Amkor Test Services Brochure
Dedicated to comprehensivequality and customer supportAMKOR TEST SERVICES
TABLE OF CONTENTSA HISTORY OF QUALITY. 2LOCATIONS & SERVICES. 3TEST SERVICES . 4CAPABILITY HIGHLIGHTS. 7LOWERING THE COST OF TEST. 8DIFFERENTIATED TEST BY MARKET. 9OTHER TEST SERVICES AND PROCESSES. 14AMKOR TESTS A VARIETY OFDEVICES, ACROSS MANY MARKETS1Amkor Test Services amkor.com
A HISTORY OF QUALITYWith knowledge gathered from decades of supporting Tier 1 and emerging industry leaders, Amkorunderstands that test solutions must address advanced technology, quality, performance and cost of test.Through early engagement in each customer’s product lifecycle, Amkor helps define test strategies andintelligent equipment selection to provide differentiated test solutions.#1WHO IS AMKOR?1Amkor provides comprehensive test services thatcomplement wafer level and package assembly#1#1Amkor is the #1 RF test services supplier forsub-6 GHz. Amkor has ongoing joint effortswith test equipment suppliers and customersto enable 5G product production testingWe are the #1 OSAT supplier for Automotiveand Artificial Intelligence (AI) processor testingAmkor has a vast array of test capabilities andrich experience in device testingMarkets Automotive & Industrial, Communications,Networking, Computing and ConsumerApplications Analog/Mixed signal, digital, imaging,memory, power/discrete, PMIC, RF,sensors & actuators and SoC(s), includingproducts designed per 3GPP (5G) RFstandardsAdvanced Packages 2.5/3D, Cavity MEMS, fine pitch Cu pillar,MCM (Multi-Chip Module), advanced SiP,SWIFT , WLCSP, WLCSP , WLFOAmkor Test Services amkor.com2
ACCURATE AND THOROUGH TEST SERVICESWafer probe, final test, strip test, film frame test, system level test,opens/shorts test, burn-in and complete end-of-line24/7TESTED ANNUALLY 9 Billion unitsFull end-of-line processing: bake, scan, pack,ship and finished good servicesOperation of fullynetworked test floorsOUR SITES ARESTRATEGICALLY LOCATEDTESTING FOR COMMERCIAL,INDUSTRIAL &AUTOMOTIVE DEVICESTEST DEVELOPMENTSoftware & hardware forprobe, strip, final andsystem level test 1.8 Million wafersnear leading foundries, majorcustomer sites and co-located tosupport probe with bump/WLCSPand test with assemblyDiscrete, power, mixed-signal,memory, RF, MEMS and SiP devicesLOCATIONS & SERVICESKOREA SHANGHAI Wafer probe/Package test,Film frame test, System level testCommunication, Memory Bumping, FC, CSP, MLF , PBGA V93000, UFLEX, FLEX, J750,Magnum, T5XXX Test development Wafer probe/Package test,Film frame test, System level testAutomotive, Consumer,CommunicationJAPANBumping, FC, CSP, MLF , TSV,TMV , TQFPV93000, UFLEX, FLEX, J750,T55XX, T2KTest development Wafer probe/Package test FC, PBGA, QFN Automotive, Consumer,MemoryV93000, UFLEX, FLEX, J750,T2K, Magnum, T65XXTest developmentPORTUGAL Wafer probe WLFO Communication,Memory experience, RFUFLEX RF, Rack & Stack, T5XXXPHILIPPINES Test developmentTAIWAN 3Amkor Test Services Wafer probe/Package test,Film frame testCommunication, Consumer,NetworkingBumping, FC, WLCSPV93000, UFLEX, FLEX, J750,T2K, ETS, LTX, T6XXX, STSTest developmentamkor.comMALAYSIA Package test TO-220FP, SO8-FL,TSON8-FL, SONXXX-FL Power, DiscreteTESEC, CATS, ITS, Tsuruga Wafer probe/Package test,Film frame test,System level test,MEMS testAutomotive, Consumer, MemoryMLF , Leadframe, QFP, Burn-inV93000, FLEX, J750, T2K,Magnum, ETS, LTX, D10, ASLXTest development
TEST SERVICESAmkor has an extensive equipment fleetand continues to invest in new capabilitiesrequired to test the latest devices.Primary testers, probers and ANALOGRFMEMORYV93000 (PS400/800), T657X, I-FLEX,J750, SX-37XXV93000 (PS1600), T2000,UFLEX, DiamondChroma 3650V93000 (PS5000, XPS256),UltraFLEXplus (UP2200, UltraVS256)J750, EVA100V93000 (PS1600), ETS88/364, T2000IPS, UFLEX, J750EX/HDETS800I-FLEX RF, PAX, NI-STSV93000 (PS1600, PS-RF), UFLEX,(UW-12G/24G), V93000 (PS1600,WS-RF), PAx & DMDx (DragonRF)V93000 (WS-RF mmWave), UFlex-RF(MX20, MX44), PAx (RedDragon-RFmmWave), NI-STS (PXIe-5831 mmWave)T537X, T558X, Magnum 1,Magnum 2, Magnum 2xMagnum VU, Magnum VUxMagnum VUyCISIP750, T2000ISSPRODUCTION TESTERSAmkor Test Services amkor.com4
TESTERS FOR NANDAdvantestPCIe Gen45.8 -8.0 Gbps (UFS 2.x)PCIe Gen31G800M500M400M300M200M100M1.6 Gbps1.33 Gbps (Toggle 4.0)800 Mbps (Toggle 3.0)533 Mbps (Toggle 2.0)400 Mbps(Toggle 2.0)200 Mbps133 Mbps (Toggle 1.0)Magnum 2x(800 Mbps)2G2.9 Gbps (UFS)T5588 (800 Mbps)3GT537X(286 Mbps)Data Transfer Rate (bps)4GT5851 STM-8G,STM-16G5G11.6-16.0 Gbps (UFS 3.x )T5833 (2.4 Gbps)8GMAGNUM VU,VUx16GTester Model Name/Spec.Magnum V (1.6 Gbps) PROBERSAPPLICATION300 MMWAFERPROBE200 MMWAFERPROBEFILM FRAMEPROBE 1.5 µm*P12XLPRECIO*PRECIO-XL*UF3000*OPUS3 1.5 µm 1.0 µm*UF3000EXe*PRECIO-NANO*UF3000EX*OPUS3-SP 4.0 µm 2.0 µmP8XLUF200PRECIO-OCTO 2.0 µm 2.0 µmFP200A**WDF12DP/ PRODUCTION PROBERS*Tri-Temp option, **Tri-Temp option for FFP5TeradyneAmkor Test Services amkor.com**FP3000FD12
HANDLERSPICK &PLACETURRET 4 SITES 8 SITES 16 SITES 32 046LS*NX1032XS***TW154TBOWLFILM FRAMENY20FT2018NY32WPM38BOWLNX16/32GRAVITY 4 SITESAPPLICATION*SO1000*SO2000MEMORYSTRIP/FILM FRAMESLTSENSOR/ACTUATORXD248Z326HT1028CTW154V 8 SITESMT9928SO2800AH 128 SITES*SO8000*ZEUS 256 SITES 512 SITESHT3309M6771M6300TW350HTM6242M6243STRIPFILM FRAMEx384 SITES, STRIPFILM JaguarHT3016 (x12)Chroma 3260 (x6)TW SL301-N5033Titan/MAGNUSCUSTOMTOTAL SOLUTIONPM35 (x8) – microphoneNX32 (x8) – microphoneXD248 (x4) – e-compassNX16 (x1) – Hall sensorPM35 (x8) – humidity/tempInStrip – accel/GyroOSAI (x140) – pressurePRODUCTION HANDLERS*Tri-Temp, **Active Thermal Control (ATC), ***BothAmkor Test Services amkor.com6
CAPABILITY HIGHLIGHTSThere are many benefits to partnering with Amkor for full turnkey solutions, including wafer processing,advanced bump, wafer probe, assembly, final test, system level test, burn-in and end-of-line services.WAFER PROBE Wafer testing sizes include 8” and 12” with 14, 10,7 and 5 nm process technologiesHS Logic, mixed signal, analog, high power( 100A) and RF including NB-IoT & 5G FR1 andFR2 standardsMultiple probe card technologies: Cantilever( 1 GHz), vertical (up to 40,000 probes), pogo,membrane ( 4 GHz), MEMS and dual-level CoW Many topologies: Al pad, fine pitchCu pillar WLCSP, bump and film frame40 µm pitch and 25 x 25 µm2 pads/bumpsProber capabilities: alignment to 1 µm and-55 C to 200 C temperature rangePROBE TECHNOLOGYCantileverCu Pillar BumpCSPPogo PinMembraneMEMSFINAL TESTSYSTEM LEVEL TESTBURN-IN 7Automatic Test Equipment (ATE)Singulated up to x16/x32parallelismMassively parallel NANDSocket pin technologies forpackages supporting 5G RFstandards in 24-52, 60 and 77 GHzFR2 frequency bandsOTA waveguides to support AiPand AoP RF channelsDigital HS SerDes data rates up to32 GbpsStrip, massively parallelLeadframe (x308), saw MLF filmframe, InCarrierAmkor Test Services amkor.com Synchronous &asynchronousSpecialized solutionsSiP – using distributed testflows – 2.5/3D in-situ Development ServicesAutomotive (MCC)Analog (Shikino Hightech)MCU (Shikino Hightech)SoC (STK)Memory (STK, JEC, AEHR) – SmallMLF stripNAND (B6700)
LOWERING THE COST OF TESTIn an effort to lower the cost of test, Amkor also offers massively parallel strip test and full test software andhardware development.MASSIVELY PARALLEL STRIP TESTTEST DEVELOPMENT ENGINEERINGFor applications with long test times and lifecyclessuch as serial EEPROM, microcontrollers, powermanagement and op amps, parallel testing in a stripformat is cost effective. By utilizing Amkor’s highestdensity leadframe (XDLF) process, high parallelismis achieved – up to 300 units per touch down.Some customers develop their own completetest solutions and offload to Amkor for production.Amkor can enable co-development, or fulldevelopment, of complete test software andhardware solutions. Engage with us early in theproduct design for maximum impact, or come tous later in the product lifecycle for significant costsavings with migrations to more cost effectivetesters and/or higher parallelism.ASSEMBLY FORMATStd LeadframePACKAGESWorking collaboratively with customers,Amkor ensures: TQFP up to 64 lead,10 x 10 mm2 SOIC (mil): N (150),W (300), Std (208) mil TSSOP up to 28 lead(3.0 and 4.4 mm body sizes) PDIP up to 8 lead LGA 12 x 12 mm2Film Frame Saw MLF up to 7 x 7 mm2InCarrier Saw MLF (including varioussensors/actuators (MEMS)) Novel low costOne-stop accountabilityTurnkey with bump and assemblyWhether a customer needs to bring up NPI orreduce costs and achieve higher throughput, Amkoroffers full service test development and drawsupon a large existing tester fleet. New testers areonly recommended as a last resort.TYPICAL TEST DEVELOPMENT CYCLE TIMESMonth 0Month 1Month 2DevelopmentLEAD TIME PER APPLICATIONᗮ Logic/Mixed: 6 8 weeksSocket Load Board Interface(3 4 weeks)ᗮ Analog: 8 10 weeksᗮ RF/MEMS: 12 14 weeksPlanningProposal SOW P.O.Month 3Note: Development lead time can varydepending on customer test requirements.PIB Probe Card(4 8 weeks)ProductionSW DevelopmentDefinitionDevelopmentProgram Dev.(3 4 weeks)Debug(2 3 weeks)Corr./Qual.(1 weeks)Release HVMDeploymentAmkor Test Services amkor.com8
DIFFERENTIATED TEST BY MARKETAUTOMOTIVE & INDUSTRIALAmkor is the number one automotive OSAT,supporting major Asian, US and European supplychains. Products in this area include infotainmentand safety requiring high levels of performance.This requires a much more comprehensive set oftest requirements. High-quality, standards-compliant processesand systems Added inspections and tri-temperaturemulti-temperature test capabilities Wafer probe at -55 C to 200 CFinal test at -55 C to 175 CBurn-inSystem Level Test (SLT) Leverage cold wafer probe and perform onlyroom and hot temperature final test Supplement post assembly final (functional)test with outgoing post assembly opens/shortstesting, includes 2 and 4 wire resistance testsAMKOR IS THENUMBER ONEAUTOMOTIVEOSAT SUPPLIER9Amkor Test Services amkor.comCURRENT SOLUTIONS Large body SiP (Infotainment)using tri–temperaturesystem level test ABS & Electronic Control Unit(ECU) test (MLF , QFP) ADAS test (FCBGA) IoT (MCU, RF & sensors/actuators) Specialized test for electricvehicle components – inverters,convertersIN DEVELOPMENT mmWave radar componenttest – wafer & die-level Autonomous driving (Collisionwarning, Parking assist, Blind spotdetection) Solutions for LIDAR AEC-Q100 grade zero compliantburn-in solutions
COMMUNICATIONSMore than 35% of Amkor’s revenue is derived fromCommunications (smartphones, tablets, handhelds andwearable devices). Our leading edge test solutions keeppace with rapid changes in cellular and connectivitytechnology requirements. Amkor is already wellpositioned for 5G wireless and its new test requirements– working with leading customers and ATE suppliers, wehave 5G RF test capability in place. Leverage RF wafer probe capabilities – known good die(KGD) for WLCSP and known tested die (KTD) for SiP5G NR conductive test for both FR1 and FR2 frequencyrangesMulti-site x8 RF test to lower costAugment ATE coverage with SLT (protocol test)Address complex SiP with simple SLT, including RFcallbox testingSoC Memory PoP – double side test/stackCSP – memory and logic testAdvanced ATE w/32 port and multi-site, multi-channelTx & Rx supportLocal RF shielding 60 dBmFront-end RF, SiP and IoTAsynchronous test for different RF connectivitystandardsSingle and multiple channel beam forming, phasedarray, AiP/AoP supportCURRENT SOLUTIONS Memory interface test throughlogic or modem die DRAM test at system level testand memory fuse blow throughlogic die Top/bottom socket with0.3 & 0.35 mm pitchrespectively LTE-A, WLAN, Bluetooth, GPS,Zigbee RF Front-end (Antenna, switch,filter, PA, LNA) Transceiver, connectivity(Bluetooth, Zigbee, WLAN,802.11ac, 802.11ax & 802.11be(future), GPS 5G FR1 wide-bandwidth testsolutions RF MEMS, Passive-On-Glass(POG) Limited Ultra-Wide Band(UWB) test support. Improvedcapabilities are planned for thefuture Fine pitch TMV /IP PoP Mobile AP & BB PoP Mobile modem & memorystack CSPAmkor Test Services amkor.com10
ARTIFICIAL INTELLIGENCE (AI), NETWORKING &COMPUTINGCURRENT SOLUTIONS 2 TB bandwidth in package High performance 3 GHz DDR4, DDR5, Highbandwidth memory interfaces,including graphics Memory interface testthrough logic die UFS Protocol system level test PoP, MCP eMMC (NAND Controller),MCP (SDRAM NAND) MicroSD, SSD, UFSAmkor is a leading provider of high performance testsolutions for the demanding networking and computingmarket – where five nines (99.999%) or higher uptimeis expected. We have multiple customers supplyingSiP(s), SoC(s) and components into these markets(servers, routers, switches, PCs, laptops and peripherals).Integral to these markets are storage technology andmigrations from hard disk drives to solid state drives(SSD). In addition, Amkor has a strong array of NAND testcapabilities. Distributed test (wafer probe, in-situ test between keyassembly steps and final test (SLT and ATE) for 2.5D) Active thermal control for 300 watt products acrosstri-temperature in SLT and ATE test Silicon photonics ICs Probe solutions and wafer map management forchip on wafer (CoW) Dynamic burn-in Test during burn-in (TDBI) Film frame and strip test (x308 EEPROM) High-speed serial digital (e.g. PCIe Gen4, Gen5) testingup to 16 Gbps and 32 GbpsHIGH DATA RATE TEST TECHNOLOGIESUniversal Flash StoragePeripheral ComponentInterconnect ExpressUFS 2.06 Gbps (Max)UFS 3.012 Gbps (Max)PCle 3.08 GbpsUFS 1.03 Gbps (Max)PCle 5.0PCle 4.0 32 Gbps16 GbpsPCle 6.064 GbpsPCle 2.05 GbpsMagnum (Scalable)T5xxx (Scalable)11Amkor Test Services amkor.comV93000 ExaScale, SmartScale,UltraFLEXplus UltraPin
POWER/DISCRETESAmkor is a leader in power discrete devices,with test services that are closely integrated withassembly flow for shorter cycle times and reducedcosts. Unique requirements include: SiC, GaN module testHigh current, high voltageAdequate thermal capacityKelvin contact-type testsLow Rds onHIGH-VOLUME PRODUCTS AT AMKOR INCLUDE: Intelligent power modulesMulti-voltage FETsFlip chip MOSFETsInsulated-Gate Bipolar Transistors (IGBT)DiodesRegulators and bipolar transistors forautomotive, power transmission andindustrial segmentsTEST EQUIPMENT OFFERINGSCOMPANYMODELTEST ITEMHANDLERSMANUFACTURERTesec881-TT, 351-TT, 341-TTDCGravityTESECERDCMS-100S8 SeriesVS240AN, DTS-241RgDCHokutoAT-999 SeriesAM-083VDSX (SUS)/VCEX (SUS)/trrtrr/VsurgeDV-240 SeriesΔVDS/ΔVBECATS615-SWMinekoonSwitching test(trr/I rr/t off/t on/I Latch)ITCITC55100CUISShibasokuWL-22, WL-25ICPower TechQT-4100 SeriesQT101 SeriesDCUISPOWorldVC6700Transient testUeno SeikiTurretSowaKESSRMAmkor Test Services amkor.com12
SENSORS & ACTUATORS (MEMS)TYPEProducts for today’s Internet of Things (IoT)require an MCU, RF transmitter/receiver,sensors and actuators. The test solutionneeds to cover conversion of physical realworld analog signals into electrical data andprocessing of the data to determine if theproduct is good or not.TECHNOLOGYTEST APPLICATIONMagnetometer3-Axis, 0 to 10 gauss, 0.1 accuracyAccelerometer3-Axis, Low-g, High-g, Strip testGyroscope3-Axis yaw rate, Gyroscope testMicrophoneSound stimulus for bothtop-port/bottom-portPressure0 to 20 bar, Strip test,Bench characterizationInertial Combos6-10 Degrees of Freedom (DoF)OpticalAuto-focus, Microdisplay,PicoprojectorsRF DevicesTiming devices, Switch/Varicaps,BFilters, DuplexersEmerging MEMSEnergy harvesting, Microfluidics,Ultrasonic gesture recognitionPARALLELISMCURRENT SPECIFICATIONInertialMagnetometerx410 GaussAccelerometerx72X, Y or Z/20g Z X/Low-gGyroscopex7290/sec. 6 DoF, 9 DoFOscillator/Filterx8 6 GHz, jitter 300 fsSwitchx8 6 GHz, IL -0.5 dB, isolation -30 dBIRx32Regions UV-A to UV-BRGB UVx32Up to 600 nm wavelengthMicrophonex35SNR 70 dB, THD 130 dBHumidity/Temperaturex8 1% RHPressure/Temperaturex140 1.5 C/ 500 hPaGas––Ultrasonicx4300 mm rangeRFOpticEnvironment13Amkor Test Services amkor.com
OTHER TEST SERVICESAND PROCESSESFULL END-OF-LINE PROCESSING BakeScanPackShipFinished good servicesROBUST FACTORY AUTOMATION (CIM/CAM) High levels of quality and efficiencyRFID and hardware controlAuto test program loadingUtilization monitorYield monitorData analysisReport automationOPERATIONAL EXPERIENCE Fully automated productionenvironments Fast and accurate operation byskilled operator and systemTECHNICAL SUPPORT Advanced solution for advancedpackage (PoP/TSV/fcCSP/FCBGA) High quality advancedequipment and quick technicalsupportEQUIPMENT CAPACITY Full range of services:Laser mark/FVI/bake/tape &reel/dry-pack Various material suppliers fortape & reel and packingEXTENSIVE FAILURE ANALYSISNon-Destructive Analysis E/L Bench test X-ray Scanning acoustic tomographDestructive Analysis DecapsulationGrinder: X-sectionMicroscopeField emission scanning electron microscopeDie-Level Analysis Photo emission and OBIRCH Thermal emissionGLOSSARYABS: Anti-lock Braking SystemADAS: Advanced Driver-Assistance SystemsATE: Automatic Test EquipmentCoW: Chip on WaferCSP: Chip Scale PackagingEEPROM: Electrically Erasable Programmable Read-Only MemoryGPS: Global Positioning SystemLIDAR: Light Detection and RangingLNA: Low Noise AmplifierMCP: Multi-Chip PackagingNAND: Non-volatile storage memoryPMIC: Power Management Integrated CircuitSiP: System in PackageSLT: System Level TestSoC: System on ChipUFS: Universal Flash StorageAmkor Test Services amkor.com14
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW CURRENT PRODUCT INFORMATIONProduct info: amkor.comQuestions? Contact us: sales@amkor.comWith respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of suchinformation will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage ofwhatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document doesnot in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions ofsale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor nameand logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respectivecompanies. 2022 Amkor Technology, Incorporated. All Rights Reserved. BR204D-EN Rev Date: 01/22
Wafer probe, final test, strip test, film frame test, system level test, opens/shorts test, burn-in and complete end-of-line 24/7 Operation of fully networked test floors . 11.6-16.0 Gbps (UFS 3.x ) 5.8 -8.0 Gbps (UFS 2.x) 1.6 Gbps 1.33 Gbps (Toggle 4.0) . system level test ABS & Electronic Control Unit
We Know Automotive Amkor has extensive experience with automotive process requirements shipping billions of units every year for automotive applications. Our packages meet or exceed automotive quality, reliability, burn-in and safe launch plan criteria. Amkor also has failure analysis, tri-temp test and statistical process capability in all .
Amkor Technology Inc. Gerard.John@amkor.com 2045 East Innovation Circle, Tempe, AZ 85284, USA Phone: (480) 821-5000 . The process of building a “chip” can be viewed as a fan-out process, where the die is . To prevent thermal runaway, the die is tested at
Package (SiP) solutions. Amkor's SiP state-of-art design rules is an ideal solution in markets that demand miniaturization with increased functionality. By assembling, testing and shipping millions of SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test. System in Package
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