Cisco PCB Laminate Roadmap 2013-2015
Cisco PCB LaminateRoadmap 2013-2015Scott Hinaga, David Senk, Chris Pattberg, William Chao andMason HuOctober 22, 2013
Carrier ClassRouterHigh EndEnterpriseEnterpriseSwitch/ RouterWirelessData deo 2010 Cisco and/or its affiliates. All rights reserved.StorageIP phoneVideoConferencingSettopBoxCisco Confidential2
CRS-4/S320 GbpsCRS-16/SCRS-MC1.2 Tbps1.2 Tbps to 92 TbpsCRS-8/S640 Gbps What technology is needed for at least 10x improvementfor each product generation:– BW capacity, density,– Power efficiency (bps/W),– Cost efficiency (bps/ ) 2010 Cisco and/or its affiliates. All rights reserved.Cisco Confidential3
Carrier of transmission lines An ideal transmission line should pass a signal from Tx to Rx fastand with no distortionNoise Transmitter 2010 Cisco and/or its affiliates. All rights reserved.ReceiverCisco Confidential4
Electrical characteristic of the transmission lineSurface roughness – skin effect @ high frequencies Inhomogeneity of the transmission line – trace microvia/PTHReflection @ discontinuities – a via structural issue not a laminateissue Electrical properties of the laminateDielectric loss – worsen @ high frequencies Inhomogeneity of the laminate – glass fiber vs. resinDifferential pair signal skew – worsen @ high frequencies 2010 Cisco and/or its affiliates. All rights reserved.Cisco Confidential5
Rotate circuit images Potential cost increase due tolarger panel size (e.g. 18x24 21x24 17% cost increase!) Spread glass weave Not isotropic/homogeneous –improves but does not eliminatethe problem Match Dk between glass & resin Need to cost less than rotatingthe image 2010 Cisco and/or its affiliates. All rights reserved.Cisco Confidential6
High(Df as measured byCisco S3 test method)CostDf 0.005Df 0.010Low Df 0.015Df 0.020Lower 2010 Cisco and/or its affiliates. All rights reserved.Electrical Performance HigherCisco Confidential7
Signal Speed, Trace Length, TTM, Cost High speed, large backplane Low loss laminate High speed linecard Low/Mid loss laminate Smaller, low speed backplane, Mid/Std loss laminatelinecard Small form factor, low speedlinecard 2010 Cisco and/or its affiliates. All rights reserved. Std/High loss laminateCisco Confidential8
FY10Q4FY12Q1FY13Q1FY14Q1Low 2010 Cisco and/or its affiliates. All rights reserved.MidStdHighCisco Confidential9
High(As Relative % of Total)CostDf 0.005Df 0.010Low Df 0.015Df 0.020Lower 2010 Cisco and/or its affiliates. All rights reserved.Electrical Performance HigherCisco Confidential10
Key need #1– Ultra-Low-Loss Material- Df 0.5x Megtron 6 (by Cisco S3 Method: 0.0035 @ 10GHz)- Standard PCB processes (i.e. not like PTFE)- PTFE difficult to drill, desmear and plate- PTFE difficult to handle, poor dimensional stability- Need max. reliability on CAF and Pb free thermal resistance- Must have option for low-Dk/Df glass- Default foil: ultra-low-profile- Must have option for no-profile (resin primer) foil- Organic fiber instead of glass cloth is possible 2010 Cisco and/or its affiliates. All rights reserved.Cisco Confidential11
Key need #2 – Low/Mid-Loss Material Cost-Down- Low/Mid-Loss cost today baseline FR4- Needs to come down for -sensitive, mid-range platforms- Economy of scale: Volume Up Cost Down- Versions of existing products using lower-cost raw materials,(same Dk/Df, but CAF/Pb free performance not as high as theoriginal version), could have a role on some mid-loss platformswith lower field service lifetime. 2010 Cisco and/or its affiliates. All rights reserved.Cisco Confidential12
Architectural Changes Traditional BP Orthogonal MP Cable BP(Adam Healey, LSI Corporation; Chad Morgan, Megha Shanbhag, TE Connectivity) Modulation Changes NRZ: binary non-return to zerodata (1 bit/symbol) PAM-2 PAM-4: 4 level pulse amplitudemodulation (2 bits/symbol)(Sam Palermo, Texas A&M University ) Optical PCB Depends on ASIC, connector,optical waveguide material andother infrastructural development 2010 Cisco and/or its affiliates. All rights reserved.(Marika Immonen, TTM Technologies)Cisco Confidential13
2010 Cisco and/or its affiliates. All rights reserved.Cisco Confidential14
Router Enterprise Switch/ Router IP phone Settop Box Video Conferencing Switch UCS Server Wireless . CRS-4/S CRS-8/S CRS-16/S CRS-MC . -Df 0.5x Megtron 6 (by Cisco S3 Method: 0.0
SP3 : Technologies de traitement SP4 : Outil global d'aide à la décision Action 6 PCB OPTITRI Action 7 PCB ECODEPOT Action 8 STAB PCB Action 9 PCB SEDICA Action 10 FUNGI EAT PCB Action 12 BIODECHLOR PCB Action 13 DESTHER PCB Action 14 PLATPIL PCB Action 15 SEDIRHONE PCB / / / / SP3.1 : dragage et criblage SP3.2 : confinement SP3.3 : absorption
Rustic Oak: 1860mm x 190mm x 15mm (3mm veneer) specs . 10 year Light Commercial Wear Guarantee*. LAMINATE Greystone LAMINATE Sierra Frost LAMINATE Windspray LAMINATE Burnt Husk LAMINATE Silver Mist LAMINATE Sunset Haze Manhattan Collection - Laminate Design Featured: Sunset Haze key features No pattern repitition Real timber feel .
Cisco ASA 5505 Cisco ASA 5505SP Cisco ASA 5510 Cisco ASA 5510SP Cisco ASA 5520 Cisco ASA 5520 VPN Cisco ASA 5540 Cisco ASA 5540 VPN Premium Cisco ASA 5540 VPN Cisco ASA 5550 Cisco ASA 5580-20 Cisco ASA 5580-40 Cisco ASA 5585-X Cisco ASA w/ AIP-SSM Cisco ASA w/ CSC-SSM Cisco C7600 Ser
11.1 PCB design process The PCB Design training covers how to use the PCB Editor to create a PCB from setup, through component placement, routing, design rule checking and CAM output. We first look at the overall PCB design process. The diagram below shows an overview of the PCB design process from schematic entry through to PCB design completion.
Aluminum Single Side PCB Aluminum Metal Clad Circuit Boards Aluminum Printed Circuit Board P r o d u c t s & S e r v i c e s. MC PCBS MC PCB Single Slide PCB SS PCB Panel Light MC PCB P r o d u c t s & S e r v i c e s. METAL CORE PCBS LED Street Lights Metal Clad PCB Metal Clad PCB Metal Core Circuit Metal Core Circuit Boards P r o d u c t s .
components on the PCB and solder them. Di erent method to make PCB There are in all three basic methods to make PCB 1. Iron on Glossy paper method 2. Circuit by hand on PCB 3. Laser cutting edge etching. Since laser method is industrial method to make PCB we will get in detail of %rst two method to make PCB at home. How to Make PCB at Home: Page 1
Supported Devices - Cisco SiSi NetFlow supported Cisco devices Cisco Catalyst 3560 Cisco 800 Cisco 7200 Cisco Catalyst 3750 Cisco 1800 Cisco 7600 Cisco Catalyst 4500 Cisco 1900 Cisco 12000 Cisco Catalyst 6500 Cisco 2800 Cisco ASR se
Cisco Nexus 1000V Cisco Nexus 1010 Cisco Nexus 4000 Cisco MDS 9100 Series Cisco Nexus 5000 Cisco Nexus 2000 Cisco Nexus 6000 Cisco MDS 9250i Multiservice Switch Cisco MDS 9700 Series Cisco Nexus 7000/7700 Cisco Nexus 3500 and 3000 CISCO NX-OS: From Hypervisor to Core CISCO DCNM: Single
