket .Venting and Draining .Traditional Structure .LP1 Low Profile Structure .LP2 Low Profile Structure .Installation of Flow Measurement Piping .Filling System with Seal Liquid .Positioning the Housing .Positioning the Display .Setting the Write Protect Jumper .Cover Locks .Wiring .Accessing Transmitter Field Terminals .Wiring Notes .Wiring the Transmitter .Installing the Fieldbus Software .Putting a Differential Pressure Transmitter Into Operation .Taking a Differential Pressure Transmitter Out of Operation ii

MI IDP10-F – May 2010Contents3. Operation Via Local Display .Entering Numerical Values .Viewing the Database .Viewing the Pressure Range .Testing the Display .35363737374. Calibration .Calibration Setup .Field Calibration Setup .Bench Calibration Setup .Calibration Using the Optional Local Display .Zero Adjustment Using External Zero Button .Calibration from a Fieldbus Host .393939404143445. Configuration.Configuration Using the Optional Local Display .Character Lists .Configuration Using a Fieldbus Host .Configuration Procedure Using a Fieldbus Host .Configuring the Transducer Block .Configuring the Scaling Parameters in the Analog Input Block .Application Specific Configurations .Changing the Primary Range Values(Reranging) by Editing the Transducer Block Parameters .Disabling the Link Active Scheduler (LAS) .47475353545455586. Maintenance.Troubleshooting .Simulation Mode .Restart .Switch Mode Checklist .Schedule Download Checklist .Block Errors .Interboard Communication Errors/Status .Parts Replacement .Replacing the Terminal Block Assembly .Replacing the Electronics Module Assembly .Removing and Reinstalling a Housing Assembly .Adding the Optional Display .Replacing the Sensor Assembly .Rotating Process Covers for Venting .6363636465656567686868707171736262List of Parameters 75Index . 89iv

2728293031323334353637383940Transmitter Identification .Top Level Structure Diagram .Minimum Allowable Absolute Pressure vs. Process Temperaturewith Fluorinert Fill FluidTypical Mounting of an IDP Transmitter Supported by Process Piping .Typical Mounting of an IDP Transmitter Supported by a Bypass Manifold .Typical Mounting of IDP Transmitter on Coplanar‰ Manifold .Pipe or Surface Mounted Transmitter Using a Standard Bracket .Examples of Mounting With a Standard Bracket .Details of a Universal Bracket .Mounting a Transmitter with Traditional Structure Using a Universal Bracket .Vertical Pipe Mounting a Transmitter with LP2 Structure Using a Universal Bracket .Horizontal Mounting a Transmitter with LP2 Structure Using a Universal Bracket .Vertical Mounting - Cavity Draining .Vertical Mounting - Cavity Venting .Horizontal Mounting - Cavity Venting .Vertical Mounting - Cavity Venting .Horizontal Mounting - Cavity Venting and Draining .Cavity Venting and Draining .Example of Horizontal Process Line Installation .Example of Vertical Process Line Installation .Housing Screw or Clip Location .Write Protection Jumper .Cover Lock Location .Accessing Field Terminals .Identification of Field Terminals .Wiring Diagram of Typical Foundation Fieldbus Transmitter Installation .Local Display Module .Top Level Structure Diagram .Display Test Segment Patterns .Field Calibration Setup .Bench Calibration Setup .Calibration Structure Diagram .Configuration Structure Diagram (1 of 3) .Configuration Structure Diagram (2 of 3) .Configuration Structure Diagram (3 of 3) .Simulation Jumper .Replacing the Electronics Module Assembly and Display .Replacing the Sensor Assembly .Replacing the Sensor Assembly (pvdf Inserts) .Sensor Cavity Venting and Draining 3536384041424849506370727273v

Tables123456789101112131415Reference Documents .Minimum Supply Voltage Requirements .Electrical Safety Specifications .Minimum Supply Voltage Requirements .Parameters Configurable from the Local Display .Alphanumeric Character List .Numeric Character List .Unit names and Unit Codes .Flow Applications .Pressure Applications .Open Tank or Dry Leg Level Applications .Wet Leg Level and Dual Seal Applications .Block Errors .Configuration Errors .Fieldbus Parameters .2910294753535558596061656675vi

1. IntroductionGeneral DescriptionThe IDP10-F intelligent differential pressure transmitters measure the difference between twopressures applied to opposite sides of a silicon strain gauge microsensor within the sensorassembly. This microsensor converts differential pressure to a change in resistance. The resistancechange is then converted to a FOUNDATION fieldbus digital signal proportional to the differentialpressure or to the square root of the differential pressure. This measurement signal is transmittedto remote receivers over the same two wires that supply power to the transmitter electronics.These wires also carry two-way data signals between the transmitter and remote communicationdevices.The transmitter is often used for measuring fluid flow rates across a primary device such as anorifice plate, but can also be used for other types of differential pressure measurements such asliquid level, interface level, or density measurements. The IDP10 can also be supplied with directconnected or remote pressure seals to isolate the measuring element from corrosive or viscousfluids. For more detailed information on the principle of operation of the transmitter, refer toTI 037-096, available from Invensys.The measurement signal is a FOUNDATION fieldbus digital signal for full communication with anyFOUNDATION fieldbus host equipped with a FOUNDATION fieldbus Interface Module. Thecommunication functionality permits you to reconfigure a transmitter from a remote fieldbushost personal computer, or I/A Series system equipped with a FOUNDATION fieldbus InterfaceModule.The FOUNDATION fieldbus is an all digital, serial, two-way communication system that runs at31.25 kbps, interconnecting a fieldbus host and various field devices such as processsensors/transmitters, valves/actuators, and controllers — all connected in parallel to the same bus.Both ends of the bus must be terminated with standard characteristic impedance networks tominimize reflected signals. Power to all devices is supplied by a dc fieldbus power sourceconnected anywhere on the bus.NOTEThe power supply must be a fieldbus-specific power supply.The communication signals between a fieldbus host and all other bus-connected devices, whichare superimposed on the dc power signal on the bus, are controlled according to a strict cycleschedule and protocol. During intervals when control and data signals are not being transmittedaccording to the schedule, the devices are free to communicate with each other for such functionsas local PID control, trend recording/indicating, etc.The FOUNDATION fieldbus uses “Function Blocks” (standardized automation functions) toimplement measurement and control strategies. These blocks may be distributed throughout thearray of devices in whatever manner is most efficient. A major advantage of the concept is thatdevices from many manufacturers may be intermixed in a seamless and integrated manner. Sinceall devices in a system connect to the same wire pair, the system requires less wire thancomparable systems, fewer intrinsic safety barriers and fewer interface cards, resulting insignificant cost savings.1

MI IDP10-F – May 20101. IntroductionThe Foxboro FOUNDATION fieldbus system implements the following blocks — Resource Block,Transducer Block, Analog Input (AI) Blocks, and Proportional Integral Derivative (PID) Block.The Resource Block contains all parameters needed to define the device description for thetransmitter. The Transducer Block handles all configurable parameters that define the sensor,transmitter hardware, and manufacturer-specific data. The AI Blocks contain all configurableparameters needed to define the input data for use with the other function blocks. The PID Blockcontains parameters required for PID control.Reference DocumentsTable 1. Reference DocumentsDocumentDescriptionDimensional PrintsDP 020-342Dimensional Print – PSFLT Pressure SealsDP 020-343Dimensional Print – PSFPS and PSFES Pressure SealsDP 020-345Dimensional Print – PSFAR Pressure SealsDP 020-347Dimensional Print – PSTAR Pressure SealsDP 020-349Dimensional Print – PSISR Pressure SealsDP 020-351Dimensional Print – PSSCR Pressure SealsDP 020-353Dimensional Print – PSSCT Pressure SealsDP 020-354Dimensional Print – PSSSR Pressure SealsDP 020-355Dimensional Print – PSSST Pressure SealsDP 020-446Dimensional Print – IDP10, IDP25, and IDP50 Differential Pressure TransmittersDP 022-335Dimensional Print – Model CO Compact OrificeParts ListsPL 006-172Parts List – Model CO Compact OrificePL 009-005Parts List – IDP10 Differential Pressure TransmitterInstructionsMI 014-900Instruction –Fieldbus OverviewMI 020-328Instruction – Bubble Type Installation for Liquid LevelMI 020-329Instruction – High Accuracy Flow MeasurementMI 020-360Instruction, Wiring Guidelines for Foxboro FOUNDATION fieldbus TransmittersMI 020-369Instruction – Pressure SealsMI 020-427Instruction – Intrinsic Safety Connection Diagrams and Nonincendive CircuitsMI 022-138Instruction – Bypass Manifolds - Installation and MaintenanceMI 022-335Instruction – Model CO Compact Orifice

1. IntroductionMI IDP10-F – May 2010Table 1. Reference Documents (Continued)DocumentDescriptionTechnical InformationTI 1-50aTechnical Information – Liquid Density MeasurementTI 001-051Technical Information – Liquid Interface MeasurementTI 001-052Technical Information – Liquid Level MeasurementTI 37-75bTechnical Information – Transmitter Material Selection GuideTI 037-097Technical Information – Process Sealing of I/A Series Pressure Transmitters for usein Class 1, Zone 0, 1, and 2 Hazardous LocationsTransmitter IdentificationSee Figure 1 for transmitter data plate contents. For a complete explanation of the ModelNumber code, see the parts list. The sensor board firmware version is identified on the top line ofthe display when VIEW DB (View Database) is selected in the top level structure. See Figure 2.STYLEMODEL CODESERIAL NUMBERCALIBRATED RANGEAUXILIARY SPECIFICATION CODEPLANT AND DATE OF MANUFACTURESUPPLY VOLTAGEMAXIMUM WORKING PRESSURECUSTOMER TAGMODELREFERENCEAUX. SPEC.SUPPLYCUST. TAGCAL. RANGEORIGINMWPSTFigure 1. Transmitter Identification3

MI IDP10-F – May 20101. IntroductionEDISPLAY MEAS AND EGUN or EDISPLAY MEAS AND EGUNECALIBNCONFIGELOCAL MODE, GO TO CALIBRATION MENUOFF-LINE, GO TO CONFIGURATION MENUNVIEW DBEON-LINE MODENNETST DSPECANCELON-LINE MODENNEESTEP THROUGH DATABASE DISPLAYSTEP THROUGH DISPLAY TEST PATTERNEXIT MODE SELECT MENU, RETURN TO ON-LINE MODEN NEXT BUTTONE ENTER BUTTONNFigure 2. Top Level Structure DiagramThe initial PDTag of the device is:PRODUCT TYPETRANSMITTER FAMILYSENSOR IDENTIFICATION NUMBE(10 CHARACTERS)FOX-IADP-10 FOX-IASVT-nnnnnnnnnnThe Device ID is:MANUFACTURER IDTRANSMITTER FAMILYSENSOR IDENTIFICATION NUMBE(10 CHARACTERS)385884 FOX-IASVT-nnnnnnnnnn4

1. IntroductionMI IDP10-F – May 2010Standard SpecificationsOperative LimitsInfluenceOperative LimitsSensor Body Temperature(a)Silicone Fill FluidFluorinert Fill Fluidpvdf InsertsElectronics TemperatureWith LCD DisplayRelative HumiditySupply VoltageMounting PositionPollution DegreeInstallation Category(Overvoltage Category)Vibration-46 and 121 C (-50 and 250 F)-29 and 121 C (-20 and 250 F)-7 and 82 C (20 and 180 F)-40 and 85 C (-40 and 185 F)-40 and 85 C (-40 and 185 F)(b)0 and 100%9 to 32 V dcNo Limit2II6.3 mm (0.25 in) double amplitude from 5 to 15 Hz withaluminum housing and from 5 to 9 Hz with 316 ss housing.0 to 30 m/s (0 to 3 “g”) from 15 to 500 Hz with aluminum housingand0 to 10 m/s (0 to 1 “g”) from 9 to 500 Hz with 316 ss housing.(a)Refer to MI 020-369 for temperature limits with pressure seals.(b)Display updates are slowed and readability decreased at temperatures below -20 C (-4 F).Span and Range LimitsSpan LimitCodeA(b)BCDESpan LimitsΔP0.12 and 7.5 kPa0.5 and 30 inH2012 and 750 mmH200.87 and 50 kPa3.5 and 200 inH2087 and 5000 mmH207.0 and 210 kPa28 and 840 inH202.3 and 69 ftH200.07 and 2.1 MPa10 and 300 psi23 and 690 ftH200.7 and 21 MPa100 and 3000 psiRange LimitsΔP (a)-7.5 and 7.5 kPa-30 and 30 inH20-750 and 750 mmH20-50 and 50 kPa-200 and 200 inH20-5000 and 5000 mmH20-210 and 210 kPa-840 and 840 inH20-69 and 69 ftH20-0.21 and 2.1 MPa-30 and 300 psi-69 and 690 ftH20-0.21 and 21 MPa-30 and 3000 psi(a)Negative values of differential pressure indicate a higher pressure on the low side of the sensor.Positive values indicate a higher pressure on the high side of the sensor.(b)Span Limit Code “A” not available with pressure seals.5

MI IDP10-F – May 20101. IntroductionMaximum Static, Overrange, and Proof PressureTransmitter Configuration(Bolting Material)(c)Standard (B7 steel),Option “-B2” (17-4 PH ss),Option “-D3” or “-D7”Option “B1” (316 ss) orOption “-D5”Option “B3” (B7M)Option “-D1”Option “-D2”, “-D4”,“-D6”, or “-D8”(d)Option “-D9” (17-4 PH ss)Maximum Static and OverrangePressure Rating(a,e,f )Proof Pressure )Either side can be at higher pressure during overrange.(b)Meets ANSI/ISA Standard S82.03-1988.(c)-D1 DIN Single ended process cover with M10 B7 bolting.-D2 DIN Double ended process cover with M10 B7 bolting-D3 DIN Single ended process cover with 7/16 in B7 bolting.-D4 DIN Double ended process cover with 7/16 in B7 bolting.-D5 DIN Single ended process cover with 7/16 in 316 ss bolting.-D6 DIN Double ended process cover with 7/16 in 316 ss bolting.-D7 DIN Single ended process cover with 7/16 in 17-4 ss bolting.-D8 DIN Double ended process cover with 7/16 in 17-4 ss bolting-D9 DIN Single ended process cover with 7/16 in 17-4 ss bolting.(d)Limited to operating temperatures ranging from 0 to 60 C (32 to 140 F).(e)When Structure Codes 78/79 are used (pvdf inserts in the Hi and Lo side process covers), the maximumoverrange is 2.1 MPa (300 psi) and temperature limits are -7 and 82 C (20 and 180 F).(f )Static pressure rating of 40 MPa (5800 psi) with Option Code -Y.NOTEStatic pressure zero shift for all calibrated spans can be eliminated by readjusting thezero output at nominal operating static pressure.! CAUTION1. Exceeding the maximum overrange pressure can cause damage to the transmitterdegrading its performance.2. The transmitter could be nonfunctional after application of the proof pressure.Elevated Zero and Suppressed ZeroFor applications requiring an elevated or suppressed zero, the maximum span and theupper and lower range limits of the transmitter can not be exceeded.Sensor Fill FluidSilicone Oil (DC 200) or Fluorinert (FC-43)6

1. IntroductionMI IDP10-F – May 2010Minimum Allowable Absolute Pressure vs. Process TemperatureWith Silicone Fill Fluid:With Fluorinert Fill Fluid:-80At full vacuum: Up to 121 C (250 F)Refer to Figure 3.030Temperature C6090120140Absolute Pressure, mmHg120Fluorinert FC-43 Fluid(operating area above curve)10080604020-25050100150200250Temperature FFigure 3. Minimum Allowable Absolute Pressure vs. Process Temperaturewith Fluorinert Fill FluidMounting PositionThe transmitter can be mounted in any orientation. It can be supported by the processpiping. It can also be mounted directly to a vertical or horizontal pipe or surface mountedusing an optional mounting bracket. The housing can be rotated up to one full turn toany desired position for access to adjustments, display, or conduit connections. See“Positioning the Housing” on page 26. The display (if present) can also be rotated in thehousing to any of four different positions at 90 increments. See “Positioning theDisplay” on page 26.NOTEPosition effect zero shift for all calibrated spans can be eliminated by readjustingzero output after installation.Approximate MassWithout Process ConnectorsWith Process ConnectorsWith Optional 316 ss HousingWith Pressure Seals3.5 kg (7.8 lb)4.2 kg (9.2 lb)Add 1.1 kg (2.4 lb)Varies with seal usedProcess ConnectionsIDP10 transmitters are connected to the process via a 1/4 NPT thread or any one of anumber of optional process connectors.7

MI IDP10-F – May 20101. IntroductionProcess Wetted MaterialsDiaphragm: 316L ss, Co-Ni-Cr, Hastelloy C, Monel, gold plated 316L ss, or tantalumCovers and Process Connections: 316 ss, carbon steel, Hastelloy C, Monel, or pvdf insertsPressure Seals: Refer to MI 020-369Process Pressure and Temperature Limits for Pressure SealsRefer to MI 020-369Electrical ConnectionsField wires enter through 1/2 NPT, PG 13.5 or M20 threaded entrances on either side ofthe electronics housing. Leads terminate under screw terminals and washers on theterminal block in the field terminal compartment. To maintain RFI/EMI, environmental,and explosionproof ratings, unused conduit connection must be plugged with metal plug(provided), inserted to five full turns for 1/2 NPT connections; seven full turns for M20and PG 13.5 connections.Adjustable DampingThe transmitter response time is normally 1.0 second or the electronically adjustablesetting of 0.00 (none), 0.25, 0.50, 1, 2, 4, 8, 16, or 32 seconds, whichever is greater, for a90% recovery from an 80% input step as defined in ANSI/ISA S51.1.Output SignalFOUNDATION fieldbus linear or square root digital; software selectable and remotelyconfigurable from a FOUNDATION fieldbus host such as a PC or I/A Series consoleequipped with a FOUNDATION fieldbus Interface Module. The output is also locallyconfigurable with the pushbuttons on the display.Zero and Span AdjustmentsThe zero and span is adjustable from the FOUNDATION fieldbus host computer orI/A Series console equipped with FOUNDATION fieldbus Interface Module. They are alsoadjustable at the transmitter using the display. An optional self-contained moisture sealedpushbutton assembly allows local resetting of the zero without removing the housingcover.Shielding (Screening)For best performance, fieldbus cables should be shielded. Use common multi-conductor(multi-core) “instrument” cable with one or more twisted pairs, an overall, metallizedshield, and a shield wire. You can also use cable that has individually shielded pairs. Fornew installations, ask cable vendors for “fieldbus cable.”Connect the shield on each spur to the trunk shield and connect the overall shiel

MI 020-360 Instruction, Wiring Guidelines for Foxboro FOUNDATION fieldbus Transmitters MI 020-369 Instruction - Pressure Seals MI 020-427 Instruction - Intrinsic Safety Connection Diagrams and Nonincendive Circuits MI 022-138 Instruction - Bypass Manifolds - Installation and Maintenance MI 022-335 Instruction - Model CO Compact Orifice

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