Molex Silver Flexible Silver Flexible Circuits Circuit Solutions

MOLEX SILVER FLEXIBLECIRCUIT SOLUTIONSSILVER FLEXIBLE CIRCUITSFOR LOW-POWER APPLICATIONSFlexible Solutions that DeliverMolex silver flexible circuits are ideal for low-power and low-signal applicationswhere space is a premium. By choosing silver, you can design a product that bendsor flexes while reducing costs — making silver particularly desirable.CONSUMERThe Molex ApproachConsumer and smart home appliances, wearables,VR/AR, handheld devices — where size, flexibility andcost matter. Flexible circuits can wrap around a wristor a torso, powering many fitness wearablesAt Molex, we take a multidimensional approach to developcomplete, integrated solutions that turn your ideas into reality.With the industry’s broadest line of printed electronics and theexpertise to work through your mechanical rigors, we can adviseyou on the best fit for your needs, balancing cost, performance,durability, weight and other requirements.DATA LOGGING AND SMART TAGSSensor products, RFID, data logging and otherInternet of Things applications to wirelessly monitorenvironmental conditionsLearn whether a Molex silver flexible circuit is right for yourend application, and start designing your solution today ic and therapeutic medical devices thatenable telehealth and remote monitoring — disposable,single use devices such as blood glucose monitoring,electrodes and drug deliveryAUTOMOTIVESensors and controls for instrument panels and thecenter stack with smaller, lighter, less expensive silverflexible circuits — well suited throughout the dashboarduser interface and smart surfacesMolex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.Order No. 987651-6664USA/250/MIB/KC/2017.07 2017 Molex

MOLEX SILVER FLEXIBLECIRCUIT SOLUTIONSSILVER FLEXIBLE CIRCUITSFOR LOW-POWER APPLICATIONSFlexible Solutions that DeliverMolex silver flexible circuits are ideal for low-power and low-signal applicationswhere space is a premium. By choosing silver, you can design a product that bendsor flexes while reducing costs — making silver particularly desirable.CONSUMERThe Molex ApproachConsumer and smart home appliances, wearables,VR/AR, handheld devices — where size, flexibility andcost matter. Flexible circuits can wrap around a wristor a torso, powering many fitness wearablesAt Molex, we take a multidimensional approach to developcomplete, integrated solutions that turn your ideas into reality.With the industry’s broadest line of printed electronics and theexpertise to work through your mechanical rigors, we can adviseyou on the best fit for your needs, balancing cost, performance,durability, weight and other requirements.DATA LOGGING AND SMART TAGSSensor products, RFID, data logging and otherInternet of Things applications to wirelessly monitorenvironmental conditionsLearn whether a Molex silver flexible circuit is right for yourend application, and start designing your solution today ic and therapeutic medical devices thatenable telehealth and remote monitoring — disposable,single use devices such as blood glucose monitoring,electrodes and drug deliveryAUTOMOTIVESensors and controls for instrument panels and thecenter stack with smaller, lighter, less expensive silverflexible circuits — well suited throughout the dashboarduser interface and smart surfacesMolex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.Order No. 987651-6664USA/250/MIB/KC/2017.07 2017 Molex

MODERN ELECTRONICSNEED SILVER FLEXIBLECIRCUIT SOLUTIONSSILVER FLEXIBLE CIRCUITSOLUTIONSMOLEX IS EVOLVINGPRINTED ELECTRONICS WITH SILVERA HISTORY OF SILVER PRINTINGMolex has been printing silver circuitry for more than 30 years,and bonding components to polyester substrates for more than20 years. Through this experience, we’ve become a trustedleader in silver printing, bonding over 1 billion LEDs to silvercircuits on polyester.LightweightFlexibleThin30Silver flexible circuits solutionsare a cost-effective choice formany applications that demandflexible interconnect technologyin smaller form factors.LEDs bonded to silvercircuits on polyesterPROPRIETARY TECHNIQUES TO SOLDERAND BOND COMPONENTSMolex engineers developed and optimized a better method tosolder components to a proven polyester substrate, allowingelectronics to flex and bend to fit into tight spaces. We havestreamlined our process to boost reliability, even in the mostchallenging conditions.A TRUSTED PARTNEREnvironmentally friendlyA new alternative to traditional printed circuit boardshelps you meet these challenges. Molex silver flexiblecircuits use finely spaced, narrow silver traces to attachcomplex components onto a proven polyester substrate— delivering a flexible option ideal for your low-powerand signal applications.of silver circuitry1 BILLION Cost effectiveEvery year, consumers demand smaller, lighter, lessexpensive electronics — and you’re pressured to find newways to meet demand without compromising on qualityor performance. Stronger environmental regulationsmean you’re simultaneously trying to reduce waste,protect natural resources and use more sustainableprocesses and materials.YEARSMOLEX DELIVERS:Design engineering supportProven Molex reliabilityMolex can integrate flexible interconnects, sensor systemsand flex circuit assemblies to develop a complete solutionthat leverages advanced materials and innovative formfactors. Our engineers can help you maximize all threedimensions of your space with greater density andfunctionality. As a manufacturer of both flexiblecopper circuits and silver printed circuits, Molex willprovide you with the right solution for your needs.In-house value-addcapabilities1Calculate and thoroughly optimize thenecessary bend radius to minimizepoints of flex stress.2Bond fine-pitch active devices(0.50mm), such as integrated circuits,to polyester using traditional SMTprocesses. Encapsulate componentsto protect solder joints frommechanical failure and vibration.NEW METHODS SHRINK TRACES — AND SPACESDEMONSTRATED CAPABILITIESPRINTINGASSEMBLYPrinting methodsScreen printing, flexo, sheet based or roll-to-rollInksSilver flake, silver/silver chloride, carbon, nano silver, PEDOT,silver nano-wire, dielectric, radio translucent or opaque ink, PTCand moreSubstratesPET, PI, LDPE, paper, fabrics, non-woven fabricsLayersSingle- and double-sided printingUp to 4 conductive layersTrace and space0.005" x 0.005"FFC tailsAs small as 0.50mm pitchAttach methodSurface mountSMD passives0402, 0603, 0805, 1206Integrated circuitsQFN, QFP, D-PAK (0.50mm pitch)Value-addMechanical assembly, hydrogel integration, adhesives,lamination, shielding, forming packagingMolex silver ink technology and proprietarytechniques enable fine line printing, withtraces as narrow as 0.127mm (0.005").These thin traces allow better routabilityand more densely packaged circuitry.Traces as narrow as0.127mm(0.005")Our printing capability also supports0.50mm (0.020") FFC tails. Together,these capabilities provide an alternativeto traditional copper circuitry in waysthat were never possible before.

MODERN ELECTRONICSNEED SILVER FLEXIBLECIRCUIT SOLUTIONSSILVER FLEXIBLE CIRCUITSOLUTIONSMOLEX IS EVOLVINGPRINTED ELECTRONICS WITH SILVERA HISTORY OF SILVER PRINTINGMolex has been printing silver circuitry for more than 30 years,and bonding components to polyester substrates for more than20 years. Through this experience, we’ve become a trustedleader in silver printing, bonding over 1 billion LEDs to silvercircuits on polyester.LightweightFlexibleThin30Silver flexible circuits solutionsare a cost-effective choice formany applications that demandflexible interconnect technologyin smaller form factors.LEDs bonded to silvercircuits on polyesterPROPRIETARY TECHNIQUES TO SOLDERAND BOND COMPONENTSMolex engineers developed and optimized a better method tosolder components to a proven polyester substrate, allowingelectronics to flex and bend to fit into tight spaces. We havestreamlined our process to boost reliability, even in the mostchallenging conditions.A TRUSTED PARTNEREnvironmentally friendlyA new alternative to traditional printed circuit boardshelps you meet these challenges. Molex silver flexiblecircuits use finely spaced, narrow silver traces to attachcomplex components onto a proven polyester substrate— delivering a flexible option ideal for your low-powerand signal applications.of silver circuitry1 BILLION Cost effectiveEvery year, consumers demand smaller, lighter, lessexpensive electronics — and you’re pressured to find newways to meet demand without compromising on qualityor performance. Stronger environmental regulationsmean you’re simultaneously trying to reduce waste,protect natural resources and use more sustainableprocesses and materials.YEARSMOLEX DELIVERS:Design engineering supportProven Molex reliabilityMolex can integrate flexible interconnects, sensor systemsand flex circuit assemblies to develop a complete solutionthat leverages advanced materials and innovative formfactors. Our engineers can help you maximize all threedimensions of your space with greater density andfunctionality. As a manufacturer of both flexiblecopper circuits and silver printed circuits, Molex willprovide you with the right solution for your needs.In-house value-addcapabilities1Calculate and thoroughly optimize thenecessary bend radius to minimizepoints of flex stress.2Bond fine-pitch active devices(0.50mm), such as integrated circuits,to polyester using traditional SMTprocesses. Encapsulate componentsto protect solder joints frommechanical failure and vibration.NEW METHODS SHRINK TRACES — AND SPACESDEMONSTRATED CAPABILITIESPRINTINGASSEMBLYPrinting methodsScreen printing, flexo, sheet based or roll-to-rollInksSilver flake, silver/silver chloride, carbon, nano silver, PEDOT,silver nano-wire, dielectric, radio translucent or opaque ink, PTCand moreSubstratesPET, PI, LDPE, paper, fabrics, non-woven fabricsLayersSingle- and double-sided printingUp to 4 conductive layersTrace and space0.005" x 0.005"FFC tailsAs small as 0.50mm pitchAttach methodSurface mountSMD passives0402, 0603, 0805, 1206Integrated circuitsQFN, QFP, D-PAK (0.50mm pitch)Value-addMechanical assembly, hydrogel integration, adhesives,lamination, shielding, forming packagingMolex silver ink technology and proprietarytechniques enable fine line printing, withtraces as narrow as 0.127mm (0.005").These thin traces allow better routabilityand more densely packaged circuitry.Traces as narrow as0.127mm(0.005")Our printing capability also supports0.50mm (0.020") FFC tails. Together,these capabilities provide an alternativeto traditional copper circuitry in waysthat were never possible before.