Introduction To Aluminum And Magnesium Annealed Pyrolytic .
k Technology DivisionIntroduction to Aluminum andMagnesium Annealed PyrolyticGraphite (k-Core)MEPTEC Thermal Management SymposiumMarch 19, 2012San Jose, CA
k Technology DivisionCooling Requirements High capability semiconductor devicesgenerate large amounts of waste heat– Typical Aircraft Versa Module Europa(VME) board produces 250 watts over a15.24 cm. by 22.86 cm. area– High power aircraft electronics canproduce 500 watts in 0.16 cm2. Keep operating temperatures below125ºC
k Technology DivisionConduction Cooling Aluminum substrates provide the baseline Low Cost Processing well-understoodBUT Limited by low thermal conductivity– 180 to 240 W/m-K Copper has better conductivity, but is HEAVY
k Technology Division1800Conductivity x (W/mK)Conductivity y (W/mK)Conductivity z (W/mK)1600140012001000800600400200E1103Modulus (GPa)E2E310311Materialv120.3AluminumUHM PitchFiberMechanicalCopper0APGThermal Conductivity (W/mK)Annealed Pyrolytic Graphite (APG)Poisson's Ratiov13v230.0020.002G12Shear Modulus (GPa)G13G2311 Gpa6.66.6a1CTE (PPM/K)a2a3-6.00E-07-6.00E-072.57E-05oThermal, 25 CConductivity (W/mK)k1k2k31700.01700.010.0Diffusivity (cm2/K)v1v2v31071.51071.56.3Specific Heat (W/gK)Cp0.702Density (g/cm3)d2.26
k Technology DivisionAPG DescriptionAs Deposited Pyrolytic Graphite(PG), Mosaic Spread 40 to 50 DegHighly Oriented Pyrolytic GraphiteAnnealed Pyrolytic Graphite(APG), Mosaic Spread 5 to 10 Deg (HOPG), Mosaic Spread 2 DegInterlayer Spacing 3.43 Angstroms kab 300. W/m-K kc 3.0 W/m-KEab 34 GPaEc 11 GPaCTEab 0.5x10-6 oC-1CTEc 20. x10-6 oC-1Tensile Strengthab 100 MPaTensile Strengthc 1.03 MPaInterlayer Spacing 3.36 Angstroms kab 1700. W/m-Kkc 10. W/m-KEab 103 GPaEc 34 GPaCTEab -1.0 x10-6 oC-1CTEc 25. x10-6 oC-1Tensile Strengthab --Tensile Strengthc ---ksiInterlayer Spacing 3.36 Angstroms kab 2000. W/mKkc 10. W/mKEab 145. GPaEc 21 GPaCTEab -1.0 x10-6 oC-1CTEc 25. x10-6 oC-1Tensile Strengthab --Tensile Strengthc---
k Technology DivisionAnnealed Pyrolytic Graphite(APG) Thermal Conductivity 1700 W/m-k Al is 200 Density 2.1 g/cc Al is 2.7 g/cc Fragile Hygroscopic
k Technology Divisionk-Core Material Concept Patented Encapsulated APGmaterial system – 3x theconductivity (k) of copper withthe mass of aluminum Annealed pyrolytic graphiteprovides a high k path Encapsulant sets the CTE andstructural properties Encapsulant material selectedto satisfy requirementsEncapsulantU.S. Patent #5296310APG Insert
k Technology DivisionProduction Electronics ModulesFinished part appearanceX-Ray image
k Technology DivisionTypical Performance Comparison SEM E Avionics Application100 W Waste Heat (2)Sides– Dissipating 100 W Per Side– Design Goal - Use COTSElectronic Parts Junction TemperaturesBelow 85 C Baseline Material– 6061-T6 Aluminum40 C @ Rail (2)PlacesFinite Element Model of SEM EModule
k Technology DivisionSEM-E Thermal k-CoreTMAPG MaterialMax Surface Temperature - 59.4 CAluminum BaselineMax Surface Temperature - 152 C
k Technology DivisionF35 Joint Strike Fighter Standard ModuleAluminum BaselineMax Surface Temperature – 59.8 Ck-Core MaterialMax Surface Temperature – 17.5 C Conduction cooled module, F35 standardStandard APG configuration with core personalizationUp to 250 W heat dissipation through coreAluminum encapsulation
k Technology DivisionVME k-CoreTM Power SupplyEncapsulated APGDelta Temp 18oCWeight 204 gmOFHC CopperDelta Temp 24oCWeight 731 gm Conduction cooled VME 1101.2 Format 80 W Heat Dissipation through CoreAluminum EncapsulationAirborne Qualified -- MIL-STD-810C, Cat 6. In ServiceCarbon Fiber CompositeDelta Temp 28oCWeight 172 gm
k Technology Divisionk-Core ProcessTMMaterialsAluminumTarget AssemblyMaterial Prep.GraphiteHIP BondingBonded TargetMachiningFinishing andAssembly
k Technology Divisionk-Core Applications Over TemperatureElectronic PackagingPower ConversionNi/APG ConductorsPower GenerationBeCu/APG ConductorsCryo Conduction BarAl/Cu/APGCold Shield BracketAl/APGRe-entry CarbonCarbon/APG nose cone
k Technology DivisionBi-Metallic k-CoreConduction BarK-Core Aluminum with Copper FlangeBonded and Machined Bi-Metal Bar
k Technology Divisionk-Core VME 1101.2 ModuleAluminum Encapsulated APGRuggedized Conduction Cooled VME Format (IEEE 1101.2)Qualified andFieldedAL/APG Assembly View
k Technology Divisionk-Core Travelling Wave Tube Radar Cold PlateAluminum Encapsulated APG with Copper ViasDoD Radar SystemsCopper Via Section ViewQualified and Fielded
k Technology DivisionMagnesium k-Core
k Technology DivisionDensity ComparisonAl, Al k-Core, Mg, Mg K-CoreComponent WeightWeightOverallDensityMaterial%%Density Improvement(%)APG Encapsulant (gm/cc)6061 Al01002.7BaselineAl k-Core50502.488.1Mg AZ80A01001.833Mg k-Core50502.0325
k Technology DivisionThermal Conductivity ComparisonComponentMaterialVolume%APG6061 Al0100170Al k-Core65351071Mg t(W/m-k)
k Technology DivisionProperty Overview Magnesium k-Core significantly reducesweight– 25% weight reduction below Al– 10 to 20% weight reduction below Al k-Core Thermal conductivity values equivalent toAl k-CoreConclusion-Mg k-Core saves weight withno thermal management penalty
k Technology DivisionPrototype ChassisCompleted k-Core, Prototype Magnesium Chassis(Adhesive Bonded-not hardware suitable)
k Technology DivisionPrototype ChassisData ComparisonChassis CompositionAluminum 6061Magnesium AZ31Bk-Core, Aluminumk-Core, MagnesiumMass (g)MassReduction (%)DeltaTemp (K)TempReduction eline-139%38%40%
k Technology DivisionOther Considerations Cost Reduction Possibilities– Magnesium Forming Technologies such asdie casting may prove useful– The low density of magnesium comparedto aluminum compensates for the higherper pound cost
Annealed Pyrolytic Graphite (APG) Mechanical E1 E2 E3 v12 v13 v23 G12 G13 G23 a1 a2 a3 103 103 11 0.3 0.002 0.002 11 Gpa 6.6 6.6 -6.00E-07 -6.00E-07 2.57E-05 Modulus (GPa) Poisson's Ratio Shear Modulus (GPa) CTE (PPM/K) k Technology Division APG Description As Deposited Pyrolytic Graphite .File Size: 1MB
Description: Synthetic magnesium may be obtained from magnesium carbonate, magnesium chloride, magnesium hydroxide, magnesium oxide, and magnesium sulfate. Nonsynthetic magnesium may be obtained from magnesium limestone and magnesium mica. NOP Rule: 205.237(a), 205.237(b)(2) & 205.603(d)(2) 6.2
Allyl Chloride A - - A Aluminum Acetate (satured) - - - A Aluminum Chloride A B2 A1 A Aluminum Chloride 20% A B2 A1 A Aluminum Fluoride A A2 - A . Magnesium Chloride A A1 A2 A2 Magnesium Hydroxide B A2 A1 A Magnesium Nitrate B A2 A1 A Magnesium Sulfate (Epson Salts) A A2 A1 A Maleic Acid A B2 - A
17. Magnesium has three naturally occurring isotopes. 78.70% of magnesium atoms exist as magnesium-24 (23.9850 amu), 10.03% exist as magnesium-25 (24.9858 amu) and 11.17% exist as magnesium-26 (25.9826 amu). Calculate the average atomic mass of magnesium 18. Which subatomic particle plays t
Allyl Chloride (3-Chloropropene) CH2 CHCH2CI Almond Oil (artificial) . Magnesium Carbonate MgCO3 Magnesium Chloride MgCl2-6H2O Magnesium Hydroxide Mg(OH)2 Magnesium Nitrate Mg(NO3)2-6H2O Magnesium Oxide MgO Magnesium Sulfate MgSO4 Maleic Acid (CHCOOH)2 Maleic Anhydride C4H2O2
Given the fact of widespread Magnesium deficiency, Dr. Mark Sircus, author of the book Transdermal Magnesium Therapy, suggests that one of the best (and easiest) ways to determine Magnesium deficiency is to apply Magnesium chloride transdermally in low doses, and then to assess improvement
1) Magnesium has three naturally-occurring isotopes: Magnesium-24 (78.99%), Magnesium-25 (10.00%), and Magnesium-26 (11.01%). Calculate the atomic mass (in amu) of magnesium. Max Time: 4 min 2) Silicon has three naturally-occurring isotopes: Silicon-28, Silicon-29, and Silicon-30. Their natural abundances
Transdermal* Magnesium is the safest and most effective way to take magnesium *“Transdermal Magnesium Therapy offers a stunning breaktrough in medicine. It’s an entirely new way to supplement magnesium that naturally increases DHEA levels, boosts cellular magnesium level
Aluminum Association's Task Group on Visual Quality Attributes of Aluminum Sheet and Plate. ALUMINUM ASSOCIATION SHEET AND PLATE DIVISION COMPANIES Alcan Inc. Alcoa, Inc. ARCO Aluminum Inc. Coastal Aluminum Rolling Mills, Inc. Corus Aluminium Rolled Products Jupiter Aluminum Corporation Kaiser Aluminum & Chemical Corporation Spectrulite .
