Dell EMC PowerEdge T640 Technical Guide
Dell EMC PowerEdge T640Technical GuideRegulatory Model: E47SRegulatory Type: E47S001
Notes, cautions, and warningsNOTE: A NOTE indicates important information that helps you make better use of your product.CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid theproblem.WARNING: A WARNING indicates a potential for property damage, personal injury, or death. 2017 - 2020 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or itssubsidiaries. Other trademarks may be trademarks of their respective owners.2020 - 02Rev. A04
ContentsList of Figures.5List of Tables. 61 System overview . 8Introduction. 8New Technologies. 82 System features .9Product comparison. 9Specifications.103 Chassis views and features . 12Chassis view and features.12Inside the system.14Control panels and LED. 14Security features. 144 Processor.16Processor Features.16Supported processors. 16Chipset.215 System memory. 22Memory speed. 22Memory module installation guides. 236 Storage. 24Supported hard drives. 24Storage controllers.25IDSDM/vFlash card.25Boot Optimized Storage Subsystem (BOSS).25External storage.267 Networking and PCIe. 27PCIe expansion slots. 278 GPU and FPGA. 289 Power, Thermal, and Acoustics.29Power consumption and energy efficiency.29PSU specifications. 30Thermal and acoustics.31Contents3
10 Rack rails. 3211 Dell EMC OpenManage systems management. 33Server and Chassis Managers. 34Dell EMC consoles.34Automation Enablers. 34Integration with third-party consoles.34Connections for third-party consoles. 34Dell EMC Update Utilities. 34Dell resources.3412 Appendix A. Additional specifications.36Power supply specifications.36Chassis dimensions .37Chassis weight.40Environmental specifications. 40Video specifications.42USB peripherals. 4213 Appendix B. Standards compliance. 4314 Appendix C. Additional resources. 4415 Appendix D. Support and deployment services. 45ProDeploy Enterprise Suite and Residency Services.45ProDeploy Plus.45ProDeploy. 45Basic Deployment. 45ProSupport Enterprise Suite. 46ProSupport Plus.46ProSupport.46ProSupport One for Data Center. 47Support Technologies. 47Additional professional services. 48Dell Education Services. 48Dell EMC Global Infrastructure Consulting Services.48Dell EMC Managed Services.484Contents
List of FiguresFigure 1. PowerEdge T640 front panel.12Figure 2. PowerEdge T640 back view.13Figure 3. Dell EMC OpenManage Portfolio. 33Figure 4. Chassis base and top cover/foot height.37Figure 5. Left slam latch handle outer surface to right slam handle outer surface height. 38Figure 6. Chassis base width and foot to foot width.39Figure 7. Bezel to rear wall/Bezel to rear power supply handle/Bezel to rear fan depth. 40Figure 8. ProDeploy Enterprise Suite capabilities.45Figure 9. ProSupport Enterprise Suite.46Figure 10. Enterprise Support feature comparison.47Figure 11. SupportAssist model. 47List of Figures5
List of TablesTable 1. New technologies. 8Table 2. Product comparison. 9Table 3. Technical specifications.10Table 4. Security features. 14Table 5. Supported Processors for T640.16Table 6. Supported memory.22Table 7. DIMM performance details. 22Table 8. Supported RAS features.23Table 9. Supported hard drives. 24Table 10. PERC series offerings. 25Table 11. Supported external storage devices.26Table 12. PCIe expansion slots. 27Table 13. Power tools and technologies. 29Table 14. PSU specifications. 30Table 15. Supported rack type. 32Table 16. Dell resources. 34Table 17. Power efficiency levels. 36Table 18. Temperature specifications. 40Table 19. Relative humidity specifications. 41Table 20. Maximum vibration specifications.41Table 21. Maximum shock specifications.416List of Tables
Table 22. Maximum altitude specifications. 41Table 23. Operating temperature de-rating specifications. 41Table 24. Standard operating temperature.41Table 25. Expanded operating temperature. 41Table 26. Video modes.42Table 27. Industry standard documents. 43Table 28. Additional resources. 44List of Tables7
1System overviewIntroductionThe PowerEdge T640 is the latest 2-socket, rack-capable tower (5U rack) server designed to run complex workloads using highly scalablememory, I/O, and network options. The system features the Intel Xeon Processor Scalable family, up to 24 DIMMs, PCI Express (PCIe)3.0 enabled expansion slots, and a choice of network interface technologies to cover NIC and LOM.The PowerEdge T640 is a general-purpose platform capable of handling demanding workloads and applications, such as: Data warehouseEcommerceDatabasesHigh-performance computing (HPC)The PowerEdge T640 is the most scalable 2-socket tower server in the Dell EMC portfolio. The T640 is suitable for Remote Office,Branch Office (ROBO) and Small Medium Business (SMB) usage in an office or data center environment that requires large amount ofdisk, memory space, I/O slots, and GPGPU.New TechnologiesTable 1. New technologiesTechnologyDetailed Description2nd Generation Intel Xeon Processor Scalable family Intel C620 ChipsetIntel Platform Controller Hub (PCH)Memory iDRAC9 with Lifecycle ControllerThe new embedded systems management solution for the Dell EMC systems features hardwareand firmware inventory and alerting, data center level power monitoring, and faster performance.14nm process technologyVirtual address space: 48 bitsPhysical address space 46 bitsIntel Hyper-Threading TechnologyUp to 28 coresUp to 3.7 GHzMax TDP: 205W6x DDR4 Channels per socket, 2 DIMMs per channel (2DPC)Up to 2933 MT/s (configuration-dependent)RDIMMs up to 32GBLRDIMMs at 128GB supported.NVDIMMs of 16GB supportedFor details, see the Dell EMC OpenManage systems management sectionWireless Management8System overviewThe Quick Sync feature is an extension of NFC based low bandwidth of the previous generationQuick Sync interface. Quick Sync 2.0 will offer feature parity with previous generation serverNFC interface with improved user experience. To extend this Quick Sync feature to wide varietyof Mobile OS's with higher data throughput, the Quick Sync 2.0 version replaces previousgeneration NFC technology with wireless at-the-box system management.
2System featuresProduct comparisonTable 2. Product comparisonFeaturePowerEdge T640CPU2x 2nd Generation Intel Xeon processor Scalable Family 2x Intel Xeon E5-2600 v3 (Haswell-EP),BroadwellMemory CPU InterconnectIntel Ultra Path Interconnect (UPI)Intel QuickPath Interconnect (QPI)Hard drives8x3.5 -inch, 18x3.5 -inch, 16x2.5 -inch, 16x2.5 -inch 8xNVMe, 32x2.5 -inch - 12Gb SAS, 6Gb SATA8x3.5 -inch, 18x3.5 -inch, 16x2.5 -inch, 32x2.5 inch - 12Gb SAS, 6Gb SATAStorage ControllersAdapters: HBA330, H330, H730P, H740P, H840, 12Gb SAS Adapters: HBA330, H330, H730, H730P, H830HBA Mini Mono: HBA330, H330, H730P, H740P SW RAID: (ext) Mini Mono: HBA330, H330, H730, H730PS140SW RAID: S130PCIe SSDUp to 8x PCIe SSD (NVMe)4x PCIe SSDPCIe SlotsMax 8 PCIe 3.0 1 internalMax 7 PCIe Gen3 1 internalLOM2x 10GbE (10GBASE-T) Broadcom 574162x 1GbEUSB PortsFront: 1 port (USB 3.0), 1 port (USB 2.0), dedicated iDRAC, Front: 1 port (USB 3.0), 1 port USB2.0,serial, video, 6x USB2.0/3.0dedicated iDRAC, serial, video,4x USB 2.0Tower/Rack5U (rack)5U (rack)Power Supplies AC: 495W, 750W, 1100W DC: 1100W MixedMode: 750W 1100W DC, 1600WRemote ManagementiDRAC9iDRAC8Internal GPU4x 300W (DW) Passive or 8x 150W (SW)4x 300W (DW) Active or 7x 150w (SW)Availability 24 DDR4 DIMM slotsSupports RDIMMs/LRDIMMsSpeeds up to 2933MT/s, 3TB maxUp to 12 NVDIMM, 192GB max2400W Platinum (AC only)2000 Platinum (AC only)1600W Platinum (AC only)1100W Platinum (AC/DC)750W Platinum/Titanium (AC only)750W Platinum Mixed Mode DC (For china only)495W Platinum (AC only)Hot-plug DrivesHot-plug Redundant CoolingHot-plug Redundant Power SuppliesBOSSIDSDMPowerEdge T630 Up to 24 DDR4 DIMM slots1.5TB max memorySpeeds up to 2400MT/sHot-plug DrivesHot-plug redundant CoolingHot-plug Redundant Power SuppliesIDSDM SupportSystem features9
SpecificationsTable 3. Technical specificationsFeatureSpecificationForm factor5U rackable towerChassis dimension Width: 217.7 mmHeight: 443.23 mmDepth: 707.8 mmChassis weight 16x2.5 inch hard drive with 8 fans: 38.42 kg/84.70 lb32x2.5 inch hard drive with 8 fans: 42.36 kg/93.38 lb18x3.5 inch hard drive with 8 fans: 49.65 kg/109.45 lbProcessors2nd Generation Intel Xeon processors Scalable familyProcessor sockets2 socketsChipsetIntel C620Memory Maximum RAM: 3TB-24 DIMM slotsMinimum RAM: 8GB-one moduleRDIMM-maximum system capacity: 768GBLRDIMM-maximum system capacity: 3TBNVDIMM-maximum system capacity: 192GB (up to 12 DIMMs per system)Architecture: 2666 or 2933 MT/s DDR4, registeredRAID controller H330H730PH840H740PHBA 33012Gb SAS HBASoftware RAID: S140Hardware RAID: M.2 SATA adapter (BOSS)Drives bays Up to 8 x3.5 -inch SAS, SATA, and SSD drivesUp to 18 x3.5 -inch SAS, SATA, and SSD drivesUp to 32 x2.5 -inch SAS, SATA, and SSD drivesUp to 16 x2.5 -inch SAS, SATA, and SSD drivesUp to 16 x2.5 -inch SAS, SATA and SSD plus up to 8 NVMe drivesPCIe slots Slot 1: Full Length, Full Height, CPU1 - PCIe Gen3 x16 (x16 connector)Slot 2: Full Length, Full Height, CPU1 - PCIe Gen3 x4 (x8 connector)Slot 3: Full Length, Full Height, CPU1 - PCIe Gen3 x16 (x16 connector)Slot 4: Half Length, Full Height, CPU2 - PCIe Gen3 x8 (x8 connector)Slot 5: Full Length, Full Height, CPU2 - PCIe Gen3 (DMI) x4 (x8 connector)Slot 6: Full Length, Full Height, CPU2 - PCIe Gen3 x16 (x16 connector)Slot 7: Full Length, Full Height, CPU2 - PCIe Gen3 x8 (x8 connector)Slot 8: Full Length, Full Height, CPU2 - PCIe Gen3 x16 (x16 connector)Slot 9(internal): Half Length, Full Height, CPU1 - PCIe Gen3 x8 (x8 connector)Power supply 495W AC, 86 mm-Platinum750W AC, 86 mm-Titanium750W AC, 86 mm -Platinum750W AC/HVDC, 86 mm-Platinum (Mixed mode China only)750W DC-Platinum 240 V DC (For china only)1100W AC, 86 mm-Platinum10System features
FeatureSpecification 1100W DC, 86 mm-Gold1600W AC, 86 mm-Platinum2000W AC, 86 mm-Platinum2400W AC, 86 mm-PlatinumAvailability Hot-plug hard drivesHot-plug redundant coolingHot-plug redundant powerInternal Dual SD Module (IDSDM)BOSSSystemsManagement Dell EMC Systems management consoles and tools: OpenManage Essentials OpenManage Mobile 2.0 with Quick Sync 2 OpenManage Power Center Repository ManageriDRAC License options: iDRAC9 Basic (default) iDRAC9 Express (upgrade) iDRAC9 Enterprise (upgrade) vFlash with 16GB micro SD card (upgrade)Dell EMC OpenManage Integrations : Dell OpenManage Integration Suite for Microsoft System Center Dell OpenManage Integration for VMware vCenter BMC Software (available from BMC)Dell EMC OpenManage Connections: Operating systems HPE Operations Manager I (OMi)Nagios Core and Nagios XIMicrosoft Windows Server with Hyper-VCitrix XenServer SUSE Linux Enterprise ServerRed Hat Enterprise LinuxVMware ESXiCanonical Ubuntu LTSFor more information on the specific versions and additions, visit Dell.com/OSsupport.Internal GPU4x 300W (DW) passive or 8x 150W (SW)System features11
3Chassis views and featuresChassis view and featuresFront panel view and featuresThe following components are located on the front of the PowerEdge T640:Figure 1. PowerEdge T640 front panel1. Power button2. System information tag12Chassis views and features
3.4.5.6.7.8.9.10.System health and system ID indicatorStatus LED indicatorsiDRAC Quick Sync 2 wireless indicator (optional)USB portUSB portMicro USB portOptical drive (optional)Hard drive slotsFor more information on the HDD numbering or to view other configurations, see the PowerEdge T640 Hardware Owner’s Manual onwww.dell.com/support.Back view and featuresThe following components are located on the back of the PowerEdge T640:Figure 2. PowerEdge T640 back view1.2.3.4.5.6.PCIe expansion card slot(s)System health and system ID indicatorVGA portSerial portiDRAC9 Enterprise portUSB 2.0 port (2)Chassis views and features13
7.8.9.10.PCIe expansion card slot(s)NIC port (2)USB 3.0 port (4)Power supply unit (2)Inside the systemNOTE: Components that are hot swappable are marked orange and touch points on the components are marked blue.1.3.5.7.9.11.release latchcooling fan assemblyinternal PERCPCIe slotsright external fanCPU12.4.6.8.10.12.drive cageGPU card holderPCIe card holderleft external fanCPU2 socketbackplaneControl panels and LEDFor more information about the PowerEdge T640 control panels, see the PowerEdge T640's Owner’s Manual at Dell.com/Support/Manuals.Security featuresThe latest generation of PowerEdge servers has the features listed in the table to help ensure the security of your data center.Table 4. Security featuresSecurity featureDescriptionCover latchA tooled latch is integrated in the top cover to secure it to the rackchassis.TPMThe Trusted Platform Module (TPM) is used to generate/storekeys, protect/authenticate passwords, and create/store digitalcertificates. Intel's TXT (Trusted Execution Technology)functionality along with Microsoft's Platform Assurance feature inWindows Server 2016 is supported. TPM can also be used to14Chassis views and features
Security featureDescriptionenable the BitLocker hard drive encryption feature in WindowsServer 2012/2016. Three versions of TPMs are supported in 14Gnamely TPM 1.2, TPM 2.0(Rest of World, aka everywhereexcluding China and Russia) and TPM 2.0. No TPMs are supportedfor Russia in 14G.Front bezelThe front bezel of the system contains a lock. A locked bezelsecures the system hard drivesPower-off securityBIOS has the ability to disable the power button function.Intrusion alertAn internal switch is used to detect chassis intrusion.Secure Boot modeA switch mounted on the air shroud is used to detect chassisintrusion. When the cover is opened, the switch circuit closes toindicate intrusion to ESM. When enabled, the software will providenotification that the cover has been opened.Chassis views and features15
4ProcessorProcessor FeaturesThe 2nd Generation Intel Xeon Processor Scalable Family provides the foundation for a powerful datacenter platform. The keyfeatures are as follows: Higher Per-Core Performance: Up to 28 cores, delivery high performance and scalability for compute-intensive workloads acrosscompute, storage & network usages.Greater Memory Bandwidth/Capacity: 50% increased memory bandwidth and capacity. 6 memory channels vs. 4 memory channels ofprevious generation for memory intensive workloads.Expanded I/O: 48 lanes of PCIe 3.0 bandwidth and throughput for demanding I/O-intensive workloads.Intel Ultra Path Interconnect (UPI): Up to three Intel UPI channels increase scalability of the platform to as many as eight sockets, aswell as improves inter-CPU bandwidth for I/O intensive workloads.Intel Advanced Vector Extensions 512 (Intel AVX-512) with a single AVX512 fused multiply add (FMA) execution units. SKUs whichsupport Advanced RAS enable a 2nd FMA execution unit.Security without Compromise: Near-zero encryption overhead enables higher performance on all secure data transactions.Supported processorsTable 5. Supported Processors for T640ModelIntel SKU SKU type Stepping Speed(GHz Cache(M QPI(GT/)B)s)MaxCoresMemorySpeed(MT/s)TurboTDP (W)Intel Xeon 28Turbo205Intel Xeon 322Turbo140Intel Xeon 20Turbo115Intel Xeon 20Turbo125Intel Xeon 322Turbo140Intel Xeon 324Turbo205Intel Xeon cessor
ModelIntel SKU SKU type Stepping Speed(GHz Cache(M QPI(GT/)B)s)MaxCoresMemorySpeed(MT/s)TurboTDP (W)ScalableFamilyIntel Xeon Turbo205Intel Xeon 12Turbo165Intel Xeon 20Turbo205Intel Xeon 324Turbo165Intel Xeon 18Turbo150Intel Xeon 28Turbo165Intel Xeon 22Turbo140Intel Xeon 8Turbo130Intel Xeon 326Turbo150Intel Xeon 0Turbo125Intel Xeon Turbo150Inte
Notes, cautions, and warnings NOTE: A NOTE indicates important information that helps you make better use of your product. CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the
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