Specification For Base Materials For Rigid And Multilayer . - KAZUS.RU

December 1997IPC-4101Specification for Base Materials forRigid and Multilayer Printed Boards1.0 GENERAL1.1 Scope This specification covers the requirements forbase materials, herein referred to as laminate or prepreg, tobe used primarily for rigid or multilayer printed boards forelectrical and electronic circuits.The system shown below identifiesclad and unclad laminate or prepreg base materials. Across-reference list, which connects the outlined call-outsystem in this document to previously used systems isshown in the specification sheet section.1.2 ClassificationExample for laminate base materials where IPC-4101 isreferenced:L251500Material Designator(see 1.2.1)Specification SheetNumber (see 1.2.1)Nominal LaminateThickness (see1.2.2)C1/C1AAMetal CladdingType and NominalWeight/Thickness(see 1.2.3)Thickness ToleranceClass (see 1.2.4)Surface QualityClass (see 1.2.5)Example for prepreg base materials where IPC-4101 isreferenced:P25E7628Material Designator(see 1.2.1)Specification SheetNumber (see 1.2.1)Reinforcement Style(see 1.2.6)TWREVCResin ContentMethod - Column A(see 1.2.7)Flow ParameterMethod - Column B(see 1.2.7)Optional PrepregMethod - Column C(see 1.2.7)1.2.1 Specification Sheet Description At the end of thisdocument is a series of specification sheets. Each sheetoutlines requirements for both laminate and prepreg foreach product grade. The specification sheets are organizedby a specific reinforcement type, resin system, and/or construction and are provided with a Specification Sheet Number for ordering purposes. The laminate and prepregrequirements for materials of the like composition are onthe same specification sheet for convenience. Material Designator ‘‘L’’ indicates laminate material and Material Designator ‘‘P’’ indicates prepreg material as shown in theabove designation examples.1.2.2 Nominal Laminate Thickness The nominal thick-ness is identified by four digits. For all substrates coveredby this document, thicknesses may be specified or measured either over the cladding or over the dielectric (see1.2.4 and 3.8.4.2). For metric specification, the first digitrepresents whole millimeters, the second represents tenthsof millimeters, etc. For orders requiring English units, thefour digits indicate the thickness in ten-thousandths of aninch (tenths of mils). In the example shown in 1.2, 1500 isdesignated for the English usage of 0590.1.2.3 Metal Cladding Type Nominal Weight/ThicknessThe type and nominal weight or thickness of the metalliccladding for laminate base material is identified by fivedesignators, with the first and fourth designators indicatingtype of cladding, the third designator being a slash mark todifferentiate sides of the base material, and the second andfifth designators indicating the nominal weight or thicknessof the metallic cladding.1.2.3.1 The types of metallic cladding and the designators representing them are shown in Table 1. This table isprovided as a reference only. The referee document is thelatest version of IPC-CF-148, IPC-MF-150, or IPC-CF-152as appropriate. Cladding types C and R, and H and S,respectively, may be used interchangeably as agreed uponbetween user and supplier.Table 1Metal Cladding TypesABCDG– Copper, wrought, rolled (IPC-MF-150, grade 5)– Copper, rolled (treated)– Copper, electrodeposited (IPC-MF-150, grade 1)– Copper, electrodeposited, double treat (IPC-MF-150, grade 1)– Copper, electrodeposited, high ductility (IPC-MF-150,grade 2)H – Copper, electrodeposited, high temperature elongation(IPC-MF-150, grade 3)J – Copper, electrodeposited, annealed (IPC-MF-150, grade 4)K – Copper, wrought, light cold rolled (IPC-MF-150, grade 6)L – Copper, wrought, annealed (IPC-MF-150, grade 7)M – Copper, wrought, rolled, low temperature annealable(IPC-MF-150, grade 8)P – Copper, electrodeposited, high temperature elongation,double treat (IPC-MF-150, grade 3)R – Copper, reverse treated electrodeposited (IPC-MF-150,grade 1)S – Copper, reverse treated electrodeposited, high temperatureelongation (IPC-MF-150)T – Copper, copper foil parameters as dictated by contract orpurchase orderU – AluminumY – Copper invar copperN – NickelO – UncladX – Other, as agreed between user and supplier1

IPC-4101December 19971.2.3.2 The weight or thickness of metallic cladding andthe designators representing them are listed in Table 2. Thistable is provided as a reference only. The referee documentis the latest version of IPC-CF-148, IPC-MF-150, or IPCCF-152 as appropriate.Table 2Copper Foil Weight and ThicknessArea Weight(g/m2)Foil DesignatorNominalThickness(microns)E (1/8)*44.65.0Q (1/4)*80.39.0T (3/8)*107.012.0H (1/2)*153.017.2M .0343.0144273.0480.0A variety of test procedurescan be used to specify and determine fitness for use ofprepreg in multilayer board applications. The amount ofresin and how much that resin will flow under specifiedconditions are the two critical performance characteristics.The specification for prepreg shall consist of one testmethod from Column A and one test method from ColumnB as shown below with the corresponding designators. Theuse of a test method from Column C is optional. If no testmethod is chosen for Column C, zero-zero (00) shall be thedesignator. The choice of the test methods shall be asagreed upon between the user and supplier and supplied aspart of the ordering information. The nominal value andtolerances for the individual tests shall be as specified onthe purchase order or by other agreement between the userand supplier.1.2.7 Prepreg ParametersColumn AColumn BColumn CResin ContentMethodFlow Parameter MethodOptional PrepregMethodRC - % ResinContentMF - % Resin FlowVC - VolatileContentTW - TreatedWeightSC - ScaledFlowDY - DicyInspectionNF - No FlowGT - Gel TimeRE - Rheology Flow00 - None Specified* Values in parenthesis are common industry terminology,which may not be exact from metric origin.PC - % CureDH - Delta HThe class ofthickness tolerance for laminate base material is identifiedby either A, B, C, D, K, L, M, or X as agreed uponbetween user and supplier (see 3.8.4.2).1.2.4 Thickness Tolerance (Laminate)1.2.5 Surface Quality Class The class of surface qualityis identified by either A, B, C, D, or X as agreed uponbetween user and supplier (see 3.8.3).1.2.6 Reinforcement Style The reinforcement type andstyle of the prepreg is indicated by five digits based on thechemical type and style. Typical examples of reinforcementdesignators are shown below:a) ‘‘E7628’’ represents E glass reinforcement style7628 per IPC-EG-140.b) ‘‘S0313’’ represents S glass reinforcement style 313per IPC-SG-141.c) ‘‘A3080’’ represents aramid reinforcement style3080 per IPC-A-142.d) ‘‘Q0525’’ represents quartz reinforcement style 525per IPC-QF-143.Reinforcement properties such as thickness, construction,and weight are established in accordance with the reinforcement style designations of the appropriate materialspecification.2Unless otherwise specified, all laminates andprepregs are supplied in the natural (undyed/unpigmented)color. If another color is required by the user, it shall bespecified on the purchase order.1.2.8 ColorContrast agents, which may beadded to a natural color resin system to enhance processing, such as tinting agents for contrast in automatic opticalinspection, shall not adversely affect the performance,properties, or functionality of the laminate or prepreg andshall be considered as the natural color.1.2.8.1 Contrast AgentsAll dimensions and tolerances specified herein are applicable only to the endproduct. Dimensions are expressed in millimeters. Reference information is shown in parentheses.1.3 Dimensions and Tolerances2.0 APPLICABLE DOCUMENTSThe following documents of the issue in effect at the timeof the order form a part of this specification to the extentspecified herein.2.1 IPCIPC-T-50 Terms and Definitions for Interconnecting andPackaging Electronic Circuits

December 1997IPC-PC-90 General Requirements for Implementation ofStatistical Process ControlIPC-CC-110 Guidelines for Selecting Core Constructionsfor Multilayer Printed Wiring Board ApplicationsSpecification for Finished Fabric Woven from‘‘E’’ Glass for Printed BoardsIPC-EG-140IPC-41012.4.4.1Flexural Strength of Laminates (at ElevatedTemperature)2.4.8Peel Strength of Metallic Clad Laminates2.4.8.2Peel Strength of Metallic Clad Laminates atElevated Temperature (Hot Fluid Method)2.4.8.3Peel Strength of Metallic Clad Laminates atElevated Temperature (Hot Air Method)2.4.13.1 Thermal Stress of LaminatesSpecification for Finished Fabric Woven from‘‘S’’ Glass for Printed Boards2.4.22.1 Bow and Twist, Laminate2.4.24Specification for Finished Fabric Woven fromAramid for Printed BoardsGlass Transition Temperature and Z-Axis Thermal Expansion by TMA2.4.25Glass Transition Temperature and Cure Factorby DSCIPC-SG-141IPC-A-142Specification for Finished Fabric Woven fromQuartz (Pure Fused Silica) for Printed BoardsIPC-QF-143IPC-CF-148Resin Coated Metal for Printed BoardsIPC-MF-150Metal Foil for Printed Wiring ApplicationsComposite Metallic Materials Specificationfor Printed Wiring BoardsNote: Test Method 2.4.25 also describes thedelta glass transition temperature test (Delta Tg).2.4.38Prepreg Scaled Flow Testing2.4.39Dimensional Stability, Glass Reinforced ThinLaminates2.4.41Coefficient of Linear Thermal Expansion ofElectrical Insulating MaterialsIPC-CF-152IPC-TM-650Test Methods2.4.41.1 Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer Method2.5.1Arc Resistance of Printed Wiring Materials2.5.5.2Dielectric Constant and Dissipation Factor ofPrinted Wiring Board Materials - Clip Method2.5.5.3Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (TwoFluid Cell Method)2.2.19.1 Length, Width and Perpendicularity of Laminateand Prepreg Panels2.5.6Dielectric Strength of Rigid Printed WiringMaterial2.3.1.1Chemical Cleaning of Metal-Clad Laminates2.5.6.2Electric Strength of Printed Wiring Material2.3.4.2Chemical Resistance of Laminates, Prepreg andCoated Foil Products, by Solvent Exposure2.5.17.1 Volume and Surface Resistivity of DielectricMaterial2.3.4.3Chemical Resistance of Core Materials to Methylene Chloride2.6.1Fungus Resistance, Printed Wiring Materials2.6.2.1Water Absorption, Metal-Clad Plastic Laminates2.3.6Etching, Ammonium Persulfate Method2.6.162.3.7Etching, Ferric Chloride MethodPressure Vessel Method for Glass Epoxy Laminate Integrity2.3.7.1Cupric Chloride Etching Method2.3.10Flammability of Laminate2.3.16Resin Content of Prepreg by Burn-Off2.1.5Surface Examination, Unclad and Metal-CladMaterial2.1.9Surface Scratch Examination Metal-Clad Foil2.1.10Visual Inspection for Undissolved DicyandiamideIPC-QL-653 Qualification of Facilities that Inspect/TestPrinted Boards, Components, and MaterialsLaminator’s Qualification Profile2.3.16.1 Resin Content of Prepreg by Treated WeightIPC-LQP-17302.3.16.2 Treated Weight of PrepregJ-STD-004Requirements for Soldering FluxesJ-STD-003Solderability Test Methods For Printed Wiring2.3.17Resin Flow Percent of Prepreg2.3.17.2 Resin Flow of ‘‘No Flow’’ ResinBoards2.3.18Gel Time, Prepreg Materials2.3.19Volatile Content of Prepreg2.2 National Conference of Standards Laboratories2.4.4Flexural Strength of Laminates (at AmbientTemperature)General Requirements for Calibration Laboratories and Measuring and Test EquipmentANSI/NCSL Z540-1-19943

IPC-41012.3 International StandardsISO 10012-1 Quality Assurance Requirements for Measuring Equipment, Part 1 - Metrological Confirmation Systemfor Measuring Equipment3.0 REQUIREMENTSThe definition of terms shallbe in accordance with IPC-T-50 and the following.3.1 Terms and DefinitionsQualification Assessment is a form of risk reduction between a buyer and asource for laminates and prepregs. The laminator shall produce an assessment of its capabilities and sources of verification for the buyer to evaluate. The buyer must thenreview this assessment and determine whether the information and verification provided constitutes an acceptablelevel of risk. The more verification of self declarationparameters provided, the lower the risk factor associatedwith utilizing a new laminator. There is no minimum levelof Qualification Assessment Verification required by thisstandard, and it is between the buyer and laminator todetermine the extent of verification applicable to theirrequirements. If the risk assessment is determined to beunacceptably high, the risk may be reduced by increasingthe verification requirements. The cost associated withreducing this risk varies with the type of verification that isdetermined to be necessary.3.1.1 Qualification Assessment3.1.2 Quality Conformance Testing Quality conformance testing is performed on a regular basis followingqualification testing as determined by the Manufacturer’sQuality System. This is done to demonstrate that the supplier is continually meeting the finished product requirements of this specification and the applicable specificationsheet for each base material. In the absence of a documented Manufacturers Quality System, the conformancetesting shall be conducted in accordance with the frequencyas specified in Table 5 for laminates and Table 6 forprepregs.3.1.3 Manufacturer’s Quality System The Manufactur-er’s Quality System is an organized entity within the laminator’s operation that administers the documentation system, steering committee, lines of responsibilities, etc., asdescribed in IPC-PC-90.Testing performed forthe purpose of nominalizing the critical steps of the manufacturers internal process.3.1.4 Process Control TestingDecember 1997processing and test equipment, technology specifics, quality program, manufacturing history, company information,and data verification sources. Self Declaration is the laminator’s view of its products and process capabilities tomeet the customer’s requirements, the requirements of thestandard, and the applicable associated specificationsheet(s) (see 3.3).The data contained inthe Self Assessment is compiled and analyzed for performance characteristics of laminates or prepregs. The performance data may be based on information from a variety ofboth internal and external sources.3.1.6 Quality Assessment Data3.1.7 Sample Qualification Verification by SampleQualification signifies that a manufacturer was capable ofproducing a product with a given set of parameters at apoint in time when the Qualification sample was manufactured. Sample Qualification Testing of laminate andprepreg performance characteristics shall be performed at afacility that has demonstrated compliance of IPC-QL-653.3.1.8 Production Data Production data is normal performance data from manufacturing runs generated as a qualityassurance function. This data can be compiled, analyzed,and reported as support for product compliance to this standard by the laminator.3.1.9 Customer Test Data Customer test data is normalperformance data generated at incoming inspection by thecustomer. This data can be compiled, analyzed, andreported as support for product compliance to this standardby the laminator.3.1.10 Internal Assessment Internal Assessments con-sist of periodic supplier verification of data contained in theQuality Profile section of the Self Declaration.3.1.11 Individual Customer Audit The Individual Customer Audit is an evaluation of the laminator’s facility tocompare the current Management Quality System versusthe Self Declaration and the requirements of this document.The analysis, summary, and necessary corrective actions, atthe discretion of the customer, may become part of thelaminator’s Self Declaration.3.1.12 Independent Third Party Assessment Assessments are performed by a third party assessor, which isgenerally procedural in nature. Examples of third partyassessors are ISO Registrars, Malcom Baldridge, Underwriters’ Laboratories, Canadian Standards Agency, IECQ,DSCC, etc.The individual item requirements shall be as specified herein and in

IPC-4101 Specification for Base Materials for Rigid and Multilayer Printed Boards IPC-4101 December 1997 Supercedes IPC-L-108, IPC-L-109, IPC-L-112, IPC-L-115 IPC-AM-361 TheInstitutefor Interconnecting andPackaging ElectronicCircuits A standard developed by the Institute for Interconnecting