Stress Test Qualification For Automotive Grade Discrete Semiconductors
AEC - Q101 - REV - CJune 29, 2005STRESS TEST QUALIFICATIONFORAUTOMOTIVE GRADEDISCRETE SEMICONDUCTORSAutomotive Electronics CouncilComponent Technical Committee
AcknowledgmentAny document involving a complex technology brings together experience and skills from many sources.The Automotive Electronics Counsel would especially like to recognize the following significantcontributors to the development of the C revision to this document:Robert V. KnoellJeff S. PriceBrian JendroMark A. KellyWerner KanertArthur ChiangGary B. FisherJean ClaracJeff JarvisJeff ParkerJohn TimmsMark GabrielleMichael ClarkTed KruegerZhongning LiangVisteon Automotive SystemsDelphi CorporationSiemens VDO Automotive Electronics Corp.Delphi CorporationInfineonVishay-SiliconixJohnson ControlsSiemensUnited States ArmyInternational Rectifier Corp.MotorolaON SemiconductorJohnson ControlsVishay-General SemiconductorPhilips SemiconductorNOTICEAEC documents contain material that has been prepared, reviewed, and approved through the AECTechnical Committee.AEC documents are designed to serve the automotive electronics industry through eliminatingmisunderstandings between manufacturers and purchasers, facilitating interchangeability andimprovement of products, and assisting the purchaser in selecting and obtaining with minimum delay theproper product for use by those other than AEC members, whether the standard is to be used eitherdomestically or internationally.AEC documents are adopted without regard to whether or not their adoption may involve patents orarticles, materials, or processes. By such action AEC does not assume any liability to any patent owner,nor does it assume any obligation whatever to parties adopting the AEC documents. The informationincluded in AEC documents represents a sound approach to product specification and application,principally from the automotive electronics system manufacturer viewpoint. No claims to be inConformance with this document may be made unless all requirements stated in the document are met.Inquiries, comments, and suggestions relative to the content of this AEC document should be addressedto the AEC Technical Committee on the link http://www.aecouncil.com.Published by the Automotive Electronics Council.This document may be downloaded free of charge, however AEC retains the copyright on this material.By downloading this file the individual agrees not to charge for or resell the resulting material.Printed in the U.S.A.All rights reservedCopyright 2005 by Delphi Electronics & Safety, Siemens VDO, and Visteon Corporation. Thisdocument may be freely reprinted with this copyright notice. This document cannot be changed withoutapproval by the AEC Components Technical Committee.
AEC - Q101 - REV - CJune 29, 2005Automotive Electronics CouncilComponent Technical CommitteeTable of ContentsItemPageAEC- Q101 STRESS TEST QUALIFICATIONFOR AUTOMOTIVE GRADE DISCRETE SEMICONDUCTORS1Appendix 1 - Definition of a Qualification Family17Appendix 2 - Certification of Design, Construction and Qualification20Appendix 3 - Qualification Plan21Appendix 4 - Data Presentation Format22Appendix 5 - Minimum Parametric Test Requirements24Revision History25Attachments1. AEC-Q101-001Electrostatic Discharge Test - Human Body Model2. AEC-Q101-002Electrostatic Discharge Test - Machine Model3. AEC-Q101-003Wire Bond Shear Test4. AEC-Q101-004Miscellaneous Test Methods5. AEC-Q101-005Electrostatic Discharge Test – Capacitive Discharge Model
AEC - Q101 - REV - CJune 29, 2005Automotive Electronics CouncilComponent Technical CommitteeSTRESS TEST QUALIFICATIONFOR DISCRETE SEMICONDUCTORS1.SCOPE1.1DescriptionThis document defines minimum stress test driven qualification requirements and references testconditions for qualification of discrete semiconductors (e.g. transistors, diodes, etc.). This document doesnot relieve the supplier of their responsibility to meet their own company's internal qualification program.Additionally, this document does not relieve the supplier from meeting any user requirements outside thescope of this document. In this document, "user" is defined as any company developing or using adiscrete semiconductor part in production. The user is responsible to confirm and validate all qualificationand assessment data that substantiates conformance to this document.1.1.1PurposeThe purpose of this specification is to determine that a device is capable of passing the specified stresstests and thus can be expected to give a certain level of quality / reliability in the application.1.1.2Definition of Stress-Test QualificationAEC-Q101 Stress Test “Qualification” is defined as successful completion of the test requirementsoutlined in this document. The minimum temperature range for discrete semiconductors per thisspecification shall be -40oC to 125oC ambient, except the minimum range for all LEDs shall be –40oC to 85oC ambient. (Note: Some components may be derated to zero at the maximum temperature.)1.1.3Approval for Use in an Application"Approval" is defined as user approval for use of a part in the application. The user’s method of approvalis beyond the scope of this document.1.2Reference DocumentsCurrent revision of the referenced documents will be in effect at the date of agreement to the qualificationplan. Subsequent qualification plans will automatically use updated revisions of these referenceddocuments.1.2.1Military1.MIL-STD-750 Test Methods for Semiconductor DevicesPage 1 of 25
AEC - Q101 - REV - CJune 29, 2005Automotive Electronics CouncilComponent Technical Committee1.2.2Industrial1. UL-STD-94 Test for Flammability of Plastic Materials of Parts in Devices and Appliances.2. JEDEC JESD-22 Reliability Test Methods for Packaged Devices3. J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals andWires.4. J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State SurfaceMount Devices5. JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to ReliabilityTesting1.2.3AEC1.2.3.4.5.AEC - Q001 Guidelines for Part Average TestingAEC - Q101 - 001 ESD (Human Body Model)AEC - Q101 - 002 ESD (Machine Model)AEC - Q101 - 003 Discrete Component Wirebond Shear TestAEC - Q101 - 004 Miscellaneous Test MethodsUnclamped Inductive SwitchingDielectric IntegrityDestructive Physical Analysis6. AEC – Q101 – 005 ESD (Charged Device Model)1.2.4Other1. QS-90002. ISO-TS-169492.GENERAL REQUIREMENTS2.1ObjectiveSuccessful completion and documentation of the test results and the use of generic data fromrequirements outlined in this document allows the supplier to claim that the part is “AEC Q101qualified”. The supplier, in agreement with the user, can perform qualification at sample sizes andconditions less stringent than what this document requires. However, that part cannot be considered“AEC Q101 qualified” until such time that the unfulfilled requirements have been successfullycompleted.NOTE: This document does not include qualification requirements for Pb-free components. The nextrevision will include these requirements.Page 2 of 25
AEC - Q101 - REV - CJune 29, 2005Automotive Electronics CouncilComponent Technical Committee2.2Precedence of RequirementsIn the event of conflict in the requirements of this specification and those of any other documents, thefollowing order of precedence applies:1.2.3.4.5.The purchase orderThe individual device specificationThis documentThe reference documents in Section 1.2 of this documentThe supplier's data sheetFor the device to be considered a qualified part per this specification, the purchase order and/orindividual device specification cannot waive or detract from the requirements of this document.2.3The Use of Generic Data to Satisfy Qualification and Requalification RequirementsThe use of generic (family) data to simplify the qualification/requalification process is encouraged. Tobe considered, the generic data must be based on the following criteria:1. Component qualification requirements listed in Table 22. A matrix of specific requirements associated with each characteristic of the device andmanufacturing process as shown in Table 3.3. Definition of family guidelines established in Appendix 1.4. Represent a random sample of the normal population.Table 2 defines a set of qualification tests that must be considered for both new device qualificationsand requalification associated with a design or process change.Table 3 defines a matrix of appropriate qualification tests that must be considered for any changesproposed for the component. Table 3 is the same for both new processes and requalificationassociated with a process change. This table is a superset of tests that the supplier and user shoulduse as a baseline for discussion of tests that are required for the qualification/requalification inquestion. It is the supplier's responsibility to present and document rationale for why any of thehighlighted tests need not be performed.Appendix 1 defines the criteria by which components are grouped into a qualification family for thepurpose of considering the data from all family members to be equal and generically acceptable to thequalification of the device in question. With proper attention to these qualification family guidelines,information applicable to other devices in the family can be accumulated. This information can be usedto demonstrate generic reliability of a device family and minimize the need for device-specificqualification test programs. This can be achieved through qualification of a range of devicesrepresenting the “four corners” of the qualification family (e.g. highest/lowest voltage, largest/smallestdie, etc). Sources of generic data should come from supplier-certified test labs, and can include internalsupplier's qualifications, user-specific qualifications and supplier's in-process monitors. The genericdata to be submitted must meet or exceed the test conditions specified in Table 2. Table 1 providesguidelines showing how the available part test data may be applied to reducing the number of lotsrequired for qualification. Electrical characterization to the individual user device specification must beperformed for each device submission, generic characterization data is not allowed. The user(s) willbe the final authority on the acceptance of generic data in lieu of specific device test data.Page 3 of 25
AEC - Q101 - REV - CJune 29, 2005Automotive Electronics CouncilComponent Technical CommitteeTable 1: Part Qualification/Requalification Lot RequirementsPart InformationLot Requirements for QualificationNew device, no applicable generic data.Lot and sample size requirements per Table 2.A part in a family is qualified. The part to bequalified is less complex and meets the FamilyQualification Definition per Appendix 1.Only device specific tests as defined in section4.2 are required. Lot and sample sizerequirements per Table 2 for the required tests.A new part that has some applicable genericdata.Review Appendix 1 to determine required testsfrom Table 2. Lot and sample sizes per Table 2for the required tests.Part process change.Review Table 3 to determine which tests fromTable 2 are required. Lot and sample sizes perTable 2 for the required tests.Qualification/Requalification involving multiplesites.Refer to Appendix 1, section 3.Qualification/Requalification involving multiplefamilies.Refer to Appendix 1, section 3.2.4Test Samples2.4.1Lot RequirementsLot requirements are designated in Table 2, herein.2.4.2Production RequirementsAll qualification parts shall be produced on tooling and processes at the manufacturing site that will beused to support part deliveries at projected production volumes.2.4.3Reusability of Test SamplesDevices that have been used for nondestructive qualification tests may be used to populate otherqualification tests. Devices that have been used for destructive qualification tests may not be usedany further except for engineering analysis.Page 4 of 25
AEC - Q101 - REV - CJune 29, 2005Automotive Electronics CouncilComponent Technical Committee2.4.4Sample Size RequirementsSample sizes used for qualification testing and/or generic data submission must be consistent withthe specified minimum sample sizes and acceptance criteria in Table 2. If the supplier elects tosubmit generic data for qualification/requalification, the specific test conditions and results must bereported. Existing applicable generic data should first be used to satisfy these requirements andthose of section 2.3 for each test requirement in Table 2. Part specific qualification testing should beperformed if the generic data does not satisfy these requirements.2.4.5Pre- and Post-stress Test RequirementsAll pre and post stress test parts must be tested to the electrical characteristics defined in theindividual user device detail specification at room temperature.2.5Definition of Test Failure After StressingTest failures are defined as devices exhibiting any of the following criteria:1. Devices not meeting the electrical test limits defined in the first user's device specification orappropriate supplier generic device specification. Minimum test parametric requirementsshall be as specified in Appendix 5.2. Devices not remaining within 20% of the initial reading of each test (with the exception ofleakage limits which are not to exceed 10 times the initial value for moisture tests and 5times the initial value for all others) after completion of environmental testing. Devicesexceeding these guidelines must be justified by the supplier and approved by the user. Forleakages below 100 nA, tester accuracy may prevent a post stress analysis to initialreading.3. Any device exhibiting external physical damage attributable to the environmental test.If the cause of failure is agreed (by the manufacturer and the user) to be due to mishandling or ESD,the failure shall be discounted, but reported as part of the data submission.2.6Criteria for Passing Qualification / RequalificationPassing all appropriate qualification tests specified in Table 1, either by performing the tests(acceptance of zero failures using the specified minimum sample size) on the specific part ordemonstrating acceptable family generic data (using the family definition guidelines defined inAppendix 1 and the total required lot and sample sizes), qualifies the device per this document.Devices that have failed the acceptance criteria of tests required by this document require the supplierto satisfactorily determine root cause and corrective action to assure the user that the failuremechanism is understood and contained. The device shall not be considered as passing stress-testqualification until the root cause of the failure is determined and the corrective and preventive actionsare confirmed to be effective. New samples or data may be requested to verify the corrective action.If generic data contains any failures, the data is not usable as generic data unless the supplier hasdocumented corrective action or containment for the failure condition.Any unique reliability tests or conditions requested by the user and not specified in this documentshall be agreed upon between the supplier and user requesting the test, and will not preclude adevice from passing stress-test qualification as defined by this document.Page 5 of 25
AEC - Q101 - REV - CJune 29, 2005Automotive Electronics CouncilComponent Technical Committee2.7Alternative Testing RequirementsAny deviation from the test requirements and conditions listed in Table 2 are beyond the scope of thisdocument. Deviations (e.g. accelerated test methods) must be demonstrated to the AEC forconsideration and inclusion into future revisions of this document.3.QUALIFICATION AND REQUALIFICATION3.1Qualification of a New DeviceStress test requirements and corresponding test conditions for a new device qualification are listed inTable 2. For each qualification, the supplier must present data for ALL of these tests, whether it isstress test results on the specific device or acceptable generic family data. A review is to be made ofother parts in the same generic family to ensure that there are no common failure mechanisms in thatfamily. Justification for the use of generic data, whenever it is used, must be demonstrated by thesupplier and approved by the user. For each part qualification, the supplier must present Certificate ofDesign, Construction and Qualification to the requesting user. See Appendix 2.3.2Requalification of a Changed DeviceThe supplier will meet the user requirements for product/process changes.3.2.1Changes Requiring User Notification and/or RequalificationProcess changes include, but are not limited to:1. Location of a plant or production line in which fabrication, assembly or testing is to takeplace.2. Die size, metallization, cross-section, geometry or construction technique (e.g. waferstepping or re-design, but not including master mask restepping when no changes aremade).3. Device assembly process sequence, or final testing process program sequence orassembly/test equipment type.4. Materials and finishes used to manufacture the device internally or externally (e.g. dopanttype, lead frame material or plating, molding compound, etc.).5. Internal connection methods, including die or lead attach.6. Package sealing or encapsulation techniques in the specified packaging process; coatingor passivation techniques.7. Quality Assurance procedures that may affect the quality/reliability of the part.Page 6 of 25
AEC - Q101 - REV - CJune 29, 2005Automotive Electronics CouncilComponent Technical CommitteeAs a minimum, any change to the product, as defined above, requires performing the applicable testslisted in Table 2, using Table 3 to determine the requalification test plan. Table 3 will be used as aguide for determining which tests need to be performed or whether equivalent generic data can besubmitted for that test. A Qualification Plan agreement between the supplier and the user(s) withjustification for performing or not performing any recommended test shall occur before theimplementation of any requalification test plan.3.2.2Process Change NotificationThe supplier shall submit a projection to the users of all forecasted process changes. The projectionof any changes shall be submitted a minimum of six months in advance. Information required forsubmission to the user, for each change, shall include the following as a minimum:1.2.3.4.5.6.7.Benefit to the user (value, time and quality).For each user part number involved in the change, the following information is required:a) Supplier and user part numbersb) An estimated date of the last production lot of unchanged parts.c) An estimated final order date and final ship date of unchanged parts.d) A projected shipment date and date code of changed parts.A detailed description of the change in terms of the materials, processes, equipment,cosmetic or dimensional differences, characteristics, rating, circuit design, die size andwafer size, as applicable.Technical data and rationale to support the proposed changes.An electrical performance characterization comparison (between the new and originalproduct) of all significant electrical parameters over temperature extremes that could beaffected by the change. Changes in median and dispersion performance shall be notedeven though conformance to specification limits is still guaranteed. (Include F-Test, T-Test,or ANOVA comparisons, as needed.)The supplier shall submit an updated Certificate of Design, Construction and Qualificationalong with information required by this section (Section 3.2.2).The results of completed supplier requalification tests of the changed device(s).Items 1, 2, 3 & 4 are background information needed up front to evaluate the impact of the change onsupply and reliability and to come to agreement on a qualification plan acceptable to the supplier anduser. Items 5, 6 and 7 must be submitted prior to any final approval to implement any change on theuser's product.No changes shall be implemented without prior approval of the user.3.2.3Criteria for Passing RequalificationIt is the responsibility of each user to review the data, change notices, and supporting documentationto either qualify or not qualify the change based on the results of the tests performed. Additionally, thecriteria for passing qualification (Section 2.6) apply.3.2.4End User ApprovalA change may not affect a part's qualification status, but may affect its performance in an application.Individual user authorization of a process change will be required for that user's particularapplication(s), and this method of authorization is outside the scope of this document.Page 7 of 25
AEC - Q101 - REV - CJune 29, 2005Automotive Electronics CouncilComponent Technical Committee3.3Qualification Test PlanThe supplier is requested to initiate a discussion with each user (as needed) resulting in completion ofa signed Qualification Test Plan agreement as soon as possible after supplier selection for new parts,and at the time of notification (reference 3.2.2) prior to process changes. The Qualification Test Plan,as defined in Appendix 3, shall be used to provide a consistent method of documentation supportingwhat testing will be performed as required by Tables 2 & 3.4QUALIFICATION TESTS4.1General TestsTest details are given in Table 2. Not all tests apply to all devices. For example, certain tests applyonly to hermetically packaged devices, others apply only to power MOSFET devices, and so on. Theapplicable tests for the particular device type are indicated in the "Note" column and the "AdditionalRequirements" column of Table 2. The "Additional Requirements" column of Table 2 also serves tohighlight test requirements that supersede those described in the referenced test.4.2Device Specific TestsThe following tests must be performed on the specific device, i.e., family data is not allowed for thesetests:1. Electrostatic Discharge Characterization (Table 2, Test #11)2. Parametric Verification (Table 2, Test #4) - The supplier must demonstrate that the part is capableof meeting parametric limits detailed in the individual user device specification.4.3Data Submittal TypeData to be submitted to the user are classified in three types (Data Type column in Table 2):Data Type 1Data (generic or specific) from these tests should be formatted as defined inSection 4.4 and included in each qualification submission.Data Type 2Package specific data that should not be included with each qualificationsubmission (except where the package is new). In place of this data the suppliercan submit a "Document of Completion" that references successful completion ofthe specific test previously performed, provided no significant changes have beenmade. For Test #14 (Physical Dimensions) the Document of Completion should becompleted referencing the appropriate user packaging specification.For test 11 – Charged Device Model, small packages may not be able to holdenough charge to meet the specified discharge voltage. For these packages,perform the test once and, if there is insufficient charge, the supplier must insteadperform HBM and MM. The supplier must document that the package could nothold sufficient charge to perform the test.Data Type 3Re-qualification data should be included in the qualification submission as requiredby Table 3. These tests shall be considered by the supplier during re-qualificationplan development as useful tools to provide supporting rationale for new partqualification (including new packages) and/or process changes. It is the supplier'sresponsibility to present rationale for why any of these tests need not be performed.Page 8 of 25
AEC - Q101 - REV - CJune 29, 2005Automotive Electronics CouncilComponent Technical Committee4.4Data Submission FormatA data summary shall be submitted as defined in Appendix 4. Raw data and histograms shall besubmitted to the individual user upon request. All data and documents (e.g. justification for nonperformed tests, etc.) shall be maintained by the supplier in accordance with QS-9000 and/orTS-16949 requirements.Page 9 of 25
AEC - Q101 - REV - CJune 29, 2005Automotive Electronics CouncilComponent Technical Committee#StressAbrvDatatypeNoteTABLE 2 - QUALIFICATION TEST DEFINITIONSSample# ofAcceptReferenceSizelotson #(currentfailedper lotrevision)1Pre- and PostStress ElectricalTestTEST1NGAll qualification partstested per therequirements of theappropriate devicespecification.SMD qualificationparts for TC,AC,H3TRB &IOL/PTCAll qualification partssubmitted for testing253Note A02Pre-conditioningPC1GS3External VisualEV1NG4ParametricVerificationPV1N5High TemperatureReverse BiasHTRB1DGUVP771Note B06High TemperatureGate BiasHTGB1DGMUP771Note B0000Userspecification 22B-101Individual AECuserspecificationJESD22A-108JESD22A-108Page 10 of 25Additional RequirementsTest is performed as specified in the applicable stressreference at room temperature.Performed on surface mount devices (SMDs) prior to TC,AC, H3TRB & IOL/PTC stresses only. Use A113 SensitivityLevel 1. TEST before and after PC. Any replacement ofparts must be reported.Inspect device construction, marking and workmanship.Test all parameters according to user specification over thedevice temperature range to insure specificationcompliance.1000 hours at junction temperature TJ 150OC, or specifiedTJ(max) rating, with device reverse biased to 80% ofmaximum breakdown voltage specification. The ambienttemperature TA is to be adjusted to compensate for currentleakage. Can reduce duration to 500 hours throughincreasing TJ by 25OC, adjusting TA to compensate forcurrent leakage. TEST before and after HTRB as aminimum.1000 hours at junction temperature TJ 150OC, or specifiedTJ(max) rating, with gate biased at 100% of maximum gatevoltage rating indicated in the detail specification withdevice biased OFF. The ambient temperature TA is to beadjusted to compensate for current leakage. Can reduceduration to 500 hours through increasing TJ by 25OC,adjusting TA to compensate for current leakage. TESTbefore and after HTGB as a minimum.
AEC - Q101 - REV - CJune 29, 2005Automotive Electronics CouncilComponent Technical Committee#StressAbrvDatatypeNoteTABLE 2 - QUALIFICATION TEST DEFINITIONSSample# ofAcceptReferenceSizelotson #(currentfailedper lotrevision)7TemperatureCyclingTC1DGU771Note B0JESD22A-1048AutoclaveAC1CDGU7709High HumidityHigh Temp.Reverse BiasH3TRB1DGUV771Note B1Note BJESD22A-102JESD22A-1019altHighlyAcceleratedStress TestHAST1CDGUV771Note B0JESD22A-11010IntermittentOperational LifeIOL1DGTUWP771Note B0MIL-STD-750Method 103710altPower andTemperatureCyclePTC1DGTUW771Note B0JESD22A-1050Page 11 of 25Additional Requirements1000 cycles (TA minimum range of -55oC to maximumrated junction temperature, not to exceed 150ºC). Canreduce duration to 400 cycles using TA (max) 25OC overdevice maximum rated junction temperature. TEST beforeand after TC as a minimum.96 hours, TA 121oC, RH 100%, 15psig, TEST beforeand after AC.1000 hours at TA 85oC/85% RH with device reversebiased at 80% of rated breakdown voltage up to amaximum of 100V or limit of chamber. TEST before andafter H3TRB as a minimum.96 hours at TA 130oC/85%RH with device reverse bias at80% of rated voltage up to a voltage above which arcing inthe chamber will likely occur (typically 42V). TEST beforeand after 96 hours HAST.Tested per duration indicated in Timing Requirementstable on Page 13. TA 25oC. Devices powered to insure TJ 100oC (not to exceed absolute maximum ratings).TEST before and after IOL as a minimum.Perform PTC if TJ 100oC cannot be achieved with IOL.Tested per duration indicated for Timing Requirements inTable 2A. Devices powered and chamber cycled to insure TJ 100oC (not to exceed absolute maximum ratings).TEST before and after PTC as a minimum.
AEC - Q101 - REV - CJune 29, 2005Automotive Electronics CouncilComponent Technical CommitteeTABLE 2 - QUALIFICATION TEST DEFINITIONSSample# ofAcceptReferenceSizelotson #(currentfailedper zationESD1(HBM,MM)2(CDM)D30 D2NG301Note B1014TerminalStrengthResistance 4)10Note BItems 16 through 19 aresequential tests for hermeticpackages. (See note H onLegend page.)00Additional RequirementsAECQ101-001, 002and 005Supplier must perform at least two of the referenced ESDmodels through the end of 2005. CDM will be required asone of the two selected models as of 2006. For CDM, smallpackages may not be able to hold enough charge to meetthe specified discharge voltage. For these packages,perform the test once and, if there is insufficient charge,the supplier must instead perform HBM and MM. Thesupplier must document that the package could not holdsufficient charge to perform the test. See attachedprocedure for details on how to perform the test. TESTbefore and after ESD.AEC-Q101-004 Random sample of devices that have successfullySection 4completed H3TRB or HAST, and TC.JESD22B-100MIL-STD-750Method 2036JESD22B-107MIL-STD-750Method 2006JESD22B-103JESD22B-104JESD22A-109Page 12 of 25Verify physical dimensions to the applicable user devicepackaging specification for dimensions and tolerances.Evaluate lead integrity of leaded devices only.Verify marking permanency. (Not required for laser etchedparts or parts with no marking.)Y1 plane only, 15K g-force. TEST before and after CA.Use a constant displacement of 0.06 inches (doubleamplitude) over the range of 20Hz to 100 Hz and a 50gconstant peak acceleration over the range of 100 Hz to 2KHz. TEST before and after VVF.1500 g's for 0.5mS, 5 blows, 3 orientations. TEST beforeand after MS.Fine and Gross leak test per individual user specification.
AEC - Q1
The Automotive Electronics Counsel would especially like to recognize the following significant contributors to the development of the C revision to this document: Robert V. Knoell Visteon Automotive Systems Jeff S. Price Delphi Corporation Brian Jendro Siemens VDO Automotive Electronics Corp. Mark A. Kelly Delphi Corporation
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1.4 importance of human resource management 1.5 stress management 1.6 what is stress? 1.7 history of stress 1.8 stressors 1.9 causes of stress 1.10 four major types of stress 1.11 symptoms of stress 1.12 coping with stress at work place 1.13 role of human resource manager with regard to stress management 1.14 stress in the garment sector
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