DRA Automotive Grade Power Inductors - Eaton

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Technical Data 4319Effective January 2018Supersedes September 2017DRAAutomotive gradeHigh power density, high efficiency, shielded drum corepower inductorsApplicationsBody electronicso Headlamps, tail lamps and interiorlightingo Heating Ventilation and AirConditioning controllers (HVAC)o Doors, window lift and seat controlAdvanced driver assistance systemso Adaptive cruise control (ACC)o Collision avoidance systemo Car black box systemInfotainment and cluster electronicso Audio subsystem: head unit andtrunk ampo Digital instrument clustero In-Vehicle Infotainment (IVI) andnavigationChassis and safety electronicso Electronic Stability Control system(ESC)o Electric parking brakeo Electronic Power Steering (EPS)Engine and powertrain systemso Diesel/gasoline engine managemento Powertrain Control Module (PCM)/Engine Control Unit (ECU)o Transmission Control Unit (TCU) Product features AEC-Q200 qualifiedFive different mechanical sizes availableMagnetically shielded-reduces EMIFerrite core materialInductance range from 0.28 µH to 1000 µHCurrent range up to 56 ARugged construction for high shock andvibration environments Moisture Sensitivity Level (MSL): 1 Environmental data Storage temperature range (component):-40 C to 165 COperating temperature range: -40 C to 165 C(ambient plus self-temperature rise)Solder reflow temperature:J-STD-020 (latest revision) compliantPb HFFREEHALOGEN

Technical Data 4319Effective January 2018Product specificationsPartOCL1Number6 20% (µH)Irms2(A)Isat13(A)(A)DCR (Ω)@ 25 CDCR (Ω)@ 25 1925.156.1810.31. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0A dc @ 25 C2. Irms: DC current for an approximate temperature rise of 40 C without core loss.Derating is necessary for AC currents. PCB layout, trace thickness and width, airflow and proximity of other heat generating components will affect thetemperature rise. It is recommended that the temperature of the part not exceed 165 C under worst case operating conditions verified in the end application.3. Isat1: Peak current for approximately 30% rolloff at 25 C.2Isat24www.eaton.com/electronics4. Isat2: Peak current for approximately 40% rolloff at 125 C.5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p K * L * I.Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in µH), I (peak-to-peak ripplecurrent in amps).6. Part Number Definition: DRAxxx-yyy-R DRAxxx Product code and size yyy Inductance value in uH, R decimal point,if no R is present then third character number of zeros. -R suffix RoHS compliant

Technical Data 4319DRAAutomotive gradeHigh power density, high efficiency, shielded drum core power inductorsEffective January 2018Product specificationsPartNumber6DRA74-R33-ROCL1 20% (µH)0.29Irms2(A)7.26Isat13(A)18.4Isat24(A)14.7DCR (Ω)@ 25 CDCR (Ω)@ 25 R1001.70.2600.2920.2344.195.028.71. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc @ 25 C2. Irms: DC current for an approximate temperature rise of 40 C without core loss.Derating is necessary for AC currents. PCB layout, trace thickness and width, airflow and proximity of other heat generating components will affect thetemperature rise. It is recommended that the temperature of the part not exceed 165 C under worst case operating conditions verified in the end application.3. Isat1: Peak current for approximately 30% rolloff at 25 C.4. Isat2: Peak current for approximately 40% rolloff at 125 C.5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p K * L * I.Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in µH), I (peak-to-peak ripplecurrent in amps).6. Part Number Definition: DRAxxx-yyy-R DRAxxx Product code and size yyy Inductance value in uH, R decimal point,if no R is present then third character number of zeros. -R suffix RoHS compliantwww.eaton.com/electronics3

DRAAutomotive gradeHigh power density, high efficiency, shielded drum core power inductorsTechnical Data 4319Effective January 2018Product specificationsPartOCL1Number6 20% (µH)Irms2(A)Isat13(A)Isat24(A)DCR (Ω)@ 25 CTypicalDCR (Ω)@ 25 032.943.524.01. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc @ 25 C2. Irms: DC current for an approximate temperature rise of 40 C without core loss.Derating is necessary for AC currents. PCB layout, trace thickness and width, airflow and proximity of other heat generating components will affect thetemperature rise. It is recommended that the temperature of the part not exceed 165 C under worst case operating conditions verified in the end application.3. Isat1: Peak current for approximately 30% rolloff at 25 C.4www.eaton.com/electronics4. Isat2: Peak current for approximately 40% rolloff at 125 C.5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p K * L * I.Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in µH), I (peak-to-peak ripplecurrent in amps).6. Part Number Definition: DRAxxx-yyy-R DRAxxx Product code and size yyy Inductance value in µH, R decimal point,if no R is present then third character number of zeros. -R suffix RoHS compliant

DRAAutomotive gradeHigh power density, high efficiency, shielded drum core power inductorsTechnical Data 4319Effective January 2018Product specificationsPartNumber6OCL1 20% (µH)Irms2(A)Isat13(A)Isat24(A)DCR (Ω)@ 25 CDCR (Ω)@ 25 6950.5561.7802.1303.71. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc @ 25 C2. Irms: DC current for an approximate temperature rise of 40 C without core loss.Derating is necessary for AC currents. PCB layout, trace thickness and width, airflow and proximity of other heat generating components will affect thetemperature rise. It is recommended that the temperature of the part not exceed 165 C under worst case operating conditions verified in the end application.3. Isat1: Peak current for approximately 30% rolloff at 25 C.4. Isat2: Peak current for approximately 40% rolloff at 125 C.5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p K * L * I.Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in µH), I (peak-to-peak ripplecurrent in amps).6. Part Number Definition: DRAxxx-yyy-R DRAxxx Product code and size yyy Inductance value in µH, R decimal point,if no R is present then third character number of zeros. -R suffix RoHS compliantwww.eaton.com/electronics5

DRAAutomotive gradeHigh power density, high efficiency, shielded drum core power inductorsTechnical Data 4319Effective January 2018Product specificationsPartOCL1Number6 20% (µH)Irms2(A)Isat13(A)(A)DCR (Ω) @ 25 CDCR (Ω) @ 25 102.41. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc @ 25 C2. Irms: DC current for an approximate temperature rise of 40 C without core loss.Derating is necessary for AC currents. PCB layout, trace thickness and width, airflow and proximity of other heat generating components will affect thetemperature rise. It is recommended that the temperature of the part not exceed 165 C under worst case operating conditions verified in the end application.3. Isat1: Peak current for approximately 30% rolloff at 25 C.6Isat24www.eaton.com/electronics4. Isat2: Peak current for approximately 40% rolloff at 125 C.5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p K * L * I.Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in µH), I (peak-to-peak ripplecurrent in amps).6. Part Number Definition: DRAxxx-yyy-R DRAxxx Product code and size yyy Inductance value in µH, R decimal point,if no R is present then third character number of zeros. -R suffix RoHS compliant

DRAAutomotive gradeHigh power density, high efficiency, shielded drum core power inductorsTechnical Data 4319Effective January 2018Dimensions - mmDRA73 & DRA74Top viewSchematicFront viewBottom viewPart Marking: ### inductance value in µH, R decimal point; if no R is present, then 3rd digit equals number of zeroswwllyy Date code, R revision levelAll soldering surfaces to be coplanar within 0.10 millimetersTolerances are 0.2 millimeters unless stated otherwise.Do not route traces or vias underneath the inductor*Special Characteristic epoxy protrusion or any flashing from the plastic on the header/base can be below the terminalsurface and must not exceed 0.08 mm beyond the bottom surface of the terminal.DRA124, DRA125 & DRA127Top viewRecommended pad layoutMaxSchematicFront viewBottom viewPart Marking: DRAxx, xx 124, 125 or 127, ### inductance value in µH, R decimal point; if no R is present, then 3rd digit equals number ofzeros wwllyy Date code, R revision levelAll soldering surfaces to be coplanar within 0.10 millimetersTolerances are 0.2 millimeters unless stated otherwise.Do not route traces or vias underneath the inductor*Special Characteristic epoxy protrusion or any flashing from the plastic on the header/base can be below the terminal surface and must notexceed 0.08 mm beyond the bottom surface of the terminal.www.eaton.com/electronics7

Technical Data 4319Effective January 2018DRAAutomotive gradeHigh power density, high efficiency, shielded drum core power inductorsPackaging information - mmDRA73 & DRA74Supplied in tape and reel packaging, on a 13” diameter reel: DRA73 - 1350 pieces DRA74 - 1100 piecesDRA124, DRA125 & DRA127Supplied in tape and reel packaging, on a 13” diameter reel: DRA124 - 750 pieces DRA125 - 600 pieces DRA127 - 350 pieces8www.eaton.com/electronics

DRAAutomotive gradeHigh power density, high efficiency, shielded drum core power inductorsTechnical Data 4319Effective January 2018Temperature rise vs. total lossDRA74707060605050Temp. Rise( C)Temp. Rise( 360.40.44Total Loss (W)0.480.520.560.60.64DRA1240.687060605050Temp. Rise( C)7040300.20.30.40.50.60.70.8Total Loss .50.60.70.80.911.11.21.3000.10.20.30.40.5Total Loss (W)0.60.7Total Loss (W)0.80.911.11.21.3DRA127807060Temp. Rise( C)Temp. Rise( 11.11.21.31.41.5Total Loss (W)www.eaton.com/electronics9

DRAAutomotive gradeHigh power density, high efficiency, shielded drum core power inductorsTechnical Data 4319Effective January 2018Core loss vs. Bp-pDRA73DRA74Core Loss vs Bp-p100.10.010.10.0110010000.0011001 0000Bp-p (Gauss)Core Loss vs Bp-p101Core Loss (W)Core Loss (W)10.10.10.010.010.00110000DRA125Core Loss vs Bp-p101000B p-p (Gauss)DRA1240.00110010001 0000Bp-p (Gauss)1001 000Bp-p (Gauss)DRA127Core Loss vs Bp-p10Core Loss (W)10.10.010.00110p-p1Core Loss (W)Core Loss (W)10.001Core Loss vs B10www.eaton.com/electronics1001000Bp-p (Gauss)1 000010000

DRAAutomotive gradeHigh power density, high efficiency, shielded drum core power inductorsTechnical Data 4319Effective January 2018Inductance characteristicsDRA73DRA74OCL vs Isat1120 %110 %110 %100 %100 %90 %90 %80 %% of OCL80 %% of OCLOCL vs Isat1120 %-40 C70 %60 % 25 C50 %-40 C70 %60 % 25 C50 %40 %40 % 85 C30 %30 % 85 C20 %20 % 125 C10 % 125 C10 %0%0%0%10 %20%30 %40%50 %60%70 %80%90 %100 %0%110 % 120 % 130 % 140 %10 %20%30 %40%50 %DRA12470 %80%90 %100 %110 %120 %DRA125OCL vs Isat1120 %OCL vs Isat1120 %110 %100 %100 %90 %90 %80 %80 %% of OCL110 %70 %-40 C60 %50 % 25 C40 %-40 C 25 C50 %30 % 125 C20 %70 %60 %40 % 85 C30 % 85 C20 % 125 C10 %10 %0%0%0%10 %20%30 %40%50 %60%70 %80%0%90 % 100 % 110 % 120 % 130 % 140 % 150 % 160 %% of Isat110 %20%30 %40%50 %60%70 %% of Isat180%90 %100 % 110 % 120 % 130 % 140 %DRA127OCL vs Isat1120%110%100%90%80%% of OCL% of OCL60%% of Isat1% of Isat170%60%-40 C50%40% 25 C30% 85 C20% 125 C10%0%0%10%20%3 0%40%50%6 0%70%80%90%% of ctronics11

DRAAutomotive gradeHigh power density, high efficiency, shielded drum core power inductorsTechnical Data 4319Effective January 2018Solder Reflow ProfileTPTC -5 CTemperatureTL25 CPreheatAT smaxTable 1 - Standard SnPb Solder (Tc)tPMax. Ramp Up Rate 3 C/sMax. Ramp Down Rate 6 C/stVolumemm3 350235 C220 CPackageThickness 2.5mm2.5mm Volumemm3350 220 C220 CTable 2 - Lead (Pb) Free Solder (T c)TsminPackageThickness 1.6mm1.6 – 2.5mm 2.5mmtsTime 25 C to PeakVolumemm3 350260 C260 C250 CVolumemm3350 - 2000260 C250 C245 CVolumemm3 2000260 C245 C245 CTimeReference JDEC J-STD-020Profile FeaturePreheat and Soak Temperature min. (Tsmin) Temperature max. (Tsmax) Time (Tsmin to Tsmax) (ts)Average ramp up rate Tsmax to TpLiquidous temperature (TL)Time at liquidous (tL)Peak package body temperature (TP)*Time (tp)** within 5 C of the specified classification temperature (Tc)Average ramp-down rate (Tp to Tsmax)Time 25 C to Peak TemperatureStandard SnPb Solder100 CLead (Pb) Free Solder150 C150 C200 C60-120 Seconds60-120 Seconds3 C/ Second Max.3 C/ Second Max.183 C60-150 Seconds217 C60-150 SecondsTable 1Table 220 Seconds**30 Seconds**6 C/ Second Max.6 C/ Second Max.6 Minutes Max.8 Minutes Max.* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express writtenapproval of an officer of the Compan . Life support systems are devices which support or sustain life, and whose failure to perform, when properlyused in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant inju y to the user.Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton alsoreserves the right to change or update, without notice, any technical information contained in this bulletin.EatonElectronics Division1000 Eaton BoulevardCleveland, OH 44122United Stateswww.eaton.com/electronics 2018 EatonAll Rights ReservedPrinted in USAPublication No. 4319 BU-MC17080January 2018Eaton is a registered trademark.All other trademarks are propertyof their respective owners.

2. Technical Data 4319. Effective January 2018. DRA Automotive grade High power density, high efficiency, shielded drum c

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