ALPHA OM-338 PT Solder Paste - Solder Connection
the product:A world classlead free, highreliability noclean solderpaste with bestin class incircuit pintestabilityALPHAOM-338 PTSolderPaste product guideThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.1
OM-338 PT solder pasteWelcome to theALPHA OM-338 PT ProductGuideCONTENTSPage #1. Introduction32. Performance Summary43. Print Performance4. Reflow Performance5 - 1213 - 175. Post Reflow Cosmetics 18 - 196. Reliability20 - 237. Summary24 - 268. Techical Bulletin27 - 299. MSDS30 - 35The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.2
OM-338 PT solder pasteIntroductionIntroducing ALPHA OM-338 PT, a more pin testable variation of theOM-338 lead-free solder paste family.Cookson considered what you need from a lead free solder paste – high yieldfine feature printing with a wide process window, excellent reflow yields withboth straight ramp and soak profiles, high electrical reliability AND worldclass in circuit pin testability.OM-338 PT passed every major Surface Insulation and ElectrochemicalMigration test, including Bellcore, IPC, JIS and the HP protocols.With our local teams of technical experts, you can count on Cookson’scomplete support whenever and however you need us. It’s the kind ofsupport you would expect from a company that’s remained dedicated toserving the needs of the Global circuit assembly market for over 50 years.The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.3
OM-338 PT solder pastePerformance SummaryProcess BenefitOM-338 PT BenefitPrint Process WindowReflow YieldElectrical ReliabilityPerformance CapabilityExcellent print definition and consistant volumetric performanceFine Feature Print Definition to 0.25mm (10 mil) circles and 0.3mm (12 mil) pitch rectangularQFP pads.Tack Life 24 hoursCapable of printing in temperatures from 20 C to 30 C (68 F toTemperature Window 86 F)Repeatable volume deposition and low volume variability (CpK Print Consistancy2.0) on 0.25mm (10 mil) circles.25mm/second to 150mm/second (1 inch/second to 6inches/second) down to 0.25mm (10 mil) circles and .3mm (12Print Speed Rangemil) pitch QFP pads.Pin Testability 98% Yield ( 2% False Negatives) Best in ClassExceeds requirements of IPC 7095 Class lll using soak reflowResistance to Voidsprofile. Class II with straight ramp profiles.Resistance to Hot and Cold Exceeds the requirements of IPC J-STD-005 and JIS-Z-3284 forSlumphot and cold slump.Flux Residue CosmeticsClear, colorless residue.SIRMeets/Exceeds JIS, IPC and Bellcore RequirementsMeets/Exceeds JIS, Bellcore and HP EL-EN 861-00Electromigration ResistanceRequirementsJ-STD-004 ClassificationROL0Halide ContentHalide FreeThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.4
OM-338 PT solder pastePrint PerformanceFine Feature Print Definition0.3mm (12mil) pitch QFPs* Using Type 3 PowderDelivers High Fine Feature Print Yields Excellent print definition and consistent volumetric performance to 0.30mm (12mil) squaresand 0.25mm (10mil) pitch circles Type3 Powder Capable for Better Economy*10 cm/sec (4in/sec), 0.26kg/cm (1.5 lbs/in) squeegee pressure, 0.125mm (5 mil) stencilThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.5
OM-338 PT solder pastePrint PerformancePaste Volume, Repeatability- Room Temperature (25 C)Print volume CpK: OM-338PT4004.003503.50300Volume CpK (within boards)Volume (cu mil)Print data: OM-338PT250200150100Average50 - Boards 1-6 (Initial)Average - Boards 7-12 (wipe)Average0 - Boards 13-18 (pause)LSL - Average VolumeMinimum1 vol. - Boards 1-67Minimum vol. - Boards 7-12Minimum vol. - Boards 13-18LSL - Minimum volume3.002.502.001.50Initial - Boards 1-61.00After wipe - Boards 7-12After 1 hour pause - Boards 13-180.5013Board #0.001713Board #Repeatable volumes after stencil wipe and 1 hour response to pause Continuous monitoring of paste volume over time demonstrates ALPHA OM-338 PT’s consistent printability HighVolume Deposits HighLevel of Volume RepeatabilityThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.6
OM-338 PT solder pastePrint PerformancePaste Volume, Repeatability- Low Temperature (20 C)Print volume CpK: OM338PT (type 3)3503.003002.50Volume CpK (within boards)Volume (cu mil)Print data: OM-338PT (type 3)250200150100Average50 - Boards 1-6 (Initial)Average - Boards 7-12 (wipe)Average0 - Boards 13-18 (pause)LSL - Average VolumeMinimum1 vol. - Boards 1-67Minimum vol. - Boards 7-12Minimum vol. - Boards 13-18LSL - Minimum volume13Board #2.001.501.00Initial - Boards 1-6After wipe - Boards 7-120.50After 1 hour pause - Boards 13-180.001713Board #Repeatable volumes after stencil wipe and 1 hour response to pause Continuous monitoring of paste volume over time demonstrates ALPHA OM-338 PT’s consistent printability HighVolume Deposits HighLevel of Volume RepeatabilityThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.7
OM-338 PT solder pastePrint PerformancePaste Volume, Repeatability- High Temperature (30 C)Print volume CpK: OM-338PT (type 3)3503.003002.50Volume CpK (within boards)Volume (cu mil)Print data: OM-338PT (type 3)250200150100Average50 - Boards 1-6 (Initial)Average - Boards 7-12 (wipe)Average0 - Boards 13-18 (pause)LSL - Average VolumeMinimum1 vol. - Boards 1-67Minimum vol. - Boards 7-12Minimum vol. - Boards 13-18LSL - Minimum volume13Board #2.001.501.00Initial - Boards 1-6After wipe - Boards 7-120.50After 1 hour pause - Boards 13-180.001713Board #Repeatable volumes after stencil wipe and 1 hour response to pause Continuous monitoring of paste volume over time demonstrates ALPHA OM-338 PT’s consistent printability HighVolume Deposits HighLevel of Volume RepeatabilityThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.8
OM-338 PT solder pastePrint PerformanceStencil Life – Tack 00051015Time (hr)20JIS Tack (gf)IPC Tack (gf / sq mm)OM338PT T4 - Tack over time25JIS-Z-3284 Appendix 8Maintains consistent tack strength over 24 hoursJIS Classification 80 gf and above at 24 hoursIPC Classification Less than 1 unit change in tack when tested at a humidity range of 25% - 75% RHmeasured over a 8 hour periodThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.9
OM-338 PT solder pastePrint Consistency Over Range of PrintSpeeds-.010” (.25mm) CirclesPrint speed 1 in./sec (25.4mm/sec)Squeegee pressure 1 lb/linear in.(0.18 Kg/cm)Print speed 4 in./sec (100mm/sec)Squeegee pressure 1.25lb/linear in.(0.22 Kg/cm)Print PerformancePrint speed 6 in./sec (150mm/sec)Squeegee pressure 1.5 lb/linear in.(0.26 Kg/cm)Wide print speed capability allows for maximum throughput Repeatable volume deposition and low variability based ontheoretical aperture volumes Faster print speed reduces print cycle timeThis allows printer to perform secondary functions withoutaffecting SMT line beat rate Under stencil wipe 2D vision inspectionThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.10
OM-338 PT solder pastePrint Consistency Over Range of PrintSpeeds-.012” Pitch (.30mm) QFP PadsPrint speed 1 in./sec (25.4mm/sec)Squeegee pressure 1 lb/linear in.(0.18 Kg/cm)Print speed 4 in./sec (100mm/sec)Squeegee pressure 1.25lb/linear in.(0.22 Kg/cm)Print PerformancePrint speed 6 in./sec (150mm/sec)Squeegee pressure 1.5 lb/linear in.(0.27 Kg/cm)Wide print speed capability allows for maximum throughput Repeatable volume deposition and low variability based ontheoretical aperture volumes Faster print speed reduces print cycle timeThis allows printer to perform secondary functions withoutaffecting SMT line beat rate Under stencil wipe 2D vision inspectionThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.11
OM-338 PT solder pastePrint PerformanceViscosity StabilityOM-338 PT Room Temperature Stability200010 RPM Viscosity (CPS)1800160015701540T015102 Weeks1 Week1400120010002 Weeks Room Temperature Stability (25 C; 77 F)The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.12
OM-338 PT solder pastePost-Reflow CosmeticsPin TestabilityHigh first pass strike rate ( 98%) underdemanding conditions Pin Tip: Sharp Chisel Pin Force: 6.5 oz (0.18 Kg) Point 1: 0.040” (1.01mm) pad Point 2: 0.028” (0.71mm) pad Pad Finishes: HASL and Entek OSPPerformance Indicator Minimal residue contamination of pinshelps to eliminate false negatives.Resistance(Ώ) 55 – 1010 – 2020 – 5050 – 100100 – 200200 – 500500 – 10001000 - 2000 2000Point 1Point 21000000000000990200000008The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.13
OM-338 PT solder pasteReflow PerformanceReflow Process GuidelinesParameterGuidelineAdditional InformationAtmosphereAir or N2Mass production verification both inair and N2.SnAgCu alloy melting ranges.Lower temperature solidus;higher temperature liquidusSAC305: 217 – 220 SAC405: 217 – 225 SAC387: 217 – 220 Use for reflow above liquidus settingProfile General Guideline (Typical for SAC305)Setting ZoneOptimal Dwell PeriodExtended window40oC to 220oC3 min – 3:15 3:30 min.130oC to 220oC1:30 to 1:40 2:15 min.170oC to 220oC1 min. 1:30 min.TAL (220oC)45 - 90 sec.30-90 sec. 240oC for OSP finishNo limit to other surface finish 3oC – 8oCRecommended to prevent surfacecracking issue.Peak temp.Joint cool downrate from 170CThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.14
OM-338 PT solder pasteReflow PerformanceSuggested Reflow Profile:OM-338 PTThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.15
OM-338 PT solder pasteReflow PerformanceReflow Yield: Application NoteDefinition of Voiding PerformanceSolder OutlineVoid OutlinesLocation of VoidClass IClass IIClass IIIVoid in Solder60% of diameter42% of diameter30% of diameter(Solder Sphere) 36% of Area 20.25% of Area 9% of AreaVoid at interface ofSolder (Sphere)and Substrate0.1d50% of diameter25% of diameter20% of diameter 25% of Area 12.25% of Area 4% of Area0.25ddExample:Total Void Diameter0.10d 0.25d 0.35dIPC Criteria for Voids in BGAs, IPC 7095 7.4.1.6The IPC criteria provide three classes of acceptance for both the solder sphere and the spherepad interface.Where multiple voids exist, the dimensions will be added to calculate total voiding in the joint.The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.16
OM-338 PT solder pasteReflow PerformanceVoiding PerformanceVoid Size DistributionBGA256100.00%OM338-PT CERF 175 60 SOAK 240C PEAK 60S TAL90.00%OM338-PT CERF 160 60 SOAK 240C PEAK 45 60S TAL80.00%OM338-PT CERF ST.RAMP 1.5C S 240C PEAK 60S TAL% of 00%ZERO0-4%4-8%8-12%12-16%16-20% 20%% of Joint areaExcellent, low voiding performance Meets IPC 7095 Class III Requirements with Soak Reflow ProfileMeets IPC 7095 Class II Requirements with Straight Ramp Reflow ProfileThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.17
OM-338 PT solder pasteReflow PerformanceCold & Hot slump performanceNo bridging after 3 minute soak at 170 C usingJIS-Z-3284 Appendix 8 test patternMeets Hot & Cold Slump Requirements per IPC J-STD-005Pad SizeLargest GapBridgedIPC max gapbridge allowedCold Slump25 C / 50% / 75% RH0.63 x0.33 x2.03mm2.03mmHot Slump Oven 150 C10 minutes0.63 x0.33 x2.03mm2.03mmNo e information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.18
OM-338 PT solder pastePost-Reflow CosmeticsFlux Residue Cosmetics0805 Components0603 ComponentsLocation and appearancePerformance Indicator No flux bridging between two terminations atintentional 10% overprint on 0805 and 0603 Products that do not deliver clearresidues can lead to inconsistent fluxcosmetics, increasing the difficulty ofvisual inspection. Thin, consistent flux residue on top of joints Clear colorless flux residue on all devicesThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.19
OM-338 PT solder pasteReliabilitySummary TableChemicalCu CorrosionCu MirrorAg ChromateIPC J-STD 004IPC J-STD 004IPC J-STD 004PassPassPassPaste is ROL-0 per IPCElectricalSIR (IPC)SIR (Bellcore)SIR S)7 day 85 C/85% RH96 hours @ 35 C/85% RH7 day, 40 C, 93% RH500 hours, 65 C, 85% RH94.1 X 10 ohm118.4 X 10 ohm111.4 x 10 ohm10Initial: 1.2 X 109Final: 5.1 X 10101000 hours, 85 C, 85% RH1.0 x 10 ohmElectromigration28 day, 50 C, 90% RH, 5V,(HP EL-EN861-00) Readings Every 10 minutesTest ReportAvailable UponRequest8 10 Pass11 10 Pass11 10 PassPassFinal Initial/10Pass8 1.0 X 10 ohmPassThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.20
OM-338 PT solder pasteReliabilityElectrical Reliability DataPasses IPC SIR TestSIR TEST REPORT - IPCControl BoardsArithmetic meanArithmetic meanVisually OKReflowed Paste, UncleanedTest #.0527-2i T/H/B:85/85/-48Tested by:.K. Tellefsen Report Pass/Fail Limit 1.0 E 8ΏCONDITIONMATERIAL TESTED/1 Day SIR 4 Day SIR 7 Day SIR CommentsOM338 PTPNC0513A (PT817-2) sac 3052.90E 093.70E 094.30E 093.10E 093.40E 093.40E 098.60E 088.10E 089.80E 083.30E 094.40E 095.20E 093.90E 095.50E 096.50E 093.00E 094.50E 094.90E 092.50E 093.20E 093.70E 092.50E 091.50E 092.20E 093.00E 093.90E 094.60E 092.60E 092.40E 094.20E 092.80E 094.80E 097.40E 093.30E 091.70E 091.90E 092.80E 093.30E 094.10E 094.40E 092.40E 092.60E 094.70E 095.30E 091.70E 094.10E 094.50E 091.10E 108.20E 096.90E 096.70E 096.10E 093.00E 093.20E 096.20E 096.40E 094.10E 094.50E 095.20E 099.40E 096.50E 095.50E 096.00E 096.90E 093.40E 093.40E 097.10E 097.10E 094.10E 094.80E 095.00E 099.40E 096.50E 095.70E 096.30E 095.20E 095.50E 095.80E 09The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.21
OM-338 PT solder pasteReliabilityElectrical Reliability DataPasses Bellcore SIR TestSIR TEST REPORT - BELLCORE(per GR-78-CORE Issue 1, Sept 97)Control BoardsGeometric mean:Geometric mean:Visually OKReflowed Paste, UncleanedTest #.0527-2b T/H/B:35/85/-48Tested by:.K. Tellefsen Report limit:1E11 OhmsCONDITIONMATERIAL TESTED/1 Day SIR 4 Day SIR CommentsOM338 PTPNC0513A (PT817-2) sac 3052.20E 125.50E 125.80E 121.50E 121.60E 125.30E 112.30E 121.00E 122.10E 121.90E 125.30E 124.10E 111.60E 121.50E 122.60E 128.20E 116.80E 111.20E 128.50E 121.60E 116.30E 111.90E 112.10E 128.60E 112.20E 128.40E 112.70E 121.30E 129.00E 126.80E 121.50E 121.30E 121.70E 128.00E 123.30E 121.10E 125.00E 128.10E 122.10E 118.00E 114.10E 117.00E 115.20E 114.50E 111.80E 123.60E 118.00E 116.10E 114.00E 112.40E 113.10E 125.10E 11The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.22
OM-338 PT solder pasteReliabilityElectrical Reliability DataPasses JIS ECM TestTest #:0527-2je Start date:Tested by: K. TellefsenMATERIAL TESTED/CONDITIONOM338 PTPNC0513A (PT817-2)IPC-B-25 pattern B0.318 mm lines and spacesReflowed pasteuncleanedPassed electricaland visualrequirementsno evidence ofelectrochemicalmigrationGeometric mean:ControlsIPC-B-25 pattern BGeometric mean:9/12/2005ReportedSIR ohmsinitial------ 1.0E12 1.0E12 1.0E12 1.0E12 1.0E12 1.0E12 1.0E12 1.0E12 1.0E12 1.0E12 1.0E12 1.0E12------ 1.0E12 1.0E12 1.0E12 1.0E12 1.0E12 1.0E12 1.0E12 1.0E12 1.0E12 1.0E12 1.0E12 1.0E12 1.0E12---- 1.0E12by: K.SIR24 hrs------2.50E 094.80E 093.10E 093.00E 092.70E 092.60E 092.30E 102.00E 103.80E 095.20E 092.30E 092.80E 09------4.30E 099.00E 091.00E 101.20E 107.90E 108.80E 107.40E 103.60E 108.60E 091.10E 119.60E 108.60E 101.30E 10------3.40E 10bias TellefsenSIR96 hrs------8.60E 098.10E 098.20E 091.20E 107.90E 091.00E 106.80E 108.40E 101.10E 101.40E 109.00E 091.10E 10------1.40E 102.30E 102.30E 102.50E 105.10E 103.50E 105.00E 103.80E 101.60E 105.90E 101.00E 119.20E 102.80E 10------3.90E 1050 V T/H: 85/85SIR168 hrs------6.50E 096.20E 097.10E 096.90E 097.10E 098.20E 098.20E 109.10E 107.20E 098.50E 097.10E 097.20E 09------1.10E 103.90E 104.00E 103.70E 103.90E 103.40E 103.60E 103.40E 103.20E 103.10E 103.20E 103.00E 102.90E 10------3.40E 10SIR200 hrs------5.10E 095.20E 095.00E 095.00E 094.60E 096.40E 099.00E 101.20E 116.10E 097.90E 096.70E 095.90E 09------9.30E 094.70E 104.80E 104.40E 104.70E 104.10E 104.20E 104.00E 103.80E 103.80E 103.90E 103.60E 103.60E 10------4.10E 10SIR400 hrs------3.30E 097.90E 097.20E 097.60E 093.30E 095.40E 091.10E 111.40E 114.30E 096.00E 095.00E 092.40E 09------8.40E 099.00E 103.10E 103.10E 104.90E 104.10E 104.90E 104.00E 102.50E 105.60E 105.40E 105.00E 104.20E 10------4.40E 10SIR600 hrs------1.50E 091.40E 101.20E 101.20E 103.30E 098.10E 091.20E 111.40E 114.40E 096.30E 095.00E 091.60E 09------9.00E 091.70E 113.90E 103.90E 105.70E 104.10E 105.20E 104.40E 103.00E 106.10E 106.10E 105.60E 105.00E 10------5.20E 10SIR800 hrs------1.20E 091.60E 101.30E 101.30E 103.10E 098.40E 091.40E 112.00E 114.60E 096.70E 094.40E 091.60E 09------9.50E 091.70E 112.90E 103.60E 106.60E 104.80E 105.90E 105.10E 103.40E 106.90E 106.90E 106.40E 105.90E 10------5.60E 10SIR1000 hrs------1.10E 092.20E 101.60E 101.80E 103.40E 091.20E 107.90E 101.30E 115.80E 097.90E 096.10E 091.70E 09------1.00E 101.60E 116.00E 106.10E 107.40E 105.90E 106.80E 106.40E 104.20E 108.80E 108.20E 107.90E 107.40E 10------7.20E 10The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.23
OM-338 PT solder pasteDelivers excellent print volume and consistancy SummaryPrints .3mm pitch QFP’s , .25mm circles with Type 3 PowderPrint Temperature window 20 C to 30 CExcellent post print tack lifeWide print speed process window (25mm/sec to 150mm/sec)Stable viscosityHigh Post Reflow Yields 99% In Circuit Pin Test YieldsIPC Class III Voiding Performance (Using Soak Reflow Profile)Resistance to cold and hot slumpClear, colorless flux residueElectrical Reliability IPC SIRBellcore SIRJIS SIRBellcore ElectromigrationJIS ElectromigrationHP EL-EN861-00 ElectromigrationThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.24
OM-338 PT solder pasteSummaryLeading Products:No Clean, SnPb ALPHA OM-6106 ALPHA OM-5100No Clean, Lead-free ALPHA OM-338 T ALPHA OM-338 PT ALPHA OM-325Water Soluble, SnPb ALPHA WS-709 ALPHA WS-609Water Soluble, Lead-free ALPHA WS-619The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.25
OM-338 PT solder pasteSummaryThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.26
OM-338 PT solder paste Introduction Introducing ALPHA OM-338 PT, a more pin testable variation of the OM-338 lead-free solder paste family. Cookson considered what you need from a lead free solder paste – high yield fine feature printing with a wide process window, excellent reflow yields withFile Size: 1019KB
Jul 18, 2012 · ALPHA OM-338 PT Product Guide OM-338 PT solder paste 2. Performance Summary 4 3. Print Performance 5 - 12 5. Post Reflow Cosmetics 18 - 19 4. Reflow Performance 13 - 17 6. Reliability 20 - 23 8. Techical Bulletin 27 - 29 CONTENTS Page # 9. MSDS 30 - 35 7. Summary 24 - File Size: 728KB
2005-2006 Alpha Chi Omega Fall 2004 Delta Sigma Theta . Spring 2004 Kappa Alpha Theta 2003-2004 Alpha Xi Delta 2002-2003 Alpha Omicron Pi 2001-2002 Alpha Chi Omega . 1998-1999 Chi Omega 1997-1998 Alpha Xi Delta 1996-1997 Alpha Gamma Delta . 1995-1996 Alpha Gamma Delta 1994-1995 Alpha Gamma Delta 1993-1994 Chi Omega 1992-1993 Chi Omega .
paste will be the only option to introduce solder to the joint. The solder paste can be introduced by printing solder on the board or on the part. It is not possible to position a ministencil on a densely assembled board for printing solder paste. The better choice is to print solder on the part and place it on the board using the BGA rework .
Get dataset D t {(s t,π*(s t))} D Aggregate dataset D D D t Train classifier π i ̂ 1 on D p̂t π θ(y1 set t s t) π θ(y t 2 s t) draw Bernoulli variable Z t 1 of parameter b b p̂t if Z t π i for t 1to T * After completing his Ph.D., Ellis worked at Bell Labs from 1969 to 1972 on probability theory. Name Entity .
CASIO IT -3000 PolyTherm 200-2.8 Alpha 800-3.4 PolyTherm 200-3.2 CASIO PB -300 Alpha 800-2.4 CASPAR INTEGRATED SYSTEMS PTS -160 Alpha 800-2.4 CBM iDP -3210 Alpha 800-2.4 CIBA 200/270 Alpha 800-2.4 CIBA #473552 Alpha 400-2.3 CIBA CORNING MAGIC LIFE ANALYZER II Alpha 800-2.4 CITIZEN CBM -210/220 Alpha 800-2.4
near-eutectic (63-37 and 60-40) tin-lead solder that has a melting point of approximately 183 oC. Solder Metallurgical Considerations . Before exploring the mechanical properties of room-temperature solder, it is impor-tant to note that molten solder is an extremely good solvent, and readily dissolves metals such as copper and gold that it comes in
Solder You will want rosin core, 60/40 solder. Good solder is a good thing. Bad solder leads to bridging and cold solder joints which can be tough to find.
Brian Nicholas Harris, CC Citizen and Glazier . Barbara Anne Bear Citizen and Musician Maureen Sutherland Smith a Public Relations Consultancy Chairman 78 Hamilton Terrace, St Johns Wood, Westminster The Rt Hon The Lord Mayor Barbara Anne Bear Citizen and Musician Michael John Henesy a Meat and Fish Specialist 49 Hatton House, St Georges Estate, Stepney, Tower Hamlets Susan Margaret Hughes .
