LIN Stack Package - NXP Community
LIN Stack PackageFor 8/16/32 bit MCU User’s GuideDocument Number: LIN STACK UGRev2.5.7 1/2017
Table of ContentsChapter 11.11.21.3Revision History . 5Definitions, Acronyms, and Abbreviation . 6References . 7Chapter 22.12.22.34.54.65.22How to use LIN Package . 20Environment requirements . 21Hardware configuration file generation . 23Target setup . 28Configuration Files and LIN Stack Source Code Integration . 314.4.1 Create an empty project of the target MCU board . 314.4.2 Create a folder containing configuration files . 324.4.3 Create a group containing LIN Stack source code . 33Configuration in CW10.6 . 40Getting Started with LIN application . 474.6.1 Initialization of hardware utilities. 474.6.2 Initialization of LIN system. 484.6.3 Timer for LIN schedule execution (Master mode only) . 494.6.4 LIN PHY Enable . 514.6.5 LIN Applications . 52Chapter 55.1LIN Stack Package . 16Stack Source Code . 163.1.1 Board Support Package . 163.1.2 Low Level layer. 183.1.3 Core API Layer . 183.1.4 Transport Layer . 193.1.5 Diagnostic Service . 193.1.6 Include folder . 19Chapter 44.14.24.34.4Overview . 8System Architecture . 9Supported Derivatives . 10LIN Stack Package Components . 112.3.1 Node Configuration Tool . 122.3.2 LIN Stack Architecture . 12Chapter 33.1Introduction . 4Demo Application . 58LIN Protocol demo application . 585.1.1 Introduction . 585.1.2 Demo Environment Setup . 595.1.3 Detail Description of Nodes . 595.1.4 LIN System Initialization . 605.1.5 Functionality Description . 625.1.6 Operation . 66LIN diagnostic demo application . 70NXP Semiconductors
5.35.2.1 Introduction . 705.2.2 Diagnostic services support . 715.2.3 Demo setup . 725.2.4 Operation description . 75Resynchronization demo application . 805.3.1 Introduction . 805.3.2 Demo setup . 805.3.3 Operation description . 83Appendix A . 85Appendix B . 87Appendix C . 903NXP Semiconductors
Chapter 1IntroductionThis document details the implementation of LIN 2.0/2.1/2.2A and SAE J2602 compliant (see[1],[2],[3],[4]) SW drivers for NXP 8, 16 and 32 bit microcontroller portfolio. Throughout the textthe stack will be called LIN2.x/J2602. The aim of the documents is to help the user to easily utilizethese stacks in the project and explain the configuration flow.The information in this document is subject of change without notice and does not represent acommitment on the part of NXP Semiconductors. The software describes in this document isfurnished under a license agreement and may be used or copied in accordance with the terms of thatlicense agreement. No part of this manual may be reproduced in any form or by any means,electronically or mechanically, including photocopying and recording for any purpose without theexpress written permission of NXP Semiconductors.4NXP Semiconductors
Introduction1.1 Revision HistoryTable 1-1. Revision 26340-Cong TranInitial release2.02011-03-21B26340-Cong TranUpdate chapter 2 for new HW supportedUpdate chapter 3.1 for NPF structure, 3.2 forSCI folder and add RESYN featureUpdate chapter 4.5 for diagnostic exampleapplicationAdd demo application for diagnostic andresynchronization to chapter 62.0.12011-03-24B26340-Cong TranUpdate table 2.12.12011-12-19B26340-Cong TranUpdate chapter 3.1.2 for NCF toolUpdate table MCU support for MM912xxx,VR64, GN32, SC4, LG322.22012-06-11B26340-Cong TranUpdate chapter 4.5 for new CW supportUpdate support 9S12ZVM128 MCU2.32013-07-13B26340-Cong TranUpdate table MCU support for Lumen,QuIBSJ638, RN60, VR64 SCIv6, KnoxUpdate chapter 4 for LIN PHY using2.42013-09-17B26340-Cong TranUpdate application for LIN master, slavetasks, goto sleep/wake up, multi timerselection2.52014-08-11B26340- Cong TranAdd Kinetis platform supportAdd AUTOBAUD feature in LIN Driver2.5.12014-09-11B26340- Cong TranAdd Hearst platform support2.5.22015-04-15B39392- Lan BuiUpdate to support 9S12ZVML31, 9S12VR32MCUs2.5.32015-06-01B39392- Lan Bui2.5.42015-09-26B39392- Lan BuiUpdate to support 9S12ZVL128,9S12ZVMC256 MCUs2.5.52015-11-18B39392- Lan BuiUpdate SCI Version of S12ZVHY64 to SCIV6Changed name of the LIN Driver Package toLIN Stack PackageAdd max message length and support sidfield to network description in npf files2.5.62016-06-23B39392- Lan BuiUpdate to support 9S12ZVMA, 9S12ZVMBFamily MCUs2.5.72017-01-13B54556- Dat BuiUpdate to support MC9S12VRP64,MC9S12VRP48Update copyright to NXP5NXP Semiconductors
Introduction1.2 Definitions, Acronyms, and AbbreviationBSPBoard Support PackageCANController Area NetworkDTCDiagnostic Trouble Code.GPIOGeneral Purpose Input OutputLINLocal Interconnect NetworkLDFLIN Description FileMCUMicrocontroller unitNADNode Address for slave nodes. Diagnostic frames are broadcasted and the NADspecifies the addressed, respectively responding slave node. The NAD is theaddress of a logical node.NCFNode Capability FileNPFNode Private FilePCIProtocol Control InformationPDUPacket Data UnitPIDProtected IdentifierRISCReduced Instruction Set ComputerSAESociety of Automotive EngineersSCISerial Communication InterfaceSLICSlave LIN Interface ControllerSNPDSlave Node Position Detection. Defines a recommended practice to position andseparate identical slave nodes.UARTUniversal Asynchronous Receiver/TransmitterUDSUnified Diagnostic Service.XGATERISC coprocessor that allows autonomous high-speed data processing andtransfers.6NXP Semiconductors
Introduction1.3 References[1] LIN Specification Package, rev. 2.1, November 24, 2006[2] LIN Specification Package, rev. 1.3, December 12, 2002[3] LIN Specification Package, rev. 2.0, September 23, 2003[4] LIN Specification Package, rev. 2.2A, December 31, 2010[5] SAE J2602/1 LIN Network for Vehicle Application, September 2005[6] MISRA-C:2004 Guidelines for the use of the C language in critical systems, October 2004[7] MC9S12HZ256 Data Sheet, rev. 2.05, 04/2008[8] MC9S12P128 Reference Manual, rev. 1.08, 2 July 2008[9] MC9S12XEP100 Reference Manual, rev. 1.18, 09/2008[10] MC9S12XDP512 Data Sheet, rev. 2.17, July 2007[11] MC9S08SG32 Data Sheet, rev. 4, 5/2008[12] MC9S08SG8 Data Sheet, rev. 5, 6/2008[13] MC9S08DZ60 Data Sheet, rev. 4, 6/2008[14] MC9S08DZ128 Data Sheet, rev. 1, 5/2008[15] MC9S08AW60 Data Sheet, rev. 2, 12/2006[16] MC9S08QD4 Data Sheet, rev. 3, 11/2007[17] MC9S08EL32 Data Sheet, rev. 3, 7/2008[18] MC9S08MP16 Reference Manual, rev.1, 9/2009[19] MC9S12XHY256 Reference Manual, rev 0.1, 11/2009[20] MM912F634 Advanced Information, Rev. 4.0, 10/2010[21] Surface vehicle recommended practice.[22] CodeWarrior Development Studio 8/16-Bit IDE User’s Guide[23] CANoe as a diagnostic tool, v.1.2, June 06,2006[24] ISO 14229-1, Road vehicles - Unified diagnostic services (UDS), December 2006[25] Application note AN3756, Rev. 0, 10/20087NXP Semiconductors
Chapter 2OverviewThis chapter provides a high-level description of LIN Stack architecture with hardwareindependence. This chapter contains information about following: System architecture of LIN Stack Node configuration Tool which is used for generation hardware configuration files.NXP Semiconductors8
Overview2.1 System ArchitectureThe layered architecture of the LIN2.x/J2602 Stack package is shown on Figure 2-1. Sucharchitecture approach aims maximum reusability of common code base for LIN2.x and J2602standards for 8 bit, 16 bit and 32 bit NXP automotive MCU portfolio.The core API layer of LIN2.x/J2602 handles initialization, processing and signal based interactionbetween application and LIN Core. The LIN2.x TL (Transport Layer) provides methods for testerto transmit diagnostic requests.The low level layer offers method of handling signal transmission between user application andhardware independence such as byte sending, response receiving, break symbol detection, etc.The physical transport layer of the Driver supports three standard interfaces SCI, SLIC, GPIO tooperate with 8 bit and 16 bit MCU hardware.Refer to Chapter 2.3.2 LIN Stack for detail information.LIN2.1 APILIN 2.1 TLLIN2.1/J2602 APIJ2602 APILIN 2.1 Core APICommon Core APIJ2602 Core APILIN 2.1/J2602Low LevelMCU HWSCI/GPIO/SLIC/UARTFigure 2-1. LIN Stack Architecture diagramNXP Semiconductors9
Overview2.2 Supported DerivativesThe following table displays the list of supported MCU derivatives including the functionalitiesNote that all derivatives support the LIN2.x and J2602 specifications.For some derivatives, this table displays the MCU family names only. For detailed list ofsupported derivatives, please see the Release note.Table 2-1. Target PlatformNo.TypeMCULIN ModuleVersionMaster ModeSlave ModeDiagnosticDiagnosticClassI19S08AW16ASCI V429S08SG32SCI V439S08SG8*SCI V449S08DZ60SCI V459S08DZ128SCI V469S08AW60SCI V279S08QD4**GPIO9S08EL32***SCI V488 8MP16SCI V4109S08SG4SCI V4119S08SG8SCI V4129S08LG32SCI V4139S08SC4**SCI V4149S08RN60SCI V4159S12HY64SCI V5169S12XHY256SCI V5179S12P128SCI V5189S12XS128SCI V5199S12XS256SCI V5209S12XEP100SCI V5219S12XEQ512SCI V59S12XET256SCI V59S12XDP512SCI V5249S12XF512SCI V5259S12G128SCI V5269S12G240SCI V5279S12GN32SCI V5289S12G64SCI V5299S12VR64SCI V6LINPHY V1222316 bitMCUNXP Semiconductors10
Overview309S12VR32 TomarinoSCI V6LINPHY V2319S12VRP64SCI V69S12VRP48LINPHY V232MM912F634****SCI V433MM912G634SCI V434MM912H634SCI V435MM912J637SCI V436MM9Z1J638D2D SCI4379S12ZVML128 CarcassonneSCI V5389S12ZVL KnoxSCI V6399S12ZVL128SCI V6LINPHY V2409S12ZVHY64 LumenSCI V69S12ZVH128 LumenSCI V64216 bitMCU9S12ZVC64 HearstSCI V643S12Z9S12ZVML31 ObidosSCI V641LINPHY V3449S12ZVMC256SCI V6459S12ZVMASCI V6LINPHY V2469S12ZVMBSCI V6LINPHY : Support: Not support* 9S08SG8 Supports master and slave modes in diagnostic class I only dueto memory limitation** 9S08QD4, 9S08SC4 supports LIN protocol only*** 9S08EL32 contains SCI and SLIC interfaces. SLIC supports slave mode only due to itsfunction to support slave LIN interface.**** MM912 integrated LIN frontend / Quest / Quicksilver2.3 LIN Stack Package ComponentsLIN Stack Package consists of two major parts: Node Configuration Tool – PC based script for LIN Stack configuration generation. LIN Stack – Embedded SW package supporting the LIN2.x and J2602 communicationNXP Semiconductors11
Overview2.3.1 Node Configuration Tool The Node Configuration Tool is a built-in script of the LIN Stack packagewhich allows user to easily generate the node configuration .h and .c files basedon LIN Configuration Description File (LCF) and Node Private Description File(LPF) (see more inGeneration Configuration ). Those files are then in compiler integrated with LIN Stack source codeand user application and after compilation downloaded to the target derivative. Figure 2-2 showsthe diagram of configuration data flow.LIN ConfigurationDescription File(.ldf)Node ConfigurationToolNode PrivateDescription File(.npf)Node ConfigurationCode (.c and .h)Target DerivativeLIN StackCode (.c and .h)Compiler/LinkerFigure 2-2. Configuration dataThe LDF file describes a complete LIN cluster including Master/slave mode definition andcontains information to handle the cluster.The NPF file contains information about LIN nodes – such as node name, number of interface,MCU clock frequency, used communication channel (e.g. SCI channel) and port (e.g. GPIO port),etc., required for full description of the node.2.3.2 LIN Stack ArchitectureThe Figure 2-3. shows the details of modules in the LIN Stack package. It also demonstrates therelationship among modules and the direction of function call among them.NXP Semiconductors12
OverviewApplicationlayerApplicationLIN Diagnostic servicesDiagnostic class IIIDiagnosticserviceDiagnostic class IIDiagnostic class ILIN2.1J2602LIN 2.0 NodeConfigTL APIsMulti frame transportSingle frame transportTransportlayerJ2602LIN 2.1LIN 2.1APIsLIN 2.0 TransportprotocolLIN 2.1 TransportprotocolLIN 2.1 Core APIJ2602 Core APILIN 2.1 InterfaceLIN 2.1LIN 2.0LIN corelayerJ2602 InterfaceLIN 2.0StatusMgmtLIN 2.0SignalMgmtLIN 2.0NetworkMgmtLIN 2.0SchedulerJ2602 StatusMgmtLow level APILIN Low Level Driver eprocessingBit processingSLIC ControllerGPIOControllerLegend:Function blockFunction callInteractiveFigure 2-3. LIN Stack Layer DiagramLIN Stack software package provides support for LIN2.x and J2602 communication protocols. TheStack package is divided into the layers as follows:1. The lowest layer – Board Support Package (BSP) layer is comprised of codes, whichimplements the tasks dedicated to specific MCU platform: interrupt service routines, i/oNXP Semiconductors13
Overviewport setup, memory handling and so on. There are three interfaces implemented within theStack package: SCI, SLIC and GPIO.2. Low level layer consists of core functions for the LIN protocol such as the frames handling,signals transmission and reception, data preparation, etc. Besides, this layer containscommon implementation functions for the lowest layer to provide the interface abstraction.Function for LIN cluster setup can be found here as well. This layer interacts with the coreAPI layer through low level API functions.3. Core API layer consists of API functions as defined by the LIN2.x/J2602 specificationenabling the user to utilize the LIN2.x/J2602 communication within the user application.Both the static and dynamic modes for calling the API functions are supported. The coreAPI layer interacts with the low level layer and can be called by such upper layers asLIN2.x TL API, LIN TL J2602 or application for diagnostic implementation.4. Transport layer stands between the application layer and the core API layer includingLIN2.x TL API and LIN TL J2602. This layer provides APIs for the transport protocol,node configuration and diagnostic. For LIN2.x, all components will be extended from LIN2.0 specification. The node configuration for J2602 implements only some functions ofLIN 2.0 specification. The layer contains some main components below: Transport protocol:- Transport protocol presented in LIN2.x Stack supports single and full frametransmission. Single frame transmission is applied for diagnostic class I,whereas the full frame is applied for diagnostic classes II and III.5. Diagnostic services layer presented in the Stack supports all diagnostic classes as defined in[1]. Diagnostic class I: Node configuration and Identification- LIN2.x extends slave configuration and assign frame with ID range to LIN2.0. The assign frame with ID is removed.- J2602 simplifies LIN 2.0 Node configuration. Diagnostic classes II and III:- The diagnostic services are implemented based on standard diagnosticspecification [24]. The layer supports API functions and OEMs will add toapplication source code to complete base on their specific application.The table below shows the services supported in the LIN StackDiagnosticIClassIIIIIUDS service index [Hex]DataIdentifierDiagnostic Transport Protocol RequirementsSingle frame transport only Full transport protocol (multi-segment) Required Configuration ServicesAssign frame identifier range 0xB7Read by identifier (0 product id) 0xB2 0x00Read by identifier (all others)optionaloptional 0xB2 0xXXAssign NADoptionaloptionaloptional0xB0Conditional change NADoptionaloptionaloptional0xB3Positive response on service NXP Semiconductors14
Overviewsupported configuration services0x40Required UDS ServicesRead data by identifier 0x220x00910x0092Write data by identifier 0x2F0x0092Session control 0x100x01Read by identifier for sensor and actuatordata 0x22Implementedby OEMI/O control by identifier 0x2F0x08Read DTC (fault memory) 0x190x01Clear DTC (fault memory) 0x14N/ARoutine controlif applicable0x31Other diagnostic servicesif applicable Flash Reprogramming ServicesFlash programming servicesoptional0xXXTable 2-2. LIN2.x diagnostic service specificationNote* The blue color shows the services are supported by Stack** The orange color shows the services are not supported by Stack( ) Plugs are mandatory services for LIN Stack6. Application layer is the highest layer which stands for user’s applications.Refer to Stack Source Code for detail about source code files of each layer.NXP Semiconductors15
LIN Stack PackageChapter 3 LIN Stack PackageThis section presents more detail description of products in the package. The content is focusedhow to construct input files for Node configuration tool and explore deeply in the source code.The chapter contains sections: Generation Configuration Files Stack Source Code Generation Configuration FilesThe language described in this section is used in order to create input files for the Nodeconfiguration tool to generation configuration files. To understand how to run this tool, refer toChapter 4.2, Hardware configuration file generation for more information.NOTEThe LDF and NPF files could be created in notepad or wordpadtext editors in window and saved into .ldf and .npf extension files.3.1 Stack Source CodeThe Stack source code is organized to five folders: bsp, coreapi, diagnostics, include and transportas shown in Figure 3-1. The structure of source code is based on the LIN system architecture (seemore in Chapter 2.2, LIN Stack).Figure 3-1. LIN Stack Source Code Directory Structure3.1.1 Board Support PackageBoard Support Package (BSP) layer is the lowest layer, which is comprised of functions related tothe specific hardware. Here you could find out the special interrupt service routines, IONXP Semiconductors16
LIN Stack Packageparameters, memory handling and so on. There are three interfaces implemented within the stackpackage: SCI, SLIC and GPIO.3.1.1.1GPIOThere is only one MCU name 9S08QD4 in the support derivative table (see more in Table 2-1)support GPIO interface. The source code in this folder is served for this MCUs.In this folder, there are four files, including lin lld gpio.c, lin lld gpio.h, timer.cand timer.h. Namely lin lld gpio.c define initialization, data sending flow of GPIO interface timer.c define timeout management, counter for user application, and timer interrupt. lin lld gpio.h , timer.h includes the prototypes for functions served for .c files.3.1.1.2RESYNThe source code in this folder support resynchronization feature of LIN Driver as the applicationnote [25]. The folder contains two source files lin lld resyn.c and lin lld resyn.h. TheMCUs support this feature include 9S08SG32, 9S08EL32, 9S08DZ60, 9S08DZ128 and9S08MP16.3.1.1.3SCIThere three SCI communication versions supported in the LIN Driver and the version has beencombined in a single module of SCI.The folder contains files lin lld sci.c which implements all the functions universally used for allMCUs with SCI interface. The lin lld sci.h contains the prototypes for functionsimplemented in lin lld sci.c. The lin lld timesrv.c consists of timing and boardfrequency setup functions; lin lld timesrv.h consists of the prototypes for functionsimplemented in lin lld timesrv.c and lin reg.h contains the registry map declaration forthe MCU. The lin isr.c contains interrupt service routines for SCI communication and timer.The folder to the target MCU contains the file lin isr.c which implements the interrupt serviceroutines and other initial tasks dedicatedly.3.1.1.4SLICSlave LIN Interface Controller is embedded module that automates LIN message handling to helpincrease performance while reducing development time and cost.In this folder, there are four files, including lin lld slic.c, lin lld slic.h,slic isr.c and slic isr.h. The contents of the files are described below: lin lld slic.c includes all the initial functions and other related task handlingfunctions which will be used to directly interact with the physical hardware. lin lld slic.h includes the prototypes for functions implemented in the filelin lld gpio.c, constant declarations and macros. slic isr.c consists of interrupt service routines for the physical board.NXP Semiconductors17
LIN Stack Package slic isr.c consists of the prototypes for functions implemented in the fileslic isr.h, constant declaration and macros.3.1.1.5XGATEThe XGATE module on the advanced S12X family of 16-bit MCUs is a highly flexible, highperformance and cost-sensitive parallel processing solution. The XGATE module is a peripheralcoprocessor that allows autonomous high-speed data processing and transfer between the MCU’speripherals and the internal RAM and I/O ports. XGATE uses SCI for I/O communication andhandling interrupt.Similar to modules in the SCI structure, the XGATE folder contains modules specific for XGATExlin sci.cxgate, xvector.cxgate. The source code in these modules is stored in the RISCcore.3.1.1.6UARTThe UART layer provides physical hardware communication handling for Kinetis MCU platforms.This is based on SCI version-4 communication specified for 32 bit ARM architecture.3.1.1.7AUTOBAUDThe signal on the UART receive pin (RX pin) can be internally routed to an Input Capture moduleto time the edges of the incoming signal. From that timing the layer can set up the UART at thecorrect baud rate.3.1.2 Low Level layerLow level layer consists of core functions for the LIN protocol such that frames handling, signalstransmission and reception, data preparation, etc. It also contains the functions used to set up theLIN cluster. There are two files included in: lin.c contains the functions for initialization of LIN core features, preparation of currenttransmission and interaction with hardware modules. lin.h consists of function declaration, macro definitions and so on which areimplemented within the lin.c file.3.1.3 Core API LayerCore API layer is a set of functions which are intended to be used to develop the applicationsinteracting with the LIN bus. There are six files in this folder, including: lin common api.c contains the common API functions which are applicable for allthree versions LIN2.x and J2602. lin common proto.c contains the functions which are used to set up the sessionenvironment based on the low level layer. lin lin21 api.c contains the API functions for LIN2.x communication protocol. lin lin21 proto.c contains the functions which prepares the background tasks forLIN2.x API functions. lin j2602 api.c contains the API functions for J2602 communication protocol.NXP Semiconductors18
LIN Stack Package lin j2602 proto.c contains the functions which prepares the background tasks forJ2602 API functions.3.1.4 Transport LayerTransport layer comprises of functions, which represent the transport layer specification within theLIN protocol. This layer is only applicable for some types of communication within the LIN bus.The other types will not use the transport layer but the API and the low-level layer for opening aworking session for transmission and reception of data within the LIN bus.There are four files in this folder, including: Lin commontl api.c consists of function calls for data preparation, node identificationand configuration and others which are the implementation of the transport layerspecification. Lin commontl proto.c consists of functions which do the background tasks for settingup the transport layer. lin 21tl api.c consists of functions which implements the transport layer for LIN2.xcommunication protocol. lin j2602tl api.c consists of functions which implements the transport layer forJ2602 communication protocol.3.1.5 Diagnostic ServiceThe transport layer is also complemented with the diagnostic services, which implement fulldiagnostic nodes defined in the LIN specification. Three diagnostic classes are supported whereClass I is u
CAN Controller Area Network DTC Diagnostic Trouble Code. GPIO General Purpose Input Output LIN Local Interconnect Network LDF LIN Description File MCU Microcontroller unit NAD Node Address for slave nodes. Diagnostic frames are broadcasted and the NAD specifies the addressed, respectively responding slave node. The NAD is the
packages assembled at NXP and NXP's assembly and test vendors. Refer to Section Downloading package information from NXP website of this application note for step by step instructions for retrieving package information. For more details about NXP products, visit www.nxp.com or contact the appropriate product application team.
Before you can use a stack you have to initialize the SP to point to one value higher than the highest memory location in the stack. For the HC12 use a block of memory from about 3B00 to 3BFF for the stack. For this region of memory, initialize the stack pointer to 3C00. Use LDS (Load Stack Pointer) to initialize the stack pointer.
Un secondo esame nella lingua scelta: B030784 Didattica della lingua russa 6 L-LIN/21 B029981 Lingua francese 2 6 L-LIN/04 B029982 Lingua inglese 2 6 L-LIN/12 B029985 Lingua portoghese e brasiliana 2 6 L-LIN/09 B029984 Lingua spagnola 2 6 L-LIN/07 B029986 Lingua tedesca 2 6 L-LIN/14
PUBLIC 2 NXP's SOLUTIONS ORGANIZATION Cross Business Line organization within NXP Application specific expertise and focus Work at system level, bringing together cross-NXP hardware and software to develop and support complete solutions For wireless power, this is Qi certified transmitters and receivers, that contain NXP application software, libraries, controllers, NFC .
Power Supply Design for NXP i.MX 6 Using the TPS65023 Application Report SLVA943-February 2018 Power Supply Design for NXP i.MX 6 Using the TPS65023 ABSTRACT This document details the design considerations of a power management unit solution for the NXP i.MX 6Solo and 6DualLite processors using the TPS65023 power management IC (PMIC).
Colour Names; Colour Codes Sheet SizesBenchtop: Chemsurf Chemsurf Compact 2440x1220mm: 3050x1320mm 3650x1220mm: 3650x1320mm 3660x1530mm: 2400x1200mm MR MDF E0 43mm x 1.5mm 15 lin M Unglued 29mm x 1mm 100 lin M Unglued 38mm x 1mm 100 lin M Unglued 21mm x 1mm 100 lin M Unglued 21mm x 1mm 50 lin M Unglued - Hewn 2440x1220x12.7mm 3660x1830x12.7mm
The Stack Topology displays whether the topology of the stack is chain or ring. In this example, the topology is Chain. The Stack Active switch displays the unit ID of the Active unit of the stack. In this example, the switch being configured (Unit 1) is the Active of the stack. Step 3. Click at least two ports to configure as stacking ports.
Application of Silicon Carbide in Abrasive Water Jet Machining Ahsan Ali Khan and Mohammad Yeakub Ali International Islamic University Malaysia Malaysia 1. Introduction Silicon carbide (SiC) is a compound consisting of silicon and carbon. It is also known as carborundum. SiC is used as an abrasive ma terial after it was mass produced in 1893. The credit of mass production of SiC goes to Ed .
