Semiflex: An Award-winning Miniaturization Success
Semiflex: an award-winning miniaturization successDecember 5th, 2018Speaker:Andreas Schilpp
agenda The way to the champion1 The genes of the champion2 What may peak performance cost?3 What's left in it? Roadmap406.12.2018Seite 3www.we-online.de
mecablitz M400 - „Compact and powerful.“ system flash unit –„Perfectly equipped, attractively packaged.“Link06.12.2018Seite 4www.we-online.de
Project „M400“Briefing – specification as small as possible Energy from 4 AA batteries Guide number 40 (ISO100) perfect all-rounder formirrorless system cameras as cheap as possibleAugust:Start of seriesproductionSeptember:leading fairApril:Meeting at Metzwithinterdisciplinarydevelopment teamFebruary:First definitions forlayer stackup06.12.2018Seite 5www.we-online.de
Design Chain electronic system development„a pcb is a complex construction made out ofmany different materials, produced using avariety of processes for getting tailoredfunctionality!“stated conditions Specification06.12.2018page 6www.we-online.com
Größenvergleich / size comparison06.12.2018Seite 7www.we-online.de
Vergleich Systeme / Comparison of systems06.12.2018Seite 8www.we-online.de
agenda The way to the champion1 The genes of the champion2 What may peak performance cost?3 What's left in it? Roadmap406.12.2018Seite 9www.we-online.de
The heart of the champion - the Semiflex circuit board „Blueprint" forminiaturized devices withhigh energy requirements,electronics built around theenergy storage unit to savespace!06.12.2018Seite 10www.we-online.de
The heart of the champion - the Semiflex circuit board Layer Stackup:Necessary length L of the bending area is:L angle x radius R x Pi / 180 2 x 0.4mm (bevel Y) 06.12.2018FR4Semiflex does not have flex areas, but bending areas.no flexible material Polyimide!no separate drying necessaryqualified for 10 bendsBending radius and direction must be respected!Seite 11www.we-online.de
Big influence: layer structure and dielectric material Prepreg constructions: not too coarse and not too fine for Semiflex!type 10650 – 55 µmtype 108060 - 70 µmtype 211685 – 100 µmtype 7628180 – 210 µm Resin and fillers– Tg135 shows the best bending properties– higher Tg and fillers worsen the bending properties06.12.2018Seite 12www.we-online.de
Designrules FR4 SemiflexMaximum copper design Bad: copper free area in bending zone, smallcontour radius Good: balanced copper design in bending area,big contour radius06/12/2018Seite 13www.we-online.com
Designrules FR4 Semiflex Replace large 180 areas with 2 x 90 with rigid intermediate part Regard bending direction:06.12.2018Seite 14 von 30www.we-online.de
Reliability of construction Bending aids: Example (left) or integrated in housing (right) Array design panel separation!– Semiflex area must not be damaged during separation!06.12.2018Seite 15www.we-online.de
How do you get a complex Semiflex in there?www.we-online.deSeite 1606.12.2018
Bending and assembly toolwww.we-online.deSeite 1706.12.2018
Reliability of construction idea of combined bending fixing tools:www.we-online.deSeite 1806.12.2018
Reliability of construction idea of combined bending fixing tools: Does that look familiar to you?www.we-online.deSeite 1906.12.2018
Gerätemontage M400 / device assembly M400 perfect job, guys @ metz!06.12.2018Seite 20www.we-online.de
Applications Semiflex Technology Automotive (headlights, ECU, cameras, distance measuringtechnology, transmission electronics .) Industrial electronics (sensor technology, LED lights, drivetechnology, motor control, hydraulic control.) Heavy mechanical engineering Security technology, building services engineering (accesscontrol, climate sensors, control and operating devices,Smart Water Metering) Medical technology (charger, handheld devices) Railway technology (ECU diesel engine) Geotechnics (Switchbox)06.12.2018Seite 21www.we-online.de
agenda123406.12.2018 The way to the champion The genes of the champion What may peak performance cost? What's left in it? RoadmapSeite 22www.we-online.de
cost comparisonWebinar from March 03, 2015:No more cable spaghetti –Wiring 4.0 via Semiflex available in our Webinar Archive!06.12.2018Seite 23www.we-online.de
comparison: total systemrigid pcbswith cables and connectorsSemiflexible pcb balance sheet100 pcs1.000 pcs100 pcs1.000 pcsRemarksa) pcb price58,50 40,50 55,90 45,50 pcbs from Europeb) FFC cables, ZIF connectors30,00 13,00 --EMS Swedenc) for this SMD assembly AOI2,00 1,50 --EMS Swedend) final assembly2,00 1,50 --EMS Swedene) final test1,50 1,00 1,50 1,00 EMS Sweden94,00 57,50 57,40 46,50 -39%-19%sum of BoM and processingcost savingadditional cost factors:5 pcbs1 pcb17 components 5 stencils1 component 2 stencilsh) assembly expenditure5x1xi) test expenditure6x1xk) stock / logistics22 positions3 positions312 ZIF-contacts 312 solder jointsintegrated Semiflex connectionf) design forg) inventory controll) Pin- and solder connections06.12.2018Seite 24Reliabilitywww.we-online.de
comparison: total systemrigid pcbswith cables and connectorsSemiflexible pcb balance sheet100 pcs1.000 pcs100 pcs1.000 pcsRemarksa) pcb price58,50 40,50 55,90 45,50 pcbs from Europeb) FFC cables, ZIF connectors30,00 13,00 --EMS Swedenc) for this SMD assembly AOI2,00 1,50 --EMS Swedend) final assembly2,00 1,50 --EMS Swedene) final test1,50 1,00 1,50 1,00 EMS Sweden94,00 57,50 57,40 46,50 -39%-19%sum of BoM and processingcost savingadditional cost factors:5 pcbs1 pcb17 components 5 stencils1 component 2 stencilsh) assembly expenditure5x1xi) test expenditure6x1xk) stock / logistics22 positions3 positions312 ZIF-contacts 312 solder jointsintegrated Semiflex connectionf) design forg) inventory controll) Pin- and solder connections06.12.2018Seite 25Reliabilitywww.we-online.de
agenda123406.12.2018 The way to the champion The genes of the champion What may peak performance cost? What's left in it? RoadmapSeite 26www.we-online.de
Semiflex constructions for special requirements application-specific adaptations– The bending area is covered with coverlay– use of mid Tg or high Tg base material (Tg150, Tg240) Bending area with 2 copper layers Adapted laminating technology– improved bending behaviour– also for thicker bending areas– smaller bending radii Combination with HDI– microvia– buried via06.12.2018Seite 27www.we-online.de
2Ri – xRi : Semiflexible area with 2 copper layers for very high number of connections in thebending areafor complete reference layer – impedancematching replacement of high pin-count connectorsand shielded cables in this case price advantage is evenhigher!Z1Z206.12.2018Seite 28www.we-online.de
2Ri – xRi : Semiflexible area with 2 copper layers06.12.2018Seite 29www.we-online.de
Summary Congratulation and many thanks to the companymetz-mecatech!– for the exemplary cooperation and the information! Semiflex is an affordable 3D technology for reliableminiaturization solutions. Semiflex solutions are always project-specific!– We will be happy to advise you! More information in our webinar archive! Event note:AltiumLive, Munich, January 2019 - "Digital Standards forEDA-Tools" presented by Andreas Schilpp06.12.2018Seite 30LINKwww.we-online.de
Thank you very much for your attention! Questions?06.12.2018www.we-online.com
Semiflex: an award-winning miniaturization success December 5th, 2018 . Combination with HDI . AltiumLive, Munich, January 2019 - "Digital Standards for EDA-Tools" presented by A
Bio-Intelligent Products Miniaturization Business Systems Miniaturization 5. Miniaturization of electronic components 6. Miniaturization of bio-hybrid systems 7. Functional materials and surfaces Bio-Intelligent Systems are based on high technology with spatial highly concentrated functionality
Chapter 1 – The Odds Of Winning The Lottery: A Primer On Playing The Lotto In this chapter you will learn: The Odds Of Winning In Powerball The Odds Of Winning InMega Millions The Odds Of Winning InWild Card 2 The Odds Of Winning InKansas Super Cash The Odds Of Winning InUK Thunderball The Odds Of Winning InTurkey Sans Topu The Odds Of Winning InTennessee Cash
Miniaturization, Packaging, and Thermal Analysis of Power Electronics Modules by Alexander B. Lostetter Thesis submitted to the Faculty of the Virginia Polytechnic Institute and State University in partial fulfillment of the requirements for the degree of Master of Science In Electrical Engineering Approved: _ A. Elshabini, Chairman
ment in miniaturization of electronics products—Moore’s Law. Now, scaling hits a brick wall, a par adigm shift. The industry roadmaps recognized the scaling limitation and project that packaging technologies will meet further miniaturization needs or a.k.a “More than Moore”. This paper pre
Miniaturization Techn
31. The members of winning teams are decisive and make it happen 32. Winning teams renounce bureaucracy in all its forms 33. Honesty and candor are prevalent within winning teams 34. Listening and communication are hallmarks of winning teamwork 35. Mutual support and recognition are pervasive within winning teams 36.
Soul-winning has erroneously been equated with reaching the unsaved with the mes-sage of the gospel of grace; and few Christians, viewing soul-winning in this manner, seem to even give the matter a second thought. Books have been written on soul-winning, Bible colleges and seminaries teach courses on soul-winning, and soul-winning confer-
Studying the Korean language is even more challenging and fascinating than studying other languages. Korea has an ancient culture. Over the centuries, it has— amazingly—been able to mix all the influences coming from Central Asia, the Steppes, Manchuria, China, Japan, and the West into a beautiful, brilliant, and unique new culture. This cultural richness has affected the Korean language .
