The NASA Electronic Parts And Packaging (NEPP) Program - Parts .
The NASA Electronic Parts and Packaging(NEPP) Program –Parts, Packaging, and Radiation ReliabilityResearch on ElectronicsKenneth A. LaBelMichael J. v301-286-9936301-614-6233Co- Managers, NEPP esented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.Outline Overview of NEPP–––– What We Do and Who We AreFlight ProjectsTechnologyWorking With OthersRecent HighlightsPlans for FY13gChallengesSummaryPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.2Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components ConferenceESCCON 2013, Noordwijk, NE, March 12-14, 2013, and published on http://nepp.nasa.gov/.1
NEPP – What We Do NEPP provides two prime functions for NASA– Assurance infrastructure for NASA– Research on advanced/new electronic devices and technologies We work with– Active and passive semiconductors– Electronic device packaging– Radiation effects on electronics We collaborate with others in technical areas suchas––––WorkmanshipAlert systemsStandards development and maintenanceE iEngineeringiandd technologyh ldevelopmentdl We provide an independent view for the safe useof electronic integrated circuits for NASAElectrical overstress failurein a commercial electronic devicePresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.3NEPP’s Two Functions Assurance– Customer: Space systems indesign and development– Issues applicable tocurrently availabletechnologies (aka, maturetechnologies)– Examples Cracked capacitors Power converter reliability– NASA Electronic Partsp (NEPAG)()Assurance Groupa subset of NEPP Communication infrastructure Audit and review support Investigation into reportedfailures (when of potential widereaching impact to NASA flightprojects) Advanced/new electronicstechnology research– Customer: Space systems inearly design orconceptualization– Issues applicable to newtechnologies (or those withpotential Mil/Aero applicability)– Examples Commercial fieldprogrammable gate arrays(FPGAs) Sub 32nm electronics– Technology evaluation– Development of test methodsand qualificationrecommendationsPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.4Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components ConferenceESCCON 2013, Noordwijk, NE, March 12-14, 2013, and published on http://nepp.nasa.gov/.2
The NEPP Program in a NutshellManagementCoreElementsKen LaBel EngineeringMike Sampson AssuranceRadiation EffectsAdvanced ActivesNEPP alAreaAArraysGuidelinesSpecificationsand ivesMemoriesDiscretesWebsite ContentNASA Parts Selection ListTest encyFiberOpticsInterconnectsProgrammableL edgTechnologiesSystemson a Chip(SOC)TechnicalReportsBodies of KnowledgeConferencePapersPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.5NASA EEE Parts Assurance Group(NEPAG) Formed in 2000 Weekly Telecons– Typical participation 35– Share knowledge andexperience– Address failures,requirements, testmethods– Monthly international Audit support Coordinate specificationand standards changesPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.6Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components ConferenceESCCON 2013, Noordwijk, NE, March 12-14, 2013, and published on http://nepp.nasa.gov/.3
Hermeticity Correlation Study MIL-STD-750, Test Method (TM) 1071.8 tightened theleak rate limits for transistors and diodes– Change successfully fixed inconsistent Internal Gas Analysisresults and improved package integrityKr85 Bomb Station– Traditional helium mass spectrometersp(HMS)() were not capablepof testing reliably to the tighter limits– New piece of equipment, the Cumulative Helium Leak Detector(CHLD) was added to 1071.8 – it is capable– Most manufacturers are using Krypton 85 (Kr85) radioactivetracer gas method– Optical Leak Testing (OLT) is also allowed for TM 1078.1– No correlation study for Kr85, CHLD or OLTCHLD System– HMS to Kr85 study done 40 years agoOLT System Space users want to tighten MIL-STD-883,TM 1014 but manufacturers opposed– NASA has HMS, CHLD (2) and Kr85 and has been doinga “round robin” comparison to support our case– OLT equipment manufacturer willing to support effortPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.7NEPP and NASA Flight ProjectsNEPPFlight Projects Works general devicequalification standardsq Develops theknowledge-base onHOW to qualify a deviceused by flight projects Work mission specificrequirementsq Qualify a device tomission requirementsor to a standard– Test methods– Failure modeidentification– User guidelines andlessons learned Works issues that arerelevant across NASA– Uses NEPP knowledge toperform qualification Work issues relevant toa specific projectNEPP provides products foruse by flight projectsPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.8Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components ConferenceESCCON 2013, Noordwijk, NE, March 12-14, 2013, and published on http://nepp.nasa.gov/.4
Qualifying Electronic TechnologiesNEPP Perspective Electronics in space face hazardssignificantly beyond theterrestrial/commercial environment Qualification requires repeatableand statisticallstatistically significant testingover relevant environments toensure mission success NEPP provides the basis forunderstanding the “how to” forelectronics qualification Is this needed for commercialdevices?Shock/VibrationIonizing RadiationLong Lifetime/No ServicingElectronics SpaceQualificationVacuum– Previous independentreview/testing has repeatedlyshown discrepancies betweenindustry claims versus independenttest results that impact reliableusage in spaceThermalPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.9Maturity of Technology –The NEPP Model NASA flight project timelines areinsufficient to learn how to qualify anew technologyt h ldeviced iNEPAGinterestrange– Sufficient time may exist to qualify adevice, but not to determine HOW toqualifyNEPPinterestrange For 2016 launch, technology freezedates are typically 2013 or earlier Technology development andevaluation programs need to be inplace prior to mission design– NEPP’s strategic advanced planningon technology evaluation is critical toallow timely and safe flight projectinsertion of new technologiesNASA Technology ReadinessLevels (TRLs)Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components ConferenceESCCON 2013, Noordwijk, NE, March 12-14, 2013, and published on http://nepp.nasa.gov/.5
Sample NEPP Technology ChallengesKey Question: Can we “qualify” without high cost and schedule?Silicon- 32 nm CMOS- new materials such ascarbon nanotubes (CNTs)- FINFETs- 3D integrated circuits (ICs)Device ArchitecturesPackages-system on a chip-interconnects-power distribution-highhi h frequenciesfi-application specific results-inspection-lead free-failure analysis-stackingConnectorsPassives-higher-speed, lower noise-serial/parallel-ruggedized, electro-optic-embedded-higher performance-Base metal electrode(BME) capacitorsPower ConversionBoard Material-widebandgap devices-distributeddistributed architecture-thermal modeling-stabilityRelated areas(non-NEPP)-thermalthl coefficientsffi i t-material interfacesDesign Flows/ToolsWorkmanship-programming algorithms, application-design rules, tools, simulation, layout-hard/soft IP instantiation-inspection, lead free-stacking, double-sided-signal integrityPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.Sharing NEPP Knowledge NEPP success is based on providing appropriateguidance to NASA flight projects– Interaction with the aerospace community, other governmentagencies, universities, and flight projects is critical. NEPP utilizes– NEPP Website: http://nepp.nasa.gov– NEPP 4th Annual Electronics Technology Workshop (ETW):Week of June 10th 2013 HiREV (National High Reliability Electronics Virtual Center)Review Meetingg to be held in conjunctionj– Standards working groups– Telecons (NEPAG weekly and monthly international)– Documents such as Guidelines, Lessons Learned, Bodies ofKnowledge (BOKs)Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.12Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components ConferenceESCCON 2013, Noordwijk, NE, March 12-14, 2013, and published on http://nepp.nasa.gov/.6
Collaboration “Promote enhanced cooperation withinternational, industry, other U.S. governmentagency, and academic partners in the pursuit ofour missions.” – Charles Bolden,, NASA Administrator NEPP has a long history of collaboration.Examples include:– Direct funding and in-kind (no funds exchanged)support from DoD– Multiple universities Vanderbilt, Georgia Tech, U of MD, Auburn University, – Electronics manufacturers too numerous to mention!– International with major non-US government agencies We work with the NASA flight programs,but do not perform mission specific tasksPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.13Consortia and Working Groups NEPP realizes the need to work in teams toprovide better and more cost-effective solutions NEPP utilizes working groups for informationexchange and product development– External examples: JEDEC* commercial electronics and TechAmerica G11/12Government Users– Internal (NASA-only) examples: DC-DC converters, point-of-load convertors, GaN/SiC, andconnectors NEPP supports university-based research whenfunds allow*formerly known as the Joint Electron Devices Engineering Council (JEDEC)Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.14Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components ConferenceESCCON 2013, Noordwijk, NE, March 12-14, 2013, and published on http://nepp.nasa.gov/.7
NEPP Recent Highlights (1 of 2) Continued leading Qualified Manufacturer’s List(QML) MIL-PRF-38535 Class Y development Released documents:– Single-event effects (SEE) Test Guideline for FPGAs Firsts and significant results– 1st data on helium leak intercomparison study– Base metal electrode (BME) reliability data – positiveresults– Combined radiation/reliability tests of GaN devices,DDR-class and Flash memories– RadiationR di ti testst t off 28nm TriGate processor (proprietary data) 32nm SOI processor (AMD) IPad generation 4– Destructive SEE observed on Schottky Diodes– Independent SEE test of Xilinx Virtex-5QVPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.15NEPP Recent Highlights (2 of 2) 3rd NEPP Electronics Technology Workshop (ETW) June 2012– 2.5 days of presentations– 250250 attendees including 50% via the web Assurance Efforts– Cracked capacitor evaluation Recent test focuses (on-going)– Power devices GaN, SiC, and Si Power Device (radiation and combined effects)– FPGAs Xilinx Virtex-5QV and Commercial Virtex-5 (radiation)– Underfill (reliability)– Point-of-load (POL) ConvertersPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.16Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components ConferenceESCCON 2013, Noordwijk, NE, March 12-14, 2013, and published on http://nepp.nasa.gov/.8
NEPP – Radiation Highlight (1) Total dose and dose rate evaluations were performed on a AMDstate-of-the-art processor (fabrication: 32nm CMOS SOI technologyfrom Dresden, Germany).U.S. International Traffic in Arms Regulations (ITAR) criteria wereused as a metric with the processor device tolerance exceedingthese levels.AMD A4-3300 series microprocessor Total dose results: NO processor failures observed (1,4(1 4 and 17Mrad(Si), respectively). “17” is NOT a typo. Failures observed on peripheral devices on motherboard as low as 1.1krad(Si)Dose rate: no latchup observed. Upset observed on processor aboveITAR levels. Motherboard peripherals (graphics) upset at levelsbelow ITAR.Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.17NEPP – Radiation Highlight (2)) Initial radiation testing of 4th generation IPad - a test to simulateradiation exposure for true 100% commercial off the shelf (COTS)systems (i.e., very limited knowledge of electronics) Preliminary total dose testing performed on devices in standby modeandd “on”“ ” followedf lld byb a suiteit off “app”“” testst t forf video,idaudio,di globall b lpositioning system, etc Initial failures between 2 and 8 krad(Si) on battery charging circuitryDisplay image degrades until unusable at 10 krad(Si)Processor appears to be fully functional at these low TID levels– Proves the adage that COTS will have a wide range of radiationfailure levels depending on technology and functionPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.18Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components ConferenceESCCON 2013, Noordwijk, NE, March 12-14, 2013, and published on http://nepp.nasa.gov/.9
Non-hermetic IC Package,with “Space” Features (CCGA?)(ceramic column grid array)Substrate andSn/Pb ColumnGrid ArrayCoverDieCapacitor,R i t etc.ResistortUnderfillSpace ChallengeFlip Chip DieBump“Enclosed”PackageOptionSome DefensesVacuumLow out/off-gassing materials. Ceramics vs polymers.Shock and vibrationCompliant / robust interconnects - wire bonds, solder balls, columns, conductive polymerThermal cyclingCompliant/robust interconnects, matched thermal expansion coefficientsThermal managementHeat spreader in the lid and/or substrate, thermally conductive materialsThousands of interconnectsProcess control, planarity, solderability, substrate designLow volume assemblyRemains a challengeLong lifeGood design, materials, parts and process controlNovel hardwareTest, test, testRigorous test and inspectionTestability and inspectability will always be challengesPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.19NEPP Task Focuses – FY13 Goals: Develop guidelines for qualification andradiation testing–––––Class Y Qualification (non-hermetic area array)Flash Memory Qualification (reliability)Flash Memory Testing (radiation) – in final reviewSolid State Recorder (radiation) – in final reviewDDR-class Memory (reliability) Evaluate state-of-the-art commercial electronics(reliability, radiation)–––––Memories, FPGAs, SOC ProcessorsXilinx Virtex-7Sub-32nm CMOSIpad BME CapacitorsCourtesy eetimes.comPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.20Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components ConferenceESCCON 2013, Noordwijk, NE, March 12-14, 2013, and published on http://nepp.nasa.gov/.10
What Determine the Reliability of a X7RMulti-Layer Ceramic Capacitor (MLCC)?Microstructure ParameterAverage Grain Size rDielectricThickness d Important microstructure parameter of a single-layercapacitor: Number of stacked grains per dielectric layerPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.21Case Studies: High-Performance BME MLCCsThin Dielectric BMED08X10425 (PME)C08X22516 (BME)B12X68316 (BME)N2003025064d ( m)1.0020.23.856.29ā ( 00.0000%100.0000%99.9800%99.9999%99.9999%99.9997%y can be empiricallypy estimated usingg onlyy MLCC reliabilitymicrostructure and construction parameters N, d, ā, and The microstructure parameters for thin dielectric BME MLCCswere based on an Intel report. Structural parameters for all other MLCCs were experimentallydetermined.Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.22Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components ConferenceESCCON 2013, Noordwijk, NE, March 12-14, 2013, and published on http://nepp.nasa.gov/.11
Base Metal Electrode (BME) Ceramic CapacitorOverview BMEs represent a commercial technology. Not all BME capacitorscan be qualified for high-reliability applications. A minimum dielectric thickness requirement that has been used forhigh-reliabilitymaking highreliability PME capacitors is not applicable to BMEcapacitors. BME capacitors have more complicated structures thanPME capacitors: Dielectric thickness d is extremely thin; Grain size varies from 0.5 m down to 0.1 m.The reliability of a BME MLCC has been found to be directly related totthee microstructurec ost uctu e paa ete N (# oe ect c layers)aye s)parameterof ddielectricand Number of dielectric layers N in a BME capacitor is extremely high;(# of stacked grains per dielectric layer).A reliability model regarding the microstructure of a BME MLCC isdeveloped and has been applied to screen the BME capacitors withpotential reliability concerns.Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.23BME Ceramic Capacitors with C0G Dielectric C0G (or NP0) type MLCCs are characterized bycapacitance almost independent from temperature (TCC 30ppm from -55oC to 125oC) and frequency These BME C0G ceramic capacitors are made using aCaZrO3-based dielectric and Ni electrodes (K 32) Dielectric aging is negligible! The dielectric is non-ferroelectric and with zero VCC andno piezoelectric effect (non-ferroelectric material) Excellent candidate for impedance match, RF tuning,temperature compensation, and possible CPU/ICdecouplingPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.24Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components ConferenceESCCON 2013, Noordwijk, NE, March 12-14, 2013, and published on http://nepp.nasa.gov/.12
Excellent Microstructures Cross-section scanning electron microscopephotos reveal an excellent microstructure withdense,uniformgraindifi structurett CaZrO3-based dielectric is highly reduction-robust(no oxygen vacancy concerns) Very good processing compatibility between nickelelectrode and dielectric material25Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.High Capacitance Per Volume020104020603080512061210Max Cap for BME C0G (pF, 25V)EIA Chip Size100 pF2,20015,00047,000100,000220,000Max Cap per PME X7R (pF, 50V)N/A3,90022,00082,000220,000390,000 Chart compares capacitance between commercially availableBME C0G at 25V and PME X7R at 50V The precious metal electrode (PME) data are from GSFCDocument S-311-P-829C (1/2010) which allows the use of PMEcapacitors with small chip size and lower rated voltage.However, 50% voltage de-rating is still applicable. The BME C0G MLCCs can reach 50% capacitance that asame chip size PME X7R can provide (after de-rating)Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.26Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components ConferenceESCCON 2013, Noordwijk, NE, March 12-14, 2013, and published on http://nepp.nasa.gov/.13
Excellent Reliability PerformanceDielectric Strength of C0G BME Capacitors99.999.0at 1000 hoursRated Voltage 10V90.090.0Normalizzed Percentile (%)Specified: 1.67E10 (Ohm)10.0at 4000 hours5.0at 2000 hours1.00.50.11.0E 101.0E 111.0E 121.0E 13Cumulative Faiilure Percentile 05.01.05.0Insulating Resistance at 25C (ohm)10.0100.0500.0DC Voltage (V) A 4000-hour life test did not reveal any failures Insulating resistance was more than 10 times greater than MIL-PRF123 requirement, both at 2525 CC and at 125125 CC No dielectric wearout failures were generated when the capacitorswere tested under accelerated stress conditions as high as 175 C and500V for a group of 50 C0G BME capacitors DC breakdown voltage is at least 20 times greater than the ratedvoltagePresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.27SummaryThis low-cost,, commerciallyy available BMEcapacitor with a CaZrO3-based C0G dielectric isone of a few existing commercial products thatcan significantly exceed the NASArequirements for high-reliability spaceapplications and that can be directlyrecommended for use in NASA flight projects!Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.28Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components ConferenceESCCON 2013, Noordwijk, NE, March 12-14, 2013, and published on http://nepp.nasa.gov/.14
Sample NEPP Areas – Radiation EffectsCore Areas are Bubbles;Boxes underneath are variabletasks in each coreLegendDoD and NASA fundedNASA-only fundedUnfunded in FY13NEPP RResearchhCCategoriesti – ActiveA ti ElectronicsEl ti (1 off 2)SiGe.Mixed SignalScaledCMOSCommercial DevicesIBM 9hpSensorTechnologiesTest StructuresIRSilicon on Insulator (SOI)Memories –Non-volatile, volatileUltra-low ppowerSiGe PhysicsModelingAdvancedData Conversion,Amplifiers, DriversArchitecturalcomparisonBelow 32nmCNTsStructured ASICSRHBD SupportSiGeExotic-dopedFiber componentsCryoy SELPartners include:DoD, IBM, TI, Intel, Boeing,Aeroflex, Xilinx, MicrosemiLow pproton energygyCompact model basedrate predictionWavelength DivisionMultiplexingPartners at:AFRL, Cypress, BallDevelops students atGeorgia Tech32 and 45 nm CMOSFiber AmplifiersVisibleOthersFPGAsProcessors, SOCsPerformanceToolsPhotonicsFree spaceOptical interconnectsFiber Data LinksOptocouplersand PM OptocouplersDevelopsstudentsat VanderbiltPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.29Estimated Test/Parts Costs Normalizedto FY9860Relative Cost50403020100FY98FY99 FY00FY01FY02FY03 FY04FY05FY06FY07 FY08FY09FY10FY11 FY12FYCost of highest priced flight partCost of comprehensive radiation/reliability tests on most expensive partBottom line:Test costs have risen significantly, unfortunately NEPP budget hasn’t!Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components ConferenceESCCON 2013, Noordwijk, NE, March 12-14, 2013, and published on http://nepp.nasa.gov/.15
Disclaimer:Statistics and “Radiation Qualification”Device Under Test (DUT)Single Event Effect Test Matrixfull generic testingAmount36843333Commercial 1 Gb SDRAM-68 operating modes-can operate to 500 MHz-Vdd 2.5V external, 1.25V internalItemNumber of SamplesM odes of OperationTest PatternsFrequencies of OperationPower Supply VoltagesIonsHours per Ion per Test M atrix Point66096Hours2754Days7.54YearsDoesn’t include temperature variations!!!Devices/technology are more complex: testing is as wellPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.Budget Challenges for FY13 The NEPP Program had a significant budget cutin FY13 Reduction in efforts from FY12:– Areas unfunded or very limited in FY13 include PhotonicsSensors/imagersMixed signal electronicsCommercial systemsUniversity grants (research)– Fewer technology evaluations/tests– Commodities expertise at risk– Travel reduction impacts number of audits and meetingssupportedPresented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.32Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components ConferenceESCCON 2013, Noordwijk, NE, March 12-14, 2013, and published on http://nepp.nasa.gov/.16
Summary NEPP is an agency-wide program that endeavorsto provide added-value to the greater aerospacecommunity.– Always looking at the big picture (widest potential spaceuse of evaluated technologies),– Never forgetting our partners, and,– Attempting to do “less with less” (rising test costsversus NEPP budget reduction). We invite your feedback and collaboration andinvite you to visit our website(http://nepp.nasa.gov) and join us at our annualmeeting in June at NASA/GSFC or via the web. Questions?Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components Conference ESCCON 2013, Noordwijk, NE,March 12-14, 2013, and published on http://nepp.nasa.gov/.33Presented by Kenneth A. LaBel and Michael J. Sampson at 16602-13 - European Space Components ConferenceESCCON 2013, Noordwijk, NE, March 12-14, 2013, and published on http://nepp.nasa.gov/.17
Electronic Parts Advanced Information Lead-free Systems on a Chip (SOC) Extreme Environments Core Elements Effects Parts Reliability Assurance (NEPAG) Packaging Dissemination Focus Technologies Scaled CMOS Sensor Technology Fiber Optics Radio Frequency Memories Power Devices SiGe Mixed Signal Area A
Silat is a combative art of self-defense and survival rooted from Matay archipelago. It was traced at thé early of Langkasuka Kingdom (2nd century CE) till thé reign of Melaka (Malaysia) Sultanate era (13th century). Silat has now evolved to become part of social culture and tradition with thé appearance of a fine physical and spiritual .
May 02, 2018 · D. Program Evaluation ͟The organization has provided a description of the framework for how each program will be evaluated. The framework should include all the elements below: ͟The evaluation methods are cost-effective for the organization ͟Quantitative and qualitative data is being collected (at Basics tier, data collection must have begun)
̶The leading indicator of employee engagement is based on the quality of the relationship between employee and supervisor Empower your managers! ̶Help them understand the impact on the organization ̶Share important changes, plan options, tasks, and deadlines ̶Provide key messages and talking points ̶Prepare them to answer employee questions
Dr. Sunita Bharatwal** Dr. Pawan Garga*** Abstract Customer satisfaction is derived from thè functionalities and values, a product or Service can provide. The current study aims to segregate thè dimensions of ordine Service quality and gather insights on its impact on web shopping. The trends of purchases have
On an exceptional basis, Member States may request UNESCO to provide thé candidates with access to thé platform so they can complète thé form by themselves. Thèse requests must be addressed to esd rize unesco. or by 15 A ril 2021 UNESCO will provide thé nomineewith accessto thé platform via their émail address.
Chính Văn.- Còn đức Thế tôn thì tuệ giác cực kỳ trong sạch 8: hiện hành bất nhị 9, đạt đến vô tướng 10, đứng vào chỗ đứng của các đức Thế tôn 11, thể hiện tính bình đẳng của các Ngài, đến chỗ không còn chướng ngại 12, giáo pháp không thể khuynh đảo, tâm thức không bị cản trở, cái được
Food outlets which focused on food quality, Service quality, environment and price factors, are thè valuable factors for food outlets to increase thè satisfaction level of customers and it will create a positive impact through word ofmouth. Keyword : Customer satisfaction, food quality, Service quality, physical environment off ood outlets .
More than words-extreme You send me flying -amy winehouse Weather with you -crowded house Moving on and getting over- john mayer Something got me started . Uptown funk-bruno mars Here comes thé sun-the beatles The long And winding road .
