Leica EM RES102 - Labsoft

Leica EM RES102Ion Beam Milling Systemfor TEM, SEM and LM preparation

ION BEAM MILLINGIn recent years, ion milling has been developed into the mostFor TEM sample preparation a low ion incidence with respectapplicable method of sample preparation for the analysis ofto the sample surface polishes the sample until it is electroninorganic material. The ion beam milling method uses hightransparent.energy ion bombardment to remove material or modify thesurface of a sample. The ions are generated by an ion gunSurface modification for SEM samples, for example, can be(in a high vacuum) toward the sample, which is orientated sorealized with higher milling angles up to 90 . This includesthe surface is bombarded at an angle.surface cleaning, polishing and contrast enhancement.

LEICA EM RES102 – ION BEAM MILLING SYSTEM3Unique SolutionThe Leica EM RES102 is a unique ion beam milling device that has two saddlefield ionsources with variable ion energy for optimum milling results. Like no other instrumenton the market, it accommodates the preparation of TEM, SEM and LM samples in onesingle benchtop unit. In addition to high-energy milling, the Leica EM RES102 can beused for very gentle sample processing using low ion energy.TEM SAMPLESSEM or LM SAMPLES› Single-sided or double-sided low angle milling for uniform ion› Ion beam polishing of surfaces up to 25 mm in diameter withmilling of materials. The saddle-field ion sources can preparea large electron-transparent area of the sample.› Program-controlled alternating milling angles of the ionsources are used to fulfill special sample preparation tasks,e.g. FIB cleaning, to reduce amorphizised layers.the highest possible surface finish› Surface cleaning of contaminated samples or the removal ofsmearing effects after mechanical polishing› Contrast enhancement of sample surfaces instead ofchemical etching› 35 slope cutting for cross-sectioning of layered materials› 90 slope cutting for cross-sectioning of structuredsemiconductor material and packaging with minimalmechanical pre-preparation work loadKEY FEATURES› One single benchtop unit for TEM, SEM and LM sample preparationn› External control of the milling process via LAN› Preparation of samples up to 25 mm diameter› Fully computer-controlled milling parameters

4TEM, SEM or LM preparation –a matter of choiceTo support the diverse range of application possibilities, the Leica EM RES102 can beequipped with a variety of sample holders for the preparation of TEM, SEM and LMsamples. The load-lock system provides high sample throughput with fast sample exchange.SEMSample holder for the cleaning, polishing and contrastenhancement of SEM and LM samples at environmenttemperature or with LN2 cooling. The SEM holder allows you toprepare a sample size up to 25 mm diameter. An adapter isavailable to clamp commercially available SEM stubs with a3.1 mm diameter pin.SEMSlope cutter holder for the production of cross-sectioned (90 )and angled sections (35 ) for SEM investigation of verticalstructured samples. Specimens can be prepared at environment temperature or with LN2 cooling.

LEICA EM RES102 – ION BEAM MILLING SYSTEMSEM clampSEM holder to hold small sampleswith maximal dimensions of 5(H) x 7(W) x2(T)mm.Thisholdercansmallbe easilytransferClampholderto holdsampleswith maximum dimensionsred tooftheSEMwithoutremovingthe5 (H) 7 (W) 2 (D) mm. This holdersampis easily transferredle. directly to the SEM without removing the sample.TEMSample holder (Quick clamp holder) for single and double-sidedlow angle milling down to 4 .TEM Sample Holder (Quick Clamp Holder)for single and double-sided low angle millingdown to 4 .TEMCooling holder for the preparation of temperature-sensitivesamples in combination with the LN2 cooling device.FIBCleaning holder used to reduce the amorphisized layer of a FIBsample.5

6Your BenefitsLeica EM RES102 can thin, clean, cross section, polish and provides contrastenhancement with the highest level of flexibility for the user.EASY OPERATIONEFFECTIVE AND COST EFFICIENTSAVE› PC control unit with 19” touch screen› One system for TEM, SEM and LM› Precise automatic termination featurefor process monitoring and controllingapplicationswith optical image processing orFaraday cup for light transparent› Integrated applications library› Improved effectiveness in TEM samplesamplespreparation by large electron› Programmable process parameterstransparent area of TEM samplesaccelerate the learning curve ofbeginners› Storage of live images and videos fordocumentation of the milling process –› SEM preparation of samples up to25 mm diameterto provide the maximum documentationmaterial› Help files for beginners and maintenance› Reduced holding time due to Load-lock› Fully program controlled motorized ionsystem for rapid sample transfer andsource and sample movements forpermanent high vacuumreproducible results› LAN capability for external operationand monitoring› LN2 sample stage cooling to keeptemperature sensitive specimens underthe optimum conditions for milling

LEICA EM RES102 – ION BEAM MILLING SYSTEM7TEM image of X5CrNi8Gold wire bonds after ion beam polishingOil Shale at the rim of 25 mm diameter after ion beam polishingSTEM images of a Ti film that has been ion beam milled at an angle of 6 Solder ball after ion beam polishingHRTEM image of SiTiO3 after FIB cleaning

8SpecificationsION SOURCEIon gunTwo saddle-field gun with large area milling propertiesIon energy0.8 keV to 10 keVSource currentUp to 4.5 mA (per ion source)Ion current density 1 mA/cm2 at 8 kV/3 mA (per ion source)FWHM0.8 mm (at 10 keV), 2.5 mm (at 2 keV)Gas usedArgon (Ar 5.0)Incoming pressure 500 mbarGas flow 1 sccm/ion source with automatic controlMOTORIZED ANGLE SETTINGS (PC CONTROLLED)Gun tilting– Gun 1 45 (0.1 setting accuracy)– Gun 2 45 (0.1 setting accuracy)Sample holder tilting–120 to 210 (0.1 setting accuracy)Milling angle range–90 to 90 (dependent on the sample holder)SAMPLE MOVEMENTS (PC CONTROLLED)Rotation0.6 to 10 rpmOscillationUp to 360 , in 1 stepsZero point set upIn 1 stepsIn x direction 5 mm, 0.1 mm accuracyTilting–120 to 210 SAMPLE HOLDERS (DIMENSIONS)Sample size SEM holdermax. Ø 25 mm 12 mmPrepared area SEM holdermax. Ø 25 mmSample size TEM and FIB holderØ 3 mm or Ø 2.3 mmSample size SEM clamp holdermax. 5 mm (H) 7 mm (W) 2 mm (D)Sample size SEM slope cut holdermax. 5 mm (H) 5 mm (W) 3 mm (D)

LEICA EM RES102 – ION BEAM MILLINGLEICA EMSYSTEMRES102 – ION BEAM MILLING SYSTEM9COOLING DEVICE (OPTIONAL AVAILABLE)› Automated liquid nitrogen cooled contact mechanism› Automated heat up control to avoid moisture contamination of the sample› LN2 consumption 0.6 l/1 hCONTROL (USER INTERFACE)› PC control unit with 19" touch screen› LAN capability for external operation and monitoring› Integrated application library (programs)› Individual programming and storage of milling parameters in steps or sequencesVACUUM SYSTEM› Oil-free 1 10 –5 mbar, four stage system diaphragm and turbo molecular pump (70 l/s)› Vacuum load lock system for sample transfer within 1 minutePRESSURE MEASUREMENT› Compact full range gauge, Pirani for low vacuum, cold cathode for high vacuumOBSERVATION SYSTEM› Digital CMOS-colour camera with motorized zoom, aperture diaphragm and automated focus adaptation› Storage of live images and videos› Beam cam function (false-color image) for precise gun alignmentAUTOMATED TERMINATION OF THE MILLING PROCESS› Time controlled› Optical image termination for opaque material› Faraday cup for opaque and light transparent material (optional)ELECTRICAL DATASupply voltage90–260 VAC, 50/60 HzPower consumptionmax. 400 WDIMENSIONS AND WEIGHTWidthDepthHeightNet weightBasic instrument720 mm700 mm950 mm 100 kg

10Synergies with the Leica EM TXPPrior to using the Leica EM RES102, mechanical preparation is often required to get asclose as possible to the area of interest. The Leica EM TXP is a unique target surfacingsystem developed for cutting and polishing samples prior to follow-on techniques withinstruments such as the Leica EM RES102. The Leica EM TXP is speciallydesigned to prepare samples by sawing, milling, grinding andpolishing. It excels with challenging specimens where pinpointing and preparing difficult targets becomes easy.The Leica EM TXP is a unique target surfacing system developed forcutting and polishing samples. It can be used prior to follow-ontechniques with the Leica EM RES102.Leica EM TXP/EM RES102 for SEMGold wire bonding prepared with theLeica EM TXP (left). Same gold wirebonding after additional ion polishingstep (about 30 minutes) with the LeicaEM RES102 (right).1234

LEICA EM RES102 – ION BEAM MILLING SYSTEM11Picture 1Leica EM TXP / EM RES102 for TEM3 mm disc of a cross-sectionedIC-package with a thickness of 40 μm,mechanically prepared with the LeicaEM TXP, clamped in the TEM sampleholder of the EM RES102.Picture 2

www.leica-microsystems.com90 slope cut of an Au wire bondTEM image of a milled ceramic sample (Al2O3)The statement by Ernst Leitz in 1907, “With the User, For the User,” describes the fruitful collaboration with end users and driving force ofinnovation at Leica Microsystems. We have developed five brand values to live up to this tradition: Pioneering, High-end Quality, Team Spirit,Dedication to Science, and Continuous Improvement. For us, living up to these values means: Living up to Life.Leica Microsystems operates globally in three divisions, where we rankwith the market leaders.LIFE SCIENCE DIVISIONThe Leica Microsystems Life Science Division supports the imagingneeds of the scientific community with advanced innovation andtechnical expertise for the visualization, measurement, and analysisof microstructures. Our strong focus on understanding scientificapplications puts Leica Microsystems’ customers at the leading edgeof science.INDUSTRY DIVISIONThe Leica Microsystems Industry Division’s focus is to supportcustomers’ pursuit of the highest quality end result. Leica Microsystemsprovide the best and most innovative imaging systems to see, measure,and analyze the microstructures in routine and research industrialapplications, materials science, quality control, forensic science investigation, and educational applications.MEDICAL DIVISIONThe Leica Microsystems Medical Division’s focus is to partner withand support surgeons and their care of patients with the highest-quality,most innovative surgical microscope technology today and into thefuture.Leica Microsystems – an international company with a strong networkof worldwide customer services:Active worldwideTel.FaxAustralia North Ryde 612 8870 35002 9878 1055Austria Vienna 431 486 80 50 01 486 80 50 30Belgium Diegem 32Canada Concord/Ontario 12 790 98 502 790 98 68800 248 0123847 405 0164Denmark Ballerup 454454 01014454 0111France Nanterre Cedex 33811 000 6641 56 05 23 23Germany Wetzlar 4964 41 29 40 0064 41 29 41 55Italy Milan 3902 574 86102 574 03392Japan Tokyo 813 5421 28003 5421 2896Korea Seoul 822 514 65 432 514 65 48Netherlands Rijswijk 3170 4132 10070 4132 109 8522564 66992564 416321 6387 660621 6387 6698People’s Rep. of China Hong Kong ShanghaiPortugal Lisbon 86 35121 388 911221 385 4668 656779 78236773 0628Spain Barcelona 3493 494 95 3093 494 95 32Sweden Kista 468 625 45 458 625 45 10Switzerland Heerbrugg 4171 726 34 3471 726 34 44United Kingdom Milton Keynes 44800 298 23441908 246312 1800 248 0123847 405 0164SingaporeUSA Buffalo Grove/lllinoisOrder no.: English 167220002 III/13/DX/Br.H. Copyright by Leica MikrosystemeGmbH Vienna, Austria, 2013. Subject to modifications. LEICA and the Leica Logo areregistered trademarks of Leica Microsystems IR GmbH.

The Leica EM TXP is a unique target surfacing system developed for cutting and polishing samples. It can be used prior to follow-on techniques with the Leica EM RES102. Leica EM TXP/EM RES102 for SEM Gold wire bonding prepared with the Leica EM TXP (left). Same gold wire bonding after additional ion polishing step (about 30 minutes) with the Leica