Final Program AI/ML. Autonomous Vehicles. Security. IoT .

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AI/ML. Autonomous Vehicles. Security.IoT. Quantum Computing.Final Program202122nd International Symposium onQUALITYELECTRONICDESIGNApril 7-9, 2021Virtual ConferenceCalifornia Pacific DaytimeSan Jose, CA USAInternational Society for Quality Electronic DesignCopyright ISQED . All rights reserved. www.ISQED.comSince 1999

Corporate SponsorsTechnical SponsorsISQED’21 is produced and sponsored by theInternational Society for Quality Electronic DesignCopyright 2021 All rights reserved

WELCOME TO ISQED’21On behalf of the ISQED conference and technical committees, we are pleased to welcome you to the 22nd anniversaryof the International Symposium on Quality Electronic Design, ISQED’21.For the past 22 years, ISQED has been the leading voice and pioneer in Quality Electronic Design (QED). With thedrastic increase in complexity of semiconductor technology and design, following QED and its underlying principlesare becoming more necessary and essential as never before. ISQED’21 strives to lead the community in that direction with a comprehensive program consisting of keynotes, panel, tutorials, and over 100 peer-reviewed articles.The conference is held in Virtual format, with the technical sponsorship of the IEEE Electron Devices Society, the IEEECircuits and Systems Society, IEEE Reliability Society, and In-cooperation with ACM/SigDA. Conference proceedings& Papers will published in IEEE Xplore digital library and indexed by Scopus.ISQED’21 is organized around the important trends in AI/ML, Autonomous Vehicles, Security, IoT, and QuantumComputing. The conference program consists of two keynote talks, four embedded tutorials and a panel discussion,and many Peer-reviewed technical papers with focus on these timely and hot topics.We are pleased to see an increase in the number of papers submitted to the conference this year. The two- andhalf-day technical program with four parallel sessions packs over 100 peer-reviewed papers highlighting the latesttrends in electronic circuit and system design & automation, testing, verification, sensors, security, semiconductortechnologies, cyber-physical systems, etc.All technical presentations, plenary sessions, panel discussions, tutorials and related events will take place on April7-9, conducted virtually, at Pacific Daylight Time (PDT).We would like to thank the ISQED’21 corporate sponsors: Synopsys, Siemens EDA, and Innovotek for their valuablefinancial support of this conference. Welcome to another exciting year of ISQED and thanks for your support andparticipation.General ChairSwaroop GhoshPennsylvania State UniversityOrganizing Committee ChairKurt SchwartzMicron TechnologyTPC ChairSara TehranipoorSanta Clara UniversityTPC -Co-ChairAbhilash Goyal,Velodyne LiDARTPC Co-ChairAmey KulkarniNVIDIATPC Co-ChairCindy YiVirginia TechSpecial Sessions ChairPravin Kumar VenkatesanVelodyne LiDARSpecial Sessions Co-ChairPrabha SundaravadivelUT TylerSpecial Sessions Co-ChairRajat Subhra ChakrabortyIndian Institute of Technology KharagpurTutorials ChairJosé Pineda de GyvezNXPTutorials Co-ChairYu PuAlibabaPanels ChairShigeki Tomishima,Intel CorporationPanels Co-ChairSiddha GanjuNVIDIAPublication ChairPaul WeslingHewlett Packard (retired)Founding ChairAli A. IranmaneshSilicon Valley Polytechnic1

ISQED’21 Best Papers3B.3Six-track Standard Cell Libraries with Fin Depopulation, Contact over Active Gate,and Narrower Diffusion Break in 7nm TechnologyTzu-Hsuan Wang, Chih-Chun Hsu, Li Kao, Bing-Yu Li, Tung-Chun Wu,Tsao-Hsuan Peng, Rung-Bin LinYuan Ze University, Taoyuan City, Taiwan1A.2Design Space Extrapolation for Power Delivery Networksusing a Transposed Convolutional NetOsama Waqar Bhatti1 , and Madhavan Swaminathan y2 1School of Electrical and Computer EngineeringSchool of Material Science and Engineering23D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USABEST WIP PAPERPW4.4Large-Scale Quantum System Design on Nb-based Superconducting SiliconInterconnect FabricYu-Tao Yang, Subramanian S. IyerDepartment of Electrical and Computer EngineeringUniversity of California, Los Angeles (UCLA)Authors of best papers are acknowledged on Wednesday April 7.2

ISQED’21 Organizing CommitteeGeneral ChairSwaroop GhoshPennsylvania State UniversityOrganizing Committe ChairKurt SchwartzTexas InstrumentsTPC ChairSara TehranipoorSanta Clara UniversityTPC Co-ChairAbhilash GoyalVelodyne LiDARTPC Co-ChairAmey KulkarniNVIDIATPC Co-ChairCindy YiVirginia TechTutorials ChairJosé Pineda de GyvezNXP SemiconductorsPanel Co-ChairSiddha GanjuNVIDIATutorials Co-ChairYu PuAlibabaSpecial Sessions ChairPravin Kumar VenkatesanVelodyne LiDARPanel ChairShigeki TomishimaIntel CorporationSpecial Sessions Co-ChairRajat Subhra ChakrabortyIndian Institute of TechnologyKharagpurPlenary ChairAli A. IranmaneshSilicon Valley Polytechnic Inst.Special Sessions Co-ChairMimi XieThe University of Texas at San AntonioPublication ChairPaul WeslingHewlett Packard (retired)Europe ChairGeorge P. AlexiouUniversity of Patras andRA-CTI, Patras, GreeceBrazil & South America ChairFabiano Passuelo HesselPontificia Universidade Catolica do Riodo Sul, BrazilChina ChairGaofeng WangHangzhou Dianzi UniversityJapan ChairMasahiro FujitaUniversity of TokyoSpecial Sessions Co-ChairPrabha SundaravadivelUT TylerGLOBAL REPRESENTATIVESTaiwan ChairShih-Hsu HuangChung Yuan ChristianUniversityTECHNICAL PROGRAM COMMITTEESSara Tehranipoor, Santa Clara University (TPC Chair)Abhilash Goyal, Velodyne LiDAR (TPC Co-Chair)Amey Kulkarni, NVIDIA (TPC Co-Chair)Cindy Yi, Virginia Tech (TPC Co-Chair)Cognitive Computing Hardware (CCH)Deliang Fan, Arizona State University (Chair)Zhen Zhou, Intel Corp (Co-Chair)Committee Members:Hongyu An - Michigan Technological UniversityAbishai Daniel - IntelCaiwen Ding - University of ConnecticutXin Fu - University of HoustonMiao Hu - Binghamton UniversityHyeran Jeon - University of California MercedDoo Seok Jeong - Hanyang UniversityHao Jiang - San Francisco State UniversityOmid Kavehei - The University of SydneyAmey Kulkarni - NVIDIA IncXue Lin - Northeastern UniversityIshan Thakkar - University of KentuckyYang (Cindy) Yi - Virginia Tech3

TECHNICAL PROGRAM COMMITTEES(continued)Electronic Design Automation Tools and Methodologies (EDA)Srini Krishnamoorthy, Intel Corp. (Chair)Srinivas Katkoori, University of South Florida (Co-Chair)Committee Members:Dhruva Ghai - ORIENTAL UNIVERSITY INDOREXinfei Guo - NVIDIA CorporationShih-Hsu Huang - Chung Yuan Christian UniversitySheikh Ariful Islam - University of Texas Rio Grande ValleyAnand Iyer - MicrosoftYu-Min Lee - National Chiao Tung UniversityRung-Bin Lin - Yuan Ze UniversityOfelya Manukyan - CAD/EDA R&D, SynopsysGayatri Mehta - University of North TexasRajeev Murgai - Synopsys India Pvt. Ltd.Siddhartha Nath - Synopsys Inc.Murthy Palla - Synopsys Inc.Shilpa Pendyala - Intel CorporationChidhambaranathan Rajamanikkam - Utah State UniversityAndre Reis - UFRGSEmre Salman - Stony Brook UniversityTakashi Sato - Kyoto UniversityJia Wang - Illinois Institute of TechnologyHua Xiang - IBM ResearchDesign Test and Verification (DTV)Sreejit Chakravarty, Intel Corporation (Chair)Fei Su, Intel (Co-Chair)Committee Members:George Alexiou - Univ. Of PATRASSoumya Chakraborty - Cypress SemiconductorsKanad Chakraborty - Real IntentSerge Demidenko - Sunway UniversityMichael Hsiao - Virginia TechChrysovalantis Kavousianos - University of IoanninaDimitris Nikolos - University of PatrasErnesto Sanchez - Politecnico di TorinoDeepashree Sengupta - Synopsys Inc.Yiorgos Tsiatouhas - University of IoanninaMiroslav N. Velev - Aries Design AutomationArnaud Virazel - LIRMMEmerging Device and Process Technologies and Applications (EDPT)Rasit Onur Topaloglu, IBM (Chair)Vita Pi-Ho Hu, National Taiwan University (Co-Chair)Committee Members:Arijit Banerjee - Advanced Micro DevicesRajan Beera - Pall CorporationAbishai Daniel - IntelTuhin Guha Neogi - Intel CorporationSumeet Gupta - Purdue UniversityNikos Konofaos - Aristotle University of ThessalonikiChun-Yu Lin - National Taiwan Normal UniversityMehran Mozaffari Kermani - RITMahdi Nikdast - Colorado State UniversityChenyun Pan - University of Texas at ArlingtonKun Qian - GLOBALFOUNDRIESArman Roohi - University of Nebraska - LincolnSwatilekha Saha - Cypress Semiconductor CorporationJinhui Wang - University of South AlabamaLan Wei - University of WaterlooMustafa Berke Yelten - Istanbul Technical University4

TECHNICAL PROGRAM COMMITTEES(continued)Circuit Design, 3D Integration and Advanced Packaging (ICAP)Libor Rufer, University of Grenoble-Alpes (Chair)Payman Zarkesh-Ha, University of New Mexico (Co-Chair)Nihaar Mahatme, NXP Semiconductors (Co-Chair)Raviprakash Rao, Texas Instruments (Co-Chair)Committee Members:Ali Afzali-Kusha - University of TehranPawan Agarwal - Maxlinear IncDivya Akella Kamakshi - University of VirginiaIraklis Anagnostopoulos - Southern Illinois University CarbondaleKaran Bhatia - Texas Instruments, Inc.Paulo Butzen - Universidade Federal do Rio Grande SulPradeep Chawda - Apple IncYuanqing Cheng - Beihang UniversityMinki Cho - Intel Corp.Abishai Daniel - IntelShomit Das - AMD ResearchMarshnil Dave - Lion SemiconductorMike DiRenzo - Texas InstrumentsMd Amimul Ehsan - Intel CorporationVittorio Ferrari - University of BresciaTobias Gemmeke - RWTH Aachen UniversityPatrick Girard - LIRMM / CNRSNa Gong - University of South AlabamaSrinivasan Gopal - Intel CorporationRekha Govindaraj - Apple Inc.Jie Gu - Northwestern UniversityZhong Guan - UC Santa BarbaraAnkush Gupta - Texas InstrumentsJos Huisken - Eindhoven University of TechnologyRouwaida Kanj - American University of BeirutDae Hyun Kim - Washington State UniversityRakesh Kumar - Ampere ComputingJoshua Lee - City University of Hong KongJin-Fu Li - National Central UniversityRakeshkumar Mahto - California State UniversityMaria Malik - IntelEverton Matos - Technology Innovation InstituteShreepad Panth - Altera Corporation, An Intel CompanyHarsh Patel - AMDJose Pineda de Gyvez - NXP SemiconductorsThilo Sauter - Danube University KremsAbhronil Sengupta - The Pennsylvania State UniversityAli Shahi - GlobalFoundriesPrabha Sundaravadivel - University of Texas at TylerVishnoi Upasna - Marvell Semiconductor Inc.Jianyong Xie - IntelAmir Zjajo - Delft University of TechnologySystem-level Design and Methodologies (SDM)Harsh Patel, AMD (Chair)Shiyan Hu, University of Southampton (Co-Chair)Committee Members:Mohamad Hammam Alsafrjalani - University of MiamiSourav Das - Intel CorporationFabiano Hessel - PUCRSGeorgios Keramidas - Aristotle University of Thessaloniki/Think Silicon S.A., GRSelcuk Kose - University of RochesterHana Kubatova - CTU in PragueCarlos Moratelli - UFSCAntonio Nunez - University of Las Palmas GCPravin Kumar Venkatesan - Velodyne LidarRajeev Murgai - Synopsys India Pvt. Ltd.5

TECHNICAL PROGRAM COMMITTEES(continued)Hardware and System Security (HSS)Nima Karimian, San Jose State University (Chair)Anupam Chattopadhyay, Nanyang Technological University (Co-Chair)Committee Members:Shivam Bhasin - Temasek Laboratories, Nanyang Technological UniversityHari Cherupalli - SynopsysJia Di - University of ArkansasChenglu Jin - CWI AmsterdamJan Moritz Joseph - RWTH Aachen UniversityAmey Kulkarni - NVIDIA IncFarhad Merchant - RWTH Aachen UniversityDebdeep Mukhopadhyay - Indian Institute of TechnologySeetharam Narasimhan - Intel CorpGang Qu - Univ. of Maryland, College ParkFrancesco Regazzoni - University of Amsterdam and ALaRI - USISamah Saeed - City College of New Yorkfareena saqib - University of North Carolina at CharlotteIoannis Savidis - Drexel UniversityHossein Sayadi - California State University, Long BeachBenjamin Tan - New York UniversityXiaowei Xu - Huazhong university of science and technologyWeize Yu - Shandong UniversityJiliang Zhang - Hunan UniversityDominik Šišejković - RWTH Aachen UniversitySpecial SessionsPravin Kumar Venkatesan, Velodyne Lidar (Chair)Prabha Sundaravadivel, University of Texas at Tyler (Co-Chair)Rajat Subhra Chakraborty, IIT Kharagpur (Co-Chair)Mimi Xie, The University of Texas at San Antonio (Co-Chair)Committee Members:Abhilash Goyal - IEEE MemberAmey Kulkarni - NVIDIA IncWIP - Work in ProgressSara Tehranipoor, Santa Clara University (Chair)Kurt Schwartz, Texas Instruments (Co-Chair)Ali Iranmanesh, ISQED (Co-Chair)6

GENERAL INFORMATIONGENERAL INFORMATIONISQED’21April 7-9, 2021Pacific Daylight Time (PDT)Virtual EventAWARDS & RECOGNITIONSWednesday April 7, 9:00 AM - 9:20 AMTrack GBest Paper AwardsRecipients of the ISQED’21 Best Paper Awards will be recognized in this segment of the program. The best papers areshown in Page 2 of this document.KeynotesWednesday, April 7, 9:20 AM - 9:55 AMTrack GConfluence of AI/ML with EDAand Software EngineeringArun VenkatacharVice President, Artificial Intelligence and Central EngineeringSynopsysThursday April 8, 9:00 AM - 9:35 AMTrack GCars Driving Chips or Chips Driving Cars?Ravi Subramanian, Ph.DSenior Vice President - IC VerificationSiemens EDAPanel DiscussionWednesday, April 7, 12:55 PM - 2:25 PMTrack GState of Autonomous Vehicle Development:Moving Forward with Safe CarsThe automotive industry is going through a disruptive phase andone of the major factors causing this disruption is autonomouscars. The digitalization of the automotive industry is changingthe traditional patterns of transport and mobility, and connectedvehicles, self-driving vehicles, and vehicles that are increasinglyconnected to the internet and equipped with electromechanicalcontrols are defining some of today and most of the future automotive industry. Though there is strong demand from users, howrealistic is the future of autonomous vehicles? Is the safety of autonomous cars an issue for drivers and will potential safety issuescause the autonomous vehicle development to crash? Is the mobility trend shifting towards ride sharing? What new challengesand opportunities do driverless cars bring to the microelectronicindustry? What are the safety and security constraints? What arethe implications of the inclusion of AI hardware and software?Join us to listen to our panelist’s thoughts on the subject.Panelists:Nirmal R. Saxena - NVIDIALee Harrison - Mentor, A Siemens BusinessJames Herman - CMU/RoboraceSweta Mehta - Tata Consultancy ServicesSrijani Dey - DXC TechnologyModerator:Aditya Sharma - Microsoft (Chair)Chairs:Shigeki Tomishima - Intel Corporation (Chair)Siddha Ganju - Nvidia (Co-Chair)7

GENERAL INFORMATIONEmbedded TutorialsChair & Moderators:José Pineda de Gyvez - NXP Semiconductors (Co-Chair)Yu Pu - Alibaba (Co-Chair)Track GTutorial 1Wednesday, April 7, 11:50 PM - 12:50 PMSemiconductors for the next wave in AutomotiveClara Otero PerezNXP SemiconductorsTutorial 2Thursday April 8, 12: 35 PM 1:35 PMLarge-Scale Quantum Computers:The need for Cryo-CMOSDr. Fabio SebastianoDelft University of Technology, Delft, The NetherlandsTutorial 3Friday April 9, 9:00 AM - 10:00 AMPutting AI on Diet:TinyML and Efficient Deep LearningProf. Song Han, MIT EECSTutorial 4Friday April 9, 10:00 AM - 11:00 AMSecurity challenges and opportunities at theIntersection of Architecture and ML/AINael Abu-GhazalehUniversity of California, Riverside8TECHNICAL SESSIONSThere are a total of 16 paper sessions held on Wednesdayto Friday. Technical sessions are held in the format of fourparallel virtual tracks A, B, C, D.

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10WELCOME AND INTRODUCTIONTRACK AEMBEDDED TUTORIAL 1PANEL DISCUSSIONTRACK GSEMICONDUCTORS FOR THE NEXT WAVE IN AUTOMOTIVECLARA OTERO PEREZ - NXP SEMICONDUCTORSEND OF DAY 1TRACK BTRACK CTRACK DANALOG, NANOTUBE, ANDQUANTUM RELEVANCE OF MACHINELEARNINGSESSION 2C.2HARDWARE-SOFTWARE CO-DESIGN OFEMBEDDED AI FOR NEXT-GENERATION IOTSYSTEMSEDA METHODOLOGIES FOR SECUREAND ERROR RESILIENT HARDWAREDESIGNSESSION 2DSESSION 2C.1EFFICIENT AI COMPUTINGSESSION 2BBREAKTRACK GSTATE OF AUTONOMOUS VEHICLE DEVELOPMENT: MOVING FORWARD WITH SAFE CARSLOW POWER COMPUTATION TECHNIQUESAND CONCEPTSSESSION 2ATRACK DTRACK CTRACK BTRACK ABREAKAPPLIED MACHINE LEARNING FORHARDWARE CYBERSECURITYEMERGING DEVICES ANDTECHNOLOGIESVERIFICATION AND FAULT ANALYSIS OFCIRCUITSADVANCED ANALOG DESIGN ANDCONCEPTSSESSION 1DSESSION 1CSESSION 1BSESSION 1ABREAKTRACK GCONFLUENCE OF AI/ML WITH EDA AND SOFTWARE ENGINEERINGARUN VENKATACHAR - VICE PRESIDENT, ARTIFICIAL INTELLIGENCE AND CENTRAL ENGINEERING , SYNOPSYSTRACK GKEYNOTE SPEECH - PLENARY SESSION P1FLOOR PLAN2:30 PM - 3:50 PM2:25 PM - 2:30 PM12:55 PM - 2:25 PM11:50 AM -12:55 PM11:20 AM - 11:50 AM10: AM - 11:20 AM9:55 AM - 10:00 AM9:20 AM - 9:55 AMTIME9:00 AM - 9:20 AMDATEWEDNESDAY4/7/2021ISQED’21 PROGRAM AT A GLANCEPROGRAM AT A GLANCE - WEDNESDAY

1:40 PM -3:20 PM1:35 PM -1:40 PM12:35 PM -1:35 PM112:05 PM -12:35 PM10:25 AM - 12:05 PM10:20 AM - 10:25 AM9:35 AM -10:20 AM9:00 AM -9:35 AMTIME8:50 AM - 9:00 AMDATETHURSDAY4/8/2021TRACK ATRACK BEMBEDDED TUTORIAL 2BREAKTRACK CSESSION 3CREVERSE ENGINEERING ANDHARDWARE OBFUSCATIONTRACK CSESSION PW3POSTER AND WIP PAPERSTRACK CTRACK BEND OF DAY 2SESSION 4CMEMORY AND ARCHITECTURE LEVELSECURITYSESSION 4BCAD FOR SYSTEM ANALYSIS ANDOPTIMIZATIONBREAKTRACK GLARGE-SCALE QUANTUM COMPUTERS: THE NEED FOR CRYO-CMOSFABIO SEBASTIANO - DELFT UNIVERSITY OF TECHNOLOGY, DELFT, THE NETHERLANDSSESSION 4ADESIGN TECHNIQUES & METHODOLOGIESFOR AN ENERGY-EFFICIENT SYSTEMTRACK ABREAKSESSION 3BEDA METHODOLOGIES FOR DESIGNPLANNING AND CHARACTERIZATIONTRACK BTRACK ASESSION 3AROBUST AND EFFICIENT AI COMPUTINGSESSION PW2POSTER AND WIP PAPERSTRACK GCARS DRIVING CHIPS OR CHIPS DRIVING CARS?RAVI SUBRAMANIAN, PH.D., SENIOR VICE PRESIDENT - IC VERIFICATION, SIEMENS EDAWELCOME & INTRODUCTIONKEYNOTE SPEECH - PLENARY SESSION P2TRACK GSESSION PW1POSTER AND WIP PAPERSISQED’21 PROGRAM AT A GLANCETRACK DSESSION 4D.3RELIABILITY IN NEURAL NETWORKSSESSION 4D.2N-MEMORY AND QUANTUMCOMPUTING TECHNOLOGIESSESSION 4D.1SOLVING SOC/CHIPLETSCOMMUNICATION ANDCOMPUTATION CHALLENGESTRACK DSESSION 3DAPPLICATION OF AI/MLIN HARDWARE SECURITYTRACK DSESSION PW4POSTER AND WIP PAPERSLunchen KeynotePROGRAM AT A GLANCE - THURSDAY11

12DATEFRIDAY4/9/2021TIME11:10 AM -12:30 PM11:00 AM -11:10 AM10:00 AM - 11:00 AM9:00 AM - 10:00 AMEMBEDDED TUTORIAL 4TRACK GPUTTING AI ON DIET: TINYML AND EFFICIENT DEEP LEARNINGPROF. SONG HAN, MIT EECSEMBEDDED TUTORIAL 3TRACK AIOT AND WEARABLE COMPUTINGSESSION 5AEND OF DAY 3BREAKSECURITY CHALLENGES AND OPPORTUNITIES AT THE INTERSECTION OF ARCHITECTURE AND ML/AIPROF. NAEL ABU-GHAZALEH , UNIVERSITY OF CALIFORNIA, RIVERSIDETRACK GISQED’21 PROGRAM AT A GLANCEPROGRAM AT A GLANCE - FRIDAY

ISQED Keynote 1PWednesday April 79:20 AM - 9:55 AMTrack GConfluence of AI/ML with EDA and Software EngineeringArun VenkatacharVice President, Artificial Intelligence and Central Engineering , SynopsysInvestments into AI/ML to solve EDA problems with ever-increasing complexities of chip-design is startingto come to light. Recent product announcements like the DSO.ai from Synopsys revolutionizes chip designby massively scaling exploration of options in design workflows. Similarly, there are many applications inproduction solving different challenges in areas like verification, place & route, dfm etc., that have harnessedthe power of AI/ML, Big-Data and Compute to provide a new set of tools and techniques for EDA to addressboth existing and new challenges. Not only do these technologies aid EDA, they are also helping us addresschallenges during software engineering development of these complex EDA products. By harnessing thedata from code, tests, and bugs one can now improve product quality, improve productivity, and providegreater customer experience. In my talk I will be also going over such applications that are in production.With such potential, companies now need to build good data strategies to harness these benefits acrosstheir organizations. They will also need to invest in good data and AI/ML infrastructures to expedite building these solutions. It is now time to have data generate algorithms instead of the other way around! Whilethese inve

Deepashree Sengupta - Synopsys Inc. Yiorgos Tsiatouhas - University of Ioannina Miroslav N. Velev - Aries Design Automation Arnaud Virazel - LIRMM Emerging Device and Process Technologies and Applications (EDPT) Rasit Onur Topaloglu, IBM (Chair) Vita Pi-Ho Hu, National Taiwan University (Co

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