System Scaling - SRC
System ScalingforNew Era of Automotive Electronics: A Largescale Industry Consortium at Georgia Techin Partnership withGlobal Supply-Chain Mfg and OEMsSRC June 7, 2016Prof. Rao R. TummalaJoseph M. Pettit Endowed ChairProfessor in ECE & MSEDirector, 3D Microsystems Packaging Research CenterGeorgia Institute of Technology – Atlanta, GA USArao.tummala@prc.gatech.edu
Outline System Scaling as a Microelectronics TechnologyFrontierNew Era of Automotive Electronics (NAE)Industry Consortium at GT Faculty Industry Partners Facilities Technical Programs 1 SRCComputing and Communication ElectronicsSensing ElectronicsHigh Power and High Temperature ElectronicsSummaryProf. Rao R. Tummala
SYSTEM SCALING AS A MICROELECTRONICSSYSTEMS TECHNOLOGY FRONTIER2 SRCProf. Rao R. Tummala
Georgia Tech PRC Center started with a Vision ForDigital Convergence by SOP Concept in 1993Digital Analog RF Optical Sensors 3 SRCComputing/InternetDigital AudioDigital And, of course, timekeeping!Prof. Rao R. Tummala
GT PRC Started with the 1st NSF ERC in USin System Scaling and Integration (SSI)Univ. of IllinoisMid-America EarthquakeCenterUniv. of MichiganReconfigurable ManufacturingSystemsUniv. of MichiganWireless IntegratedMicroSystemsSUNY BuffaloMultidisciplinary Center forEarthquake Eng. ResearchUniv. of WashingtonEngineered BiomaterialsUniv. of MassachusettsCollaborative AdaptiveSensing of the AtmosphereWAMITBiotechnology ProcessEngineering CenterUC, BerkeleyPacific EarthquakeEngineering Research CenterUniv. of Southern CaliforniaBiomimetic MicroElectronicSystemsCalifornia Inst. of TechnologyNeuromorphic SystemsEngineeringNYMIILCACOVAAZTNSCGAColorado State Univ.ERC for Extreme UltravioletScience & TechnologyFLJohns Hopkins UniversityComputer-Integrated SurgicalSystems & TechnologyVirginia PolytechnicInstitutePower Electronic SystemsClemson UniversityAdv. Engineering ofFibers & FilmsGeorgia Inst. of TechnologyPackaging Research CenterUniv. of ArizonaEnvironmentally BenignSemiconductor Manufacturing4 SRCNortheastern UniversitySubsurface Sensing &Imaging SystemsMDKSUniv. of Southern CaliforniaIntegrated Media SystemsUniv. of KansasCenter for EnvironmentallyBeneficial CatalysisMAVanderbilt UniversityBioengineering EducationalTechnologyUniv. of FloridaParticle Science & TechnologyProf. Rao R. TummalaGeorgia Inst. of TechnologyCenter for the Engineeringof Living Tissue
SOP @ PRC“Package is the System”System: Convergent Computing,Communication, Consumer & BiomedicalSOP5 SRCProf. Rao R. Tummala
IC-Package TrendSOC6 SRC 2D MCM 3D ICs SIPProf. Rao R. TummalaSOP
Outcomes of Georgia Tech’s NSF ERC & ModelResearch & Infrastructure System Scaling for Smart phones2000 ground-breaking publications20 Faculty and 150 grad students100 Best Paper Awards 40M SOA LaboratoriesGlobal IndustryCollaborations Education Interdisciplinary Engineers Ph.D 500,MS 570,BS 340 Created 20 new courses 1st undergrad & 1st Grad. bookDisruptiveTechnology:SystemScaling150 US, 25 Jap., 10 Eu, 10 Korean10 Spin-off and spin-in companies70 Patents, and 166 IP licenses97 Technology transfers7 SRCFunds RaisedEconomic Development Raised 250M for research 350M to State of GeorgiaeconomyProf. Rao R. Tummala
An Example of System Scaling vs.Transistor Scaling10,0001,0001,000Gap Consumer High BW Automotive100Transistor Scaling (Node)1001960197019801990Year2000Courtesy: S.S. Iyer, IBM8 SRC100Prof. Rao R. Tummala20102020bump pitch(um)Node dimension (nm)System Scaling (I/O Pitch)
Basis of System ScalingRESEARCHSystem Moore(SM)System IntegrationHighUltra-Small Systems: IOT,Wearables, Medical and yMore ThanMoore(MTM)MedMANUFACTURINGLowLaptops & Tablets,Auto & BioMore of Moore (MM)High Performance Computers1960 197019801990200020102020Year9 SRCProf. Rao R. Tummala2030
3D System Package – A Fundamental Concept1. Ultra-thin, Large, Low CTE, HT Substrates2. Ultra-short TSV-like System Interconnects Signal vias, power vias, photonic viasand Large Thermal ViasLogic3.4.5.6.Ultra Low-loss Materials & InterconnectsBalanced Fine-pitch RDL for Min. WarpageHigh-temp & High-power Cu-Cu InterconnectsHigh-throughput Panel Mfg and Panel AssemblyRFPowerMEMS & SensorsRDLVia Pitch2µm–5µm5-10µmUltra-thin & largeGlass Substrate510 mm to 1000 mm in the future3D Memory10 SRCPhotonicProf. Rao R. TummalaIPD30µm30µm250 CThermal
NEW ERA OF AUTOMOTIVE ELECTRONICS(NAE)11 SRCProf. Rao R. Tummala
NAE: Most Complex Electronics System Wireless ElectronicsSensor ElectronicsCamera Electronics4G LTEDigital ElectronicsMEMS and SensorsPower Electronics Sensing Electronics forAutonomous Driving Radar, LiDAR, Cameras High-power and Hightemp for Electric Cars GaN, SiC devices Metal-insulators Healthcare ElectronicsEtc New Era of Automotive Electronics (NAE)is the Most Complex Electronic System12 SRCProf. Rao R. Tummala
Global Challenges in New Era of Electronics New TechnologiesEducated WorkforceGlobal Manufacturing Supply-chainComponent IntegrationSystem AssemblyRoadmapsStandards13 SRCProf. Rao R. Tummala
3 Main Reasons for NAE1. Reducing Human Fatalities 94% of 33,000 Deaths in the U.S., and 1.3M globally due tohuman error2. Improving Driving – Energy Efficiency3. Improving Human ProductivityMany, Many moreMercedes-Benz F 015 Luxury in Motion ResearchCar14 SRCProf. Rao R. Tummala
Grand Challenges inAutomotive Electronics (Ford)MP3 and ConnectivityCruise ControlHybridSatelliteTelematicsFlex FuelBattery VehiclesDisplaysanalogLEDsSoftwareFlex OLED0(1000)Networks1ECUs0(1M)241RFAMLength of wiresPowerLCDsFMCellular 50 meters15 SRC?6?4G? 2 kilometers? 2000 Watts?Collison avoidancelead acid19000(10M)?Sat.Autonomous Driving1850?80 200 WattsBatteryH2 Fuel Cell1925NiMH19501975Li-ion / Li-poly2000Prof. Rao R. Tummala?2006 2025NAEGrandChallenge
NAE: Ultimate Electronic System OpportunityComputing&CommunicationElectronics 5G High Bandwidth Electronics PhotonicsSensingElectronicsHigh Power &High TempElectronics16 SRCProf. Rao R. Tummala Radar Lidar CamerasBatteriesDrive TrainPower Distribution &Power Conversion
Global Ecosystem for NAE –From R&D to System IntegrationOEMsFunctional IntegrationComponentsDevices, Components & SubstratesSupply Chain Materials and ToolsResearch and Development17 SRCProf. Rao R. Tummala
INDUSTRY CONSORTIUM AT GT18 SRCProf. Rao R. Tummala
Georgia Tech Industry ConsortiumUniquenessof GT PRCState shipFacultyExpertise300mmCleanroomPilot Facility19 SRCProf. Rao R. Tummala
Automotive Programs in the South EastOrganizationEmphasisNTRC – National Transportation ResearchCenter, Oak Ridge, TNImproving fuel economy, reducing emissions andaddressing transportation systems issuesCTR – Center for Transportation Research,Univ. of Tennessee, KnoxvilleConduct research; develop expertise; servetransportation research, service and training needsCU-ICAR – Clemson Univ. - InternationalCenter for Automotive ResearchCampus is an automotive ecosystem that helpscompanies make connections and build relationshipsCAVE-3 – Center for Advanced Vehicle andExtreme Environmental Electronics, AuburnUniv.New technologies for packaging electronics withemphasis on cost, harsh environment and reliabilityCAVT – Center for Advanced VehicleTechnologies, Univ. of Alabama, TuscaloosaPowertrains, energy storage, materials andmanufacturing and other automotive electronicsCAVS – Center for Advance VehicularSystems, Mississippi St. Univ., StarkvilleEngineering solutions for design, technology,production, and infrastructure for sustainable mobilityATDC – Advanced Technology DevelopmentCenter, EI2, Georgia TechStartup incubator that helps technology entrepreneursin Georgia launch and grow successful companiesVenture Lab, EI2, Georgia TechRanked #2 University based incubator in the worldNCTSPM – National Center forTransportation Systems Productivity andManagement; Ga Tech, FL International Univ,Univ. Central FL, Univ. Alabama BirminghamTier 1 University Transportation Center(UTC) that conducts transportation related researchin the areas of safety, state-of-good-repair, andeconomic competitiveness20 SRCProf. Rao R. Tummala
Uniqueness of GT Consortium Leading-edge, precompetitive, 100 global researchers,developers, manufacturers and OEMSCo-development by all 50 companiesDevice-Package synergy and system integrationBasic research by Ph.D and MS studentsIntegration and prototype research by GRAs, companyengineers and GT research facultyLong-term roadmap with 2 year deliverables21 SRCProf. Rao R. Tummala
Georgia Tech Faculty ExpertiseDesignProf. GrahamThermalProf. JoshiThermalProf. SitaramanMechanicalProf. DupuisGaNProf. ShenGaNI&AProf. AntoniouSintered Cu22 SRCDr. SmetNon-solderProf. HeskethSensorsProf. TentzerisRF 5GMaterialsDevices: SiGe, GaN, MEMS and SensorsProf. CresslerSiGeProf. ChangOpticalProf. LosegoDielectricsProf. WongEncapsulantsSubstratesPassivesDr. SundaramGlassDr. RajRF & PowerLidarCameraSystem IntegrationSoftwareDr. TuellModeling & DesignProf. WolterFabricationProf. TummalaTechnology IntegrationDr. ChristensenSoftwareProf. Rao R. Tummala
300mm Cleanroom Pilot Facility and LabsPlating FacilityEnvironmental Testing23 SRCSubstrate CleanroomAssembly FacilityShared User LabsProf. Rao R. Tummala
Partnership with Tool CompaniesDisco Dicing Saw and PlanerESI Cornerstone Laser24 SRCXYZTEC Bond TesterMKS Ozone CleanerProf. Rao R. TummalaUshio Projection LithographyK&S APAMA Bonder
Global Industry Co-development Consortium at GT PRCUNITED STATESBrewer Sci - PolymersCorning – GlassApplied Materials – PVD,CVD ToolsCoherent – LaserESI – LaserK&S – TCB BonderMKS – Plasma EtchingTango – PVD ToolsVeeco - CleaningQualiTau – AssemblyAVX – PassivesCiena – OptoGlobal FoundriesIntel – DigitalQualcomm – AllTE – OptoTI – PassivesMaterials25 SRCEUROPEHC Starck – CapacitorsSchott – GlassAtotech – PlatingSuss – Laser ViaXyztec – AssemblyTDK-Epcos – RFASIAOrbotech – MetrologyCHINAJCET – BumpingKOREAGigalane – RFTAIWANUnimicron – 2.5DASE – AssemblyTSMC – UserToolsSubstratesProf. Rao R. TummalaAssemblyJAPANAjinomoto – Dry FilmAsahi Glass – GlassMGC – LaminatesTOK – PhotopolymerAsahi Glass – TPVDisco – DicingMitsubishi Electric – LaserUshio – LithographyNGK/NTK – 2.5DShinko – 2.5DNamics – UnderfillUsers
Additional Recent Industry InterestEUROPEUNITED rContinentalNitto StellarUSCIVeeco26 SRCProf. Rao R. TummalaFujiFilm
GT PRC 2016 Industry Consortia Members27 SRCProf. Rao R. Tummala
Fundamental Challenges & Trends in Electronics1.ICsICsDevice PackagingSystems Packaging IC 14nm: no cost Front end: leakage Back end: RC delay Split SOC inevitable Digital: Organic, Si RF: LTCC & laminate Power: embeddedfanout Bulky and expensive SIP MCM 2.5D Interposers with3D ICsTrend: 2.5D Si Interposer 2.5D Glass BGA(GT)Trend: WLFO PFO: Glass by GTTrend:System on Board 3D SystemArchitecture (GT)28 SRCProf. Rao R. Tummala
Packaging Evolution to Glass Pkg, &Wafer ate&WLP1970s1980s1990s29 SRCProf. Rao R. TummalaChip-first andChip-last PanelFanout GlassPackagingWafer Packaging WLP WLFO Si Interposer
Wafer vs. Panel Fanout Wafer FO: Promise of Ultimate I/O Density Reality: Limited by materials and processesLimited to 300 mm so limited to small size packagesHigh cost for large multi-chip or SIPReliability and lithography limited by molding materialsOne-stop shop for IC and packagePanel FO: Promise of Ultimate Low Cost Reality: Low costLimited in I/O densityLimited by polymer materialsLimited by large area sub-micron toolsLimited by large panel foundry investmentsFuture: Ultimate I/O Density and Ultimate Low Cost!30 SRCProf. Rao R. Tummala
GT Industry Consortium Technical StrategyHigh TempMaterial &ReliabilityRF(WLAN <E)High Power& Reliability3D StereoCamera5G &mm-waveResearchFocusLidarRadar31 SRCPower(Low &Wireless)GlassFanout2.5D GlassInterposer3D GlassPhotonicsProf. Rao R. Tummala
Basic & Design & Demonstration Research (2016-'18)8. High-temp Electronic Materials High-temp polymers High-temp passives High-temp interconnections High-temp encapsulants1. Design Electrical: signal & powerintegrity Mechanical: warpage & reliability Thermal: Cu TPVs, evaporationand condensation2. Electronic Substrates High-temp TPVs 1µm RDLs TPV & RDL reliabilityD&D Test Vehicles7. High-power/High-speed Switch and Gate Driver Metal Insulator substrates Embedded power chips & passives Sintered-Cu interconnection6. Devices GaN,SiC, SiGe, MEMS andSensors OEIC, RF ICs, and Digital ICs32 SRC1. Computing & CommunicationsElectronicsA. RF (WLAN & LTE)B. Power (Low & WirelessC. 5G and mm-waveD. 2.5D Glass InterposerE. 3D Glass PhotonicsF. Glass Fanout2. Sensing ElectronicsA. RadarB. LidarC. Camera3. High-power & High-temp ElectronicsA. High-powerB. High-temperature 5. Interconnects & AssemblySLID bondingLow-temp Cu-Cu interconnectsHigh-throughput TCBDirect-SMT of Glass BGAPre-applied underfillProf. Rao R. Tummala 3. Photonic SubstratesSingle and multi-modeOptical viasWG and turning structuresFiber coupling4. ComponentsCapacitors DiplexersInductors AntennasEMI shields Wireless powerPA thermal
Si-like I/Os with Glass PackagingProf. TummalaParameterDr. SundaramPrior to 20142014-20162016-2018TPV Glass Thickness180 µm100µm30-50µm TPV Pitch150-200µm100-120µm50µm Line- Space- Via5-5-15µm3-3-8µm1.5-1.5-2µm Layer Count2 23 34 4RDL33 SRCProf. Rao R. Tummala
What is a System Scaling Platform?Ultra-thin Panel Glass with Ultra-fine Pitch TPV & RDLCharacteristicMaterialsIdeal PropertiesElectrical High resistivity Low loss and low kPhysical Smooth surface finish Large area availability Ultra thinThermal High ConductivityMechanical High strength & modulus Low warpageChemical Resistance to processchemicalsTPV and RDLCost Low cost Via formationand metallizationReliability CTE matched to Si andPWBCost/mm2 At 25µm I/O pitchGlassSC SiPoly SiGood34 SRCProf. Rao R. TummalaOrganicFairMetalPoorCeramic
Leading Advances in Glass PackagingProf. TummalaDr. SundaramTPVs in Glass @ TSV Pitch2um RDL @ 20-40um Pitch20um40umPitch20umGlass10umMultilayer Glass Substrate POR35 SRC2.5D with 40um Pitch1st Demo at 20um PitchSingle Mode Photonics IntegrationProf. Rao R. Tummala
Prof. TummalaSi-like RDL on Glass Panelsfor Low Cost2.0 μm L/SDr. Sundaram1.5 μm L/SDry film resistwet processingExtending SAP to 40 μm Pitch &Beyond Enabled by Glass36 SRCVia in Line at 20 μm Pitch MultilayerRDL - 1st time on PanelProf. Rao R. Tummala
Georgia Tech Glass Embedded FanoutSi-like I/Os, Laminate-like CostReduced Die ShiftSilicon-like RDLUltra-fine Pitch I/OsSame Cost asLaminate Panel1.92 um space2µm lines and vias /-1um RegistrationGaAsIPDDirect Attach toBoard with ReliabilityICUltra-low Loss up tomm-waveHermeticsUltra-thinNo MoldingCompound37 SRCGlassProf. Rao R. Tummala
Interconnections &Assembly ResearchProf. TummalaDr. SmetManufacturability106All-Cu5x105Cu pillar IMCsTCB105SLID bondingImprovemanufacturability104Cu pillar solderCu pillar solderC4 bumpsPitch scaling103TC-NCPReflowI/O pitch (µm)Reflow11038 SRC80Prof. Rao R. Tummala402010
RF Components &Modules ResearchProf. TummalaDr. RajMaterials design and synthesis for better propertiesNanoparticlesNanofilmsPolymer filmsThinfilm components with better performance &precisionPassive integration on substratesPassive with Actives to form modulesPAFilterDiplexerGlassSwitch39 SRCProf. Rao R. TummalaFilterPCB
Power Module ResearchProf. Tummala Dr. SharmaDr. RajDesign and demonstrate low power module forconsumer electronics with following attributesMiniaturizedHigh PowerHandlingState-of-the-art power module40 SRCLow CostPRC’s proposed power moduleProf. Rao R. Tummala
5G ResearchProf. Tummala Prof. Tentzeris Dr. RajDr. SundaramExplore novel designs, materials, processes and 3D packagingstructures and RF components to build 5G-enabled modules thataccommodate V2X applications with superiority over LTCC andorganic packages in terms of:1.2.3.4.5.6.7.41 ability (e.g.transparent)IoT compatibilityBroadband/multiband(e.g. 5.9GHz/mmW) of. Rao R. TummalaRec ICChip-last
Prof. Chang 3D GlassPhotonics ResearchDr. LiuDemonstration of low loss optical interconnectsintegrated with high speed electronics in 3D GlassPhotonics (3DGP) interposer for optimum EnergyEfficiency, Density, and CostDriverSi PICSMF42 SRCProf. Rao R. TummalaDr. Sundaram
mm-Wave AutomotiveRadar ResearchProf. Cressler Prof. TummalaObjectives: Extended Range (Low SNR) byLNA chip-package Synergy SiGe for high speed and Si Mfg. Board-Level Reliability Low-cost Three Focus Areas Device Innovation Package Innovation Chip-Package Co-DevelopmentShort, Medium and Long Range RADAR ModulesCritical to Fully Autonomous Driving43 SRCProf. Rao R. TummalaDr. Sundaram
Lidar ResearchProf. Wolter Dr. TuellDesign and demonstrate a 3D Glass Packaging platform for waveformresolved Lidar module to support integrated collision avoidanceAbility to see through fog/dust/rain/snow.Electrically steerable optical transmitter & receiver array enables highspatial and temporal resolutionSmaller form factor for flexible integration (50x50x20) mm3Reaction time: 1 msecHigh reliability due to solid-state Lidar system44 SRCProf. Rao R. Tummala
Camera ResearchProf. Wolter Prof. HeskethDesign and demonstrate most advanced and miniaturized mono andhigh speed stereo camera with integrated image processing.Reaction time: 1 msecHigh frame rate on demand: 1000 fpsOptional wireless data transmission using Wi-Fi and BluetoothLow cost and High Reliability for operation time up to 20,000 hours45 SRCProf. Rao R. Tummala
Prof. Joshi Prof. Dupuis Prof. Shen High Power & High-tempElectronics ResearchDr. RajDr. SmetIntegrated power, control and drive ultra-thinCTE-matched “zero-stress” 3D integrationLow thermal impedance, no liquid coolingLow costDesign for high-temperature ( 250 C), Hi-Rel.: Glass Power Embeddingµ-controllerGate driverMicrocontrollerDriver3D IPDHigh-temp glass substratePower switchThin filmPower diodeLow-CTE & High Thermal ConductivityinterconnectionsinsulatorHeat sink46 SRCLow-cost sinteredProf. Rao R. Tummala
Summary NAE is the Most Complex Electronics System,Requiring: Technologies and Educated Workforce Partnership with Manufacturing Supply-chain and OEMsGeorgia Tech Large-scale Global Industry ConsortiumInvolves about 100: 47 SRCResearchersDevelopersManufacturers, andOEMsProf. Rao R. Tummala
Thank yourao.tummala@ece.gatech.edu
Center for Environmentally . Beneficial Catalysis. Univ. of Massachusetts. Collaborative Adaptive Sensing of the Atmosphere. Univ. of Michigan. Reconfigurable Manufacturing Systems. Univ. of Michigan. Wireless Integrated MicroSystems. SUNY Buffalo. Multidisciplinary Center for Earthquake Eng. Research. Univ. of Illinois. Mid-America Earthquake .
Measurement and Scaling Techniques Measurement In Research In our daily life we are said to measure when we use some yardstick to determine weight, height, or some other feature of a physical object. We also measure when we judge how well we like a song, a File Size: 216KBPage Count: 23Explore further(PDF) Measurement and Scaling Techniques in Research .www.researchgate.netMeasurement & Scaling Techniques PDF Level Of .www.scribd.comMeasurement and Scaling Techniqueswww.slideshare.netMeasurement and scaling techniques - SlideSharewww.slideshare.netMeasurement & scaling ,Research methodologywww.slideshare.netRecommended to you b
AWS Auto Scaling lets you use scaling plans to configure a set of instructions for scaling your resources. If you work with AWS CloudFormation or add tags to scalable resources, you can set up scaling plans for different sets of resources, per application. The AWS Auto Scaling console provides recommendations for
CPU_SEL 01 CPU0/1 133MHz (default) CPU0/1 100MHz 03 Place each 0.1uF cap as close as possible to each VDD IO pin. Place the 10uF caps on the VDD_IO plane. EC-A-10 R220 10K_4 CK505 QFN32 U24 ICS9LRS3197AKLFT 18 VDD_CPU_IO SRC-2 13 15 VDD_SRC_IO 2 VSS_DOT 27M_SS 7 DOT96# 4 SRC-1/SATA 10 SRC-1#/SATA 11 SRC-2# 14 27M 6 DOT96 3 21 VSS_CPU CPU-1 20 .
Memory Scaling is Dead, Long Live Memory Scaling Le Memoire Scaling est mort, vive le Memoire Scaling! . The Gap in Memory Hierarchy Main memory system must scale to maintain performance growth 21 3 227 11 13 2215 219 23 Typical access latency in processor cycles (@ 4 GHz) L1(SRAM) EDRAM DRAM HDD 25 29 217 221 Flash
strategy. It provides an overview of scaling frameworks and models, together with a set of case studies of scaling strategies applied by organisations within and outside the YBI network. Different models for scaling and replication are introduced by means of frameworks developed by innovation and scaling experts Nesta and Spring
The scaling plans included growth goals, plans for achieving the goals, resources to be invested in scaling, planned actions to achieve goals, plans for . Scaling Programs and Growing Impact with the Social Innovation Fund Issue Brief #7: Scaling Programs and Growing Impact with the Social Innovation Fund .
Gustafson’s law [5], and Sun-Ni’s law [6], are no longer ad- . over whether scaling-out is indeed better than scaling-up or not [15]. Second, as the existing scaling laws are increasingly . non-linear, monotonic or peaked) major scaling properties
KDC-X397 KDC-MP155U KDC-155U KMR-355U KDC -X397 KDC-355U KDC 255U KDC-MP255U BASICS To Do this (on the faceplate) Do this (on the remote control) Turn on the power Press L SRC. Press and hold to turn off the power.*1 Press and hold SRC to turn off the power. ( Pressing SRC does not turn on the power. ) Adjust the volume Turn the volume knob.
