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UM10360LPC17xx User manualRev. 01 — 4 January 2010User manualDocument informationInfoContentKeywordsLPC1769, LPC1768, LPC1767, LPC1766, LPC1765, LPC1764, LPC1759,LPC1758, LPC1756, LPC1754, LPC1752, LPC1751, ARM, ARM Cortex-M3,32-bit, USB, Ethernet, CAN, I2S, MicrocontrollerAbstractLPC17xx user manual

UM10360NXP SemiconductorsLPC17xx user manualRevision historyRevDateDescription120100104LPC17xx user manual revision.Modifications: “Draft” status removed. The note about DMA operation in Sleep mode was removed from Section 4–8.1. The UART fractional baud rate generator is disabled in auto baud mode (seeSection 14–14.4.10.1 and Section 15–4.14). In section Section 14–4.12 and Section 15–4.16, the description of the value of the DLLregister has been is corrected to read "the value of the DLL register must be greater than 2". *** Motor Control PWM *** Editorial updates and typographical corrections throughout the user manual.LPC1758, LPC1767, and LPC1768 have been added to the keywords list on the front cover,the ordering information in section Section 1–4, and the part identification number table inSection 32–7.11.In Table 8–81, the CLKOUT function was removed from the description of P1.25.In section the Ethernet chapter, in Section 10–16.1 and Section 10–17.2, it has been notedthat the external PHY must be initialized and PHY clocks received by the Ethernet block priorto further initialization of the Ethernet block. Also, in Section 10–17.1, under the heading"Ownership of descriptors", the sentence about AHB arbitration was removed. A general andmore correct discussion of the subject was added in Section 2–5.The description of RPM calculation in the QEI chapter (see Section 26–4.3), definitions for theformula values are added, and the description improved. The description of the position andindex compare registers incorrectly indicated that the less than,equal to, and greater thancompare could be selected. It is changed to only indicate “equal to”.A description of Flash signature generation has been added in Section 32–10.Contact informationFor more information, please visit: http://www.nxp.comFor sales office addresses, please send an email to: salesaddresses@nxp.comUM10360 1User manual NXP B.V. 2010. All rights reserved.Rev. 01 — 4 January 20102 of 835

UM10360Chapter 1: LPC17xx Introductory informationRev. 01 — 4 January 2010User manual1. IntroductionThe LPC17xx is an ARM Cortex-M3 based microcontroller for embedded applicationsrequiring a high level of integration and low power dissipation. The ARM Cortex-M3 is anext generation core that offers system enhancements such as modernized debugfeatures and a higher level of support block integration.High speed versions (LPC1769 and LPC1759) operate at up to a 120 MHz CPUfrequency. Other versions operate at up to an 100 MHz CPU frequency. The ARMCortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture withseparate local instruction and data buses as well as a third bus for peripherals. The ARMCortex-M3 CPU also includes an internal prefetch unit that supports speculativebranches.The peripheral complement of the LPC17xx includes up to 512 kB of flash memory, up to64 kB of data memory, Ethernet MAC, a USB interface that can be configured as eitherHost, Device, or OTG, 8 channel general purpose DMA controller, 4 UARTs, 2 CANchannels, 2 SSP controllers, SPI interface, 3 I2C interfaces, 2-input plus 2-output I2Sinterface, 8 channel 12-bit ADC, 10-bit DAC, motor control PWM, Quadrature Encoderinterface, 4 general purpose timers, 6-output general purpose PWM, ultra-low power RTCwith separate battery supply, and up to 70 general purpose I/O pins.UM10360 1User manual NXP B.V. 2010. All rights reserved.Rev. 01 — 4 January 20103 of 835

UM10360NXP SemiconductorsChapter 1: LPC17xx Introductory information2. FeaturesRefer to Section 1–4.1 for details of features on specific part numbers. ARM Cortex-M3 processor, running at frequencies of up to 120 MHz on high speedversions (LPC1769 and LPC1759), up to 100 MHz on other versions. A MemoryProtection Unit (MPU) supporting eight regions is included. ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC). Up to 512 kB on-chip flash program memory with In-System Programming (ISP) andIn-Application Programming (IAP) capabilities. The combination of an enhanced flashmemory accelerator and location of the flash memory on the CPU local code/data busprovides high code performance from flash. Up to 64 kB on-chip SRAM includes:– Up to 32 kB of SRAM on the CPU with local code/data bus for high-performanceCPU access.– Up to two 16 kB SRAM blocks with separate access paths for higher throughput.These SRAM blocks may be used for Ethernet, USB, and DMA memory, as well asfor general purpose instruction and data storage. Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayermatrix that can be used with the SSP, I2S, UART, the Analog-to-Digital andDigital-to-Analog converter peripherals, timer match signals, GPIO, and formemory-to-memory transfers. Multilayer AHB matrix interconnect provides a separate bus for each AHB master.AHB masters include the CPU, General Purpose DMA controller, Ethernet MAC, andthe USB interface. This interconnect provides communication with no arbitrationdelays unless two masters attempt to access the same slave at the same time. Split APB bus allows for higher throughput with fewer stalls between the CPU andDMA. A single level of write buffering allows the CPU to continue without waiting forcompletion of APB writes if the APB was not already busy. Serial interfaces:– Ethernet MAC with RMII interface and dedicated DMA controller.– USB 2.0 full-speed controller that can be configured for either device, Host, orOTG operation with an on-chip PHY for device and Host functions and a dedicatedDMA controller.– Four UARTs with fractional baud rate generation, internal FIFO, IrDA, and DMAsupport. One UART has modem control I/O and RS-485/EIA-485 support.– Two-channel CAN controller.– Two SSP controllers with FIFO and multi-protocol capabilities. The SSP interfacescan be used with the GPDMA controller.– SPI controller with synchronous, serial, full duplex communication andprogrammable data length. SPI is included as a legacy peripheral and can be usedinstead of SSP0.– Three enhanced I2C-bus interfaces, one with an open-drain output supporting thefull I2C specification and Fast mode plus with data rates of 1Mbit/s, two withstandard port pins. Enhancements include multiple address recognition andmonitor mode.UM10360 1User manual NXP B.V. 2010. All rights reserved.Rev. 01 — 4 January 20104 of 835

UM10360NXP SemiconductorsChapter 1: LPC17xx Introductory information– I2S (Inter-IC Sound) interface for digital audio input or output, with fractional ratecontrol. The I2S interface can be used with the GPDMA. The I2S interface supports3-wire data transmit and receive or 4-wire combined transmit and receiveconnections, as well as master clock output. Other peripherals:– 70 (100 pin package) or 52 (80-pin package) General Purpose I/O (GPIO) pins withconfigurable pull-up/down resistors, open drain mode, and repeater mode. AllGPIOs are located on an AHB bus for fast access, and support Cortex-M3bit-banding. GPIOs can be accessed by the General Purpose DMA Controller. Anypin of ports 0 and 2 can be used to generate an interrupt.– 12-bit Analog-to-Digital Converter (ADC) with input multiplexing among eight pins,conversion rates up to 200 kHz, and multiple result registers. The 12-bit ADC canbe used with the GPDMA controller.– 10-bit Digital-to-Analog Converter (DAC) with dedicated conversion timer and DMAsupport.– Four general purpose timers/counters, with a total of eight capture inputs and tencompare outputs. Each timer block has an external count input. Specific timerevents can be selected to generate DMA requests.– One motor control PWM with support for three-phase motor control.– Quadrature encoder interface that can monitor one external quadrature encoder.– One standard PWM/timer block with external count input.– Real-Time Clock (RTC) with a separate power domain. The RTC is clocked by adedicated RTC oscillator. The RTC block includes 20 bytes of battery-poweredbackup registers, allowing system status to be stored when the rest of the chip ispowered off. Battery power can be supplied from a standard 3 V Lithium buttoncell. The RTC will continue working when the battery voltage drops to as low as2.1 V. An RTC interrupt can wake up the CPU from any reduced power mode.– Watchdog Timer (WDT). The WDT can be clocked from the internal RC oscillator,the RTC oscillator, or the APB clock.– Cortex-M3 system tick timer, including an external clock input option.– Repetitive interrupt timer provides programmable and repeating timed interrupts. Standard JTAG test/debug interface as well as Serial Wire Debug and Serial WireTrace Port options. Emulation trace module supports real-time trace. Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deeppower-down. Single 3.3 V power supply (2.4 V to 3.6 V). Temperature range of -40 C to 85 C. Four external interrupt inputs configurable as edge/level sensitive. All pins on PORT0and PORT2 can be used as edge sensitive interrupt sources. Non-maskable Interrupt (NMI) input. Clock output function that can reflect the main oscillator clock, IRC clock, RTC clock,CPU clock, or the USB clock. The Wakeup Interrupt Controller (WIC) allows the CPU to automatically wake up fromany priority interrupt that can occur while the clocks are stopped in deep sleep,Power-down, and Deep power-down modes.UM10360 1User manual NXP B.V. 2010. All rights reserved.Rev. 01 — 4 January 20105 of 835

UM10360NXP SemiconductorsChapter 1: LPC17xx Introductory information Processor wake-up from Power-down mode via any interrupt able to operate duringPower-down mode (includes external interrupts, RTC interrupt, USB activity, Ethernetwake-up interrupt, CAN bus activity, PORT0/2 pin interrupt, and NMI). Each peripheral has its own clock divider for further power savings.Brownout detect with separate threshold for interrupt and forced reset.On-chip Power-On Reset (POR).On-chip crystal oscillator with an operating range of 1 MHz to 25 MHz.4 MHz internal RC oscillator trimmed to 1% accuracy that can optionally be used as asystem clock. An on-chip PLL allows CPU operation up to the maximum CPU rate without the needfor a high-frequency crystal. May be run from the main oscillator, the internal RCoscillator, or the RTC oscillator. A second, dedicated PLL may be used for the USB interface in order to allow addedflexibility for the Main PLL settings. Versatile pin function selection feature allows many possibilities for using on-chipperipheral functions. Available as 100-pin LQFP (14 x 14 x 1.4 mm) and 80-pin LQFP (12 x 12 x 1.4 mm)packages.3. Applications eMeteringLightingIndustrial networkingAlarm systemsWhite goodsMotor controlUM10360 1User manual NXP B.V. 2010. All rights reserved.Rev. 01 — 4 January 20106 of 835

UM10360NXP SemiconductorsChapter 1: LPC17xx Introductory information4. Ordering informationTable 1.Ordering informationType numberPackageNameDescriptionVersionLQFP100plastic low profile quad flat package; 100 leads; body 14 14 1.4 mmSOT407-1LQFP80plastic low profile quad flat package; 80 leads; body 12 12 1.4 C1751FBD804.1 Part options summaryTable 2.Ordering options for LPC17xx partsType numberMax. PC1769FBD100120 MHz512 kB64 kByesDevice/Host/OTG2yesyes100 pinLPC1768FBD100100 MHz512 kB64 kByesDevice/Host/OTG2yesyes100 pinLPC1767FBD100100 MHz512 kB64 kByesnonoyesyes100 pinLPC1766FBD100100 MHz256 kB64 kByesDevice/Host/OTG2yesyes100 pinLPC1765FBD100100 MHz256 kB64 kBnoDevice/Host/OTG2yesyes100 pinLPC1764FBD100100 MHz128 kB32 kByesDevice2nono100 pinLPC1759FBD80120 MHz512 kB64 kBnoDevice/Host/OTG2yesyes80 pinLPC1758FBD80100 MHz512 kB64 kByesDevice/Host/OTG2yesyes80 pinLPC1756FBD80100 MHz256 kB32 kBnoDevice/Host/OTG2yesyes80 pinLPC1754FBD80100 MHz128 kB32 kBnoDevice/Host/OTG1noyes80 pinLPC1752FBD80100 MHz64 kB16 kBnoDevice1nono80 pinLPC1751FBD80100 MHz32 kB8 kBnoDevice1nono80 pinUM10360 1User manual NXP B.V. 2010. All rights reserved.Rev. 01 — 4 January 20107 of 835

UM10360NXP SemiconductorsChapter 1: LPC17xx Introductory informationARM sClock Generation,Power Control,Brownout Detect,and othersystem functionsFlashAcceleratorHigh Speed GPIOMultilayer AHB MatrixRSTTest/Debug InterfaceUSBinterfaceXtaloutJTAGinterfaceTrace ModuleEthernetPHYinterfaceTracePortXtalin5. Simplified block diagramFlash512 kBSRAM64 kBROM8 kBAHB toAPB bridgeAHB toAPB bridgeAPB slave group 0APB slave group 1SSP1SSP0UARTs 0 & 1UARTs 2 & 3CAN 1 & 2I2SI2C 0 & 1I2C2SPI0Repetitive InterruptTimerCapture/CompareTimers 0 & 1Capture/CompareTimers 2 & 3Watchdog TimerExternal InterruptsPWM1DAC12-bit ADCSystem ControlPin Connect BlockMotor Control PWMGPIO Interrupt CtlQuadrature Encoder32 kHzoscillatorReal Time ClockNote: shaded peripheral blockssupport General Purpose DMA20 bytes of backupregistersRTC Power DomainFig 1.LPC1768 simplified block diagramUM10360 1User manual NXP B.V. 2010. All rights reserved.Rev. 01 — 4 January 20108 of 835

UM10360NXP SemiconductorsChapter 1: LPC17xx Introductory information6. Architectural overviewThe ARM Cortex-M3 includes three AHB-Lite buses, one system bus and the I-code andD-code buses which are faster and are used similarly to TCM interfaces: one busdedicated for instruction fetch (I-code) and one bus for data access (D-code). The use oftwo core buses allows for simultaneous operations if concurrent operations target differentdevices.The LPC17xx uses a multi-layer AHB matrix to connect the Cortex-M3 buses and otherbus masters to peripherals in a flexible manner that optimizes performance by allowingperipherals on different slaves ports of the matrix to be accessed simultaneously bydifferent bus masters. Details of the multilayer matrix connections are shown inFigure 1–2.APB peripherals are connected to the CPU via two APB busses using separate slaveports from the multilayer AHB matrix. This allows for better performance by reducingcollisions between the CPU and the DMA controller. The APB bus bridges are configuredto buffer writes so that the CPU or DMA controller can write to APB devices withoutalways waiting for APB write completion.7. ARM Cortex-M3 processorThe ARM Cortex-M3 is a general purpose 32-bit microprocessor, which offers highperformance and very low power consumption. The Cortex-M3 offers many new features,including a Thumb-2 instruction set, low interrupt latency, hardware divide,interruptible/continuable multiple load and store instructions, automatic state save andrestore for interrupts, tightly integrated interrupt controller with Wakeup InterruptController, and multiple core buses capable of simultaneous accesses.Pipeline techniques are employed so that all parts of the processing and memory systemscan operate continuously. Typically, while one instruction is being executed, its successoris being decoded, and a third instruction is being fetched from memory.The ARM Cortex-M3 processor is described in detail in the Cortex-M3 User Guide that isappended to this manual.7.1 Cortex-M3 Configuration OptionsThe LPC17xx uses the r2p0 version of the Cortex-M3 CPU, which includes a number ofconfigurable options, as noted below.System options: The Nested Vectored Interrupt Controller (NVIC) is included. The NVIC includes theSYSTICK timer. The Wakeup Interrupt Controller (WIC) is included. The WIC allows more powerfuloptions for waking up the CPU from reduced power modes. A Memory Protection Unit (MPU) is included. A ROM Table in included. The ROM Table provides addresses of debug componentsto external debug systems.Debug related options:UM10360 1User manual NXP B.V. 2010. All rights reserved.Rev. 01 — 4 January 20109 of 835

UM10360NXP SemiconductorsChapter 1: LPC17xx Introductory information A JTAG debug interface is included. Serial Wire Debug is included. Serial Wire Debug allows debug operations using only2 wires, simple trace functions can be added with a third wire. The Embedded Trace Macrocell (ETM) is included. The ETM provides instructiontrace capabilities. The Data Watchpoint and Trace (DWT) unit is included. The DWT allows dataaddress or data value matches to be trace information or trigger other events. TheDWT includes 4 comparators and counters for certain internal events. An Instrumentation Trace Macrocell (ITM) is included. Software can write to the ITM inorder to send messages to the trace port. The Trace Port Interface Unit (TPIU) is included. The TPIU encodes and providestrace information to the outside world. This can be on the Serial Wire Viewer pin or the4-bit parallel trace port. A Flash Patch and Breakpoint (FPB) is included. The FPB can generate hardwarebreakpoints and remap specific addresses in code space to SRAM as a temporarymethod of altering non-volatile code. The FPB include 2 literal comparators and 6instruction comparators.8. On-chip flash memory systemThe LPC17xx contains up to 512 kB of on-chip flash memory. A new two-port flashmemory accelerator maximizes performance for use with the two fast AHB-Lite buses.This memory may be used for both code and data storage. Programming of the flashmemory may be accomplished in several ways. It may be programmed In System via theserial port. The application program may also erase and/or program the flash while theapplication is running, allowing a great degree of flexibility for data storage field firmwareupgrades, etc.9. On-chip Static RAMThe LPC17xx contains up to 64 kB of on-chip static RAM memory. Up to 32 kB of SRAM,accessible by the CPU and all three DMA controllers are on a higher-speed bus. Devicescontaining more than 32 kB SRAM have two additional 16 kB SRAM blocks, each situatedon separate slave ports on the AHB multilayer matrix.This architecture allows the possibility for CPU and DMA accesses to be separated insuch a way that there are few or no delays for the bus masters.UM10360 1User manual NXP B.V. 2010. All rights reserved.Rev. 01 — 4 January 201010 of 835

UM10360NXP SemiconductorsChapter 1: LPC17xx Introductory informationARM Cortex-M3D-codebusEMULATIONTRACE faceX32KinEthernet PHYinterfaceDebug PortX32KoutJTAGinterfaceXtalin10. Block diagramclock generation, CLKpower control, OUTand othersystem functionsVddvoltage ashAcceleratorFlash512 kBSRAM32 kBROM8 kBSRAM16 kBSRAM16 kBAHB toAPB bridgeMultilayerAHB MatrixDMACregsUSBregsHSGPIOEthernetregsAHB toAPB bridgeAPB slave group 0APB slave group 1SSP1SSP0UARTs 0 & 1UARTs 2 & 3CAN 1 & 2I2SI2C 0 & 1I2C2SPI0Capture/comparetimers 2 & 3Capture/comparetimers 0 & 1Repetitive interrupttimerWatchdog timerExternal interruptsPWM1DAC12-bit ADCSystem controlPin connect blockMotor control PWMGPIO interrupt controlQuadrature encoder32 kHzoscillatorReal Time ClockNote: shaded peripheral blockssupport General Purpose DMAVbat ultra-low powerBackup registersregulator(20 bytes)RTC Power DomainFig 2.LPC1768 block diagram, CPU and busesUM10360 1User manual NXP B.V. 2010. All rights reserved.Rev. 01 — 4 January 201011 of 835

UM10360Chapter 2: LPC17xx Memory mapRev. 01 — 4 January 2010User manual1. Memory map and peripheral addressingThe ARM Cortex-M3 processor has a single 4 GB address space. The following tableshows how this space is used on the LPC17xx.Table 3.LPC17xx memory usage and detailsAddress rangeGeneral UseAddress rang

For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors UM10360 LPC17xx user manual Revision history Rev Date Description 1 20100104 LPC17xx user manual revision. Modifications: “Draft” status removed. Editorial updates and typographical corrections throughout the user manual.

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