PCB Quality Metrics That Drive Reliability Disclaimer (PD 18)

PCB Quality Metrics thatDrive Reliability(PD 18)DisclaimerThe material herein is presented “for guidance only”. We donot warrant the accuracy of the information set out on thispresentation. It may contain technical inaccuracies or errorsand/or non-updated data.Information may be changed or updated without notice.Bhanu Sood, Ph.D.Reliability and Risk Assessment BranchNASA Goddard Space Flight Centerbhanu.sood@nasa.govIPC APEX EXPO 2020IPC APEX EXPO 2020February 3rd, 2020PDC OutlineAbout MeSection 0: IntroSection 1: What is reliability and root cause?Section 2: Overview of failure mechanismsSection 3: Failure analysis techniques Member of 40 IPC Subcommittees and TaskGroups. Chair IPC-7092: Design and AssemblyProcess Implementation for EmbeddedComponents. Member of IPC A-Teams9 Microvia Weak Interfaces9 J-STD-001 X-ray Requirements9 IPC-6017 Embedded Circuits Spec NRL/CALCE/NASA Bachelors/Masters/PhD Metallurgy, ElectronicsMaterials, Risk/Reliability– Non-destructive analysis techniques– Destructive analysis– Materials characterizationSection 4: Summary and closureDiscussions and case studies of actual failures and subsequent analysis.IPC APEX EXPO 20203February 3rd, 2020bhanu.sood@nasa.govIPC APEX EXPO 2020February 3rd, 5.36.37.38.39.40.bhanu.sood@nasa.gov1-10C Test Coupon and Artwork Generation Task Group3-11 Laminate Prepreg Materials Subcommittee3-11G Corrosion of Metal Finishes Task Group3-12D Woven Glass Reinforcement Task Group3-12E Base Materials Roundtable Task Group4-14 Plating Processes Subcommittee4-33 Halogen-Free Materials Subcommittee5-21F Ball Grid Array Task Group5-21H Bottom Termination Components (BTC) Task Group5-21M Cold Joining Press-fit Task Group5-22A J-STD-001 Task Group5-22A-SKELETON J-STD-001 X-Ray Requirements5-22ARR J-STD-001 Conformal Coating Material & Application Industry Assessment5-22AS J-STD-001 Space Electronic Assemblies Task Group5-24B Solder Paste Task Group5-32A Ion Chromatography Ionic Conductivity Task Group5-32B SIR and Electrochemical Migration Task Group5-32E Conductive Anodic Filament (CAF) Task Group6-10C Plated-Thru Via Reliab.-Accelerated Test Methods7-12 Microsection Subcommittee7-23 Assembly Process Effects Handbook Subcommittee7-24 Printed Board Process Effects Handbook Subcommittee7-24A Printed Board Process Effects Handbook Task Group7-31FS IPC WHMA-A-620 Space Electronic Assemblies Addendum Task Group7-32C Electrical Continuity Testing Task Group6-10D SMT Attachment Reliability Test Methods TGD-55A Embedded Circuitry Guideline Task GroupB-11 3-D Electronic Packages SubcommitteeD-13 Flexible Circuits Base Materials SubcommitteeD-22 High Speed High Frequency Board Performance Sub-committeeD-24C High-Frequency Test Methods Task Group Frequency-Domain MethodsD-31B IPC-2221 2222 Task GroupD-32 Thermal Stress Test Methodology SubcommitteeD-33A Rigid Printed Bd. Performance Specifications TGD-33AS IPC-6012 Aerospace Addendum Task GroupD-35 Printed Board Storage and Handling SubcommitteeD-55 Embedded Devices Process Implementation SubcommitteeD-55-AT IPC-6017A A-TeamV-TSL-MVIA-CHEMPR-AT Chemical Processes and Metallurgy A-TeamV-TSL-MVIA-SIMMOD-AT Simulation and Modeling A-TeamFebruary 3rd, 2020bhanu.sood@nasa.gov

Explore some of thesolar system's oldestbodies, a series ofasteroids known as the"TrojansIPC APEX EXPO 2020February 3rd, 20205bhanu.sood@nasa.govIPC APEX EXPO 2020February 3rd, 20206bhanu.sood@nasa.govWho We AreNASA GSFC One World-Class OrganizationWhat makes Goddard one-of-a-kind?THE GODDARD COMMUNITYMore than 10,000 PeopleNASA’s leading sciencecenter, with crossdisciplinary, end-toend capabilitiesExecuting NASA’smost complexmissionsCommunicationsbackbone – 98%of NASA’s datais transmittedvia Goddardinfrastructure1 of 2 US routes forISS cargo; 1 of 4 USorbital launchfacilitiesWorld leader inunderstanding the Sun’simpact on EarthTechnicians andOthers 6%7GSFC Workforce3,000 Civil Servants6,000 Contractors1,000s of Others*Independent Verificationand Validation Facilityassures NASA’s mostcomplex softwarefunctions as planned7February 3rd, 20202Professional &Administrative 28%Scientists &Engineers 61%The Nation’s largest community of*Including off-site contractors, interns, and EmeritusIPC APEX EXPO 2020Clerical 5%bhanu.sood@nasa.govIPC APEX EXPO 2020scientists, engineers, and technologists8February 3rd, 2020bhanu.sood@nasa.gov

GSFC: A Diverse Mission PortfolioWhat is SATRHESSIReliability is the ability of a product to properly function, within specified performancelimits, for a specified period of time, under the life cycle application -2Landsat 7TRACETOPEXCALIPSOTerraGRACEACE– Within specified performance limits: A product must function within certain tolerances in order to GPMPolar– For a specified period of time: A product has a useful life during which it is expected to function SOsiris-RexCloudSatLDCM(Sample ENew HorizonsMessenger– Under the life cycle application conditions: Reliability is dependent on the product’s life cycleoperational and environmental ars ScienceLaboratoryFermiComptonGROLROIPC APEX EXPO 202099February 3rd, 2020bhanu.sood@nasa.govf(t)Failure Distribution(Weibull)Overstress failures: (stress-strength interference)Hyper-exponentialE 1infant mortalityexponentialE 1“random” failuresFebruary 3rd, 202010bhanu.sood@nasa.govInfluence of ‘Durability’ and ‘Quality’ on‘Reliability’Physics of Failure Perspective of ReliabilityReliability statisticians are interested in trackingsystem level failure data during the service life forlogistical purposes, and in determining how thehazard rate curve looks.IPC APEX EXPO 2020stress marginV50E IPC APEX EXPO tsfailuresNominalpopulationchange inmeanChanges in durabilityChanges in qualityWearout failures: (damage-endurance interference)Cumulative Distribution FunctionCumulative d lifet0.10time11lifemargin0.60.23rd,change invariancefailuresF(t)f(t) PoF reliability engineers are interested inunderstanding and controlling the individual failuresthat cause the curve. PoF engineers do so through systematic and detailedassessment of influence of hardware configuration and life-cyclestresses on root-cause failure mechanisms in the materials at potential failure sites.time (t)2020bhanu.sood@nasa.govIPC APEX EXPO 202012February 3rd,120202bhanu.sood@nasa.gov

Failure DefinitionsWhen a Product Fails, There Are Costs . . . To the Manufacturero Time-to-market can increaseo Warranty costs can increaseo Market share can decrease. Failures can stain the reputation of a company, anddeter new customers.o Claims for damages caused by product failure can increaseTo the Customero Personal injuryo Loss of mission, service or capacityo Cost of repair or replacemento Indirect costs, such as increase in insurance, damage to reputation, loss of marketshareIPC APEX EXPO 202013February 3rd, 2020bhanu.sood@nasa.govFailureA product no longer performs the function for which it was intendedFailure ModeThe effect by which a failure is observed.Failure SiteThe location of the failure.Failure MechanismThe physical, chemical, thermodynamic or other process that resultsin failure.Failure ModelQuantitative relationship between lifetime or probability of failure andloadsLoadApplication/environmental condition needed (electrical, thermal,mechanical, chemical.) to precipitate a failure mechanism.IPC APEX EXPO 2020Classification of FailuresFebruary 3rd, 202014bhanu.sood@nasa.govFailure Mechanism Identification It is helpful to distinguish between two key classes of failure mechanism:Overstress Mechanisms– overstress: use conditions exceed strength of materials; often sudden and catastrophic– wearout: accumulation of damage with extended usage or repeated stressMechanical It is also helpful to recognize early life failures:Thermal– infant mortality: failures occurring early in expected life; should be eliminated through processcontrol, part selection and management, and quality improvement proceduresIPC APEX EXPO 202015February 3rd, 2020bhanu.sood@nasa.govElectricalIPC APEX EXPO 2020Wearout MechanismsMechanicalYield, Fracture,Interfacial de-adhesionThermalGlass transition (Tg)Phase transitionDielectric breakdown,Electrical overstress,Electrostatic discharge,Second breakdownRadiationSingle event p, WearStress driven diffusionvoiding (SDDV)TDDB, Electromigration,Surface chargespreading, Hot electrons,CAF, Slow trappingRadiationRadiation embrittlement,Charge trapping in oxidesChemicalCorrosion,Dendrite growth,Depolymerization,Intermetallic GrowthFebruary 3rd, 2020bhanu.sood@nasa.gov

Cost of a Single Unplanned Data Center OutageAcross 16 IndustriesIceberg Model of Cost of Poor QualityThe average cost of data center downtime across industries was approximately 5,600 per minute.Ref: Ponemon Inst., 䇾Calculating the Cost of Data Center Outages,䇿 Feb. 1, 2011.IPC APEX EXPO 202017Ref: A. Buthmann, “Cost of Quality: Not Only Failure Costs,” iSixSigma.February 3rd, 2020bhanu.sood@nasa.govIPC APEX EXPO 2020bhanu.sood@nasa.govPrinted Circuit Boards and ClassificationQuality Assurance Functions February 3rd, 202018 Printed circuit boards are the baseline in electronic packaging – they are theinterconnection medium upon which electronic components are formed intoelectronic systems.– PCB materials are generally glass reinforced organic polyimide (epoxy,BT, ceramic are also used). Classified on the basis of– Dielectrics used– Reinforcement– Circuit type– Component types– Board construction– Design complexityIn today’s compressed development cycles where rapidand cost-effective testing and analysis are key, a properlydesigned and executed quality assurance function (withappropriate reliability analysis) can enable products withrobust design margins. If the mission conditions are not well understood or thereliability analysis and accelerated testing are notconducted right, cost and schedule impacts, along withunexpected failures will add risk to a Projectdevelopment cycle.Examples of Bare PCBsPopulated PCBASOURCE: Industrial Laser Solutions. PCBShop.orgIPC APEX EXPO 202019February 3rd, 2020bhanu.sood@nasa.govIPC APEX EXPO 202020February 3rd, 2020bhanu.sood@nasa.gov