LQFP64, Plastic, Low Profile Quad Flat Package; 64 Terminals; 0.5 Mm .

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LQ FP 64 SOT1699-1 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body 22 November 2019 1 Package information Package summary Terminal position code Q (quad) Package type descriptive code LQFP64 Package style descriptive code LQFP (low profile quad flat package) Package body material type P (plastic) JEDEC package outline code MS-026 BCD Mounting method type S (surface mount) Issue date 25-01-2016 Manufacturer package code 98ASS23234W Table 1. Package summary Parameter Min Nom Max Unit package length 9.8 10 10.2 mm package width 9.8 10 10.2 mm package height 1.35 1.4 1.45 mm nominal pitch - 0.5 - mm actual quantity of termination - 64 -

SOT1699-1 NXP Semiconductors LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body 2 Package outline Figure 1. Package outline LQFP64 (SOT1699-1) SOT1699-1 Package information All information provided in this document is subject to legal disclaimers. 22 November 2019 NXP B.V. 2019. All rights reserved. 2/6

SOT1699-1 NXP Semiconductors LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body Figure 2. Package outline detail of LQFP64 (sot1699-1) SOT1699-1 Package information All information provided in this document is subject to legal disclaimers. 22 November 2019 NXP B.V. 2019. All rights reserved. 3/6

SOT1699-1 NXP Semiconductors LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body Figure 3. Package outline note LQFP64 (sot1699-1) SOT1699-1 Package information All information provided in this document is subject to legal disclaimers. 22 November 2019 NXP B.V. 2019. All rights reserved. 4/6

SOT1699-1 NXP Semiconductors LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body 3 Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT1699-1 Package information All information provided in this document is subject to legal disclaimers. 22 November 2019 NXP B.V. 2019. All rights reserved. 5/6

SOT1699-1 NXP Semiconductors LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body Contents 1 2 3 Package summary .1 Package outline .2 Legal information . 5 NXP B.V. 2019. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 22 November 2019

Package style descriptive code LQFP (low profile quad flat package) Package body material type P (plastic) JEDEC package outline code MS-026 BCD Mounting method type S (surface mount) Issue date 25-01-2016 Manufacturer package code 98ASS23234W Table 1. Package summary Parameter Min Nom Max Unit package length 9.8 10 10.2 mm package width 9.8 10 .

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