High-Performance/High-Reliability Semiconductor Discrete .
High-Performance/High-ReliabilitySemiconductor Discrete Devices
Proven Performance and LeadershipAs a world-class supplier of RF microwave components for today’s wireless communication systems,Skyworks continues to deliver the highest performance Silicon and GaAs discrete products. Buildingon a proven legacy (which includes products developed at Alpha Industries prior to its merger withSkyworks), these innovative solutions are manufactured using the most advanced processes, drivenby decades of experience and industry leadership.With market demands constantly changing, Skyworks is committed to expanding its microwaveportfolio to meet a wider range of applications including radar, point-to-point, point-to-multipoint,cellular, military, space-based communications, and other wireless microwave functions. As always,all of our solutions are backed by world-class customer service, advanced manufacturing capabilities,and leadership technology.The Right Design Choice Starts HereWe invite you to review our complete catalog of packaged and unpackaged semiconductor diodes,passive elements, and switches for specific RF and microwave applications. Products include siliconvaractors, PIN diodes, Schottky diodes, GaAs Schottky diodes, passive elements, and PHEMT-basedswitches. Design engineers will find this catalog especially useful in finding the key specificationsfor Skyworks’ semiconductor products to easily select appropriate part numbers.For more information—including how we can help you design the perfect solution for yourapplication—contact our dedicated team of engineers at sales@skyworksinc.com. They havethe experience and technical expertise to answer any of your questions.Visit www.skyworksinc.com for regularly updated technical data, application notes, and newproduct information. Silicon Diodes: Limiter, PIN, Schottky, Varactor Silicon Passive Devices: Fixed Attenuator Pads, MIS Chip Capacitors GaAs Schottky Diodes GaAs IC Switch Devices2W W W. S K Y W O R K S I N C . C O M
CertificationsAs an industry leader, Skyworks has demonstrated its quality leadership and strengthened its commitment to customersatisfaction through formal, third-party registration to ISO 9001, ISO/TS 16949, ANSI/ESD S.20.20, and ISO 14001.ISO 9001ISO 14001Through our Green Initiative , we are committedISO 9001 is an internationally recognized Quality ManagementSystem standard that promotes customer satisfaction throughto manufacturing products that comply with globalcontinual improvement of the system’s effectiveness. ISO 9001government directives and industry requirements.provides a model for a Quality Management System which focuseson the effectiveness of the processes in a business to achievedesired results. The standard promotes the adoption of a processapproach emphasizing the requirements, added value, processperformance and effectiveness, and continual improvementthrough objective measurements.OttawaCedar RapidsAndoverWoburnNewbury ParkIrvineMexicaliANSI/ESD S.20.20Electrostatic Discharge Control Program for Protection of ElectricalISO 9001ANSI/ESD S.20.20ISO 14001ISO/TS 16949ANSI/ESD S.20.20 is a standard for the Development of anSingaporeand Electronic Parts, Assemblies and Equipment. The standardcovers the requirements necessary to design, establish, implement,and maintain an Electrostatic Discharge (ESD) Control Program.ISO/TS 16949One of the major challenges facing today’s manufacturers is that, even though there is a low failure probability for each individualcomponent, the total failure probability for all parts combined may reach unacceptable levels. The ISO/TS 16949 standard answers thischallenge by defining requirements focused on continual improvement, and the understanding of process interaction. It also creates animplementation framework for customer specific requirements, and includes clear requirements for development processes and techniquesto prevent problems in the earliest possible stage of product development.Jointly developed by International Automotive Task Force (IATF), ISO/TS 16949 is the automotive industry’s international qualitymanagement system standard intended to answer the need for global consistency, continual improvement, and increased customersatisfaction. It is approved and released by the International Organization for Standardization (ISO).W W W. S K Y W O R K S I N C . C O M3
What Certification Means to YouQuality Testing Programs Partnering with a company that has made a commitment toEnvironmental and electrical tests are used to verify andquality Doing business with an organization with a recognizedmanagement system model Assurance that necessary resources have been dedicatedimprove the reliability of commercial semiconductorcomponents.Six Sigma Consistent processes and productsAs we strive for continuous improvement, Skyworks has A management team that has establishedadopted the Six Sigma approach, a practical methodologyclear quality objectives and targets that arethat applies statistical tools and methods to aid in continuousconstantly monitored and analyzedprocess improvement. Quality systems and procedures that are continuously auditedand improvedQuality PolicySkyworks has adopted a simple yet powerful quality policy thatguides business decisions day-in and day-out.Quality Conformance TestingQuality conformance testing (also called lot acceptance testing),is testing performed on a sample of the lot to determinethat the devices meet specified electrical and mechanicalrequirements.Skyworks is committed to the never-ending quest for perfectQualification Testquality.Qualification testing is used to determine that the manufacturerOur ultimate goals:of a device can supply devices that meet the full electrical No Field Failuresand environmental capability requirements of the customer’s No Customer Returnsspecification. Skyworks qualification testing is conducted No Reliability Failuresaccording to JEDEC standards. No Yield LossOngoing Reliability Monitoring ProgramISO 14001:2004The reliability monitor program is administered and executed byAs an industry leader, Skyworks is committed to the protectionthe Quality Assurance Department. The intent of this programand preservation of the environment in all its businessis to:operations. We understand that our actions today can have Provide an ongoing evaluation of our product reliability.environmental impacts tomorrow. Improvements at our facility Maintain a pulse on the fabrication and assembly processes.will affect our customers and ultimately consumers. To this Samples are selected quarterly from representative qualifiedend, we have an established ISO 14001 certified Environmentproducts from the production line that have passed functionalManagement System by which we operate. We build productselectrical test. The product selection lists will includein consideration of regulatory and industry requirements, suchconsiderations for forecasted product volume and customeras Restriction of Hazardous Substances Derivative (RoHS), andrequests.offer lead (Pb)-free, RoHs-compliant, and Green solutions tomeet the needs of our customers in today’s environmentallyconscious market.4W W W. S K Y W O R K S I N C . C O MPlease refer to Table 1 for quality testing, and Table 2 forongoing reliability monitoring program information.
Wide Variety of Devices forHigh-Performance ApplicationsSkyworks offers a variety of hermetic and epoxy packaged devices, as well as unpackaged diceand beam-leads, in various configurations for all your high-performance applications fromlow frequency to 100 GHz. For more information, please refer to Skyworks’ complete catalogof packaged and unpackaged semiconductors, Semiconductor Discretes for RF-MicrowaveApplications, CAT501-09A. Silicon Diodes: Limiter, PIN, Schottky, Varactor GaAs Schottky Devices Silicon Passive Devices: Fixed Attenuator Pads, MIS Chip Capacitors GaAs IC Switch DevicesWhen requested, Skyworks will perform JANS level high-reliability testing on packaged devices in accordance withMIL-PRF-19500 and Element Evaluation on unpackaged dice and beam-lead devices in accordance with MIL-PRF-38534.Skyworks also offers lot approval services for sensitive circuits.Designer Kits Are AvailableSkyworks Designer Kits feature samples of a variety of leading-edgeBUYNOWcomponents, with data sheets and comprehensive application notessupplied on CD. From amplifiers to front-end modules to varactor diodes,Skyworks designer kits allow you to quickly convert your creativity intoworking designs.Innovation to GoTMDesigner KitsSelect products and sample/designer kits available online.www.skyworksinc.com KIT606-10A Silicon Limiter Diode Chips KIT601-10A MIS Chip Capacitors for Hybrid Circuit Applications KIT605-10A GaAs Schottky Diode Flip Chips for Mixer and Detector Applications KIT619-10A Fixed Attenuator Pads (ATN3590) KIT604-10A Silicon PIN Beam-Lead Diodes for High Frequency Switch Applications KIT603-10A Silicon PIN Diode Chips for Switch and Attenuator Applications KIT607-10A Silicon Schottky Diode Chips for Mixer and Detector Applications KIT609-10A Varactor Diodes for VCO, Phase Shifter and Filtering Applications KIT616-10A Varactor Diodes: Hyperabrupt and Abrupt Chips for VCO and Phase Shifter Applications KIT615-09A RF Passive Devices KIT614-10A Diodes (SMT Limiter, PIN, Schottky, Varactor) KIT617-10A Smart Energy SolutionsW W W. S K Y W O R K S I N C . C O M5
Table 1. Product Qualification TestingTestDynamic operatinglife (HTOL)Quantity(SS x Lot)77 x 1ConditionsTCASE 125 C or TJ or TCH 150 C;Depends on accel factor and lifeexpectancy. Typically 1000 hoursStandardJESD22-A108EndpointsElectrical test, pre andpost stress with additionalreadpoints per qualification planAccept Criteria0 fail/77ESD – HBM3 per level perpartitionPost-zap1 positive discharge and 1 negative discharge per pin for each pin combinationJESD22-A114Electrical test,pre and post stressPass/fail criterion isATE functional testw/production limitsESD – MM3 per level perpartitionPost-zap1 positive discharge and 1 negative discharge per pin for each pin combinationJESD22-A115Electrical test,pre and post stressPass/fail criterion isATE functional testw/production limitsESD – CDM3 per levelPost-zap3 discharges per pin; field-induced,charge-discharge methodJESD22-C101Electrical test,pre and post stressPass/fail criterion isATE functional testw/production limitsJESD22-A113Electrical test,pre and post stress0 fail/231JESD22-A110 (HAST)-A101 (THB)-A102 (AC),-A118(unbiased HAST)Electrical test,pre and post stress3% LTPD (0 fail/77)Preconditioning231 x 1Sequence: visual inspection min. 25X,24 hr bake at 125 C, moisture soak perMSL, reflow 3xHAST or THB orunbiased HAST orautoclave77 x 196 hrs, 130 C, 85% RH, 18.6 psig or1000 hrs, 85 C, 85% RH, or 96 hrs,121 C, 100% RH, 15 PSIG; preconditioned samplesTemperature cycling77 x 1-65 C to 150 C 500 cycles, or-55 C to 125 C 1000 cycles.Preconditioned samplesJESD22-A104Electrical test,pre and post stress3% LTPD (0 fail/77)High temperaturestorage77 x 1150 C500 hours (preproduction)1000 hours (production)Preconditioned samplesJESD22-A103Electrical test,pre and post stress3% LTPD (0 fail/77)6W W W. S K Y W O R K S I N C . C O M
Table 2. Ongoing Reliability Monitoring ProgramTestDynamic operating life (HTOL)Quantity77/lotStandardJESD22-A108Endpoints48 or 168 hours,and 1000 hoursAccept Criteria0 fail/77154/lotJESD22-A1133X reflow0 fail/154HAST or unbiased HAST or autoclave77/lot (from PC)JESD22-A110 (HAST)-A102 (AC),-A118 (unbiased HAST)96 hours3% LTPD (0 fail/77)Temperature cycling77/lot (from PC)JESD22-A104500 cycles3% LTPD (0 fail/77)Preconditioning (PC)*Temp. cycle and THB/autoclave will be redone if the moisture sensitivity classification changes, otherwise these tests are repeated each year.ESD AwarenessClothingSkyworks deploys state-of-the-art ESD controls from waferAn ESD-protective garment (smock, etc.) shall be used at thefabrication through to assembly, test, and pack. In order toworkstation. While a person may be grounded using a wrist strapmaintain device integrity, Skyworks has outlined critical ESDor foot strap, that does not ensure that certain clothing fabricsguidelines that should be followed as a minimum. Skyworkscan dissipate a charge to ground. The use of a conductive smockadheres to the requirements outlined in MIL-HDBK-263, MIL-is required.STD-1686 and ESD Association 2.0 Handbook. GaAs productscan be damaged at ESD voltages in the 250 V range. In this case,strict adherence to ESD Class 0 guidelines is recommended.Device HandlingRemove ESD-sensitive devices from protective containers atapproved ESD work stations only.FloorsConductive or dissipative ESD flooring shall be utilized wheneverpossible. This flooring shall be checked for ESD properties on aregular basis.Work SurfacesYour ESD work surface shall be covered with soft dissipativeESD wrist straps are required when handling devices outside theirmaterial. This surface shall be tied to earth ground and shall beESD-protective packaging.configured in a common point ground. In addition, the workAll personnel shall be properly grounded (footstraps/wrist straps)surface shall be free of any static generating material, such asprior to opening static shielding bags.nonessential plastics, or cellophane tape.ESD-sensitive devices should always be handled by the part body.EquipmentAvoid touching the leads. When hand tools are requiredto accomplish an operation, use only tools that are dissipative,conductive, or treated with topical antistat.ESD WorkstationYour ESD-safe work area should follow the requirementsAll equipment used to process ESD-sensitive devices shall bechecked for the generation of static charging. Whether solderingirons, wave solder machines, device insertion machines or testequipment, the generation of static electricity is of concern.outlined in MIL-HDBK-263 and ESD Association Handbook 2.0.ESD Component ClassificationsThe following requirements are strongly recommended:ESD-sensitive components are classified according to theirPersonnelESD withstand voltage using the test procedure described inthis standard. The HBM ESDS components classification levelsThe use of constant wrist strap monitors is highly recommended.are shown in Table 3. Screening requirements and inspectionThis monitor guarantees that the connection to ground isinformation are shown in Table 4.continuously made. An alarm will sound when that connection isbroken.W W W. S K Y W O R K S I N C . C O M7
Table 3. ESD Component ClassificationJEDEC StandardTestClassVoltage RangeJESD22-C101Charged-Device Model CDM1 200 VJESD22-C101Charged-Device Model CDM2200–500VJESD22-C101Charged-Device Model CDM3500–1000 VJESD22-C101Charged-Device Model CDM4 1000 VJESD22-A114Human Body Model HBM0 250 VJESD22-A114Human Body Model HBM1A250–500 VJESD22-A114Human Body Model HBM1B500–1000 VJESD22-A114Human Body Model HBM1C1000–2000 VJESD22-A114Human Body Model HBM22000–4000 VJESD22-A114Human Body Model HBM3A4000–8000 VJESD22-A114Human Body Model HBM3B 8000 VJESD22-A115Machine Model (MM)A 200 VJESD22-A115Machine Model (MM)B200–400 VJESD22-A115Machine Model (MM)C 400 V8W W W. S K Y W O R K S I N C . C O M
Table 4. Screening Requirement in Accordance with Table SJANTXVJANTX 1Visual InspectionMIL-STD-750 – Method 20732Pre-Cap InspectionMIL-STD-750 – Method 2070 3High-Temperature BakeMIL-STD-750 – Method 1032t 340 Hrs. 4Temperature CyclingMIL-STD-750 – Method 105120 Cycles. Condition C 5Thermal ImpedanceMIL-STD-750 – Method 3101 6Constant AccelerationMIL-STD-750 – Method 200620,000Gs Min., Y1 Axis Only 7PINDMIL-STD-750 – Method 2052Condition A 8Initial Electrical TestSerialize, Read & Record 9High-Temperature Reverse BiasCondition A, t 48 Hrs. 10Interim ElectricalsRead and Record 11Burn-inCondition B, (JANS t 240 Hrs.,JANTX & JANTXV t 96 Hrs.) 12Final Electrical TestGroup A, Subgroup 2 and 3.Read and Record 13Delta CalculationCompare Interim Test to Final Test 14PDAPercent Defective Allowable(JANS 5% Max.; JANTX andJANTXV 10% Max.) 15Fine LeakMIL-STD-750 – Method 1071Condition H 16Gross LeakMIL-STD-750 – Method 1071Condition C 17X-RayMIL-STD-750 – Method 2076 18External Visual InspectionMIL-STD-750 – Method 2071 Sample Size: JANS 15(0),JANTX and JANTXV 45(0) Electrical TestingDC (static) @ TA 25 C,Sample Size 116(0) Electrical TestingDC (static) @ Min. and Max. OperatingTemp., Sample Size 116(0) Electrical TestingDynamic @ TA 25 C,Sample Size 116(0) MIL-STD-750 – Method 1038MIL-STD-750 – Method 1038Group A Inspection in Accordance with Table E-V-MIL-PRF-19500Subgroup 11Visual and Mechanical InspectionMIL-STD-750 – Method 2071Subgroup 21Subgroup 31Subgroup 41Subgroup 5 – Not ApplicableSubgroup 6 – Not ApplicableSubgroup 7 – Not ApplicableW W W. S K Y W O R K S I N C . C O M9
Group B Inspection for JANS Devices in Accordance with Table NSSubgroup 11Physical DimensionsMIL-STD-750 – Method 2066Sample Size – Large Lot 22(0),Small Lot 8(0) 1SolderabilityMIL-STD-750 – Method 2026Sample Size – Large Lot 15(0),Small Lot 6(0) 2Resistance to SolventsMIL-STD-750 – Method 1022Sample Size – Large Lot 15(0),Small Lot 6(0) 1Temperature CyclingMIL-STD-750 – Method 1051100 Cycles. Condition C, Sample Size –Large Lot 22(0), Small Lot 6(0) 2Fine LeakMIL-STD-750 – Method 1071Condition H, Sample Size –Large Lot 22(0), Small Lot 6(0) 3Gross LeakMIL-STD-750 – Method 1071Condition C, Sample Size –Large Lot 22(0), Small Lot 6(0) 4Electrical TestingDC @ TA 25 C, Sample Size –Large Lot 22(0), Small Lot 6(0) 5Decap Internal VisualMIL-STD-750 – Method 2075Sample size 6(0) 6Bond StrengthMIL-STD-750 – Method 2037Condition D, Sample Size –Large Lot 22 Wires (0),Small Lot 12 wires (0) 7Die ShearMIL-STD-750 – Method 2017Condition D, Sample Size 6 Wires (0) 1Intermittent Operation LifeMIL-STD-750 – Method 10372,000 Cycles. Condition D, Sample Size –Large Lot 22(0), Small Lot 12(0) 2Electrical TestingDC @ TA 25 C, Sample Size –Large Lot 22(0), Small Lot 12(0) 1,000 Hrs. Sample Size –Large Lot 22(0), Small Lot 12(0) DC @ TA 25 C, Sample Size –Large Lot 22(0), Small Lot 12(0) Subgroup 2Subgroup 3Subgroup 4Subgroup 51Accelerated Steady-StateOperation Life2Electrical TestingMIL-STD-750 – Method 1027Subgroup 61Thermal ResistanceMIL-STD-750 – Method 4081Sample Size – Large Lot 22(0),Small Lot 8(0) 1High Temperature LifeMIL-STD-750 – Method 1032t 340 Hrs. @ Max. Rated Storage Temp.,Large Lot 32(0),Small Lot 12(0) 2Electrical TestingDC @ TA 25 C, Sample Size –Large Lot 22(0), Small Lot 12(0) Subgroup 710W W W. S K Y W O R K S I N C . C O MJANTXVJANTX
Group B Inspection for JANTX and JANTXV in Accordance with Table NSJANTXVJANTXSubgroup 11SolderabilityMIL-STD-750 – Method 2026Sample Size 15(0) Leads,Small Lot 4 (0) Leads 2Resistance to SolventsMIL-STD-750 – Method 1022Sample Size 15(0), Small Lot 3(0) 1Temperature CyclingMIL-STD-750 – Method 105125 Cycles. Condition C,Sample Size 22(0), Small Lot 6(0) 2Fine LeakMIL-STD-750 – Method 1071Condition H, Sample Size 22(0),Small Lot 6(0) 3Gross LeakMIL-STD-750 – Method 1071Condition C, Sample Size 22(0),Small Lot 6(0) 4Electrical TestingDC @ TA 25 C, Sample Size 22(0),Small Lot 6(0) t 340 Hrs. Sample Size 45(0),Small Lot 12(0) DC @ TA 25 C, Sample Size 45(0),Small Lot 12(0) Subgroup 2Subgroup 31Steady-State Operation LifeMIL-STD-750 – Method 10272Electrical Testing3Bond StrengthMIL-STD-750 – Method 2037Sample Size 11 Wires(0) Decap Internal VisualMIL-STD-750 – Method 2075Sample Size 1(0) Thermal ResistanceMIL-STD-750 – Method 4081Sample Size 15(0), Small Lot 6(0) 1High Temperature LifeMIL-STD-7
We invite you to review our complete catalog of packaged and unpackaged semiconductor diodes, passive elements, and switches for speci c RF and microwave applications. Products include silicon varactors, PIN diodes, Schottky diodes, GaAs Schottky diodes, passive elements, and PHEMT-based . is testing performed on a sample of the lot to .
ADEKA SUPER TEOS PRODUCT NAME Si(OC 2H5)4 CHEMICAL FORMULA APPLICATION Dielectric film/Semiconductor ADEKA HIGH-PURITY TEOP PO(OC 2H5)3 Dopant/Semiconductor ADEKA HIGH-PURITY TEB B(OC 2H5)3 Dopant/Semiconductor ADEKA HIGH-PURITY TiCl4 TiCl4 Electrode/Semiconductor ADEKA SUPER TMA Al(CH 3)3 High-k material/Semiconductor ADEKA ORCERA TDMAH Hf[N(CH 3)2]4 High-k material/Semiconductor
Test-Retest Reliability Alternate Form Reliability Criterion-Referenced Reliability Inter-rater reliability 4. Reliability of Composite Scores Reliability of Sum of Scores Reliability of Difference Scores Reliability
AUK Semiconductor Corp. Aura Vision Aureal Aurora Systems Austin Semiconductor Austria Mikro Systeme International Avance Logic Avantek Averlogic . Performance Semiconductor Pericom Semiconductor PhaseLink Laboratories Philips Photobit PLX Technology PMC-Sierra Power A
However, the semiconductor body can alternatively be of Si or of a high-bandgap com-pound semiconductor material like Ga 2O3 or GaN. [0019] According to atl east one embodiment, the pow-er semiconductor device is a field-effect transistor or an insulated gate bipolar transistor, IGBT for short. For ex-ample, the power semiconductor device .
Reliability Infrastructure: Supply Chain Mgmt. and Assessment Design for reliability: Virtual Qualification Software Design Tools Test & Qualification for reliability: Accelerated Stress Tests Quality Assurance System level Reliability Forecasting: FMEA/FMECA Reliability aggregation Manufacturing for reliability: Process design Process variability
Evidence Brief: Implementation of HRO Principles Evidence Synthesis Program. 1. EXECUTIVE SUMMARY . High Reliability Organizations (HROs) are organizations that achieve safety, quality, and efficiency goals by employing 5 central principles: (1) sensitivity to operations (ie, heightenedFile Size: 401KBPage Count: 38Explore furtherVHA's HRO journey officially begins - VHA National Center .www.patientsafety.va.govHigh-Reliability Organizations in Healthcare: Frameworkwww.healthcatalyst.comSupporting the VA’s high reliability organization .gcn.com5 Principles of a High Reliability Organization (HRO)blog.kainexus.com5 Traits of High Reliability Organizations: How to .www.beckershospitalreview.comRecommended to you b
Power Semiconductor Reliability Handbook 2010 Alpha and Omega Semiconductor www.aos
posing system reliability into component reliability in a deterministic manner (i.e., series or parallel systems). Consequentially, any popular reliability analysis tools such as Fault Tree and Reliability Block Diagram are inadequate. In order to overcome the challenge, this dissertation focuses on modeling system reliability structure using
