SERVICE MANUAL US Model

HCD-GNX60/GNX70/GX9900SERVICE MANUALUS ModelHCD-GX9900E ModelAustralian ModelVer.1.0 2005. 03HCD-GNX60/GNX70 HCD-GNX60/GNX70/GX9900 are the Amplifier,CD player, tape deck and tunersection in MHC-GNX60/GNX70/GX9900.Photo : HCD-GNX70CDSectionTAPESectionModel Name Using Similar MechanismHCD-GN880CD Mechanism TypeCDM74-F1BD81Base Unit NameBU-F1BD81AOptical Pick-up NameKSM-215DCP/C2NPModel Name Using Similar MechanismNEWTape Transport Mechanism TypeCMAT5Z2SPECIFICATIONSAUDIO POWER SPECIFICATION (MHC-GX9900 USA model only)POWER OUTPUT AND TOTAL HARMONIC DISTORTION:With 6-ohm loads, both channels driven, from 120 Hz – 10 kHz; rates 230watts per channel minimum RMS power, with no more than 10% totalharmonic distortion from 250 miliwatts to rated output.Amplifier section MHC-GX9900Total harmonic distortionLess than 0.1%(6 ohms at 1 kHz, 100 W)MHC-GNX70The following are measured atMexican model:AC 127 V, 60 HzOther models:AC 120, 220, 240 V, 60 HzDIN power output (rated)170 170 watts (6 ohms at 1 kHz, DIN)Continuous RMS power output (reference)220 220 watts (6 ohms at 1 kHz, 10% THD)MHC-GNX60The following are measured atMexican model:AC 127 V, 60 HzBrazil model:AC 127 V or 220 V, 60 HzOther models:AC 120, 220, 240 V, 50/60 HzDIN power output (rated)150 150 watts (6 ohms at 1 kHz, DIN)Continuous RMS power output (reference)200 200 watts (6 ohms at 1 kHz,10% THD)InputsVIDEO/MD (AUDIO) IN (phono jacks):voltage 250/450 mV,impedance 47 kiloohmsTV (AUDIO) IN (phono jack):voltage 250 mV,impedance 47 kiloohmsMIC (phone jack):sensitivity 1 mV,impedance 10 kiloohms9-879-532-01Sony Corporation2005C0279-1Audio GroupPublished by Sony Engineering Corporation 2005.03OutputsPHONES (stereo mini jack):accepts headphones of8 ohms or moreFRONT SPEAKER:Use only the supplied speaker SS-GNX100 (MHC-GNX70/GX9900) SS-GNX60 (MHC-GNX60)SURROUND SPEAKER: Use only the supplied speaker SS-RSX80 (MHC-GNX70/GX9900)Disc player sectionSystemLaserLaser OutputFrequency responseWave lengthSignal-to-noise ratioDynamic rangeCompact disc and digital audio systemSemiconductor laser (l 780 nm)Emission duration: continuousMax. 44.6 mW**This output is the value measured at adistance of 200 mm from the objectivelens surface on the Optical Pick-up Blockwith 7 mm aperture.2 Hz – 20 kHz ( 0.5 dB)780 – 790 nmMore than 90 dBMore than 90 dBOPTICAL CD DIGITAL OUT (Square optical connector jack, rear panel)(For MHC-GNX60/GNX70)Wave length660 nmOutput Level–18 dBm– Continued on next page –MiNi Hi-Fi COMPONENT SYSTEM

HCD-GNX60/GNX70/GX9900Tape deck sectionRecording systemFrequency response4-track 2-channel stereo50 – 13,000 Hz ( 3 dB),using Sony TYPE I tapeTuner sectionFM stereo, FM/AM superheterodyne tunerFM tuner sectionTuning range87.5 – 108.0 MHzAntennaFM lead antennaAntenna terminals75 ohm unbalancedIntermediate frequency10.7 MHzAM tuner sectionTuning rangeNorth and Latin American models:530 – 1,710 kHz(with the interval set at 10 kHz)531 – 1,710 kHz(with the interval set at 9 kHz)Other models:531 – 1,602 kHz(with the interval set at 9 kHz)530 – 1,710 kHz(with the interval set at 10 kHz)AntennaAM loop antennaAntenna terminalsExternal antenna terminalIntermediate frequency450 kHzGeneralPower requirementsNorth American model:Australian model:Argentina model:Other models:Power consumptionMHC-GX9900MHC-GNX70MHC-GNX60Dimensions (w/h/d) (Approx.)Mass (Approx.)HCD-GNX70HCD-GX9900HCD-GNX60120 V AC, 60Hz230 – 240 V AC, 50/60 Hz220 V AC, 50/60 Hz120 V, 220 V or 230 – 240 V AC, 50/60 HzAdjustable with voltage selector250 watts225 watts200 watts280 360 398.5 mm12.1 kg11.8 kg11.3 kgSAFETY CHECK-OUTAfter correcting the original service problem, perform the followingsafety checks before releasing the set to the customer:Check the antenna terminals, metal trim, “metallized” knobs, screws,and all other exposed metal parts for AC leakage. Check leakage asdescribed below.LEAKAGEThe AC leakage from any exposed metal part to earth ground andfrom all exposed metal parts to any exposed metal part having areturn to chassis, must not exceed 0.5 mA (500 microamperes).Leakage current can be measured by any one of three methods.1. A commercial leakage tester, such as the Simpson 229 or RCAWT-540A. Follow the manufacturers’ instructions to use theseinstruments.2. A battery-operated AC milliammeter. The Data Precision 245digital multimeter is suitable for this job.3. Measuring the voltage drop across a resistor by means of aVOM or battery-operated AC voltmeter. The “limit” indicationis 0.75 V, so analog meters must have an accurate low-voltagescale. The Simpson 250 and Sanwa SH-63Trd are examplesof a passive VOM that is suitable. Nearly all battery operateddigital multimeters that have a 2V AC range are suitable. (SeeFig. A)To Exposed MetalParts on Set0.15 µF1.5 kΩACVoltmeter(0.75 V)Design and specifications are subject to change without notice.Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may bedamaged by heat.Flexible Circuit Board Repairing Keep the temperature of soldering iron around 270 Cduring repairing. Do not touch the soldering iron on the same conductor of thecircuit board (within 3 times). Be careful not to apply force on the conductor when solderingor unsoldering.CAUTIONUse of controls or adjustments or performance of proceduresother than those specified herein may result in hazardousradiation exposure.This appliance is classified asa CLASS 1 LASER product.This label is located on the rearexterior.SAFETY-RELATED COMPONENT WARNING!!COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITHMARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTSLIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESECOMPONENTS WITH SONY PARTS WHOSE PART NUMBERSAPPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTSPUBLISHED BY SONY.2Earth GroundFig. A. Using an AC voltmeter to check AC leakage.Unleaded solderBoards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.(Caution: Some printed circuit boards may not come printed withthe lead free mark due to their particular size.): LEAD FREE MARKUnleaded solder has the following characteristics. Unleaded solder melts at a temperature about 40 C higher thanordinary solder.Ordinary soldering irons can be used but the iron tip has to beapplied to the solder joint for a slightly longer time.Soldering irons using a temperature regulator should be set toabout 350 C.Caution: The printed pattern (copper foil) may peel away ifthe heated tip is applied for too long, so be careful! Strong viscosityUnleaded solder is more viscous (sticky, less prone to flow)than ordinary solder so use caution not to let solder bridgesoccur such as on IC pins, etc. Usable with ordinary solderIt is best to use only unleaded solder but unleaded solder mayalso be added to ordinary solder.

HCD-GNX60/GNX70/GX9900TABLE OF CONTENTS1.SERVICING NOTES . 42.GENERALLocation of Controls . sembly Flow .Side Panel, Top Case .Loading Panel Assy .Front Panel Assy .Tuner Pack .Tape Mechanism Deck, Mic Board .Panel Board, CD-SW Board .CD Mechanism Deck .Back Panel .Primary Board .Power AMP PC Board Assy, Main Board .Surround Board, PA Board .Power Transformer (T1200) .Driver Board, SW Board .CD Board .Sensor Board .Motor (TB) Board .Motor (LD) Board .4.TEST MODE . 175.MECHANICAL ADJUSTMENTS . 216.ELECTRICAL ADJUSTMENTS7889910101111121213131414151516Deck section . 21CD Section . 20.7-21.7-22.7-23.Circuit Board Location .Block Diagram – CD Section – .Block Diagram – Tape Section – .Block Diagram – Main Section – .Block Diagram – AMP Section – .Block Diagram – Display Section – .Printed Wiring Board – CD Board – .Schematic Diagram – CD Board – .Printed Wiring Board – CD Mechanism Boards – .Schematic Diagram – CD Mechanism Boards – .Printed Wiring Boards – Main Board – .Schematic Diagram – Main Board (1/3) – .Schematic Diagram – Main Board (2/3) – .Schematic Diagram – Main Board (3/3) – .Printed Wiring Boards – Panel Board – .Schematic Diagram – Panel Board – .Printed Wiring Board – CD-SW, Jog, Mic Boards – .Schematic Diagram – CD-SW, Jog, Mic Boards – .Printed Wiring Board – PA Board – .Schematic Diagram – PA Board – .Printed Wiring Board – Trans, Primary Boards – .Schematic Diagram – Trans, Primary Boards – .IC Pin Function Description .8.EXPLODED VIEWS8-1.8-2.8-3.8-4.Case (Top), Rear Panel Section .Front Panel Section .Chassis Section .CD Mechanism Deck Section-1(CDM74-F1BD81) .8-5. CD Mechanism Deck Section-2(CDM74-F1BD81) 657585960ELECTRICAL PARTS LIST . 613

HCD-GNX60/GNX70/GX9900SECTION 1SERVICING NOTESNOTES ON HANDLING THE OPTICAL PICK-UP BLOCKOR BASE UNIT MODEL IDENTIFICATION– Back Panel –PART No.The laser diode in the optical pick-up block may suffer electrostaticbreak-down because of the potential difference generated by thecharged electrostatic load, etc. on clothing and the human body.During repair, pay attention to electrostatic break-down and alsouse the procedure in the printed matter which is included in therepair parts.The flexible board is easily damaged and should be handled withcare.NOTES ON LASER DIODE EMISSION CHECKThe laser beam on this model is concentrated so as to be focused onthe disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission,observe from more than 30 cm away from the objective lens.LASER DIODE AND FOCUS SEARCH OPERATIONCHECKCarry out the “S curve check” in “CD section adjustment” and checkthat the S curve waveform is output several times.MODELGNX60: E2, E3 modelsGNX70: E2, E3 modelsGX9900 modelGNX60: AR modelGNX60: E51 modelGNX70: AUS modelGNX70: E51 modelGNX60: AUS model AbbreviationAR : Argentine modelE2 : 120 V AC Area in E modelE3 : 240 V AC Area in E modelE51 : Chilean and Peruvian modelAUS : Australian model4PART 974-0[]

HCD-GNX60/GNX70/GX9900SECTION 2GENERALThis section is extractedfrom instruction manual.LOCATING THE CONTROLSList of button location s and reference pagesM a in unitALPHABETICAL ORDERSYMBOLSM –RMASTER VOLUME 8A –DALBUM /– qlAMP MENU edAUTO/MANUAL3) 2CD elCD SYNC qdDeck A eaDeck B wsDIRECTION qkDISC 1 3 7Disc tray 9DISPLAY rdDisplay rfMIC 1 (jack) wjMIC 2 (jack) whMIC LEVEL wgMP3 BOOSTER q;MPX4)qkOPERATION DIAL wlPHONES (jack) wkPower illuminator wdREC PAUSE/START qhS –ZSOUND FLASH e;SPEAKERS3) 1SURROUND1) rgSURR SPEAKER MODE2) rgTAPE A/B ejTape lid ws eaTUNER/BAND ekTUNING /– qjTV egVIDEO/MD efX-ROUND buttons3) 3WA VE/FADER/BALANCE/RANDOM/TWISTERX-ROUND JOG3) 4X-ROUND OFF3) 1E –LECHO LEVEL wfENTER waEQ BAND qaEX-CHANGE/DISC SKIP 6GROOVE ehILLUMINATION rsIR Receptor r;?/1 (power) raZ OPEN/CLOSE 5n N (play) qs1) ForMHC-GNX100/GNX66/GNX602) For MHC-GNX88/GNX80/. (go backward/forward) qjGNX77/GNX70/GX99003)MHC-GNX100 onlym M (rewind/fast forward) ql4)For MHC-GNX88/GNX77/X (pause) qfGNX66x (stop) qgZ A (Eject A) esB Z (Eject B) w;T op Pa ne l1 23746 5Front Pa ne eswzeawse;wlwdwkwj wh wg wf5

HCD-GNX60/GNX70/GX9900This section is extractedfrom instruction manual.Re m ot e c ont rolALPHABETICAL ORDERA –EALBUM qfALBUM – qhCD wfCLEAR qkCLOCK/TIMER SELECT 2CLOCK/TIMER SET 4DISC SKIP qdDISPLAY whENTER qsEQ qjF –ZFM MODE 6FUNCTION 8PLAY MODE 5REPEAT 6SLEEP 1TAPE wdTUNER/BAND 7TUNER MEMORY wgTUNING MODE 5VOLUME /– qgThe button has a tactile dot.*23SYMBOLS?/1 (power) 3x (stop) qaX (pause) qlN (play) w;–. (go backward) ws (go forward) wam (rewind) q;M (fast forward) 9wh4wg6wd8ws9w;qaqkqsqjqd57wfwaq;qlqhqfqg* Use the tactile dot as a referencewhen operating the system.61