MIFARE Plus Card Coil Design
AN10841MIFARE Plus Card Coil DesignRev. 1.1 — 4 April 2017172711Application noteCOMPANY PUBLICDocument informationInfoContentKeywordsContactless, MIFARE Plus, ISO/IEC 1443, Resonance, Coil, InlayAbstractThis document provides guidance for engineers designing magnetic loopantenna coils for the MIFARE Plus S, X and SE.
AN10841NXP SemiconductorsMIFARE Plus PICC Coil DesignRevision historyRevDateDescription1.120170404Updated for 70 pF version0120090626Initial versionContact informationFor more information, please visit: http://www.nxp.comAN10841Application noteCOMPANY PUBLICAll information provided in this document is subject to legal disclaimers.Rev. 1.1 — 4 April 2017172711 NXP Semiconductors N.V. 2017. All rights reserved.2 of 12
AN10841NXP SemiconductorsMIFARE Plus PICC Coil Design1. IntroductionMIFARE Plus is a passive device (without battery) powered by a magnetic fieldgenerated by the PCD. To get the magnetic flux cut by the PICC, it requires a loopantenna.This document describes some notes to the design of such loop antennas for MIFAREPlus. The detail design is explained in [1]. Although such antennas are relativelystraightforward in principle and look very similar when comparing various contactlesssmartcards, experience proves that their parameters do have a noticeable impact onperformance.In this document, some examples are attached for your reference but please adapt andverify them before you go for production.1.1 How to use this documentIn this document, only the hints and notes specific to MIFARE Plus are explained. All thebasics and common design details are explained in the base document [1]. Use the basedocument and apply wherever required the notes mentioned here.1.2 Abbreviations and termsTable 1 lists the abbreviations as used in this document.Table 1.Table of abbreviationsAbbreviationsAN10841Application noteCOMPANY PUBLICPICCProximity Integrated Circuit Card (ISO/IEC14443), tagPCDProximity Coupling Device (ISO14443), readerfRTThreshold resonance frequencyQQuality factorAll information provided in this document is subject to legal disclaimers.Rev. 1.1 — 4 April 2017172711 NXP Semiconductors N.V. 2017. All rights reserved.3 of 12
AN10841NXP SemiconductorsMIFARE Plus PICC Coil Design2. Card Coil Design notes for MIFARE PlusThere are different classes of antenna widely used in contactless application for MIFAREPlus PICC. For different antenna classes the design of PICC coils are different. Evendifferent application requirements also lead to different antenna design. Basically, threeparameters are important for card coil design: coil area, resonance frequency and qualityfactor.2.1 Different classes of antenna according to ISO/IEC 14443-1In the following figure Fig 1, different antenna sizes according ISO/IEC 14443-1 areshown.Fig 1.Different PICC antenna sizes2.2 Average card coil areaMake a card coil area as big as possible. The bending corners are better than sharpcorners.AN10841Application noteCOMPANY PUBLICAll information provided in this document is subject to legal disclaimers.Rev. 1.1 — 4 April 2017172711 NXP Semiconductors N.V. 2017. All rights reserved.4 of 12
AN10841NXP SemiconductorsMIFARE Plus PICC Coil Design2.3 Unloaded threshold resonance frequencyThe appropriate resonance frequency of the antenna coil depends on the card ICs andapplications. To cover manufacturing tolerances and optimum performance, for MIFAREPlus, the recommended threshold resonance frequency is given in Table 2.2.3.1 Measurement of threshold resonance frequencyThere are different ways to measure the resonance frequency, and may end up withdifferent results. Follow the way described in the Card Coil Design Guide.2.4 Unloaded Q of the coilThe quality factor of the antenna coil is very important for longer distance and stablecommunication. The appropriate Q of an antenna coil depends on the card ICs andapplications. To cover manufacturing tolerances and optimum performance, for MIFAREPlus, the recommended Q is given in Table 2.2.4.1 Measurement of unloaded Q of the coilThere are different ways to measure the Q, and may end up with different results. Followthe way described in the Card Coil Design Guide [1].2.5 NXP recommendation for PICC coil designTable 2 summarizes recommendations on MIFARTE Plus chip capacitance, inlaythreshold resonance frequency a well as on quality factor of the coil for different classes(sizes).Table 2.PICC coil design recommendationAntenna Recommended Recommended thresholdclasschip ofresonance frequency (fRT)MIFARE PlusRecommended Commentsunloaded QClass 117pF13.56 MHz fRT 16.00 MHz 30For the single card application, a lowerfrequency is better and for multi-card (orstacked cards) applications, a higherfrequency is better.Class 270pF12.70 MHz fRT 14.50 MHz 40For 106 kbps and single card application.The optimum resonance frequency is13.56 MHz.Class 370pF12.70 MHz fRT 14.50 MHz 40For 106 kbps and single card application.The optimum resonance frequency is13.56 MHz.Class 470pF12.70 MHz fRT 14.50 MHz 40For 106 kbps and single card application.The optimum resonance frequency is13.56 MHz.Class 570pF12.70 MHz fRT 14.50 MHz 40For 106 kbps and single card application.The optimum resonance frequency is13.56 MHz.Class 670pF13.00 MHz fRT 14.00 MHz 40For 106 kbps and single card application.The optimum resonance frequency is13.56 MHz.NOTE: Increasing the communication bit rates may reduce the communication distancespecially for the small classes of antenna (other than class 1).AN10841Application noteCOMPANY PUBLICAll information provided in this document is subject to legal disclaimers.Rev. 1.1 — 4 April 2017172711 NXP Semiconductors N.V. 2017. All rights reserved.5 of 12
AN10841NXP SemiconductorsMIFARE Plus PICC Coil Design2.6 Practical design hints and recommendations2.6.1 ID1-sized antennasWithin the confines of the application and the card manufacturing processes used, try tomaximize the antenna size. The outermost turn of the antenna coil should be placed asclose as possible to the edge of the card (represented by an 81 x 49 mm rectangle, Fig2).Note: international standards and industry specifications may restrict the choice.Fig 2.Class 1 antenna examples (with two different parameters)For 17pF chip the ID1 size (class 1) antenna is recommended. For other classes use the70pF version of MIFARE Plus chip.AN10841Application noteCOMPANY PUBLICAll information provided in this document is subject to legal disclaimers.Rev. 1.1 — 4 April 2017172711 NXP Semiconductors N.V. 2017. All rights reserved.6 of 12
AN10841NXP SemiconductorsMIFARE Plus PICC Coil DesignFig 3 shows further examples of typical parameters for different ID1-sized antennadesigns. Besides geometrical coil parameters (orange colored area), also measured(blue colored area) and calculated (green colored area) electrical parameters are listed incomparison.Fig 3.AN10841Application noteCOMPANY PUBLICTypical parameters of different class 1 card antennasAll information provided in this document is subject to legal disclaimers.Rev. 1.1 — 4 April 2017172711 NXP Semiconductors N.V. 2017. All rights reserved.7 of 12
AN10841NXP SemiconductorsMIFARE Plus PICC Coil Design2.7 Practical design hints and recommendations for 70pF ICFor class 2 and up to class 6 antennas, it is recommended to use 70pF chip version.2.7.1 ID ½ sized (class 2) antennaGeometrical parameters of one possible class 2 size antenna design, as well as itslocation within the ID1 card area is shown in Fig 4.Fig 4.Class 2 Antenna example3. Reference[1]AN10841Application noteCOMPANY PUBLICAN011732 “MIFARE Card Coil Design Guide”All information provided in this document is subject to legal disclaimers.Rev. 1.1 — 4 April 2017172711 NXP Semiconductors N.V. 2017. All rights reserved.8 of 12
AN10841NXP SemiconductorsMIFARE Plus PICC Coil Design4. Legal information4.1 DefinitionsDraft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodifications or additions. NXP Semiconductors does not give anyrepresentations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequencesof use of such information.NXP Semiconductors does not accept any liability related to any default,damage, costs or problem which is based on any weakness or default in thecustomer’s applications or products, or the application or use by customer’sthird party customer(s). Customer is responsible for doing all necessarytesting for the customer’s applications and products using NXPSemiconductors products in order to avoid a default of the applications andthe products or of the application or use by customer’s third partycustomer(s). 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This document supersedes and replaces all information supplied priorto the publication hereof.Suitability for use — NXP Semiconductors products are not designed,authorized or warranted to be suitable for use in life support, life-critical orsafety-critical systems or equipment, nor in applications where failure ormalfunction of an NXP Semiconductors product can reasonably be expectedto result in personal injury, death or severe property or environmentaldamage. NXP Semiconductors and its suppliers accept no liability forinclusion and/or use of NXP Semiconductors products in such equipment orapplications and therefore such inclusion and/or use is at the customer’s ownrisk.Translations — A non-English (translated) version of a document is forreference only. The English version shall prevail in case of any discrepancybetween the translated and English versions.Evaluation products — This product is provided on an “as is” and “with allfaults” basis for evaluation purposes only. 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The foregoing limitations,exclusions and disclaimers shall apply to the maximum extent permitted byapplicable law, even if any remedy fails of its essential purpose.4.3 LicensesICs with DPA Countermeasures functionalityNXP ICs containing functionalityApplications — Applications that are described herein for any of theseproducts are for illustrative purposes only. NXP Semiconductors makes norepresentation or warranty that such applications will be suitable for thespecified use without further testing or modification.Customers are responsible for the design and operation of their applicationsand products using NXP Semiconductors products, and NXPSemiconductors accepts no liability for any assistance with applications orcustomer product design. It is customer’s sole responsibility to determinewhether the NXP Semiconductors product is suitable and fit for thecustomer’s applications and products planned, as well as for the plannedapplication and use of customer’s third party customer(s). Customers shouldprovide appropriate design and operating safeguards to minimize the risksassociated with their applications and products.implementing countermeasures to DifferentialPower Analysis and Simple Power Analysisare produced and sold under applicablelicense from Cryptography Research, Inc.4.4 TrademarksNotice: All referenced brands, product names, service names andtrademarks are property of their respective owners.MIFARE — is a trademark of NXP B.V.MIFARE Plus — is a trademark of NXP B.V.AN10841Application noteCOMPANY PUBLICAll information provided in this document is subject to legal disclaimers.Rev. 1.1 — 4 April 2017172711 NXP Semiconductors N.V. 20174. All rights reserved.9 of 12
AN10841NXP SemiconductorsMIFARE Plus PICC Coil Design5. List of figuresFig 1.Fig 2.Fig 3.Fig 4.Different PICC antenna sizes . 4Class 1 antenna examples (with two differentparameters). 6Typical parameters of different class 1 cardantennas . 7Class 2 Antenna example . 8AN10841Application noteCOMPANY PUBLICAll information provided in this document is subject to legal disclaimers.Rev. 1.1 — 4 April 2017172711 NXP Semiconductors N.V. 2017. All rights reserved.10 of 12
AN10841NXP SemiconductorsMIFARE Plus PICC Coil Design6. List of tablesTable 1.Table 2.Table of abbreviations . 3PICC coil design recommendation . 5AN10841Application noteCOMPANY PUBLICAll information provided in this document is subject to legal disclaimers.Rev. 1.1 — 4 April 2017172711 NXP Semiconductors N.V. 2017. All rights reserved.11 of 12
AN10841NXP SemiconductorsMIFARE Plus PICC Coil Design7. 12.72.7.13.4.4.14.24.34.45.6.7.Introduction . 3How to use this document . 3Abbreviations and terms . 3Card Coil Design notes for MIFARE Plus . 4Different classes of antenna according toISO/IEC 14443-1 . 4Average card coil area . 4Unloaded threshold resonance frequency. 5Measurement of threshold resonance frequency5Unloaded Q of the coil . 5Measurement of unloaded Q of the coil . 5NXP recommendation for PICC coil design. 5Practical design hints and recommendations . 6ID1-sized antennas . 6Practical design hints and recommendations for70pF IC . 8ID ½ sized (class 2) antenna . 8Reference . 8Legal information . 9Definitions . 9Disclaimers. 9Licenses . 9Trademarks . 9List of figures. 10List of tables . 11Contents . 12Please be aware that important notices concerning this document and the product(s)described herein, have been included in the section 'Legal information'. NXP Semiconductors N.V. 2017.All rights reserved.For more information, visit: http://www.nxp.comDate of release: 4 April 2017172711Document identifier: AN10841
2. Card Coil Design notes for MIFARE Plus There are different classes of antenna widely used in contactless application for MIFARE Plus PICC. For different antenna classes the design of PICC coils are different. Even different application requirements also lead to different antenna design. Basically, threeFile Size: 212KB
the 3DES key, the MIFARE Ultralight C design shows some differences compared to MIFARE Ultralight design. In order to minimize the impact of chip differences for the customer designs and ease the transition from existing MIFARE Ultralight systems to MIFARE Ultralight C systems, this document highlights the differences between the two products.
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Mifare Encoding using Card Studio 10. Select where you wish to encode your data (sector and block) by double-clicking on one line. Mifare Encoding using Card Studio 11. Select Data to Encode and enter your data. You can specify a Variable Source. Click on Data Placement and select a different location if you wish. Click on OK.
MIFARE Ultralight EV1 - Contactless ticket IC Rev. 3.3 — 9 April 2019 Product data sheet 234533 COMPANY PUBLIC 1 General description NXP Semiconductors developed the MIFARE Ultralight EV1 MF0ULx1 for use in a contactless smart ticket, smart card or token in combination with a Proximity Coupling Device (PCD).
Automotive EMC Standards SAE J551-16 Vehicle Immunity Tests: SAE J551-17 ISO 11452-8 Reverberation Chamber Immunity Power Line Disturbances Magnetic Field Immunity August 18, 2008 13
