TA INSTRUMENTS THERMOMECHANICAL ANALYZER

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TA INSTRUMENTSTHERMOMECHANICALANALYZER

TA INSTRUMENTS Q SERIES THERMOMECHANICAL ANALYZERThe Q400 is a sixth-generation product from theworld leader in thermal analysis. Its performance, ease-of-use,and reliability aptly demonstrate our long experience inthermomechanical analysis design.The Q400EM is a high-performance, research-grade thermomechanical analyzer (TMA),with unmatched flexibility in operating modes, test probes, fixtures, and available signals.For standard TMA applications, the Q400 delivers the same performance and reliability.It is ideal for research, teaching, and quality control applications, with performanceequivalent to competitive research models.

TECHNICAL SPECIFICATIONSTemperature Range (max)-150 to 1,000 C-150 to 1,000 C /- 1 C /- 1 C 10 min from 600 C to 50 C 10 min from 600 C to 50 CMaximum Sample Size - solid26 mm (L) x 10 mm (D)26 mm (L) x 10 mm (D)Maximum Sample Size - film/fiber26 mm (L) x 0.5 mm (T)x 4.7 mm (W)26 mm (L) x 0.5 mm (T)x 4.7 mm (W) /- 0.1 % /- 0.1 %15 nm15 nm 1 µm (-100 to 500 C) 1 µm (-100 to 500 C)0.001 to 1 N0.001 to 1 N0.001 N0.001 N0.01 to 2 HzNot AvailableOptionalOptionalInert, Oxidizing,or Reactive GasesInert, Oxidizing,or Reactive Not AvailableCreepIncludedNot AvailableStress RelaxationIncludedNot AvailableDynamic TMA (DTMA)IncludedNot AvailableModulated TMA (MTMA )IncludedNot AvailableTemperature PrecisionFurnace Cool Down Time(air cooling)Measurement PrecisionSensitivityDynamic Baseline DriftForce RangeForce ResolutionFrequencyMass Flow ControlAtmosphere(static or controlled flow)Operational ModesNote: The Q400 can be field upgraded to the Q400EM.

DESIGN FEATURESANDBENEFITSA thermomechanical analyzer measures sample dimensional changes under conditionsof controlled temperature, time, force, and atmosphere. Our engineering experience in designand integration of critical furnace, temperature and dimension measurement, andatmosphere control components meld with powerful, flexible, software to optimize the manytests that the Q Series TMA can perform.1Furnace The Q400 features a rugged and reliablefurnace. Its customized electronics provide excellentheating rate control and rapid response over a widetemperature range. Furnace raising and lowering is software controlled. Benefits: The design ensures long lifeand performance consistency. The excellent heating ratecontrol provides for superior baseline stability andimproved sensitivity, while the rapid response permitsModulated TMA operation. Furnace movementprovides operational convenience, and easy access to thesample chamber.2 Sample Chamber Located in the furnace core, theeasily accessed chamber provides complete temperatureand atmosphere control for sample analysis. Purge gasregulation is provided by an optional digital mass flowcontroller. Benefits: These include enhanced data quality,ease-of-use, and productivity. The open design simplifiesinstallation of available probes (see Modes ofDeformation), sample mounting, and thermocoupleplacement. Data precision is enhanced by mass flowcontrol of the purge gas.12

3Force Motor A non-contact motor provides aprecisely controlled, friction-free, calibrated force tothe sample via the measurement probe or fixture.The force is programmable from 0.001 to 1 N, andcan be increased to 2 N by addition of weights to aspecial tray. A precision sine wave generator provides aset of ten individual frequencies for use in dynamicexperiments. Benefits: The motor smoothly generatesthe accurate and precise static, ramped, or oscillatorydynamic force necessary for quality measurementsin all modes of operation. The choiceof frequencies allows optimization ofdynamic TMA (DTMA) experiments incompression, 3-point bending, or tensionmodes of deformation.124Linear Variable DifferentialTransducer The heart of the Q400TMA sample measurement system is theprecision, moveable-core, linear variabledifferential transducer (LVDT). Benefits:It generates an accurate output signalthat is directly proportional to a sampledimension change. Its precise and reliableresponse over a wide temperature range(–150 to 1,000 C) makes for reproducibleTMA results. Its location below thefurnace protects it from unwantedtemperature effects and ensures stablebaseline performance.34

MODESOFDEFORMATIONThe Q400 offers all the major TMA deformation modes necessary to characterize solids,foams, films, and fibers. These include compression, tension, and 3-point bending.COMPRESSIONIn this mode, the sample is subjected to either a static, linear ramp, or dynamic oscillatory force, while undera defined temperature program, and atmosphere. Sample displacement (strain) is recorded by eitherexpansion / penetration experiments to measure intrinsic material properties, or dynamic tests to determineviscoelastic parameters (DTMA), to detect thermal events, and to separate overlapping transitions(MTMA ).Figure 1EXPANSIONExpansion measurements determine a material’scoefficient of thermal expansion (CTE), glass transition temperature (Tg), and compression modulus.A flat-tipped standard expansion probe (Figure 1) isplaced on the sample (a small static force may beapplied), and the sample is subjected to a temperatureprogram. Probe movement records sample expansionor contraction. This mode is used with most solidsamples. The larger surface area of the macroexpansion probe (Figure 2) better facilitates analysisof soft or irregular samples, powders, and filmsFigure 2PENETRATIONPenetration measurements use an extended tip probeto focus the drive force on a small area of the samplesurface (Figure 3). This provides precise measurementof Tg, softening, and melting behavior. It is valuablefor characterizing coatings without their removal froma substrate. The probe operates like the expansionprobe, but under a larger applied force. The hemispherical probe (Figure 4) is an alternate penetrationprobe for softening point measurements in solids.Figure 3Figure 4

TENSIONTension studies of the stress/strainproperties of films and fibers areperformed using a Film/Fiber probeassembly (Figure 5). An alignmentfixture (Figure 6) permits secure, andreproducible, sample positioning in theclamps. The clamped sample is placedin tension between the fixed andmoveable sections of the probeassembly. Application of a fixed force isusedtogeneratestress/strainFigure 5Figure 6and modulus information. Additionalmeasurements include Tg, softening temperatures, cure, and cross-link density. Dynamic tests (e.g. DTMA,MTMA ) in tension can be performed to determine viscoelastic parameters (e.g., E , E , tan δ), and toseparate overlapping transitions.3-POINT BENDINGIn this bending deformation (also known as flexure), the sample is supported atboth ends on a two-point, quartz anvil atop the stage (Figure 7). A fixed staticforce is applied vertically to the sample at its center, via a wedge-shaped, quartzprobe. Material properties are determined from the force and the measured probedeflection. This mode is considered to represent “pure” deformation, since clamping effects are eliminated. It is primarily used to determine bending properties ofstiff materials (e.g., composites), and for distortion temperature measurements.Dynamic (DTMA) measurements are also available with the Q400EM, where aspecial low-friction metallic anvil replaces the quartz version.Figure 7SPECIALTY PROBE / FIXTURE KITSAdditional sample measurement probes and fixtures are available for use with both the Q400 and Q400EMin specialty TMA applications. These include:Dilatometer Probe Kit – for use in volume expansion coefficient measurementsParallel Plate Rheometer – for the measurement of low shear viscosity of materials (10 to 107 Pa.s range)under a fixed static force.The expansion, macro-expansion, and penetration probes are supplied with the Q400. These probes, plus theflexure probe, and the low-friction bending fixture, are included with the Q400EM module. Data analysisprograms relevant to each of the measurements described are provided in our Thermal Advantage forQ Series software.

TMA THEORYTMA measures material deformation under controlled conditions of force, atmosphere, time, andtemperature. Force can be applied in compression, flexure, or tension modes using probes previouslydescribed. TMA measures intrinsic material properties (e.g., expansion coefficient, glass transition temperature,Young’s modulus), plus processing / product performance parameters (e.g., softening points). These measurements have wide applicability, and can be performed by the Q400/Q400EM.TMA can also measure polymer viscoelastic properties using transient (e.g., creep, stress relaxation) ordynamic tests. These require the Q400EM module. In creep, a known stress is applied to the sample, and itsdeformation is monitored. After a period, the stress is removed, and strain recovery is recorded. In stressrelaxation, a fixed strain is applied, and stress decay is monitored.In Dynamic TMA (DTMA), a knownsinusoidal stress and linear temperature rampare applied to the sample, and the resultingsinusoidal strain, and sine wave phasedifference (δ), are measured (Figure 8). Fromthis data, storage modulus (E ), loss modulus(E ), and tan δ (E /E ) are calculated asfunctions of temperature, time, or stress.FIGURE 9Modulated LengthModulated TemperatureTTemperatureFIGURE 8In Modulated TMA (MTMA ), the sampleexperiences the combined effects of a linear ramp, and asinusoidal temperature of fixed amplitude and period(Figure 9). The net signals, after Fourier transformationof the raw data, are total displacement and change inthermal expansion coefficient. Both can be resolved intotheir reversing and non-reversing component signals.The reversing signals contain events attributable todimension changes, and are useful in detecting relatedevents (e.g., Tg). The non-reversing signals contain eventsthat relate to time dependent kinetic processes (e.g., stressrelaxation).

MODESOFOPERATIONThe Q400 and 400EM operating modes permit multiple material property measurements.The Q400 features the Standard mode, while the Q400EM additionally offers Stress/Strain,Creep, Stress Relaxation, Dynamic TMA, and Modulated TMA modes.STANDARD MODE (Q400/Q400EM)Temperature Ramp: Force is constant, and displacement is monitored undera linear temperature ramp. Provides intrinsic property measurements.Strain (Force)TForceStrainIsostrain: Strain is constant, and the force required to maintain it isTemperature (Time)monitored under a temperature ramp. Permits assessment of shrinkage forces infilms/fibers.StrainForce Ramp: Force is ramped, and strain measured at constant temperature toFTgenerate force/displacement plots, and modulus information.Force (Time)STRESS/STRAIN MODE (Q400EM)Stress (Strain)StrainStressStress or strain is ramped, and the resulting strain or stress is measured atconstant temperature. Both provide stress / strain plots and related modulusinformation.TStrain (Stress)In Creep, stress is held constant, and strain is monitored. In Stress Relaxation,strain is held constant, and stress decay is monitored. Both are transient testsused to assess material deformation and recovery properties.Strain / StressCREEP/STRESS RELAXATION MODES (Q400EM)t1t2DYNAMIC TMA MODE (Q400EM):T% StrainTimeSA sinusoidal force (stress) is applied during a temperature ramp. Analysis ofthe resulting strain and phase data provides viscoelastic property parameters(e.g., E , E tan δ).MODULATED TMA MODE (Q400EM):Modulated LengthTemperature is programmed linearly, and simultaneously modulated at constantstress to generate signals relating to total displacement, CTE, and their reversingand non-reversing components. These permit detection of thermal transitions,and separation of overlapping events (e.g., Tg and stress relaxation).TTemperatureModulated TemperatureTemperature (time)

APPLICATIONSFIGURE 10INTRINSIC AND PRODUCT PROPERTYMEASUREMENTSFIGURE 11Point-to-Point Methodα 27.6µm/m CDimension Change (µm)40Average Methodα 26.8µm/m C2045.0 CAt a Point 127.3 Cα 25.8µm/m C0AluminumExpansion ProbeSize: 7.62mmProg.: 5 C/minAtm.: N2-104060Ts 39 CExpansionLoading: None200µm/m C90µm/m CTg -43 C-120-80-4004080Temperature ( C)230.0 C3010Ts 40 CTg -44 CPenetrationLoading: 5gACCURATE COEFFICIENT OF THERMALEXPANSION (CTE) MEASUREMENTS6050DisplacementFigure 10 shows expansion and penetration probemeasurements of Tg, and softening point of asynthetic rubber using a temperature ramp atconstant force. The large CTE changes in the expansion plot indicate the transition temperatures.In penetration, they may be detected by the sharpmovement of the loaded probe into the changingmaterial structure.80 100 120 140 160 180 200 220 240 260Figure 11 demonstrates the use of the expansionprobe to accurately measure small CTE changes inan aluminum sample over a 200 C temperaturerange. Advantage software permits analysis of thecurve slope using an “at point”, “straight line” or“best fit” method to compute the CTE (α) at aselected temperature, or over a range.Temperature ( C)FIGURE 12ANDFigure 12 is an example of a 3-point bending mode(flexure probe) experiment on a polyvinyl chloride(PVC) sample, using the ASTM International TestMethod E2092 to determine the distortion temperature. This test specifies the temperature at which asample of defined dimensions produces a certaindeflection under a given force. It has long been usedfor predicting material performance.0Dimension Change (µm)MATERIAL PERFORMANCESELECTION71.24 C-17.48µm-20Size: 0.492 x 5.41 x 5.08 mmForce: 78.48 mNDeflection: -17.48 µm-4020304050Temperature ( C)607080

MULTILAYER FILM ANALYSISFIGURE 1320102.54 CFigure 13 shows a compression mode analysis, usinga penetration probe, of a double layer PE / PET filmsample, supported on a metal substrate. The sampletemperature was linearly ramped from ambient to275 C at 5 C/min. The plot shows probe penetrations of the PE layer (93.22 µm) at 102 C, and thePET layer (14.78 µm) at 257 C respectively.Dimension Change (µm)0-20-40-60-93.22 µm-80257.71 C-100-108.0 µm-120-140-50050100150200250300350Temperature ( C)FILM PROPERTY TESTINGFIGURE 142030202020150.225Force (N)Temperature ( C)2025Dimension Change (µm)Figure 14 illustrates a classic isostrain experiment,in the tension mode, on a food wrapping film.The film was strained to 20% at room temperaturefor 5 minutes, cooled to -50 C and held for 5 moreminutes, then heated at 5 C/min to 40 C. The plotshows the force variation required to maintain a setstrain in the film. The test simulates its use from thefreezer to the microwave.0.3750.1-25201020050.001020304050Time (min)FIGURE 15FILM TENSILE TESTING0.020Figure 15 displays a strain ramp experiment, at aconstant temperature, on a proprietary film intension. The plot shows an extensive region wherestress and strain are linearly related, and over whicha tensile modulus can be directly determined.The results show the ability of the Q400EM tofunction as a mini tensile tester for films and fibers.Stress (MPa)0.0150.010Slope Modulus0.0050.0000510Strain (%)1520

FIBER STRESS/STRAIN MEASUREMENTSFIGURE 160.6As ReceivedForce (N)0.4Cold Drawn0.2403Yield Region21Elastic 02000.350.40Force (N)THERMAL STRESS ANALYSISFIGURE 170.0204Dimension Change (µm)Stress/strain measurements are widely used to assess,and compare, materials. Figure 16 shows thedifferent regions of stress/strain behavior in apolyamide fiber (25 µm) in tension, when subjectedto a force ramp at a constant temperature. The fiberundergoes instantaneous deformation, retardation,linear stress/strain response, and yield elongation.Other parameters (e.g., yield stress; Young’smodulus) can be determined.OFFIBERSFigure 17 displays a tension mode experiment,using a temperature ramp at a constant strain (1%),to perform a stress analysis on a polyolefin fiber,as received, and after cold drawing. The plot showsthe forces needed to maintain the set strain as a function of temperature. The data has been correlatedwith key fiber industry, processing parameters,such as shrink force, draw temperature, draw ratio,elongation at break, and knot strength.Temperature ( C)CREEP ANALYSISFIGURE 181.2Creep1.00.8Strain (%)Creep tests help in materials selection for end-useswhere stress changes are anticipated. Figure 18illustrates an ambient temperature creep study ona polyethylene film in tension. It reveals theinstantaneous deformation, retardation, and linearregions of strain response to the set stress, plus itsrecovery with time on stress removal. The data canalso be plotted as compliance, and recoverablecompliance, versus time.0.60.4Recovery0.20.0-10123456Time (min)78910 1112

STRESS RELAXATION ANALYSISFIGURE 19Figure 19 shows a stress relaxation test in tension onthe same polyolefin film used for the creep study. Aknown strain is applied to the film, and maintained,while its change in stress is monitored. The plotshows a typical decay in the stress relaxationmodulus. Such tests also help engineers designmaterials for end uses where changes in deformationcan be expected.Relaxation Modulus (MPa)1501451401351300.0010.010.1110Time (min)VISCOELASTIC PROPERTYDETERMINATION – DYNAMIC TMAFIGURE 80100120140Loss Modulus (MPa)Tan Delta0.100160Temperature ( C)SEPARATING OVERLAPPINGTRANSITIONS - MODULATED TMAFIGURE 214020131.68 C0-26080100120140Temperature ( C)1601802020000200Rev Dimension Change (µm)40Non-Rev Dimension Change (µm)Dimension Change (µm)2500Storage Modulus (MPa)Figure 20 illustrates a dynamic test, in which asemi-crystalline polyethylene terephthate (PET) filmin tension is subjected to a fixed sinusoidal stressduring a linear temperature ramp. The resultingstrain and phase data are used to calculate thematerial’s viscoelastic properties (E , E , and tan δ).The plotted data shows dramatic modulus changesas the film is heated through its glass transitiontemperature.200Figure 21 shows a MTMA study to determinethe Tg of a printed circuit board (PCB). The signalsplotted are the total dimension change, plus itsreversing, and non-reversing components. The totalsignal is identical to that from standard TMA, butdoes not uniquely define the Tg. The componentsignals, however, clearly separate the actual Tg fromthe stress relaxation event induced by non-optimumprocessing of the PCB.

THERMAL ADVANTAGE SOFTWAREA quality Thermal Analyzer requires flexible, intelligent software to empower it. No onebelieves this more than our software engineers, who have pioneered most of the featurescommonly seen in modern thermal analyzers. Q Series for Thermal Advantage softwareis Microsoft Windows based, and expandable to meet growing user needs.THERMAL ADVANTAGE – INSTRUMENT CONTROL Multitasking – conduct experiments and simultaneously analyzes data Multimodule – operates up to 8 modules simultaneously Wizards – guides and prompts in setting up experiments Real-Time Plot – provides a real-time display of the progress of the experiment Autoqueuing – permits pre-programmed set-up of planned experiments Autoanalysis – permits pre-programmed data analysis of planned experiments On Line Help – provides extensive, context sensitive, assistance Abort Feature – terminates a test upon attaining a specified value (e.g., CTE)UNIVERSAL ANALYSIS 2000 – DATA ANALYSIS Single Software Package – analyzes data from all TA Instruments modules Picture-in-a-Picture – provides easy one plot analysis of large and small events Real-Time Data Analysis – analyzes data “as it arrives” Ability to create up to 20 simultaneous curve overlay plots Custom Report Generation – within UA 2000 using Microsoft Word & Excel templates Saved Analysis – for quick retrieval of previously analyzed data filesMicrosoft Windows, Microsoft Word, and Microsoft Excel are trademarks of Microsoft Corporation

WHY TA INSTRUMENTSMore wo

Tg -43 C-120 -80 -40 Temperature ( C) FIGURE 10 Displacement 50 40 20 30-10 0 10 80 At a Point 127.3 C α 25.8µm/m C Point-to-Point Method α 27.6µm/m C Average Method α 26.8µm/m C 230.0 C 45.0 C Aluminum Expansion Probe Size: 7.62mm Prog.: 5 C/min Atm.: N2 40 60 100 120 140 160 180 200 220 240 260 Temperature ( C) FIGURE 11 .

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