MC33978, 22 Channel Switch Detection . - Style.nxp
NXP SemiconductorsTechnical DataDocument Number: MC33978Rev. 9, 1/202122 channel multiple switch detectioninterface with programmablewetting current3397834978MULTIPLE SWITCH DETECTION INTERFACEThe 33978 is designed to detect the closing and opening of up to 22 switchcontacts. The switch status, either open or closed, is transferred to themicroprocessor unit (MCU) through a serial peripheral interface (SPI). ThisSMARTMOS device also features a 24-to-1 analog multiplexer for reading theinput channels as analog inputs. The analog selected input signal is bufferedand provided on the AMUX output pin for the MCU to read.Independent programmable wetting currents are available as needed for theapplication. A battery and temperature monitor are included in the IC andAE SUFFIX (PBES SUFFIXEK SUFFIX (PBavailable via the AMUX pin.FREE)(PB-FREE)FREE)98ASA00173D98ASA00656DThe 33978 device has two modes of operation, Normal and Low-power mode98ASA10556D48-PIN LQFP-EP32-PIN QFN32-PIN SOICW(LPM). Normal mode allows programming of the device and supplies switch(WF-TYPE)EPcontacts with pull-up or pull-down current as it monitors the change of state onthe switches. The LPM provides low quiescent current, which makes the 33978ideal for automotive and industrial products requiring low sleep-state currents.ApplicationsFeatures Automotive Fully functional operation 4.5 V VBATP 36 V Heating ventilation and air conditioning (HVAC) Full parametric operation 6.0 V VBATP 28 V Lighting Operating switch input voltage range from -1.0 V to 36 V Central gateway/in-vehicle networking Eight programmable inputs (switches to battery or ground) Gasoline engine management 14 switch-to-ground inputs Industrial Selectable wetting current (2, 6, 8, 10, 12, 14, 16, or 20 mA) Programmable logic control (PLC) Interfaces directly to an MCU using 3.3 V / 5.0 V SPI protocol Process control, temperature control Selectable wake-up on change of state Input-output control (I/O Control) Typical standby current IBATP 30 μA and IDDQ 10 μA Single board computer Active interrupt (INT B) on change-of-switch state Ethernet switch Integrated battery and temperature sensingNotes1.The IC is functional from 4.5 V VBATP 6.0 V, but with degraded parametric values. The parameters may not meet the minimum and maximumspecifications when VBATP drops below 6.0 E BSP1SP7SG0PowerSupplyMCUVDDQINT BINTBCS gure 1. 33978 simplified application diagram NXP B.V. 2021.
Table of Contents123Orderable parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Internal block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53.1 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53.2 Pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 General product characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74.2 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94.4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175.2 Functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186 General IC functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196.1 Battery voltage ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196.2 Power sequencing conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207 Functional block description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217.1 State diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217.2 Low-power mode operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227.3 Input functional block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247.4 Oscillator and timer control functional block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267.5 Temperature monitor and control functional block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267.6 WAKE B control functional block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267.7 INT B functional block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277.8 AMUX functional block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277.9 Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 287.10 SPI control register definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 318 Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 538.1 Application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 538.2 Bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 538.3 Abnormal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 549 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 559.1 Package mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5510 Reference section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6511 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6633978NXP Semiconductors2
1Orderable partsThis section describes the part numbers available to be purchased along with their differences.Table 1. Orderable part variationsPart numberMC33978AAETemperature (TA)-40 C to 125 CPackageNotes(2)LQFP-EP 48 pinMC33978EKMC33978AEK(2), (3)-40 C to 125 CMC33978AESSOICW-EP 32 pins(2)QFN (WF-TYPE) 32 pinsMC34978EKMC34978AEKMC34978AES(2), (3)-40 C to 105 CSOICW-EP 32 pins(2)QFN (WF-TYPE) 32 pinsNotes2.To order parts in tape and reel, add the R2 suffix to the part number.3.Refer to errata MC33978ER ER01 for details on current conditions present on the MC33978EK and MC34978EK devices only.339783NXP Semiconductors
2Internal block diagramInputsVBATPSG0Internal 2.5 VVBATP, VDDQInternal 2.5 V/5.0 VPower On ResetBandgap referenceSleep PowerVBATPWetting (2.0 mA to 20 mA)Sustain (2.0 mA)Low Power Mode (1.0 mA)VBATPVDDQGNDEPSG0Internal 2.5 VTo SPI4.0 VreferenceSG1OscillatorandClock controlSG2VBATPVBATPSG5Internal 2.5 VTemperatureMonitor andControlWetting (2.0 mA to 20 mA)Sustain (2.0 mA)Low Power Mode (1.0 mA)VDDQ125 kΩSG5Internal 2.5 VTo SPI4.0 VreferenceWAKE BWAKE B control1/6 RatioInternal 2.5 VVBATPSGxVDDQ125 kΩINT BInterruptcontrolWetting (2.0 mA to 20 mA)Sustain (2.0 mA)Low Power Mode (1.0 mA)Internal 2.5 VSG13SPI Interface andControlTo SPI4.0 VreferenceVDDQ125 kΩCS BSCLKVBATPSP0-7VDDQMux controlWetting (2.0 mA to 20 mA)Sustain (2.0 mA)Low Power Mode (1.0 mA)SP0SP1MOSIMISO24To SPIVDDQ -AMUX4.0 VreferenceWetting (2.0 mA to 20 mA)Sustain (2.0 mA)Low Power Mode (2.0 mA)SP7Figure 2. 33978 internal block diagram33978NXP Semiconductors4
3Pin connections3.1PinoutTransparent Top View2952867891027Exposed PadEK 1516SG9SP2SG8SP6SG7SP7SP1WAKE B1726VBATP1627SG61828231SG51915292SP0SG41430INT B432 31AMUX30VDDQ3MISOVDDQAMUXINT BSP7SP6SP5SP4SG13SG12SG11SG10SG9SG8SG7WAKE BGND31MISO322MOSI1SCLKCS BGNDMOSISCLKCS BSP0SP1SP2SP3SG0SG1SG2SG3SG4SG5SG6VBATPFigure 3. 33978 SOICW-EP and QFN (WF-Type) pinoutsFigure 4. 33978 LQFP-EP pinout339785NXP Semiconductors
3.2Pin definitionsTable 2. 33978 pin definitionsPin number Pin numberSOICQFNPinnumberLQFPPin namePin functionFormal nameDefinition12919, 42, 43GNDGroundGroundGround for logic, analog23044MOSIInput/SPISPI Slave InSPI control data input pin from the MCU33145SCLKInput/SPISerial ClockSPI control clock input pin43246CS BInput/SPIChip SelectSPI control chip select input pin5-825 - 281-421 - 242-532 - 35SP0 – 3SP4 – 7InputProgrammableSwitches 0 – 79 - 15,18 - 245 - 1114 - 206 - 1225 - 31SG0 – 6,SG7 –13Input161216, 17VBATPPowerBattery Input171320WAKE BInput/OutputWake-upOpen drain wake-up output. Designed to control a powersupply enable pin. Input used to allow a wake-up from anexternal event.292538INT BInput/OutputInterruptOpen-drain output to MCU. Used to indicate an input switchchange of state. Used as an input to allow wake-up from LPMvia an external INT B falling event.302639AMUXOutput312740VDDQInputVoltage DrainSupply3.3 V/ 5.0 V supply. Sets SPI communication level for theMISO driver and I/O level buffer322841MISOOutput/SPISPI Slave OutProvides digital data from the 33978 to the MCU.EPGroundExposed PadIt is recommended that the exposed pad is terminated toGND (pin 1) and system ground.Switch to programmable input pins (SB or SG)Switch-to-GroundSwitch-to-ground input pinsInputs 0 – 13Battery supply input pin. Pin requires external reverse batteryprotectionAnalog MultiplexAnalog multiplex output.Output33978NXP Semiconductors6
4General product characteristics4.1Maximum ratingsTable 3. Maximum ratingsAll voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damageto the device.SymbolDescription (rating)Min.Max.UnitNotesElectrical ratingsVBATPBattery Voltage-0.340VVDDQSupply Voltage-0.37.0VCS B, MOSI,MISO, SCLKSPI Inputs/Outputs-0.37.0VSGx, SPxSwitch Input Range-14(4)38VAMUXAMUX-0.37.0VINT BINT B-0.37.0VWAKE B-0.340VWAKE BVESD1-2VESD1-3VESD3-1VESD2-1VESD2-2ESD Voltage Human Body Model (HBM) (VBATP versus GND)MC33978 and MC34978MC33978A and MC34978A Human Body Model (HBM) (All other pins) Machine Model (MM) Charge Device Model (CDM) (Corners pins) Charge Device Model (CDM) (All other pins) 2000 4000 2000 200 750 500V(5)V(6)Contact DischargeVESD5-3VESD5-4VESD6-1VESD6-2 VBATP(8) WAKE B (series resistor 10 kΩ) SGx and SPx pins with 100 nF capacitor (100 Ω series R) based on externalprotection performance(7) SGx and SPx pins with 100 nF capacitor (50 Ω series R) 8000 8000 15000 8000Notes4.Minimum value of -18 V is guaranteed by design for switch input voltage range (SGx, SPx).5.ESD testing is performed in accordance AEC Q100, with the Human Body Model (HBM) (CZAP 100 pF, RZAP 1500 Ω), the Machine Model(MM) (CZAP 200 pF, RZAP 0 Ω), and the Charge Device Model (CDM).6.CZAP 330 pF, RZAP 2.0 kΩ (Powered and unpowered) / CZAP 150 pF, RZAP 330 Ω (Unpowered)7.8. 15000V capability in powered condition, 8000V in all other conditions.External component requirements at system level:Cbulk 100uF aluminum electrolytic capacitorCbypass 100nF 37 % ceramic capacitorReverse blocking diode from Battery to VBATP (0.6 V VF 1 V). See Figure 24, Typical application diagram.339787NXP Semiconductors
4.2Thermal characteristicsTable 4. Thermal ratingsAll voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damageto the device.SymbolDescription (rating)Min.Max.UnitOperating Temperature Ambient Junction-40-40125150 CTSTGStorage Temperature-65150 CTPPRTPeak Package Reflow Temperature During Reflow–– CNotesThermal ratingsTATJThermal resistanceRΘJAJunction-to-Ambient, Natural Convection, Single-Layer Board 32 SOIC-EP 32 QFN7994 C/W(9),(10)RΘJBJunction-to-Board 32 SOIC-EP 32 QFN9.012 C/W(11)RΘJCJunction-to-Case (Bottom) 32 SOIC-EP 32 QFN3.02.0 C/W(12)Junction-to-Package (Top), Natural convection 32 SOIC-EP 32 QFN112.0 C/W
SOIC Pin number QFN Pin number LQFP Pin name Pin function Formal name Definition 1 29 19, 42, 43 GND Ground Ground Ground for logic, analog 2 30 44 MOSI Input/SPI SPI Slave In SPI control data input pin from the MCU 3 31 45 SCLK Input/SPI Serial Clock SPI control clock input pin 4 32 46 CS_
Thermal magnetic switch DIP (Dual In-line Package) Encapsulated switches Switch with delayed opening Double switch bipolar Time switch Timer Electronic limiter Mercury switch Inclination or motion detector Closed switch Switch delay when opening and closing Double limit switch
134-1400 LS EP Switch 265-1002 134-1402 LS EP Switch 265-1006 Original Part No. Mfg. Description Part No. 134-1403 LS EP Switch 265-1005 134-1404 LS EP Switch 265-1002 134-1405 LS EP Switch 265-1004 134-1406 LS EP Switch 265-1003 134-1407 LS EP Switch 265-1006 134-1452 LS Pressure Elec. Switch 134-1451 134-1456 LS Pressure Elec. Switch 134-1451 .
262 SOAP Channel 264 BBC america 265 A &E 266 Biography Channel 267 DOC- Documentary Channel 268 Best Channel 269 Hystory Channel 270 IDEA Channel 271 HInt- History Channel 272 LOGO 273 TVGN- TV Guide 274 OVTV- Ovation 275 QVC 276 NGV- National Geographic TV 277 TRAV- Travel Channel
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Aquarium Channel - SD/HD AUX TV BabyFirstTV BONUS CHANNEL BONUS CHANNEL BBC Canada BBC Kids BONUS CHANNEL PC Users: search for a channel by typing Ctrl F, then enter the channel name. Mac Users: search for a channeltype Command F, then enter the name. The channel line-up may vary in your area.
Manual 36598 DSS-2 Two-Channel Digital Speed Switch Woodward 1 Chapter 1. General Information Introduction DSS-2 (Digital Speed Switch, 2-Channel) is a two-channel electronic speed switch that combines the convenience of manual adjustments with the flexibility of a computer-based calibration tool. DSS-2 was
Wiring accessories are used for connecting appliances (Fig. 3.4). (a) Switch A switch is used to make or break an electrical circuit. It is used to switch ‘on’ or ‘off ’ the supply of electricity to an appliance. There are various switches such as y surface switch y flush switch y ceiling switch y pull switch y push button switch y bed .
Last previous edition approved in 2018 as A234/A234M – 18. DOI: 10.1520/A0234_A0234M-18A. 2 For ASME Boiler and Pressure Vessel Code applications see related Specifi-cation SA-234 in Section II of that Code. 3 For referenced ASTM standards, visit the ASTM website, www.astm.org, or contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM Standards volume information, refer .
