ESP32 C3 WROOM 02 ESP32 C3 WROOM 02U

4 Electrical Characteristics4 Electrical Characteristics4.1 Absolute Maximum RatingsStresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These arestress ratings only and functional operation of the device at these or any other conditions beyond those indicatedunder Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions forextended periods may affect device reliability.Table 5: Absolute Maximum RatingsSymbolParameterMinMaxUnitVDD33Power supply voltage–0.33.6VTST OREStorage temperature–40150 C4.2 Recommended Operating ConditionsTable 6: Recommended Operating ConditionsSymbolParameterVDD33IV DDTAHumidityMinTypMaxPower supply voltage3.03.33.6VCurrent delivered by external power supply0.5——A–40———Ambient85 C versiontemperature105 C versionHumidity condition8510585Unit C%RH4.3 DC Characteristics (3.3 V, 25 C)Table 7: DC Characteristics (3.3 V, 25 C)SymbolParameterCINPin capacitanceVIHMinTyp—High-level input voltage0.75 VDD1Max2—Unit—pF1VDD 0.3V1VILLow-level input voltage–0.3—0.25 VDDIIHHigh-level input current——50nALow-level input current——50nA——VIILVOHVOL22High-level output voltage0.8 VDDLow-level output voltage11V——0.1 VDDV—40—mA—28—mA1IOHIOLHigh-level source current (VDD 3.3 V,VOH 2.64 V, PAD DRIVER 3)Low-level sink current (VDD1 3.3 V, VOL 0.495 V, PAD DRIVER 3)RP UPull-up resistor—45—kΩRP DPull-down resistor—45—kΩCont’d on next pageEspressif Systems15ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.6Submit Documentation Feedback

4 Electrical CharacteristicsTable 7 – cont’d from previous pageSymbolParameterVIH nRSTVIL nRSTMinChip reset release voltageTyp0.75 VDDChip reset voltage1–0.31VDD is the I/O voltage for a particular power domain of pins.2VOH and VOL are measured using high-impedance load.——MaxUnit1VDD 0.30.25 VDDV1V4.4 Current Consumption CharacteristicsWith the use of advanced power-management technologies, the module can switch between different powermodes. For details on different power modes, please refer to Section Low Power Managementin ESP32-C3 Family Datasheet .Table 8: Current Consumption Depending on RF ModesWork modeDescriptionTXActive (RF working)RX1Peak (mA)802.11b, 1 Mbps, @20.5 dBm345802.11g, 54 Mbps, @18 dBm285802.11n, HT20, MCS 7, @17.5 dBm280802.11n, HT40, MCS 7, @17 dBm280802.11b/g/n, HT2082802.11n, HT4084The current consumption measurements are taken with a 3.3 V supply at 25 C of ambienttemperature at the RF port. All transmitters’ measurements are based on a 100% duty cycle.2The current consumption figures for in RX mode are for cases when the peripherals are disabled and the CPU idle.Table 9: Current Consumption Depending on Work ModesWork modeModem-sleep1, 2DescriptionThe CPU ispowered on3TypUnit160 MHz20mA80 MHz15mA130µALight-sleep—Deep-sleepRTC timer RTC memory5µAPower offCHIP PU is set to low level, the chip is powered off1µA1The current consumption figures in Modem-sleep mode are for cases where the CPU is powered on andthe cache idle.2When Wi-Fi is enabled, the chip may switch between Active and Modem-sleep modes. Therefore, currentconsumption changes accordingly.3In practice, software can adjust CPU’s frequency according to CPU load to reduce current consumption.Espressif Systems16ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.6Submit Documentation Feedback

4 Electrical Characteristics4.5 Wi Fi Radio4.5.1 Wi Fi RF StandardsTable 10: Wi Fi RF StandardsNameDescriptionCenter frequency range of operating channel12412 2484 MHzWi-Fi wireless standardIEEE 802.11b/g/n11b: 1, 2, 5.5 and 11 Mbps20 MHzData rate11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps11n: MCS0-7, 72.2 Mbps (Max)40 MHz11n: MCS0-7, 150 Mbps (Max)Antenna type1PCB antenna, IPEX antennaDevice should operate in the center frequency range allocated by regional regulatory authorities.Target center frequency range is configurable by software.4.5.2 Wi Fi RF Transmitter (TX) SpecificationsTarget TX power is configurable based on device or certification requirements. The default characteristics areprovided in Table 11.Table 11: TX Power with Spectral Mask and EVM Meeting 802.11 StandardsMinTypMax(dBm)(dBm)(dBm)802.11b, 1 Mbps—20.5—802.11b, 11 Mbps—20.5—802.11g, 6 Mbps—20.0—802.11g, 54 Mbps—18.0—802.11n, HT20, MCS 0—19.0—802.11n, HT20, MCS 7—17.5—802.11n, HT40, MCS 0—18.5—802.11n, HT40, MCS 7—17.0—RateTable 12: TX EVM TestRateMinTypSL1(dB)(dB)(dB)802.11b, 1 Mbps, @20.5 dBm—–24.5–10802.11b, 11 Mbps, @20.5 dBm—–25.0–10802.11g, 6 Mbps, @20 dBm—–23.0–5802.11g, 54 Mbps, @18 dBm—–28.0–25802.11n, HT20, MCS 0, @19 dBm—–23.5–5802.11n, HT20, MCS 7, @17.5 dBm—–30.5–27Cont’d on next pageEspressif Systems17ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.6Submit Documentation Feedback

4 Electrical CharacteristicsTable 12 – cont’d from previous pageRateMinTypSL1(dB)(dB)(dB)802.11n, HT40, MCS 0, @18.5 dBm—–26.5–5802.11n, HT40, MCS 7, @17 dBm—–30.5–271SL stands for standard limit value.4.5.3 Wi Fi RF Receiver (RX) SpecificationsTable 13: RX SensitivityMinTypMax(dBm)(dBm)(dBm)802.11b, 1 Mbps—–98.0—802.11b, 2 Mbps—–96.0—802.11b, 5.5 Mbps—–93.0—802.11b, 11 Mbps—–88.6—802.11g, 6 Mbps—–93.0—802.11g, 9 Mbps—–92.0—802.11g, 12 Mbps—–90.8—802.11g, 18 Mbps—–88.4—802.11g, 24 Mbps—–85.4—802.11g, 36 Mbps—–82.0—802.11g, 48 Mbps—–78.0—802.11g, 54 Mbps—–76.4—802.11n, HT20, MCS 0—–93.0—802.11n, HT20, MCS 1—–90.8—802.11n, HT20, MCS 2—–88.2—802.11n, HT20, MCS 3—–84.6—802.11n, HT20, MCS 4—–81.4—802.11n, HT20, MCS 5—–77.4—802.11n, HT20, MCS 6—–75.4—802.11n, HT20, MCS 7—–74.4—802.11n, HT40, MCS 0—–90.0—802.11n, HT40, MCS 1—–87.6—802.11n, HT40, MCS 2—–84.8—802.11n, HT40, MCS 3—–81.8—802.11n, HT40, MCS 4—–78.4—802.11n, HT40, MCS 5—–74.4—802.11n, HT40, MCS 6—–72.6—802.11n, HT40, MCS 7—–71.2—RateEspressif Systems18ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.6Submit Documentation Feedback

4 Electrical CharacteristicsTable 14: Maximum RX LevelMinTypMax(dBm)(dBm)(dBm)802.11b, 1 Mbps—5—802.11b, 11 Mbps—5—802.11g, 6 Mbps—5—802.11g, 54 Mbps—0—802.11n, HT20, MCS 0—5—802.11n, HT20, MCS 7—0—802.11n, HT40, MCS 0—5—802.11n, HT40, MCS 7—0—RateTable 15: RX Adjacent Channel RejectionRateMinTypMax(dB)(dB)(dB)802.11b, 1 Mbps—35—802.11b, 11 Mbps—35—802.11g, 6 Mbps—31—802.11g, 54 Mbps—14—802.11n, HT20, MCS 0—31—802.11n, HT20, MCS 7—13—802.11n, HT40, MCS 0—19—802.11n, HT40, MCS 7—8—4.6 Bluetooth LE Radio4.6.1 Bluetooth LE RF Transmitter (TX) SpecificationsTable 16: Transmitter General CharacteristicsParameterMinMaxUnitRF transmit power—0—dBmGain control step—3—dB–27—18dBmRF power control rangeEspressif SystemsTyp19ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.6Submit Documentation Feedback

4 Electrical CharacteristicsTable 17: Transmitter Characteristics Bluetooth LE 1MParameterDescriptionIn-band emissionsModulation characteristicsCarrier frequency offsetCarrier frequency driftMinTypMaxUnitF F0 2 MHz—–37.62—dBmF F0 3 MHz—–41.95—dBmF F0 3 MHz—–44.48—dBm f 1avg—245.00—kHz f 2max—208.00—kHz f 2avg / f 1avg—0.93————–9.00—kHz f0 fn n 2, 3, 4, .k—1.17—kHz f1 f0 —0.30—kHz fn fn 5 n 6, 7, 8, .k—4.90—kHzTable 18: Transmitter Characteristics Bluetooth LE 2MParameterDescriptionIn-band emissionsModulation characteristicsCarrier frequency offsetCarrier frequency driftMinTypMaxUnitF F0 4 MHz—–43.55—dBmF F0 5 MHz—–45.26—dBmF F0 5 MHz—–47.00—dBm f 1avg—497.00—kHz f 2max—398.00—kHz f 2avg / f 1avg—0.95————–9.00—kHz f0 fn n 2, 3, 4, .k—0.46—kHz f1 f0 —0.70—kHz fn fn 5 n 6, 7, 8, .k—6.80—kHzTable 19: Transmitter Characteristics Bluetooth LE 125KParameterIn-band emissionsModulation characteristicsCarrier frequency offsetCarrier frequency driftEspressif SystemsDescriptionMinTypMaxUnitF F0 2 MHz—–37.90—dBmF F0 3 MHz—–41.00—dBmF F0 3 MHz—–42.50—dBm f 1avg—252.00—kHz f 1max—200.00—kHz——–13.70—kHz f0 fn n 1, 2, 3, .k—1.52—kHz f0 f3 —0.65—kHz fn fn 3 n 7, 8, 9, .k—0.70—kHz20ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.6Submit Documentation Feedback

4 Electrical CharacteristicsTable 20: Transmitter Characteristics Bluetooth LE 500KParameterDescriptionIn-band emissionsModulation characteristicsCarrier frequency offsetCarrier frequency driftMinTypMaxUnitF F0 2 MHz—–37.90—dBmF F0 3 MHz—–41.30—dBmF F0 3 MHz—–42.80—dBm f 2avg—220.00—kHz f 2max—205.00—kHz——–11.90—kHz f0 fn n 1, 2, 3, .k—1.37—kHz f0 f3 —1.09—kHz fn fn 3 n 7, 8, 9, .k—0.51—kHz4.6.2 Bluetooth LE RF Receiver (RX) SpecificationsTable 21: Receiver Characteristics Bluetooth LE 1MParameterDescriptionSensitivity @30.8% PER——–97—dBmMaximum received signal @30.8% PER——10—dBmCo-channel C/I——7—dBF F0 1 MHz—–4—dBF F0 – 1 MHz—–4—dBF F0 2 MHz—–29—dBF F0 – 2 MHz—–31—dBF F0 3 MHz—–33—dBF F0 – 3 MHz—–35—dBF F0 4 MHz—–35—dBF F0 – 4 MHz—–37—dB——–35—dBF Fimage 1 MHz—–40—dBF Fimage – 1 MHz—–33—dB30 MHz 2000 MHz—–6—dBm2003 MHz 2399 MHz—–26—dBm2484 MHz 2997 MHz—–25—dBm3000 MHz 12.75 GHz—–5—dBm——–30—dBmAdjacent channel selectivity C/IImage frequencyAdjacent channel to image frequencyOut-of-band blocking performanceIntermodulationEspressif Systems21MinTypMaxUnitESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.6Submit Documentation Feedback

4 Electrical CharacteristicsTable 22: Receiver Characteristics Bluetooth LE 2MParameterDescriptionSensitivity @30.8% PER——–93—dBmMaximum received signal @30.8% PER——5—dBmCo-channel C/I——10—dBF F0 2 MHz—–8—dBF F0 – 2 MHz—–7—dBF F0 4 MHz—–32—dBF F0 – 4 MHz—–34—dBF F0 6 MHz—–39—dBF F0 – 6 MHz—–39—dB——–32—dBAdjacent channel selectivity C/IImage frequencyMinF Fimage 2 MHzAdjacent channel to image –8—dB30 MHz 2000 MHz—–12—dBm2003 MHz 2399 MHz—–30—dBm2484 MHz 2997 MHz—–28—dBm3000 MHz 12.75 GHz—–6—dBm——–29—dBmF Fimage – 2 MHzOut-of-band blocking performanceTypTable 23: Receiver Characteristics Bluetooth LE 125KParameterDescriptionSensitivity @30.8% PER——–105—dBmMaximum received signal @30.8% PER——10—dBmCo-channel C/I——2—dBF F0 1 MHz—–6—dBF F0 – 1 MHz—–4—dBF F0 2 MHz—–33—dBF F0 – 2 MHz—–41—dBF F0 3 MHz—–37—dBF F0 – 3 MHz—–46—dBF F0 4 MHz—–40—dBF F0 – 4 MHz—–49—dB——–40—dBF Fimage 1 MHz—–46—dBF Fimage – 1 MHz—–37—dBAdjacent channel selectivity C/IImage frequencyAdjacent channel to image frequencyMinTypMaxUnitTable 24: Receiver Characteristics Bluetooth LE 500KParameterDescriptionMinTypMaxUnitSensitivity @30.8% PER——–101—dBmMaximum received signal @30.8% PER——10—dBmCo-channel C/I——3—dBCont’d on next pageEspressif Systems22ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.6Submit Documentation Feedback

4 Electrical CharacteristicsTable 24 – cont’d from previous pageParameterAdjacent channel selectivity C/IImage frequencyAdjacent channel to image frequencyEspressif SystemsDescriptionMinTypMaxUnitF F0 1 MHz—–6—dBF F0 – 1 MHz—–7—dBF F0 2 MHz—–34—dBF F0 – 2 MHz—–37—dBF F0 3 MHz—–38—dBF F0 – 3 MHz—–40—dBF F0 4 MHz—–40—dBF F0 – 4 MHz—–42—dB——–40—dBF Fimage 1 MHz—–45—dBF Fimage – 1 MHz—–38—dB23ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.6Submit Documentation Feedback

4325 Module Schematics15 Module SchematicsThis is the reference design of the module.DD3GND XOUT1The value of R1 varies with the actualPCB board.C2TBDGND40MHz( 10ppm)0VDD33GND2C1TBDThe values of C1 and C2 vary withthe selection of the crystal.U1GNDGND4GNDXINEspressif Systems5RF ANT L2C8TBDGNDGNDR13231302928272625VDD33VDD SPIGNDTBDC9TBDGNDLNA INGPIO0GPIO1GPIO2CHIP ENGPIO312345678LNA INVDD3P3VDD3P3XTAL 32K PXTAL 32K NGPIO2CHIP ENGPIO3The values of C8, L2 and C9vary with the actual PCB board.NC: No component.ESP32-C3-WROOM-02 & WROOM-02U Datasheet SPICLKSPICS0SPIWPSPIHDVDD SPIVDD3P3 IDSPICLKSPICS0SPIWPSPIHDVDD ND812PCB ANT0.1uFPCB 40.1uFMTMSMTDIVDD3P3 510uF24Submit Documentation FeedbackCGNDGNDL133GNDR2VDDAVDDAXTAL PXTAL PIO0VDD33CHIP .11RXDPin.10IO10CESP32-C3-WROOM-02(pin-out)BFigure 5: ESP32 C3 WROOM 02 SchematicsAATitleESP32-C3-WROOM-02SizeA3Page Name 02 ESP32-C3-WROOM-02 RevV1.6Confidential and Proprietary

5 Module SchematicsDGND3GND XOUT1The value of R1 varies with the actualPCB board.C2TBDGND40MHz( 10ppm)0VDD33GND2XINC1TBDThe values of C1 and C2 vary withthe selection of the crystal.U1GNDGND4Espressif 0GPIO1GPIO2CHIP ENGPIO312345678LNA INVDD3P3VDD3P3XTAL 32K PXTAL 32K NGPIO2CHIP ENGPIO3U2SPIQSPIDSPICLKSPICS0SPIWPSPIHDVDD SPIVDD3P3 SPIWPSPIHDVDD 3/CSCLK/HOLDU3GNDESP32-C3GND8C8LNA IND1ESDGNDVCCANT1TBDThe values of C8, L2 and C9vary with the actual PCB board.NC: No in.6IO7Pin.7IO8Pin.8IO9Pin.9GNDVDD33GPIO0CHIP P32-C3-WROOM-02 & WROOM-02U Datasheet v0.6Submit Documentation FeedbackGNDRF ANT L2VDD TDIVDD3P3 XTAL PXTAL NU0TXDU0RXDGPIO19GPIO18C4GNDVDD33C3BFigure 6: ESP32 C3 WROOM 02U Page NameRev 02 ESP32-C3-WROOM-02U V1.2Tuesday, March 23, 2021Sheet1Confidential and Proprietary2of2

5436 Peripheral Schematics6 Peripheral SchematicsThis is the typical application circuit of the module connected with peripheral components (for example, powersupply, antenna, reset button, JTAG interface, and UART interface).VDD330.1uFR1C3 D 181IO0 R33V3IO0217IO1 R5ENIO1316IO2 2TXDTXD 118 IO8RXDRXD 109 IO9IO10GNDIO10U10 EN0.1uFGNDGNDX132.768kHz(NC)USB D USB D-00VDD3312JP2Boot OptionR2C4R4R6GNDSW1GNDC7GND12pF(NC) C8VDD33 NC: No TFigure 7: Peripheral Schematics Soldering the EPAD to the ground of the base board is not a must, though doing so can get optimized thermalperformance. If you do want to solder it, please ensure that you apply the correct amount of soldering paste. To ensure the power supply to the ESP32-C3 family chip is stable during power-up, it is advised to add anRC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R 10 kΩ and C 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module andthe power-up and reset sequence timing of the chip. For power-up and reset sequence timing diagram ofthe ESP32-C3 family chip, please refer to Section Power Scheme in ESP32-C3 Family Datasheet .54Espressif Systems326ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.6Submit Documentation Feedback

7 Physical Dimensions and PCB Land Pattern7 Physical Dimensions and PCB Land Pattern7.1 Physical DimensionsUnit: mm18 0.153.2 0.150.40.72.98.0418 x 0.451.150.40.76.72.918 x 0.90.710.512.3715.7Ø18 x 0.90.91.518 x Ø0.551220 0.1560.818 x 0.85Top ViewBottom ViewSide ViewFigure 8: ESP32 C3 WROOM 02 Physical DimensionsUnit: mm18 0.153.2 0.152.750.82.98.0418 x 0.451.150.40.76.72.918 x 0.92.30.30.40.70.789.0515.712.7518 x 0.90.91.51214.3 0.1511.518 x Ø0.5518 x 0.85Top ViewSide ViewBottom ViewFigure 9: ESP32 C3 WROOM 02U Physical DimensionsEspressif Systems27ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.6Submit Documentation Feedback

7 Physical Dimensions and PCB Land Pattern7.2 Recommended PCB Land PatternUnit: mmVia for thermal padCopper6Antenna Area18 x 1.57.118181201.52.90.9 18 x 0.90.40.40.70.76.72.99.9691017.50.50.5Figure 10: ESP32 C3 WROOM 02 Recommended PCB Land PatternEspressif Systems28ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.6Submit Documentation Feedback

7 Physical Dimensions and PCB Land PatternUnit: mmVia for thermal padCopper1818 x 1.50.76.72.99.96914.31.52.90.9 18 x 0.90.40.40.71.41811017.50.50.5Figure 11: ESP32 C3 WROOM 02U Recommended PCB Land PatternEspressif Systems29ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.6Submit Documentation Feedback

7 Physical Dimensions and PCB Land Pattern7.3 U.FL Connector DimensionsUnit: mmFigure 12: U.FL Connector DimensionsEspressif Systems30ESP32-C3-WROOM-02 & WROOM-02U Datasheet v0.6Submit Documentation Feedback

8 Product Handling8 Product Handling8.1 Storage ConditionsThe products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of 40 C and /90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.After unpacking, the module must be soldered within 168 hours with the factory conditions 25 5 C and /60

ESP32-C3-WROOM-02 and ESP32-C3-WROOM-02U are two general-purpose Wi-Fi and Bluetooth LE module. The rich set of peripherals and high performance make th