Raytek MI3 Series Infrared Temperature Sensor Manual
MI3Miniature Infrared SensorOperating InstructionsRev. G1 Nov/201655201
ContactsFluke Process Instruments Fluke Process Instruments North AmericaSanta Cruz, CA USATel: 1 800 227 8074 (USA and Canada, only) 1 831 458 3900solutions@flukeprocessinstruments.comFluke Process Instruments EuropeBerlin, GermanyTel: 49 30 478 0080info@flukeprocessinstruments.deFluke Process Instruments ChinaBeijing, ChinaTel: 86 10 6438 4691info@flukeprocessinstruments.cnWorldwide ServiceFluke Process Instruments offers services,including repair and calibration. For moreinformation, contact your local office or k.com Fluke Process InstrumentsSpecifications subject to change without notice.
WARRANTYThe manufacturer warrants this product to be free from defects in material and workmanship under normal useand service for the period of two years from date of purchase, except as hereinafter provided. This warranty extendsonly to the original purchaser (a purchase from the manufacturer or a licensed distributor of the manufacturer isan original purchase). This warranty shall not apply to fuses, batteries, or any product which has been subject tomisuse, neglect, accident, or abnormal conditions of operation.In the event of failure of a product covered by this warranty, the manufacturer will repair the instrument when itis returned by the purchaser, freight prepaid, to an authorized Service Facility within the applicable warrantyperiod, provided manufacturer’s examination discloses to its satisfaction that the product was defective. Themanufacturer may, at its option, replace the product in lieu of repair. With regard to any covered product returnedwithin the applicable warranty period, repairs or replacement will be made without charge and with return freightpaid by the manufacturer, unless the failure was caused by misuse, neglect, accident, or abnormal conditions ofoperation or storage, in which case repairs will be billed at a reasonable cost. In such a case, an estimate will besubmitted before work is started, if requested.THE FOREGOING WARRANTY IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED OR IMPLIED,INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS, ORADEQUACY FOR ANY PARTICULAR PURPOSE OR USE. THE MANUFACTURER SHALL NOT BE LIABLEFOR ANY SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES, WHETHER IN CONTRACT, TORT,OR OTHERWISE.SOFTWARE WARRANTYThe manufacturer does not warrant that the software described herein will function properly in every hardwareand software environment. This software may not work in combination with modified or emulated versions ofWindows operating environments, memory-resident software, or on computers with inadequate memory. Themanufacturer warrants that the program disk is free from defects in material and workmanship, assuming normaluse, for a period of one year. Except for this warranty, the manufacturer makes no warranty or representation,either expressed or implied, with respect to this software or documentation, including its quality, performance,merchantability, or fitness for a particular purpose. As a result, this software and documentation are licensed “asis,” and the licensee (i.e., the user) assumes the entire risk as to its quality and performance. The liability of themanufacturer under this warranty shall be limited to the amount paid by the User. In no event shall themanufacturer be liable for any costs including but not limited to those incurred as a result of lost profits or revenue,loss of use of the computer software, loss of data, the cost of substitute software, claims by third parties, or for othersimilar costs. The manufacturer’s software and documentation are copyrighted with all rights reserved. It is illegalto make copies for another person.Specifications subject to change without notice.The device complies with the requirements of the European Directives.EC – Directive 2004/108/EC (EMC)
ContentCONTENT . 51 SAFETY INSTRUCTIONS . 102 DESCRIPTION. 112.1 OVERVIEW COMM BOXES ······················· 123 TECHNICAL DATA . 133.1 MEASUREMENT SPECIFICATION ············· 133.1.1 Sensing Heads . 133.1.2 Comm Box . 143.1.2.1 Comm Box (metal) . 143.1.2.2 Comm Box (DIN) . 143.2 OPTICAL CHARTS ·········· 153.3 ELECTRICAL � 163.3.1 Comm Box, all models . 163.3.2 Comm Box (metal) . 163.3.3 Comm Box (DIN 6TE, analog) . 163.4 ENVIRONMENTAL SPECIFICATION ········· 173.4.1 Sensing Head. 173.4.2 Comm Box (metal) . 173.4.3 Comm Box (DIN) . 183.4.4 LTH Electronics . 183.5 DIMENSIONS ·················· 193.5.1 Sensing Head LT, G5 . 193.5.2 Sensing Head LTH . 193.5.3 Sensing Head 1M, 2M . 193.5.4 Comm Box (metal) . 193.5.5 Comm Box (DIN) . 203.6 SCOPE OF ··········· 203.6.1 Sensing Head. 203.6.2 Comm Box . 214 BASICS . 224.1 MEASUREMENT OF INFRARED TEMPERATURE ················ 224.2 EMISSIVITY OF TARGET OBJECT ·············· 224.3 AMBIENT TEMPERATURE ························ 224.4 ATMOSPHERIC �··· 224.5 ELECTRICAL INTERFERENCE ··················· 225 INSTALLATION . 245.1 POSITIONING ·················· 245.1.1 Distance to Object . 245.2 INSTALLATION SCHEMES ························ 245.2.1 Comm Box (metal) . 245.2.2 Comm Box (DIN) . 255.3 WIRING, HEAD CABLE ·· 255.3.1 Comm Box (metal) . 265.3.2 Comm Box (DIN) . 26
5.4 WIRING, TERMINAL ······ 275.4.1 Comm Box (metal) . 275.4.2 Comm Box (DIN 3TE) . 285.4.3 Comm Box (DIN 4 TE) . 295.4.4 Comm Box (DIN 6 TE) . 305.4.5 EMI Resistance for Comm Box (DIN) . 335.5 POWER ON PROCEDURE ························ 345.5.1 One Head System . 345.5.2 Multiple Heads – Random Address Assignment . 345.5.3 Multiple Heads – User Controlled Address Assignment . 345.6 �········ 355.7 FIELDBUS ······················· 375.7.1 Addressing . 375.7.2 RS485 based Installations . 376 OUTPUTS . 386.1 ANALOG OUTPUT OUT1 ······················· 386.2 ANALOG OUTPUT OUT2 ······················· 386.3 ANALOG OUTPUTS OUT1 - OUT4 ········ 396.4 ALARM OUTPUT RELAY ······················· 396.5 THERMOCOUPLE OUTPUT TC ················ 407 INPUTS . 417.1 EMISSIVITY (ANALOG) ··· 417.2 EMISSIVITY (DIGITAL) ···· 427.3 AMBIENT TEMPERATURE ·· 427.4 TRIGGER/HOLD ············· 447.5 LASER SWITCHING ········ 458 OPERATION . 468.1 CONTROL PANEL ·········· 468.2 HEAD PAGE ··············· 488.3 BOX SETUP PAGE ······· 498.4 BOX INFO PAGE ········· 518.5 POST PROCESSING ········· 518.5.1 Averaging . 518.5.2 Peak Hold . 528.5.3 Valley Hold . 528.5.4 Advanced Peak Hold . 538.5.5 Advanced Valley Hold . 548.5.6 Advanced Peak Hold with Averaging . 548.5.7 Advanced Valley Hold with Averaging . 549 OPTIONS . 559.1 WATER COOLED HOUSING (1M, 2M ··················· 559.1.1 Avoidance of Condensation . 569.2 INTRINSIC SAFETY ········· 579.2.1 Sensing Heads . 579.2.2 Ex Power Supply . 579.2.2.1 Ex Power Supply for non-hazardous areas . 579.2.2.2 Ex Power Supply for hazardous areas . 58
9.2.3 Installation . 599.2.4 Mains Supply . 6010 ACCESSORIES . 6210.1 ACCESSORIES (ALL MODELS) ················ 6210.1.1 Multi-Channel Box . 6210.1.2 USB/RS485 Adapter . 6510.2 ACCESSORIES (LT, G5 HEADS) ············· 6610.2.1 Adjustable Mounting Bracket . 6710.2.2 Fixed Mounting Bracket . 6810.2.3 Air Purge Jacket . 6810.2.4 Air Cooling System . 6910.2.5 Right Angle Mirror . 7310.2.6 Protective Windows . 7410.2.7 Close Focus Lens .
Fluke Process Instruments Fluke Process Instruments North America Santa Cruz, CA USA Tel: 1 800 227 8074 (USA and Canada, only) 1 831 458 3900 solutions@flukeprocessinstruments.com Fluke Process Instruments Europe Berlin, Germany Tel: 49 30 478 0080 info@flukeprocessinstruments.de Fluke Process Instruments China Beijing, China
conventions for infrared spectroscopy and for practical reasons are divided wavelengths of radiation to the area close to (A - NIR - Near infrared) 750-900 nm, medium (B-MIR - Middle infrared) from 1.55 to 1.75 micron and far (C - FIR - Far Infrared), 10.4 to 12.5 micron according to field use. To measure the amount of incident light are used
D B PART DESCRIPTION QUANTITY A Infrared Heater 1 B Remote Control 2 C Control Panel (pre assembled to Infrared Heater (A)) 1 D Filter Cover (pre assembled to Infrared Heater (A)) 1 E Temperature Sensor (pre assembled to Infrared Heater (A)) 1 F Mas
and cornetite were studied using a combination of infrared emission spectroscopy, infrared absorp-tion, and Raman spectroscopy. Infrared emission spectra of these minerals were obtained over the temperature range 100 to 1000 C. The infrared spectra of the three minerals are different, in line with differences in crystal struc-ture and .
the infrared thermometer above air temperature. A second brand (Cen-Tech) fixed emissivity infrared thermometer (number 13) was purchased to compare to the 12 All Sun thermometers. An additional infrared thermometer [Thermoworks infrared thermometer (2016) Ir-Gun-S (Number 14)] was purchase. It had a variable setting for emissivity and was
1 Infrared spectroscopy Chapter content Theory Instrumentation Measurement techniques Mid-infrared (MIR) – Identification of organic compounds – Quantitative analysis – Applications in food analysis Near-infrared (NIR) – Properties of the technique – Applications in food analysis Infrared spectroscopy
The infrared and Raman spectra of 3,4,5-trimethoxybenzaldehyde (3,4,5-TMB) were reported by Gupta et al (1988). But only thirteen fundamental vibrations have been observed. In the present investigation laser Raman, infrared and Fourier's transform far infrared spectra of 3,4,5-TMB are recorded and forty four funda mentals are reported.
infrared images. Moreover, unlike color images, infrared images capture information on a single band (e.g. medium wave infrared (MWIR), longwave infrared (LWIR)) unless a multispectral sensor is utilized. In the study of [15], the performances of Haar-like features and image intensity-based features are gauged in a visible/infrared comparison .
based beverages with added sugar, such as; non-diet soft drinks, energy drinks, fruit drinks, sports drinks, flavoured water and cordial. This does not include 100% fruit juice, flavoured milk, or sugared tea/coffee. 3.1 Consumption Over three-quarters (76%) of respondents reported having consumed a sugar-sweetened beverage in the three months prior to the survey, most commonly on a weekly .
