IPC-1720 Assembly Qualification Profile

1y ago
7 Views
2 Downloads
1.27 MB
55 Pages
Last View : 5d ago
Last Download : 2m ago
Upload by : Lilly Kaiser
Transcription

IPC-1720Assembly Qualification ProfileRevision: GLast Revision: April 2020

IPC-1720AAssembly QualificationProfileDeveloped by the OEM council of the IPC, IPC-1720A categorized an electronicassembly manufacturer's capabilities and supplies the OEM customer with detailed,substantive information.IPC-1720AJuly 2004A standard developed by IPC2215 Sanders Rd, Northbrook, IL 60062-6135Tel. 847.509.9700 Fax 847.509.9798www.ipc.orgii

July 2004NOTICEIPC-1720AIPC standards and publications are designed to serve the public interestthrough eliminating misunderstandings between manufacturers andpurchasers, facilitating interchangeability and improvement of products, andassisting the purchaser in selecting and obtaining with minimum delay theproper product for his particular need. Existence of such Standards andPublications shall not in any respect preclude any member or non-member ofIPC from manufacturing or selling products not conforming to such Standardsand Publications, nor shall the existence of such Standards and Publicationspreclude their voluntary use by those other than IPC members, whether thestandard is to be used either domestically or internationally.Recommended Standards and Publications are adopted by IPC without regardto whether their adoption may involve patents on articles, materials orprocesses. By such action, IPC does not assume any liability to any patentowner, nor do they assume any obligation whatever to parties adopting therecommended Standard or Publication. Users are also wholly responsible forprotecting themselves against all claims of liabilities for patent infringement.The material in this standard was developed by the OEM Council of the Institutefor Interconnecting and Packaging Electronic Circuits. Copyright 2004. IPC, Northbrook, Illinois. All rights reserved under both international and Pan-American copyright conventions.iii

FOREWORDIt is not intended that this Assembly Qualification Profile (AQP) satisfies all the requirements of the customer, however,conscientious maintenance of this document and or registration to ISO 9000 requirements should satisfy the major concerns.Thus, audits should be simpler, required less frequently, and facilitate less paper work as customers and suppliers work closerto meeting each others y DescriptionSite DescriptionProduct TypeProcessesTestingProduct ComplexityProduct VolumeQuality DevelopmentServicesMaster Equipment ListingTechnology Profile SpecificsQuality ProfileManufacturing HistoryIdentification of Previous AuditsFinancial ReviewAQP Electronic Editing and Sample FormGlossary of TermsProduct Type DescriptionHOW TO USE THE AQPAlthough the AQP is for a single site or location, information about the overall company is helpful in establishing the relationship of the existing site to the totalcompany and to other sites or divisions. The first page of section 1 is intended toconvey the overall company description and is reflected in the optional financial review detailed in section 8. The remainder of the AQP is devoted to informationabout a single site (see section 9 for examples).Although intended to be site specific, the AQP may be used to convey total corporate capability. When this practice is preferred, section 1.2 (intended for sitedescription) is modified to reflect total corporate capability, as are all other sections of the AQP.The Electronic Assembly Manufacturer should keep all sections current. In the initial contact between the manufacturer and a new customer, an abbreviatedAQP will suffice (site description from Sections 1 and 2). Access to AQP in electronic media is suggested in order to facilitate the appropriate manufacturer/userinformation interchange. The remaining sections of the AQP provide details of the site assembly capability and the quality principles that have beenincorporated into the systems used to manufacture products. The information is of use to the assembly company in assessing where the organization standson implementing quality and technology; the same data helps the customer in determining how well the manufacturers’ capability matches the customer need.ACKNOWLEDGMENTSThe IPC is indebted to the members of the OEM council who participated in the development of this document. A note of thanks is also expressed to themembers of the Electronic Manufacturing Services Industry (EMSI) for their review and critique and construction recommendations in finalizing the principlesdeveloped for the AQP.Although the IPC is grateful for all the involvement and individual contributions made in completing the AQP, a special acknowledgment is extended to thefollowing individuals. It was their dedication and foresight that made this publication possible.Donna H. HodgsonEmily NikooKevin SheehanMerixESAT, Inc.Standard Microsystems CorporationSue JonesSteve PudlesMario Suarez-SolisWilcox ElectricRonic Assoc. Inc.Encore Computer Corp.iv

July 2004IPC-1720ADATE COMPLETEDSECTION 1.1Updated July 1, 2019COMPANY DESCRIPTIONGENERAL INFORMATIONLEGAL NAMEVergent ProductsPHYSICAL ADDRESSth609 14 Street EPHONE NUMBERFAX NUMBER(970) 667-8570TELEX NUMBER(970) 667-9332E-MAIL ADDRESSMODEM NUMBERDATE FOUNDEDPUBLICsales@vergentproducts.comINTERNET URLJuly 1995PRIVATEFTP DENT and CHIEF EXECUTIVE OFFICERJay DokterVICE PRESIDENT OF MARKETING/SALESJohn SageVICE PRESIDENT OF OPERATIONS and CHIEF OPERATING OFFICERTracy IrelandVICE PRESIDENT OF FINANCE MANAGEMENT and CHIEF FINANCIAL OFFICERDan KamrathVICE PRESIDENT OF ENGINEERINGPaul BoergerDIRECTOR OF QUALITYSarah JohnsonDIRECTOR OF PROGRAM MANAGEMENTJohn SageDIRECTOR OF SUPPLY CHAINKarla LippincottCORPORATEDESCRIPTIONNUMBER OFCORPORATEEMPLOYEESNUMBER OFSITE EMPLOYEESDESIGN AND DEVELOPMENT55MANUFACTURING ENGINEERING22MANUFACTURING ITORSGENERALMANAGEMENT33Includes QA Technicians44Includes QA Inspectors11AdminSupport66Includes Client Engagement Managers, IT,Finance, HR & RATIONTOTAL1COMMENTSSupervisors and Expert AssemblersDoes not include flexible contract workforce

July 2004IPC-1720ADATE COMPLETEDUpdated August 15, 2016SECTION 1.2(TO BE COMPLETEDFOR EACH SITE)SITE DESCRIPTIONATTACH APPROPRIATE CHARTS (OPTIONAL)MANUFACTURING FACILITYVergent Products609 14th Street SWCOMPANY NAMEPHYSICAL ADDRESSCITYLovelandSTATEPROVINCECOUNTRY(970) 667-8570TELEPHONE NUMBERFAX NUMBERCOUSA(970) 667-933280537ZIPTELEXE-MAIL NUMBERMODEM NUMBERPRINCIPLE PRODUCTS/SERVICES/SPECIALTIEYEARS IN BUSINESS24 yearsBUSINESS CHARACTERIZATION (HIGH VOLUME, QUICK TURN-AROUND, ETC.)Product Commercialization Services for highlyregulated industries (Aerospace, Medical, HighPerformance Industrial, Consumer)Product realization and improvement from concept throughobsolescence, full turnkey, low to mid-volume high mix.Focus on elevating client return.FACILITY MANAGEMENTTITLEOVERALL OPERATION RESPONSIBILITY FOR THIS SITEPresident/CEOJay DokterMANUFACTURINGTracy IrelandTECHNICAL/ENGINEERINGPaul BoergerMATERIALS/PRODUCTION CONTROLKarla LippincottPURCHASINGREPORTS TO (Function/Job Title)Vice President ofOperations/COOVice President of EngineeringPresidentDirector of OperationsVice President ofOperations/COOVice President ofOperations/COOVice President ofOperations/COOPresidentDirector of OperationsKarla LippincottQUALITYDirector of QualitySarah JohnsonSALES REPRESENTATIVEVice President of BusinessDevelopmentVice President ofOperations/COOJohn SageWASTE MANAGEMENT/FACILITIES/SAFETYTracy dditionsPresidentPresidentSYSTEMS (INDICATE % COVERAGE)AGEAREA(Sq. Ft.)10 yrs10 yrs10 tCementCementWasteTreatmentOtherSAFETY AND REGULATORY AGENCY REQUIREMENTSAre fire extinguishers functional andaccessible to employees?Do you conform to local/federal environment protection agency requirements?YESAre you currently operating under a waiver orin violation of local government requirements?Do you have a safety program?Describe Comprehensive EHSNOYESNOYESNOYESNOWhat is the distance to thenearest fire station? (in minutes)Date of last OSHA visitDate of last EPA visitOther Agency Audits, UL, ISO9000, CSA Approval and NumberHazardous Waste NumberTrade Waste Account Number3 MinutesMay 2005noneUL # E162464CSA # 4694618ISO 9001 Reg#A0001804-1 Reg Date 11-08COD040724551Conditionally Exempt SmallWaste GeneratorPLANT PERSONNEL (TOTAL neering500107UnionNamen/aContractExpires (Date)n/a2

July 2004IPC-1720ADATE COMPLETEDSECTION 2.1Updated July 1, 2019PRODUCT TYPEThis section is intended to provide overview information on the product types being fabricated by the manufacturer.Site Capability Snapshot (Please Check all that apply)DesignatorsARemarks1A – Single-sided THT onlyElectronic Assembly Type1B – Single-sided SMT only1C - Single-sided simplistic mix of THT & SMT1X - Single-sided complex mix of THT & SMT with FP, BGA2B - Double-sided simplistic SMT only2C - Double-sided simplistic mix of THT & SMT2X - Double-sided complex mix of THT & SMT with FP, BGA-2Y - Double-sided complex mix of THT & SMT with ultra-FP,chip scaleHave not demonstrated chip scale capability.Have not demonstrated COB, flip chip, TAB or2Z - Double-sided complex mix of THT & SMT with ultra-FP,COB, flip chip, TAB, chip scaleBBoard Construction Typechip scale capability.Other:Rigid Printed BoardFlex Printed BoardRigid Flex BoardRigid Back PlaneMolded BoardMCM-C Ceramic Modules & HybridsMCM-L Laminated ModulesMCM-D Deposited DielectricCBoard Size DiagonalOther: 250 [10.00]250 [10.00]350 [14.00]450 [17.50]350 [14.00]SMT max board size 17” x 19”650 [25.50]750 [29.50]850 [33.50] 850 [33.50]Other:33070 test max board size 30” x 18”

July 2004DMaximum Thru Hole Work AreaIPC-1720A 300 CM2 [50 IN2]300 CM2 [50 IN2]600 CM2 [100 IN2]1000 CM2 [160 IN2}12" x 14" max selective wave solder1500 CM2 [230 IN2]2100 CM2 [325 IN2]2800 CM2 [430 IN2]3600 CM2 [550 IN2]3600 CM2 [550 IN2]EMaximum SMT Work AreaOther: 300 CM2 [150 IN2]300 CM2 [50 IN2]600 CM2 [100 IN2]1000 CM2 [160 IN2]1500 CM2 [230 IN2]SMT max board size 17” x 19”2100 CM2 [325 IN2]2800 CM2 [430 IN2]3600 CM2 [550 IN2] 3600 CM2 [550 IN2]FDistance Wiring Terminals & ConnectorsOther:Solid WireStandard WireShielded WireCoax WireTerminal Bifurcated & TurretClip & Pin TerminalsCrimped TerminalsBoard ConnectorsBackplane ConnectorsOther:GCable & Harness (Multiple Wire)Hi Power Eq. or Lgr. 10 GaugeLower Power Thinner than 10 GaugeElectrical Cable (Wire)Optical Cable (Glass)Electrical HarnessOptical HarnessRibbon Cable HarnessCombination HarnessHMechanical Assembly OperationsOther:Electronic HardwareMechanical HardwareShielding HardwareThermal Conductive Hardware4

July 2004IPC-1720AFront Panel HardwareJumper WiresMolded CableFinal System Assembly (Box Build)JCompleted End ProductOther: Small scale machine shopConsumer ProductsGeneral Purpose ComputersTelecommunications ProductsCommercial Aircraft ProductsIndustrial & Automotive ProductsHigh Performance MilitaryOuter Space (LEO & GEO)Military AvionicsAutomotive (Under the Hood)Other: Class II Medical Devices*For product type description, see Glossary, Section 10.15

July 2004IPC-1720ADATE COMPLETEDSECTION 2.2Updated July 1, 2019PROCESSESThis section is intended to provide overview information on the assembly processes used by the manufacturer.Site Capability Snapshot (Please Check all that apply)DesignatorsAThrough Hole InsertionRemarksTwo Leaded-AxialTwo Leaded RadialMultiple Leaded 6-RadialSingle-In-Line Packages (SIPS)Dual In-Line Pkgs. (DIPS) 24 PIONDual In-Line Pkgs. 24 PIONPin Grid Arrays (PGA’s)Component SocketsCard Edge/Two Piece ConnectorsBSurface Mount PlacementOther:Chip Resistors/Cap. (Reel)Bulk Chip Resistors/Cap.Tantalum CapacitorMetal Faced Components (MELFS)Sm. Outline Diodes (SODS)Sm. Outline Transistors (SOTS)Sm. Outline IC’s (SOIC’s)Variable Resistor Trim PotsSurface Mount Sockets/Test Pts. ConnectCHigh Pin CountOther:Chip-on-Tape (Molded ring) 0.4 mm pitchChip-on-Tape (Molded ring) 0.3mm pitchQuad Flat Pack (QFP) 0.4mm pitchQuad Flat Pack (QFP) 0.3mm pitchShrink Quad Flat Pack (SQFP)Thin Small Outline Pkg. (TSOP)Ball/Post Grid Array 1.0mm pitchBall/Post Grid Array 1.0mm pitchLand Grid Array Any PitchOther:6

July 2004DBare Chip AttachmentIPC-1720AThermal Wire BondingBall BondingUltrasonic Wiring BondingBeam Lead Chip BondingGeneric Tape Automated BondingCustom Tape Automated BondingFlip Chip on Ceramic or Glass BasedFlip Chip on Rigid Printed BoardsFlip Chip on Flex Circuit BoardsEAttachment TechniquesOther:Hand SolderingHot Bar SolderingFocused Hot Air SolderingWave SolderingIR Reflow SolderingVapor Phase SolderingHot Air Convection SolderingLaser SolderingConductive Adhesive AttachmentFCleaning & Cleanliness TestingOther: Automated selective wave solderNo Clean/Never Clean SystemAqueous Cleaning In-line Sys.Aqueous Cleaning Static SoakModified Solvent Clean. In-lineModified Solvent Clean. Static SoakUltrasonic Agitation CleaningIonic Salt/Residue TestOrganic Contaminate Impreg. TestSurface Insul. Resist. (SIR) TestGCoating & EncapsulationOther: Technical Devices Nu/Clean AquaBatch XL with DI Elite PlusBare Die-Glob TopBare Die-Total AssemblyAssembly (1 or 2 sides) Epoxy CoatingAssembly (1 or 2 sides) Polyurethane CoatingAssembly (1 or 2 sides) Acrylic CoatingAssembly (1 or 2 sides) Vacuum Dep CoatingEncapsulation Exterior Access (Test)Encap. Ex-access (Tuning)Encap. Entire Assembly (Thin CoatHInspectionOther: Silicone and acrylic conformal coatIn-comingIn-ProcessFinal Inspection100% Inspection7

July 2004IPC-1720AAudit InspectionManualSemi-AutomaticAutomated Optical Inspection (AOI)AutomaticOther:JTesting & RepairTest Equipment DesignTest Equipment FabricationTest DevelopmentFailure AnalysisRepair DepotRework DepotOther:8

July 2004IPC-1720ADATE COMPLETEDSECTION 2.3Updated July 1, 2019TESTINGThis section is intended to provide detailed information on the test, equipment and testing capability of themanufacturer.Site Capability Snapshot (Please Check all that apply)DesignatorsATest TypeRemarksAutomatic Test GenerationX-Ray Joint EvaluationGlenbrook on-siteCleanliness TestingAuto in-circuit Electronic Assembly2 & 3 pole SMD electrical verification @Mydata Pick & PlaceElectro-magnetic InterferenceAuto Function Electronic AssemblyPick & PlaceSystem Level Test ElectricalSystem Level Test FunctionSystem Level Test EnvironmentalBTest Fixture TypeOther:No FixtureOne-sided Probe Generic ElectricalCam Shell Test-Generic ElectricalCustom Fixture ElectricalDedicated Test Bed Electrical20 - 98% RH in range 20 to 85 CHumidity TestTemperature TestVibration Test-40 C to 200 C, 1kW load max.On siteControlled dropShock TestCProbe Point PitchOther: Test engineering/development 1.0 [.040]1.0 [.040]0.8 [.032]0.65 [.025]0.50 [.020]Shaft diameter 35 mil @ 100 mil spacingShaft diameter 25 mil @ 75 mil spacingShaft diameter 20 mil @ 50 mil spacing0.40 [.016]0.30 [.012]0.20 [.008] .20 [.008]DNo. of Probe PointsOther: 20020050010001500200093070 Configuration - 1300 nodes max.

July 2004IPC-1720A25003000 3000ENo. of Test VectorsOther: 5005001000200030004000500060003070 Configuration 6000FEnvironmental Stress ScreeningOther:Burn-in at TemperatureBurn-in with Temperature CyclingBurn-in Hi Temperature CyclesBurn-in with Temperature CyclesBurn-in with Temperature Cycles Hi-humidityPower Cycling On-OffVibrations TestingShock TestManaged subcontractManaged subcontractSalt Spray TestingOther: Water ingress custom test, vacuum custom test10

July 2004IPC-1720ADATE COMPLETEDSECTION 2.4Updated July 1, 2019PRODUCT COMPLEXITYThis section is intended to provide overview information on the product complexity being fabricated by the manufacturer.Based on component density.Site Capability Snapshot (Maximum Component Density*)*PERCENT COMPONENT AND LAND AREA/AVAILABLE BOARD AREA(Please Check all that apply)DesignatorsAType 1ASingle-sided THT onlyRemarks 3030405060708090 90BType 1BSingle-sided SMT onlyOther: 3030405060708090 90CType 1CSingle-sided simplistic mix of THT & SMTOther: 3030405060708090 90DType 1XSingle-sided complex mix of THT & SMT with FP,BGAOther: 30304011

July 2004IPC-1720A5060708090 90EType 2BDouble-sided simplistic SMT onlyOther: 3030405060708090 90FType 2CDouble-sided simplistic mix of THT & SMTOther: 3030405060708090 90GType 2XDouble-sided complex mix of THT & SMT with FP,BGAOther: 3030405060708090 90HType 2YDouble-sided complex mix of THT & SMT withultra-FP, chip scaleOther: 3030405060708012

July 2004IPC-1720A90 90JType 2ZDouble-sided complex mix of THT & SMT withultra-FP, COB, flip chip, TAB, chip scaleOther: Have not demonstrated capability. 3030405060708090 90Other: Have not demonstrated capability.13

July 2004IPC-1720ADATE COMPLETEDSECTION 2.5Updated July 1, 2019PRODUCT VOLUMEThis section is intended to provide overview information on the volume of product being fabricated by the manufacturer.Site Capability Snapshot (Please Check all that apply)DesignatorsAVolume of Electrical AssemblyRemarksPrototypeLow (Under 100)Low-Medium (To 1,000)Medium (To 5,000)Medium (To 10,000)Medium -High (To 20,000)High (To 50,000)High To 500,000)BVolume of Discrete WiringOther:PrototypeLow (Under 100)Low-Medium (To 1,000)Medium (To 5,000)Medium (To 10,000)Medium-High (To 20,000)High (To 50,000)High To 500,000)CVolume Cable/HarnessOther: Managed Subcontract higher volumesPrototypeLow (Under 100)Low-Medium (To 1,000)Medium (To 5,000)Medium (To 10,000)Medium-High (To 20,000)High (To 50,000)High To 500,000)DVolume MechanicalOther: Managed Subcontract higher volumesPrototypeLow (Under 100)Low-Medium (To 1,000)Medium (To 5,000)Medium (To 10,000)Medium -High (To 20,000)High (To 50,000)High To 500,000)Other:14

July 2004EVolume Full SystemIPC-1720APrototypeLow (Under 100)Low-Medium (To 1,000)Medium (To 5,000)Medium (To 10,000)Medium -High (To 20,000)High (To 50,000)High (To 500,000)Other:15

July 2004IPC-1720ADATE COMPLETEDSECTION 2.6Updated July 1, 2019QUALITY DEVELOPMENTThis section is intended to provide overview information on the quality systems in place in the manufacturing facility.Site Capability Snapshot (Please Check all that apply)DesignatorsAStrategic PlanRemarksFunctional Steering Committee FormedTQM Plan & Philosophy Established & PublishedDocumented Quality Progress ReviewImplementation & Review of Project TeamRecommendationsTQM Communicated Throughout OrganizationControlled New Process Start-upManagement Participates in TQM AuditsEmployee Recognition ProgramTotal TQM Plan/Involvement Customer TrainingBEmployee InvolvementOther: Performance metrics dashboardCertified Training AvailableOn site IPC trainerTraining of Employee BaseTraining lockout on shop floorTQM Team TrainedDesign of Experiment Training and UseNew Process Implementation TrainingAll employeesSupport Personnel TrainingAdvanced Statistical TrainingQuality Functional DeploymentOngoing Improvement Program for EmployeesCQuality ManualOther:Quality Manual StartedGeneric Quality manual for Facility10% of Manufacturing Depts. have ProcessSpecifications25% of Manufacturing Depts. have ProcessSpecifications50% of Manufacturing Depts. have ProcessSpecificationsNon-manufacturing Manuals Developed25% of all Departments have Quality ManualsQMS documents on-line50% of all Departments have Quality ManualsAll Manufacturing and Support Depts. have ControlledQuality ManualDInstructionsOther:Work Instructions StartedQuality Instructions Started10% Work Instructions Completed10% Quality Instructions Completed25% Work Instructions Completed, Controlled16

July 2004IPC-1720A25% Quality Instructions Completed, Controlled50% Work Instructions Completed, Controlled50% Quality Instructions Completed, ControlledWork instructions on-lineQuality and Work Instructions Completed, ControlledESPC Implementation IPC-PC-90Other:Plan ExistsTraining StartedKey employees trainedProcess Data Collected & AnalyzedAutomated data collectionAll employees TrainedFirst Process Stable & CapableSeveral Major Processes Stable & CapableContinued Improvement of Stable ProcessesAdditional Mfg Processes Under ControlAll Processes Under ControlFSupplier Programs/ControlsOther:Supplier Rating ProgramMonthly Analysis ProgramKey Problems IdentifiedSupplier Reviews Performance Data ProvidedTQM Acceptance by Suppliers10% of Suppliers Using SPC25% of Suppliers Using SPC50% of Suppliers Using SPCAll Key Suppliers Using Certified Parts ProgramGThird Party IPC-QS-95Other:Instrument Controls in PlaceMeasurement System in Control IPC-PC-90Document Controls in PlaceReduced Lot Sampling10% of Processes Under Audit Control50% or Greater of Processes Under Audit ControlISO-9003 CertifiedISO-9002 CertifiedISO-9001 CertifiedOther: ISO-13485 certified,AS9100D certified forproduction17

July 2004IPC-1720ADATE COMPLETEDSECTION 2.7Updated July 1, 2019SERVICESThis section is intended to provide overview information on the customer services offered by the manufacturer in additionto the assembly manufacturing services.Site Capability Snapshot (Please Check all that apply)DesignatorsAComponent ProcurementRemarksConsignmentSubject to meeting requirementsPassive Thru-HolePassive SMTI/C SMTI/C SMTHi-Pin Count (Peripheral)Hi-Pin Count (Array)Bare Die (CHIPS)ASIC’sBBoard ProcurementOther:ConsignmentSubject to meeting requirementsSingle SidedDouble SidedMultilayer (Rigid)Multilayer (Rigid-Flex)Metal Core BoardsCTE BoardsMCM’s & HybridsPCMCIA’sCDesign ServicesOther:OutsourceSimulationCircuit AnalysisPlacement & RoutingDesign Rule ImplementationImpedance ControlHigh SpeedMCM’s (L) (C) or (D)ASIC’sOther: Electrical, mechanical, thermal, industrial & optical18

July 2004IPC-1720ADATE COMPLETEDSECTION 3.0Updated July 1, 2019MASTER EQUIPMENT LISTINGFORM AQP 20Please complete a Master Equipment List. You may use your own form or the AQP Form en printerMANUFACTURERTYPE/MODELDEK HorizonEQUIPMENT LIMITSACCURACYCALIBRATIONFREQUENCYAnnualDEK3Screen printerDEK HorizonAnnualDEK4Screen printerDEK HorizonAnnualOVNOvenBlue MAnnualMY1SMT Pick & PlaceMydata MY9Max bd size 17 x 19”Component min .020x .010” (0201)Component max. 2.20x 2.20 x .59”Component weight 8gMY3SMT Pick & PlaceMydata MY15Max bd size 17 x 19”Component min .020x .010” (0201)Component max. 2.20x 2.20 x .59”Component weight 8gUNV1SMT Pick & PlaceUniversal AdvantisUNV2SMT Pick & PlaceUniversal GenesisUNV3SMT Pick & PlaceUniversal AdvantisUNV4SMT Pick & PlaceUniversal GenesisMax Bd size 18” x 25”Min. component 01005Max component 30mm x 30mmMax Bd. Size 18”x25”Min, Component 0201Max Component 55mm x 55mmMax Bd size 18” x 25”Min. component 01005Max component 30mm x 30mmMax Bd. Size 18”x25”Min, Component 0201Max Component 55mm x 55mmRF1Convection ReflowOvenRF2IPC-9850: X,Y & θ - Midasmount .25µm& .08 @3σ,Hydra mount.69µm & 3.0 @ 3σIPC-9850: X,Y & θ - Midasmount .25µm& .08 @3σ,Hydra mount.69µm & 3.0 @ 3σ45um @ 3σAnnualREMARKSGrid-Lok support,auto locate,underside cleanerGrid-Lok support,auto locate,underside cleanerGrid-Lok support,auto locate,underside cleanerMSD and PCBbakeHydraSpeedMount,two & three poleelectrical verifier,Agilis feeders,networkedAnnualHydraSpeedMount,two & three poleelectrical verifier,Agilis 45µm @ 3σAnnualFlexshooter,11,400 cph.,0.316cps45um @ 3σAnnualChipshooter22,600cph.159cps45µm @ 3σAnnualFlexshooter,11,400 cph.,0.316cpsVitronics SoltecXPM1- 820AnnualConvection ReflowOvenVitronics SoltecXPM2AnnualRF3Convection ReflowOvenVitronics SoltecXPM3AnnualKICThermal Profile ManagerKIC ThermalExplorerAnnualXRAY2D XrayGlenbrook RTX-113AnnualHeat zones 8Cool zones 2Lead-free processcapableHeat zones 8Cool zones 2Lead-free processcapableHeat zones 8Cool zones 2Lead-free processcapable12 thermocouplecapability,predictionsoftware optionx/y positioner80kv , 35 um focalspot, Image19

July 2004IPC-1720AAVDHot Air Rework StationMetcal ScorpionAnnualSS1Selective Solder(Lead-free)ACE ProductionTechnologiesKISS-10212 x 14” max boardsizeAnnualSS2Selective Solder(Lead-free)ACE ProductionTechnologiesKISS-10212 x 14” max boardsizeAnnualprocessingsoftware. Digitalimage and videocaptureDual headprecisionplacement pgk.Side view camera.8zone profilingcapabilitySpray fluxer,nitrogenenvironment,topside heaterSpray fluxer, dropfluxer, nitrogenenvironment,topside heater20

July 2004IPC-1720A12” wide wavesWAVWave Solder(Tin/lead)Novastar 12DSP3Miniwave(Lead-free)Automated aqueouscleanerAirVac PCBRM-15No cal requiredTechnical DevicesNu/CleanAquaBatch XL withDI Elite PlusAqueousTechnologiesSMT-600Alpha MetalsOmegaMeter 600SMDSchleunigerEcoStrip 9300TechconNo cal requiredClosed loop,DI bedNo cal requiredClosed loop,DI bedWS1WSHAutomated aqueouscleanerIONIonic ContaminationTestWSTWire StripperICT1EC1Semi-automated liquiddispenseIn circuit TestEnvironmental ChamberDEP1DEP2NIB1NIB2HP 3070Tenney EngineeringT64RSAnnualROSE methodioniccontamination testNo cal requiredNo cal required20 - 98% RH in range 20 to 85 C,-40 C to 200 C, 1kWload max.AnnualAnnualPCB Separatorv-score separatorPCB Separatorcab MAESTRO 4MFancort VPD5FKN NibblerFancort NTR2No cal requiredNo cal requiredNo cal requiredNo cal required3M 701 Test KitAnnualCP1Surface ResistivityMeter - MegohmmeterLead PrepNo cal requiredCF1CF2CF3CF4LT1LT2LT3Axial Lead FormerAxial Lead FormerRadial Lead PrepRadial Lead PrepLead TrimmerLead TrimmerLead TrimmerElectrovertElectroprepGPD CF-7GPD CF-7Hepco 1500-1Hepco 1500-1GPD TF-5300Streckfuss CO57Streckfuss CO5721Foam fluxer,24” bottom side IRpre-heaterDual waveconfigurationincludes turbulent& laminar wavesDiameter .040”Diameter .040”Diameter .032”Diameter .032”No cal requiredNo cal requiredNo cal requiredNo cal requiredNo cal requiredNo cal requiredNo cal requiredDe-score sawshearTab SeparatorHvy TabSeparatorMisc. TrimMisc. TrimMisc. Trim

July 2004IPC-1720ADATE COMPLETEDSECTION 4Updated July 1, 2019TECHNOLOGY PROFILE SPECIFICS4.1 ADMINISTRATION4.1.1CAPACITY PROFILEEST %A)Total Capacity in units per month (basedon best quarter)65%B)Presently running at % of total unitcapacity.30%C) Revenue from manufacturing services.Revenue from non-manufacturing activities.80%20%Total 100%D) Work dedicated to consignment.Work dedicated to turnkey. 5%95%Total 100%4.1.2*PERCENTAGE OF DOLLAR VOLUME1)Type 1A electronic assemblyEST %COMMENTSPCBA operating at 60% of 2 shiftsFinal Assembly is 1 shift @ 30%Consignment on exception basisCOMMENTS2%Single-sided THT only2)Type 1B electronic assembly20%Single-sided SMT only3)Type 1C electronic assembly3%Single-sided simplistic mix of THT & SMT4)Type 1X electronic assembly10%Single-sided complex mix of THT & SMTwith FP, BGA5)Type 2B electronic assembly0%Double-sided simplistic SMT only6)Type 2C electronic assembly10%Double-sided simplistic mix of THT & SMT7)Type 2X electronic assembly10%Double-sided complex mix of THT & SMTwith FP, BGA8)Type 2Y electronic assembly0%Have not demonstrated chip scale capability.0%Have not demonstrated COB, flip chip, TAB or chip scale capability.Double-sided complex mix of THT & SMTwith ultra-FP, chip scale9)Type 2Z electronic assemblyDouble-sided complex mix of THT & SMTwith ultra-FP, COB, flip chip, TAB, chipscale10) Wire wrap assemblyN/A11) Cable/harness assembly5%12) Mechanical assembly30%13) Full system assembly10%22

July 2004* For description of product types, see glossary, Section 10.123IPC-1720A

July 20044.1.3IPC-1720AUNIT PRODUCTION PROFILEUNITS PER MONTHA) What do you consider, in number ofunits per month the definition of thefollowing (units units per month)?1) High Production10000 2) Medium Production2000100003) Low Production1020004) Prototype Production 10B) What is your average lead-time(delivery) as defined in (A)?1) High Production102) Medium Production83) Low Production64) Prototype ProductionFor established clients only 3 days upon material availableQuick turn - No. of days 34.1.4MARKETS SERVEDA)Consumer ProductsB)General Purpose ComputersC)Telecommunications ProductsD)Commercial AircraftE)Industrial Products & AutomotiveF)High Performance MilitaryG)Outer Space LEO & GEOH)Military AvionicsJ)Automotive (Under the Hood)YESNOCOMMENTS24

July 20044.1.5IPC-1720AAPPROVAL & CERTIFICATION PROFILEYESNOCOMMENTSWhat company approvals do youhave?25A)J-STD-001B)IPC-A-610C)MIL-STD-2000D)UL ApprovalE)UL Level 94V0F)UL Level 94V1G)UL Level 94V2H)Canadian -9002N)ISO-9001P)BABTQ)QC9000R)EECS)Customer EvaluationT)OtherAs neededAs neededISO-13485, AS9100

July 20044.1.64.1.7IPC-1720ACUSTOMER INTERFACE PROFILEYESNOEQUIPMENTCOMMENTSA)Modem capability/BAUD rateB)Ethernet capabilityFTP of customer dataPortalC)Data verificationShared SQL databasesD)Manufacturing datarequirements:FTP, file share, portal, shared SQLE)Engineering change orderprocess:OmnifyF)Method for job status reporting tocustomers:Through Program ManagerPortalADMINISTRATIVE PROFILEYESNOQUANTITYDEGREESCOMMENTS9A)Does the facility have a separateresearch and development dept.B)Is there an (automated) on-lineshop floor control/MRP systemC)Quantity of engineers dedicatedto supporting the following areas5 (TOTAL)1)Materials11 SQE/Quality Engr2)Manufacturing32 Manufacturing Engr1 Test Engr3)Test11 Test EngineerSubcontract Test developmentSYSPROShop floor is paperles production4.2 PROCESS ORIENTATION4.2.1PLANT LAYOUT CHARACTERISTICSA)In-line Assembly ProcessB)Islands of AutomationC)Placement Equipment

Developed by the OEM council of the IPC, IPC-1720A categorized an electronic assembly manufacturer's capabilities and supplies the OEM customer with detailed, substantive information. IPC-1720A July 2004 A standard developed by IPC _ _ 2215 Sanders Rd, Northbrook, IL 60062-6135 Tel. 847.509.9700 Fax 847.509.9798 www.ipc.org

Related Documents:

IPC 3000 Lakeside Drive Suite 309S Bannockburn, Illinois 60015-1249 Tel 847 615.7100 Fax 847 615.7105 IPC 中国 电话:400-621-8610 邮箱:BDAChina@ipc.org 网址:www.ipc.org.cn 上海青岛深圳北京苏州成都 取代: IPC-A-610E,2010年4月 IPC-A-610D,2005年2月 IPC-A-610C,2000年1月 IPC-A-610B,1994年12月 IPC-A-610A .

IPC 改版履歴: IPC-A-610F WAM1 - 2016年2 IPC-A-610F - 2014年7 IPC-A-610E - 2010年4 IPC-A-610D - 2005年2 IPC-A-610C - 2000年1 IPC-A-610B - 1994年12 IPC-A-610A - 1990年3 IPC-A-610 - 1983年8 If a conflict occurs between the English and translated versions of this document, the English version will take precedence.

Venodyne boots- calf/thigh VasoPress DVT System IPC Vascutherm IPC Thrombus pumps - calf/thigh IPC Thromboguard IPC Sequential pneumatic hose IPC Sequential compression device IPC IPC Rapid inflation asymmetrical compression (RIAC) devices IPC Pneumatic intermittent impulse compression device Plexipulse-calf/thigh IPC

Ipc Module Ipc - IPC Manager Used to initialize IPC and synchronize with other processors. Application must call Ipc_start and Ipc_attach. Two startup protocols Ipc.ProcSync_ALL - all processors start at same time Ipc.ProcSync_PAIR - host processor starts first Configuration Ipc.procSync configures startup protocol When using Ipc.ProcSync_ALL, Ipc_attach is .

IPC Governing Board The IPC Governing Board is elected by the IPC membership every four years at the IPC General Assembly, is responsible for setting the policies and for ensuring that the directions set by the membership at the General Assembly are implemented. IPC headquarters The city and country where the International

IPC-A-610, Acceptability of Electronic Assemblies IPC-A-610EC, Telecommunications Addendum to IPC-A-610 (in development) *IPC-J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies IPC-A-600, Acceptability of Printed Boards IPC-6012, Qualification and Performance Specification for Rigid Printed Boards

discussed. IPC-6011, IPC-6012C, J-STD-003B and IPC-A-600H Block 3: 1400-1500 (Including one coffee break) Electronic Assembling and Soldering. What is a lead free process. Acceptability and Requirements for Electronic Assemblies will be discussed using IPC Standards; J-STD-001F, IPC-610F, IPC-7711/21B and IPC-620B

In Abrasive Jet Machining (AJM), abrasive particles are made to impinge on the work material at a high velocity. The jet of abrasive particles is carried by carrier gas or air. High velocity stream of abrasive is generated by converting the pressure energy of the carrier gas or air to its kinetic energy and hence high velocity jet. Nozzle directs the abrasive jet in a controlled manner onto .